DESC:FIELD
The present disclosure generally relates to computer data centers, and in particular, it relates to a modular cooling system for cooling a space that contains electronic equipment, such as computer server rooms and server racks in computer data centers.
BACKGROUND
The background information herein below relates to the present disclosure but is not necessarily prior art.
Large-scale computer data centers are crucial components of many organizations. The data center is a facility within which at least one of the general or special purpose computers, servers, electronic data storage, telecommunication devices, and combinations thereof are stored.
Computer systems and, more specifically, computer processors generate heat during their operation. If this heat is sufficiently concentrated, it can damage computer systems, and reduce the computing performance, and in some situations, the heat generated can damage the hardware of the computers. Additionally, this heat generation problem gets worse when numerous computers are housed in the same space or under the same roof. Thus, it becomes necessary to cool the data centers, especially the large data centers in order to dissipate this heat before it causes any damage.
In order to use and operate these computing systems and other electronic components efficiently, it is necessary to operate these components in a temperature-controlled environment. Thus, the heat generated by the electronic components must be removed in order to operate the electronic components within an acceptable temperature range and to avoid malfunctioning of these components. The amount of power utilized and the costs used for the removal of this heat are one of the major problems associated with the operation of data centers.
Further, the majority of the data centers, whether captive or colocation, use chilled water. However, the conventional water type cooling system has a large foot print which increases the energy consumption, overall cost, and maintenance requirements.
There is, therefore, felt a need for a cooling system for data centers that alleviates the aforementioned drawbacks.
OBJECTS
Some of the objects of the present disclosure, which at least one embodiment herein satisfies, are as follows:
It is an object of the present disclosure to ameliorate one or more problems of the prior art or to at least provide a useful alternative.
An object of the present disclosure is to provide a modular cooling system for a data center.
Another object of the present disclosure is to provide a modular cooling system for a data center which is cost effective.
Still another object of the present disclosure is to provide a modular cooling system for a data center which offers less foot print.
Yet another object of the present disclosure is to provide a modular cooling system for a data center that consumes less electrical power.
Still another object of the present disclosure is to provide a modular cooling system for a data center that offers high cooling capacity.
Yet another object of the present disclosure is to provide a modular cooling system for a data center that offers easy service.
Still another object of the present disclosure is to provide a modular cooling system for a data center that facilitates convenient in maintenance.
Yet another object of the present disclosure is to provide a modular cooling system for a data center that is easy to assemble and disassemble.
Still another object of the present disclosure is to provide a modular cooling system for a data center that is easy to transport.
Yet another object of the present disclosure is to provide a modular cooling system for a data center that restricts unauthorized access or tempering of data from the data center hall.
Still another object of the present disclosure is to provide a modular cooling system for a data center that facilitates the flow of chilled air in a horizontal direction across different server racks and computing systems.
Other objects and advantages of the present disclosure will be more apparent from the following description, which is not intended to limit the scope of the present disclosure.
SUMMARY
The present disclosure envisages a modular cooling system for cooling a space. The modular cooling system comprises an evaporative unit, defining a front portion of the cooling system, configured to draw air from at least one duct or ambient air from surrounding space and is further configured to cool the drawn air and deliver a chilled air. A fan section, defining a rear portion of the cooling system, is configured to receive the chilled air from the evaporative unit when the fan section is operatively coupled to the evaporative unit and is further configured to deliver the received chilled air into the space to be cooled.
In an embodiment, the evaporative unit comprises a closed cooling circuit that includes an inlet port, an outlet port, and an evaporative coil. The evaporative coil defines a front end of the evaporative unit through which the air is drawn inside the evaporative unit from at least one duct or ambient air from the surrounding space. The evaporative coil is in fluid communication with the inlet port and the outlet port to circulate a cooling fluid across the evaporative coil to cool the drawn air to a predefined set point temperature. The evaporative coil is configured to receive the cooling fluid at a first low temperature and return the cooling fluid at a second higher temperature.
In an embodiment, the first low temperature of the cooling fluid is in the range of 18°C to 25°C. The second higher temperature of the cooling fluid is in the range of 26°C to 33°C.
In an embodiment, a passage connecting the outlet port with the evaporative coil is configured with at least one valve. The valve is configured to regulate the flow rate of the cooling fluid so as to achieve the predefined set point temperature.
