TECHNICAL FIELD
[1] The present disclosure generally relates to the field of computing devices. In
particular, the present disclosure relates to the field of computing devices in server
applications.
BACKGROUND
[2] Background description includes information that may be useful in
understanding the present invention. It is not an admission that any of the information provided herein is prior art or relevant to the presently claimed invention, or that any publication specifically or implicitly referenced is prior art.
[3] The requirements of computing are often met by server class processors and
graphics processor unit in a multi-core environment. Servers that are designed for dedicated functionality such as decision support, and sensor data processing, are required to support high speed network connection, high speed processing and higher data throughput. A single multi-core server can handle the processing requirements of such applications and any additional computation intensive applications can be handled by a general purpose graphics processor. The methods in the art disclose computer graphics system suitable for such applications, however, the designs are not modular with respect to most of the components and hence any upgradation would require the entire system to be re-designed. Moreover, the peripherals and interconnects needed in the computation device varies depending on the application.
[4] Although server class processors and graphic processor units with improved
performance appear in the market on a regular basis, however, such improvements will be limited to use in certain applications only and are not convenient to redesign or upgrade, based on the end application.
[5] Another example includes components such as the network switching module
to be provided externally for connecting to various network nodes in remote fields, submarines and the like, wherein the maintenance requirement of the server is fifteen years or more. In such cases too, it is preferable to upgrade the modules, instead of replacing the entire computing apparatus.

[6] It is challenging to fulfil the requirements depending on the application, owing
to complex architecture of such devices and any replacement, or re-designing would be time-consuming and hence take longer time before it is ready for the final application.
[7] There is, therefore, a requirement in the art for computer system architecture,
and an operating methodology that provides convenience in redesigning or upgradation of the systems used in server.
[8] All publications herein are incorporated by reference to the same extent as if
each individual publication or patent application were specifically and individually indicated to be incorporated by reference. Where a definition or use of a term in an incorporated reference is inconsistent or contrary to the definition of that term provided herein, the definition of that term provided herein applies and the definition of that term in the reference does not apply.
[9] In some embodiments, the numbers expressing quantities or dimensions of
items, and so forth, used to describe and claim certain embodiments of the invention are to be understood as being modified in some instances by the term “about.” Accordingly, in some embodiments, the numerical parameters set forth in the written description and attached claims are approximations that can vary depending upon the desired properties sought to be obtained by a particular embodiment. In some embodiments, the numerical parameters should be construed in light of the number of reported significant digits and by applying ordinary rounding techniques. Notwithstanding that the numerical ranges and parameters setting forth the broad scope of some embodiments of the invention are approximations, the numerical values set forth in the specific examples are reported as precisely as practicable. The numerical values presented in some embodiments of the invention may contain certain errors necessarily resulting from the standard deviation found in their respective testing measurements.
[10] As used in the description herein and throughout the claims that follow, the meaning
of “a,” “an,” and “the” includes plural reference unless the context clearly dictates otherwise. Also, as used in the description herein, the meaning of “in” includes “in” and “on” unless the context clearly dictates otherwise.
[11] The recitation of ranges of values herein is merely intended to serve as a shorthand
method of referring individually to each separate value falling within the range. Unless otherwise indicated herein, each individual value is incorporated into the specification as if it were individually recited herein. All methods described herein can be performed in any suitable order unless otherwise indicated herein or otherwise clearly contradicted by context.