In an embodiment, the flow rate of the cooling fluid is regulated as 8 kg/sec to 11 kg/sec.
In an embodiment, the front end of the evaporative unit is configured with a plurality of air filters to filter out the intake air received within the evaporative unit through the evaporative coil.
In an embodiment, the filters are snug fit or push fit or mounted by a plurality of fasteners onto the front end of the evaporative unit.
In an embodiment, the evaporative coil is configured with a mild steel (MS) header.
In an embodiment, the front end of the evaporative unit is configured to be attached to the at least one duct to receive the air from the surrounding space.
In an embodiment, the fan section is in fluid communication with the evaporative unit. The fan section is configured with a plurality of fans or blowers configured to blow out the chilled air as sucked from the evaporative unit after exchanging heat with the evaporative coil.
In an embodiment, the fan section is mounted with the evaporative unit by means of a plurality of fasteners.
In an embodiment, the front end of the evaporative unit is configured with at least one door panel and at least one control unit. The door panel is configured to facilitate the access for a service engineer inside the cooling system, for the service of the fan section, the evaporative coil and the other electronic components of the cooling system. The control unit is configured to adjust the fans or blowers speed of the fan section and a cooling fluid regulating valve opening or closing, and to set the predefined set point temperature for the space to be cooled.
BRIEF DESCRIPTION OF ACCOMPANYING DRAWING
A modular cooling system for a data center of the present disclosure will now be described with the help of the accompanying drawing, in which:
Figure 1 illustrates a schematic arrangement of flow of water through an evaporator section and flow of air across a fan section in accordance with an embodiment of the present as per the present disclosure;
Figure 2 illustrates a side view of a modular cooling system in accordance with an embodiment of the present as per the present disclosure;
Figure 3 illustrates a rear view of a fan section in accordance with an embodiment of the present as per the present disclosure;
Figure 4 illustrates a cross-sectional view of an evaporator section and a fan section in accordance with an embodiment of the present as per the present disclosure;
Figure 5 illustrates an isometric view of a modular cooling system in which a plurality of filters is attached to an evaporator section, in accordance with an embodiment of the present as per the present disclosure;
Figure 6 illustrates a schematic isometric arrangement of the filter removal, in accordance with an embodiment of the present as per the present disclosure: and
Figure 7 illustrates a schematic isometric arrangement of a door panel provided on the front side, in accordance with an embodiment of the present as per the present disclosure.
LIST OF REFERENCE NUMERALS USED IN DETAILED DESCRIPTION AND DRAWING
100 modular cooling system (present system)
10 evaporator section
12 fan section
14 inlet port
16 outlet port
18 front portion
20 rear portion
22 evaporator coil
24 valve
26 fan
28 filter
30 door panel
32 control unit
DETAILED DESCRIPTION
Embodiments, of the present disclosure, will now be described with reference to the accompanying drawing.
Embodiments are provided so as to thoroughly and fully convey the scope of the present disclosure to the person skilled in the art. Numerous details, are set forth, relating to specific components, and methods, to provide a complete understanding of embodiments of the present disclosure. It will be apparent to the person skilled in the art that the details provided in the embodiments should not be construed to limit the scope of the present disclosure. In some embodiments, well-known processes, well-known apparatus structures, and well-known techniques are not described in detail.
The terminology used, in the present disclosure, is only for the purpose of explaining a particular embodiment and such terminology shall not be considered to limit the scope of the present disclosure. As used in the present disclosure, the forms "a,” "an," and "the" may be intended to include the plural forms as well, unless the context clearly suggests otherwise. The terms "comprises," "comprising," “including,” and “having,” are open ended transitional phrases and therefore specify the presence of stated features, elements, modules, units and/or components, but do not forbid the presence or addition of one or more other features, elements, components, and/or groups thereof.
Typically, large scale data centers consist of at least one of general or special purpose computers, servers, electronic data storage, telecommunication devices, and combinations thereof. In order to use and operate these computing system and other electronic components efficiently, it is required to operate these components in a thermodynamically stable temperature-controlled environment. Therefore, it is required to dissipate the generated heat in order to operate the electronic components within an acceptable range of temperature and to avoid malfunctioning of these electronic components. However, the amount of power and the costs used for the removal of this heat is major problem associated with the operation of data centers. Additionally, the majority of the big data centers, whether captive or colocation, uses chilled water. The water type cooling system, however, has a huge footprint, which increases the maintenance requirement, overall cost and power consumption of the system.
Therefore, the present disclosure envisages a modular cooling system (hereinafter referred to as “cooling system 100”) for cooling a space, containing electronic equipment, such as computer server rooms and server racks in computer data centers. Figure 1 and Figure 2 shows a schematic representation of a modular cooling system for the data centers. The data center hall includes one or more rows and columns of computers or servers supported in racks. The rows are arranged substantially parallel to each other. The cooling system 100 is specifically configured to maintain a thermodynamically stable temperature-controlled environment in the data center hall without exposing the server or data hall to any unauthorized access.
According to an embodiment of the present disclosure, Figure 1 shows the principal elements of the modular cooling system. Each of the modular cooling systems 100 comprises an evaporative unit 10 and a fan section, disposed normally within a cabinet of the cooling system 100. The evaporative unit 10 defines a front portion 18 of the cooling system 100 which is configured to draw hot air or warm air from at least one duct or ambient air from surrounding space and further configured to cool the drawn air, while the fan section 12 defines a rear portion 20 which is configured to deliver chilled air into the data center hall to maintain a temperature-controlled environment. Thus, the hot air is drawn from the front portion 18 of the evaporative unit 10 and the chilled air is delivered from the rear portion 20 through the fan section 12 in an operative configuration of the cooling system 100. The cooling system is called to be “modular”, since the evaporative unit 10 and the fan section 12 are configured in such a way that these units can be shipped and transported individually and can be assembled in the premises of the data center. Figure 1 illustrates a schematic arrangement of flow of water through an evaporator section and flow of air across a fan section.
In an embodiment, the data center hall may have more than one modular cooling system 100 to cool the data center hall or the server room to a desired predefined setpoint temperature.
In an embodiment, the size of the cooling system can be modified depending on the cooling capacity required by the server room or the data center hall. The cooling system can be installed by providing a cut-out in a side wall of a room.
In an embodiment, the capacity of the cooling system is 250KW to 350KW, therefore the airflow rate is in the range of 66000m3/hr to 70000 m3/hr. The capacity of the system 100 can be varied depending on the size of the data center hall and the number of computing stored in the data center hall by changing the configuration of the evaporative coil 22.
Further, the evaporative unit 10 comprises an evaporative coil 22, an inlet port 14, an outlet port, and respective passages for connecting the inlet port 14 and the outlet port 16 to the evaporative coil 22. The front portion 18 of the evaporative unit 10 is configured with a plurality of air filters. The filters 28 act as an outer covering layer for the evaporative coil 22, and to thereby configured to filter out the intake air received within the evaporative unit 10 and passing across the evaporator coils 22. The evaporative coil 22 is defined as a hollow metallic tubular structure, bent in a serpentine shape. The evaporative coil 22 is in fluid communication with the inlet port 14 and the outlet port 16 of the evaporative unit. Therefore, the evaporative coil 22 receives cooling fluid such as water through the inlet port 14 at a first low temperature. The cooling fluid circulating through the evaporative coil 22 exchanges heat by convection with the drawn air or the warm air circulating across the coil, which allows the drawn air to exchange heat with the coil and cool to the predefined set point temperature. The cooled air is routed from the fan section 12 to the data center hall. The fluid returned from the evaporative coil 22 is allowed to exit from the outlet port 16 at a second higher temperature. Figure 2 illustrates a side view of a modular cooling system.
In an embodiment, the evaporative coil 22 is configured with a mild steel (MS) header. The MS header is economical and reduces the overall cost of the cooling system 100.
In an embodiment, the first low temperature of the cooling fluid is in the range of 18°C to 25°C and the second higher temperature of the cooling fluid is in the range of 26°C to 33°C. The flow rate of the cooling fluid is regulated as 8 kg/sec to 11 kg/sec.
In an embodiment, the temperature of the sucked air or the warm air is in the range of 33°C to 35°C and the temperature of the chilled air blowing out from the fan section 12 is in the range of 26°C to 38°C.
In an embodiment, the passage connecting the outlet port 16 with the evaporative coil 22 is configured with at least one valve 24. The valve 24 is configured to regulate the flow rate of cooling fluid so as to achieve the desired set point or cooling temperature inside the data center. Therefore, the amount of valve opening or closing is directly proportional to the temperature gradient between the chilled air and the hot or warm air sucked. The valve 24 is configured to actuate either manually or automatically.