The use of any and all examples, or exemplary language (e.g. “such as”) provided with respect to certain embodiments herein is intended merely to better illuminate the invention and does not pose a limitation on the scope of the invention otherwise claimed. No language in the specification should be construed as indicating any non-claimed element essential to the practice of the invention.
[12] Groupings of alternative elements or embodiments of the invention disclosed herein
are not to be construed as limitations. Each group member can be referred to and claimed individually or in any combination with other members of the group or other elements found herein. One or more members of a group can be included in, or deleted from, a group for reasons of convenience and/or patentability. When any such inclusion or deletion occurs, the specification is herein deemed to contain the group as modified thus fulfilling the written description of all groups used in the appended claims.
OBJECTS
[13] A general object of the present disclosure is to enhance the processing capacity of
computing systems without the need to replace the entire system.
[14] Another object of the present disclosure is to provide a computing system that enables
easier upgradation and replacement of only necessary modules.
[15] Another object of the present disclosure is to provide a computing system that offers a
modular approach with hardware scalability, flexibility and software upgradation alternatives.
SUMMARY
[16] The present disclosure generally relates to the field of computing devices. In
particular, the present disclosure relates to the field of computing devices in server
applications.
[17] In an aspect, the present disclosure provides a modular computing system. The system
comprises at least one computing module, and at least one component selected from the
group consisting of a graphic module, a communication switching module, a peripheral
module and a remote configuration module, wherein the system is at least partly upgradable.
[18] In an embodiment, any or a combination of the computing module and the at least one
component are plugged to a single motherboard. In an embodiment, any or a combination of
the at least one component is in serial communication with the computing module.
[19] In an embodiment, any or a combination of the computing module and the at least one
component are independently upgradable or replaceable.

[20] In an embodiment, the computing module comprises a processor node, at least one
memory module and a power system module. In another embodiment, the computing mode
comprises a plurality of memory modules, wherein the memory modules can be updated in
plurality to support higher memory size. In another embodiment, using a bypass, only one of
the memory modules can be used to support lower memory size.
[21] In an embodiment, the graphics module comprises a first base card and pluggable
mezzanine card, where the first base card and the pluggable mezzanine card are
independently upgradable.
[22] In an embodiment, the system further comprises a hard disk drive (HDD) and a digital
versatile disk (DVD), wherein the hard disk drive (HDD) is configured for data storage and
retrieval of information.
[23] In an embodiment, the communication switching module comprises a second base
card and a child care card, wherein the communication switching module is configured to
support any one selected from layer 2 switching and layer 3 switching for communication
with devices outside the system.
[24] In an embodiment, the peripheral module comprises at least one component selected
from high speed serial interface hub, high speed expansion switch and audio converter,
wherein the high speed serial interface hub is configured to convert high speed data into low
speed serial data.
[25] In an embodiment, the remote configuration module is configured for remote
monitoring of the computing module.
[26] In an embodiment, the computing module and the at least one component are mounted
orthogonally to back-plane inside chassis.
[27] In an embodiment, the computing module and the at least one component are
subjected to thermal cooling by a cooling mechanism.
[28] Various objects, features, aspects and advantages of the inventive subject matter will
become more apparent from the following detailed description of preferred embodiments,
along with the accompanying drawing figures in which like numerals represent like
components.
BRIEF DESCRIPTION OF DRAWINGS
[29] The accompanying drawings are included to provide a further understanding of the
present invention and are incorporated in and constitute a part of this specification. The

drawings illustrate exemplary embodiments of the present invention and, together with the
description, serve to explain the principles of the present invention.
[30] FIG. 1 illustrates the overall system 100, in accordance with the present disclosure.
[31] FIG. 2 illustrates the overview of the system 100, in accordance with the present
disclosure.
[32] FIG. 3A illustrates a computing module (101), in accordance with an embodiment of
the present disclosure.
[33] FIG. 3B illustrates an exemplary construction for the computing module (101) of FIG.
3A.
[34] FIG. 4A illustrates a graphic module (102), in accordance with an embodiment of the
present disclosure.
[35] FIG. 4B illustrates an exemplary construction for the graphic module (102) of FIG.
4A.
[36] FIG. 5A illustrates a communication switching module (103), in accordance with an
embodiment of the present disclosure.
[37] FIG. 5B illustrates an exemplary construction for the communication switching
module (103) of FIG. 5A.
[38] FIG. 6A illustrates a peripheral module (104), in accordance with an embodiment of
the present disclosure.
[39] FIG. 6B illustrates an exemplary construction for the peripheral module (104), of FIG.
6A.
[40] FIG. 7A illustrates a remote configuration module (105), in accordance with an
embodiment of the present disclosure.
[41] FIG. 7B illustrates an exemplary construction for the remote configuration module
(105) of FIG. 7A.
DETAILED DESCRIPTION
[42] The following is a detailed description of embodiments of the disclosure depicted in
the accompanying drawings. The embodiments are in such detail as to clearly communicate the disclosure. However, the amount of detail offered is not intended to limit the anticipated variations of embodiments; on the contrary, the intention is to cover all modifications, equivalents, and alternatives falling within the spirit and scope of the present disclosure as defined by the appended claims.

[43] If the specification states a component or feature “may”, “can”, “could”, or “might”
be included or have a characteristic, that particular component or feature is not required to be included or have the characteristic.
[44] As used in the description herein and throughout the claims that follow, the meaning
of “a,” “an,” and “the” includes plural reference unless the context clearly dictates otherwise. Also, as used in the description herein, the meaning of “in” includes “in” and “on” unless the context clearly dictates otherwise.
[45] Exemplary embodiments will now be described more fully hereinafter with reference
to the accompanying drawings, in which exemplary embodiments are shown. These exemplary embodiments are provided only for illustrative purposes and so that this disclosure will be thorough and complete and will fully convey the scope of the invention to those of ordinary skill in the art. The invention disclosed may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Various modifications will be readily apparent to persons skilled in the art. The general principles defined herein may be applied to other embodiments and applications without departing from the spirit and scope of the invention. Moreover, all statements herein reciting embodiments of the invention, as well as specific examples thereof, are intended to encompass both structural and functional equivalents thereof. Additionally, it is intended that such equivalents include both currently known equivalents as well as equivalents developed in the future (i.e., any elements developed that perform the same function, regardless of structure). Also, the terminology and phraseology used is for the purpose of describing exemplary embodiments and should not be considered limiting. Thus, the present invention is to be accorded the widest scope encompassing numerous alternatives, modifications and equivalents consistent with the principles and features disclosed. For purpose of clarity, details relating to technical material that is known in the technical fields related to the invention have not been described in detail so as not to unnecessarily obscure the present invention.
[46] The use of any and all examples, or exemplary language (e.g., “such as”) provided
with respect to certain embodiments herein is intended merely to better illuminate the invention and does not pose a limitation on the scope of the invention otherwise claimed. No language in the specification should be construed as indicating any non – claimed element essential to the practice of the invention.
[47] Embodiments described herein generally relate to the field of computing devices, and
in particular, they relate to the computing devices in server applications.

[48] The present disclosure relates to a computing system based on modularity approach
for complex computation. In an aspect, the present disclosure provides a modular computing
system (100) as shown in FIG. 1 and FIG. 2. The system (100) comprises at least one
computing module (101), and at least one component selected from the group consisting of a
graphic module (102), a communication switching module (103), a peripheral module (104)
and a remote configuration module (105), wherein the system (100) is at least partly
upgradable.
[49] In accordance with FIG. 1 and 2 and as per one embodiment, the system (100) further
comprises a hard disk drive (HDD) (112) and a digital versatile disk (DVD) (114), wherein
the hard disk drive (HDD) (112) is configured for data storage and retrieval of information.
[50] In an embodiment, the system (100) optionally comprises an expansion slot (110), for
allowing addition of other modules, based on the application.
[51] In an embodiment, the at least one computing module (101), and at least one
component (102, 103, 104, 105) are assembled within a single enclosure.
[52] In an embodiment, any or a combination of the computing module (101) and the at
least one component (102, 103, 104, 105) are plugged to a single motherboard.
[53] In accordance with an embodiment of the present disclosure, any or a combination of
the at least one component (102, 103, 104, 105) is in serial communication with the
computing module (101).
[54] In an embodiment, any or a combination of the computing module (101) and the at
least one component (102, 103, 104 and 105) are independently upgradable or replaceable.
[55] FIG. 3A illustrates the computing module (101), in accordance with an embodiment
of the present disclosure. In accordance with an exemplary embodiment, the computing
module (101) comprises a processor node (201), at least one memory module (202, 203) and
a power system module (204), as shown in FIG. 3A. FIG. 3B illustrates an exemplary
construction for the computing module (101) of FIG. 3A. In accordance with the present
disclosure, the memory modules (202, 203) can be upgraded in plurality to support higher
memory size.
[56] The at least one memory module (202, 203) comprises one or more synchronous
memory components arranged in a dense and compact arrangement. In an embodiment, the
memory modules (202, 203) can be upgraded in plurality for increasing the memory capacity
of the system (100). One of the memory module (202 or 203) alone can be used with the help
of a bypass card.