In an embodiment, the filters 28 are snug fit or push fit or mounted by a plurality of fasteners onto the front portion 18 of the evaporative unit.
In an embodiment, the front portion 18 of the evaporative unit 10 is configured to be attached to the duct to receive the warm air from the data center.
Further, the fan section 12 is in fluid communication with the evaporative unit. The fan section 12 is configured with a plurality of fans 26 or blowers, configured to blow out the chilled air as sucked from the evaporative unit 10 after exchanging heat with the evaporative coil 22. The number of fans or blowers depends on the floor area and the cooling capacity required to cool the data center. The fans 26 or the blowers are configured to regulate the flow of air based on the desired pre-set temperature of the data center. Figure 3 illustrates a rear view of a fan section 12. Figure 4 illustrates a cross-sectional view of the evaporator section and the fan section 12. Figure 5 illustrates an isometric view of a modular cooling system in which a plurality of filters 28 is attached to an evaporator section. Figure 6 illustrates a schematic isometric arrangement of the filter removal.
In an embodiment, the fan section 12 is mounted with the evaporative unit 10 by means of a plurality of fasteners.
Further, the front portion 18 of the evaporative unit 10 is configured with at least one door panel 30 and at least one control unit 32. The door panel 30 is allowed to open on front side of the cooling system. The door panel 30 is configured to facilitate the access for a service engineer inside the cooling system 100, for the service of fan section, the evaporative coil 22, and the other electronic components of the cooling system. Advantageously, the service need not required to enter the data center or the server room for service and maintenance of the fan unit. Therefore, the tempering of data or unauthorized access to the data can be prevented. Figure 7 illustrates a schematic isometric arrangement of a door panel 30 provided on the front portion, in accordance with an embodiment of the present as per the present disclosure.
Also, the control unit 32 is provided on the front portion 18 of the cooling system 100. The control unit 32 is configured to adjust the fans 26 or blowers speed and the valve 24 opening or closing as well as to set a set-point temperature for the data center or the server room.
Further, the side panels of the fan section 12 are also removable. Thereby, it provides easy access for the service engineer to repair and maintenance.
Since, the plurality of fans 26 or the blowers are mounted to blow the chilled air in the horizontal direction of the system, therefore the different computing system and servers rack in the data center receive even distribution of chilled air without any hinderance or obstruction in the path of chilled air flow.
TECHNICAL ADVANCES AND ECONOMICAL SIGNIFICANCE
The present disclosure described herein above has several technical advantages including, but not limited to, the realization of a modular cooling system for a data center, that:
• is cost effective;
• offers modular assembly;
• offers less foot print;
• is simple and easy to assemble or disassemble the fan section with the evaporative unit;
• consumes less electrical power;
• offers high cooling capacity;
• offers easy service;
• facilitate convenient in maintenance; and
• is easy to transport;
• restricts unauthorized entry in the data center hall; and
• facilitates the flow of chilled air in horizontal direction across different server racks and computing systems.
The foregoing description of the specific embodiments so fully reveals the general nature of the embodiments herein that others can, by applying current knowledge, readily modify and/or adapt for various applications such specific embodiments without departing from the generic concept, and, therefore, such adaptations and modifications should and are intended to be comprehended within the meaning and range of equivalents of the disclosed embodiments. It is to be understood that the phraseology or terminology employed herein is for the purpose of description and not of limitation. Therefore, while the embodiments herein have been described in terms of preferred embodiments, those skilled in the art will recognize that the embodiments herein can be practiced with modification within the spirit and scope of the embodiments as described herein.
Throughout this specification the word “comprise”, or variations such as “comprises” or “comprising”, will be understood to imply the inclusion of a stated element, integer or step, or group of elements, integers, or steps, but not the exclusion of any other element, integer or step, or group of elements, Integers or steps.
The use of the expression “at least” or “at least one” suggests the use of one or more elements or ingredients or quantities, as the use may be in the embodiment of the disclosure to achieve one or more of the desired objects or results.
Any discussion of documents, acts, materials, devices, articles, or the like that has been included in this specification is solely for the purpose of providing a context for the disclosure. It is not to be taken as an admission that any or all of these matters form a part of the prior art base or were common general knowledge in the field relevant to the disclosure as it existed anywhere before the priority date of this application.
While considerable emphasis has been placed herein on the components and component parts of the preferred embodiments, it will be appreciated that many embodiments can be made and that many changes can be made in the preferred embodiments without departing from the principles of the disclosure. These and other changes in the preferred embodiment as well as other embodiments of the disclosure will be apparent to those skilled in the art from the disclosure herein, whereby it is to be distinctly understood that the foregoing descriptive matter is to be interpreted merely as illustrative of the disclosure and not as a limitation. ,CLAIMS:WE CLAIM:
1. A modular cooling system (100) for cooling a space, comprising:
an evaporative unit (10), defining a front portion (18) of the cooling system (100), configured to draw air from at least one duct or ambient air from surrounding space and further configured to cool the drawn air and deliver a chilled air; and
a fan section (12), defining a rear portion (20) of the cooling system (100), configured to receive the chilled air from the evaporative unit (10) when the fan section (12) is operatively coupled to the evaporative unit (10) and further configured to deliver the received chilled air into the space to be cooled.
2. The cooling system (100) as claimed in claim 1, wherein the evaporative unit (10) comprises a closed cooling circuit including:
an inlet port (14);
an outlet port (16); and
an evaporative coil (22) defining a front end of the evaporative unit (10) through which the air is drawn inside the evaporative unit (10) from at least one duct or ambient air from surrounding space, wherein the evaporative coil (22) being in fluid communication with the inlet port (14) and the outlet port (16) to circulate a cooling fluid across the evaporative coil (22) to cool the drawn air to a predefined set point temperature, and wherein the evaporative coil (22) being configured to receive the cooling fluid at a first low temperature and return the cooling fluid at a second higher temperature.
3. The cooling system (100) as claimed in claim 2, wherein the first low temperature of the cooling fluid is in the range of 18°C to 25°C, and wherein the second higher temperature of the cooling fluid is in the range of 26°C to 33°C.
4. The cooling system (100) as claimed in claim 2, wherein a passage connecting the outlet port (16) with the evaporative coil (22) is configured with at least one valve (24), and wherein the valve (24) is configured to regulate the flow rate of the cooling fluid so as to achieve the predefined set point temperature.
5. The cooling system (100) as claimed in claim 4, wherein the flow rate of the cooling fluid is regulated as 8 kg/sec to 11 kg/sec.
6. The cooling system (100) as claimed in claim 2, wherein the front end of the evaporative unit (10) is configured with a plurality of air filters (28) to filter out the intake air received within the evaporative unit (10) through the evaporative coil (22).
7. The cooling system (100) as claimed in claim 6, wherein the filters (28) are snug fit or push fit or mounted by a plurality of fasteners onto the front end of the evaporative unit (10).
8. The cooling system (100) as claimed in claim 2, wherein the evaporative coil (22) is configured with a mild steel (MS) header.
9. The cooling system (100) as claimed in claim 1, wherein the front end of the evaporative unit (10) is configured to be attached to the at least one duct to receive the air from the surrounding space.
10. The cooling system (100) as claimed in claim 1, wherein the fan section (12) is in fluid communication with the evaporative unit (10), and wherein the fan section (12) is configured with a plurality of fans (26) or blowers configured to blow out the chilled air as sucked from the evaporative unit (10) after exchanging heat with the evaporative coil (22).
11. The cooling system (100) as claimed in claim 1, wherein the fan section (12) is mounted with the evaporative unit (10) by means of a plurality of fasteners.
12. The cooling system (100) as claimed in claim 1, wherein the front end of the evaporative unit (10) is configured with at least one door panel (30) and at least one control unit (32), wherein the door panel (30) is configured to facilitate the access for a service engineer inside the cooling system (100), for the service of the fan section (12), the evaporative coil (22) and the other electronic components of the cooling system (100), and wherein control unit (32) is configured to adjust fans (26) or blowers speed of the fan section (12) and a cooling fluid regulating valve (24) opening or closing, and to set the predefined set point temperature for the space to be cooled.

Dated this 22nd day of December, 2023

_______________________________
MOHAN RAJKUMAR DEWAN, IN/PA – 25
of R.K.DEWAN & CO.
Authorized Agent of Applicant

TO,
THE CONTROLLER OF PATENTS
THE PATENT OFFICE, AT MUMBAI