[57] In an embodiment, the computing module (101) is configured to support a plurality of
memory printed circuit boards (PCBs).
[58] In accordance with an exemplary embodiment, the graphic module (102) comprises a
first base card (301) and a pluggable mezzanine card (302) as shown in FIG. 4A. FIG. 4B illustrates an exemplary construction for the graphic module (102) of FIG. 4A. In an exemplary embodiment, the pluggable mezzanine card (302) is Mobile PCI Express mezzanine (MXM) card.
[59] In an embodiment, the first base card (301) and the pluggable mezzanine card (302)
are independently upgradable. In accordance with an exemplary embodiment, the pluggable mezzanine card (302) is mounted on the first base card (301), wherein the first base card (301) is low performance graphics base card, such that it is capable of a stand-alone operation. The present arrangement offers a dynamic graphics performance based on power budget, wherein the switching between two graphics does not require any user intervention. The hardware upgradation of any of the pluggable mezzanine card (302) or the first base card (301), is accomplished without re-designing the entire module. In an embodiment, the first base card (301) alone is optionally used for display purpose in applications, wherein the processing requirements is handled by the computing module (101).
[60] In an embodiment, the communication switching module (103) comprises a second
base card (401) and a child care card (402) as shown in FIG. 5A. FIG. 5B illustrates an exemplary construction for the communication switching module (103) of FIG. 5A. In an embodiment, the communication switching module (103) is configured to support any one selected from layer 2 switching and layer 3 switching for communication with devices outside the system. The communication switching module (103) interfaces to the outside world through high speed interface with layer 2 or layer 3 switching. In an exemplary embodiment, the high speed interface is ethernet. The switching functionality is implemented in a programmable device so that the layer 2 or layer 3 networking switch functionality and a plurality of ports corresponding to the switching is programmable, based upon the requirement.
[61] FIG. 6A illustrates a peripheral module (104), in accordance with an embodiment of
the present disclosure. FIG. 6B illustrates an exemplary construction for the peripheral module (104), of FIG. 6A. In an embodiment, the peripheral module (104) comprises at least one component selected from high speed serial interface hub, high speed expansion switch and audio converter, wherein the high speed serial interface hub is configured to convert high speed data into low speed serial data.

[62] In an embodiment, the peripheral module (104) comprises a plurality of high speed
serial ports, low speed serial ports and audio ports.
[63] FIG. 7A illustrates a remote configuration module (105), in accordance with an
embodiment of the present disclosure. FIG. 7B illustrates an exemplary construction for the remote configuration module (105) of FIG. 7A. In an embodiment, the remote configuration module (105) is configured for remote monitoring of the computing module (101). In an embodiment, the remote configuration module (105) handles remote configuration of the computing module (101) using a communication protocol. The remote configuration module also includes power supply section for lower voltage generation to distribute various voltages to the system. The system further comprises input output connector module which can cater to external interface requirements of the system based on requirements of various applications.
[64] In an embodiment, the computing module (101) and the at least one component (102,
103, 104, 105) are mounted orthogonally to back-plane inside chassis. In an embodiment, the
computing module (101) and the at least one component (102, 103, 104, 105) are subjected to
thermal cooling by a cooling mechanism. In an exemplary embodiment, a customized fan
mounted cooling design is used which can be optimized as per the heat load. The inlet and
outlet fans can also been placed on the chassis to deliver most effective heat removal.
[65] The present disclosure, thus, provides a system with enhanced processing capacity,
especially for server application, based on modularity approach for complex computation.
The modular computing system of the present disclosure also enables full system
management through remote monitoring and configuration. The modular approach provides
added advantages of hardware scalability, flexibility and software upgrade of the modules.
[66] It should be apparent to those skilled in the art that many more modifications besides
those already described are possible without departing from the inventive concepts herein. The inventive patient matter, therefore, is not to be restricted except in the spirit of the appended claims. Moreover, in interpreting both the specification and the claims, all terms should be interpreted in the broadest possible manner consistent with the context. In particular, the terms “includes” and “including” should be interpreted as referring to elements, components, or steps in a non-exclusive manner, indicating that the referenced elements, components, or steps may be present, or utilized, or combined with other elements, components, or steps that are not expressly referenced. Where the specification claims refer to at least one of something selected from the group consisting of A, B, C ….and N, the text should be interpreted as requiring only one element from the group, not A plus N, or B plus

N, etc. The foregoing description of the specific embodiments will so fully reveal the general nature of the embodiments herein that others can, by applying current knowledge, readily modify and/or adapt for various applications such specific embodiments without departing from the generic concept, and, therefore, such adaptations and modifications should and are intended to be comprehended within the meaning and range of equivalents of the disclosed embodiments. It is to be understood that the phraseology or terminology employed herein is for the purpose of description and not of limitation. Therefore, while the embodiments herein have been described in terms of preferred embodiments, those skilled in the art will recognize that the embodiments herein can be practised with modification within the spirit and scope of the appended claims.
[67] While the foregoing describes various embodiments of the invention, other and
further embodiments of the invention may be devised without departing from the basic scope thereof. The scope of the invention is determined by the claims that follow. The invention is not limited to the described embodiments, versions or examples, which are included to enable a person having ordinary skill in the art to make and use the invention when combined with information and knowledge available to the person having ordinary skill in the art.
ADVANTAGES
[68] The present disclosure provides a system that enhances the processing capacity of
computing systems without the need to replace the entire system.
[69] The present disclosure provides a computing system that enables easier upgradation
and replacement of only necessary modules.
[70] The present disclosure provides a computing system that provides a modular design
with hardware scalability, flexibility and software upgradation alternatives.

We Claim:
1. A modular computing system (100), said system (100) comprising:
at least one computing module (101), and at least one component selected from the group consisting of a graphic module (102), a communication switching module (103), a peripheral module (104) and a remote configuration module (105),
wherein said system (100) is at least partly upgradable.
2. The system (100) as claimed in claim 1, wherein any or a combination of said
computing module (101) and said at least one component (102, 103, 104, 105) are
plugged to a single motherboard, or wherein any or a combination of said at least
one component (102, 103, 104, 105) is in serial communication with said computing
module (101).
3. The system (100) as claimed in claim 1, wherein any or a combination of said computing module (101) and said at least one component (102, 103, 104 and 105) are independently upgradable or replaceable.
4. The system (100) as claimed in claim 1, wherein said computing module (101) comprises a processor node (201), at least one memory module (202, 203) and a power system module (204), wherein said memory modules (202, 203) are upgradable in plurality.
5. The system (100) as claimed in claim 1, wherein said graphics module (102) comprises a first base card (301) and pluggable mezzanine card (302), or wherein said first base card (301) and said pluggable mezzanine card (302) are independently upgradable.
6. The system (100) as claimed in claim 1, wherein said system (100) further comprises a hard disk drive (HDD) (112) and a digital versatile disk (DVD) (114), wherein said hard disk drive (HDD) (112) is configured for data storage and retrieval of information.
7. The system (100) as claimed in claim 1, wherein said communication switching module (103) comprises a second base card (401) and a child care card (402), wherein said communication switching module (103) is configured to support any one selected from layer 2 switching and layer 3 switching for communication with devices outside said system.
8. The system (100) as claimed in claim 1, wherein said peripheral module (104) comprises at least one component selected from high speed serial interface hub, high

speed expansion switch and audio converter, wherein said high speed serial interface hub is configured to convert high speed data into low speed serial data. 9. The system (100) as claimed in claim 1, wherein said remote configuration module (105) is configured for remote monitoring of said computing module (101). 10. The system (100) as claimed in claim 1, wherein said computing module (101) and said at least one component (102, 103, 104, 105) are mounted orthogonally to back¬plane inside chassis, or wherein said computing module (101) and said at least one component (102, 103, 104, 105) are subjected to thermal cooling by a cooling mechanism.