Claims:We Claim:
1. An electronic device (100) of an electronic product, said electronic device comprising:
a circuit board (101);
said plurality of electronic components (102) operatively disposed on said circuit board (101); and
a conductive outer casing (103) enclosing said plurality of electronic components (102) disposed on said circuit board (101) along with a heat exchange member (104);
said one or more electronic components of said plurality of electronic components (102) being secured to said heat exchange member (104) by said mounting assembly;
said mounting assembly comprising at least two clip members (105), each unit of said at least two clip members (105) being designed for exerting compressive forces on said electronic components (102) while being permanently located in at least a portion of said heat exchange member (104), is formed with a flange (105f) at a point of contact of said clip members (105) with said at least a portion of said heat exchange member (104), and with a lancing protrusion (105d), at least a portion of said lancing protrusion (105d) remains in contact with each unit of said electronic components (102) while exerting compressive forces.
2. The electronic device (100) as claimed in claim 1, wherein said heat exchange member (104) is formed with a guiding surface (104b) to guide said flange (105f) into a clip holding channel (104a) formed therein.
3. The electronic device (100) as claimed in claim 2, wherein the guiding surface (104a) is formed at an angle in the range of 40°-50° with respect a top surface (104c) of said heat exchange member 104.
4. The electronic device (100) as claimed in claim 1, wherein said lancing protrusion (105d) is formed in a central region of a rear tongue portion (105b) of said clip members (105).
5. The electronic device (100) as claimed in claim 4, wherein at least a portion of said lancing protrusion (105d) is disposed to be in contact with a rear portion of each unit of said electronic components (102) when each unit of said clip members (105) is assembled over said electronic components (102) in order to secure said components (102) to said heat exchange member (104).
6. The electronic device (100) as claimed in claim 1, wherein said each unit of said clip members (105) comprises a front tongue portion (105a) disposed to be in contact with a front portion of each unit of said electronic components (102) when each unit of said clip members (105) is assembled over said heat exchange member (104), exerting compressive forces thereon.
7. The electronic device (100) as claimed in claim 1, wherein said flange (105f) is formed at a rear base section (105e) of a rear tongue portion (105b) of said each unit of said clip members (105).
8. The electronic device (100) as claimed in claim 7, wherein said flange (105f) is formed at an angle in the range of 85-95° with respect to a base surface (105g) of said rear base section (105e).
9. The electronic device (100) as claimed in claim 1, wherein said at least two clip members (105) are integrally formed, with a point integration being provided besides said central region of said each unit of said clip members (105).
10. The electronic device (100) as claimed in claim 1, wherein said clip holding channel (104b) is formed along length of said heat exchange member (104), below said guiding surface (104a).
11. A method of manufacturing an electronic device (100), said electronic device (100) comprising:
a circuit board (101);
a plurality of electronic components (102) operatively disposed on said circuit board (101); and
a conductive casing (103) enclosing said plurality of electronic components disposed on said circuit board (101) along with a heat exchange member (104);
said electronic components (102) being secured to said heat exchange member (104) by said method comprising steps of
providing at least two clip members (105), each unit of said at least two clip members (105) being designed for exerting compressive forces on each unit of said electronic components (102) and for being permanently located in at least a portion of said heat exchange member (104);
providing a flange (105f) at a point of contact of said clip members (105) with said at least a portion of said heat exchange member (104), and
providing a lancing protrusion (105d), at least a portion of the lancing protrusion (105d) remains in contact with each unit of said electronic components (102) while exerting compressive forces.
12. The method of manufacturing said electronic device (100) as claimed in claim 11, wherein said heat exchange member (104) is formed with a guiding surface (104b) to guide said flange (105f) into a clip holding channel (104a) formed therein.
13. The method of manufacturing of said electronic device (100) as claimed in claim 12, wherein the guiding surface (104b) is formed at angle in the range of 40°-50° with respect a top surface (104c) of said heat exchange member (104).
14. The method of manufacturing said electronic device (100) as claimed in claim 12, wherein said at least two clip members (105) are integrated to form an integrated clip member (106).
15. The method of manufacturing said electronic device (100) as claimed in claim 14, wherein said at least two clip members (105) are integrated at a point of integration which lies besides a central region of said each unit of said clip members (105).
16. The method of manufacturing said electronic device (100) as claimed in claim 12, wherein said integrated clip member (106) is assembled to secure said electronic components (102) to said heat exchange member (104) by sliding said clip member (106) through said clip holding channel (104b), followed by being pressed with the help of a tool.
17. A mounting assembly for securing one or more electronic components of a plurality of electronic components (102) of an electronic device (100), said electronic device (100) comprising:
a circuit board (101);
said plurality of electronic components (102) operatively disposed on said circuit board (101); and
a conductive outer casing (103) enclosing said plurality of electronic components (102) disposed on said circuit board (101) along with a heat exchange member (104);
said one or more electronic components of said plurality of electronic components (102) being secured to said heat exchange member (104) by said mounting assembly;
said mounting assembly comprising at least two clip members (105), each unit of said at least two clip members (105) being designed for exerting compressive forces on said electronic components (102) while being permanently located in at least a portion of said heat exchange member (104), is formed with a flange (105f) at a point of contact of said clip members (105) with said at least a portion of said heat exchange member (104), and with a lancing protrusion (105d), at least a portion of said lancing protrusion (105d) remains in contact with each unit of said electronic components (102) while exerting compressive forces.
, Description:TECHNICAL FIELD
[0001] The present subject matter generally relates to an electronic device and particularly but not exclusively relates to a method of manufacturing and mounting assembly for securing at least one electronic component of said electronic device.
BACKGROUND
[0002] Typically, electronic devices, electrical systems such as control systems, power controls, switches etc. generate lot of heat during operation. To avoid damage to the device as a whole or to any of the components of such devices/systems, heat must be dissipated. Commonly, a component made of metal or a highly conductive thermal material, in the form of a heat exchange member is placed in thermal contact with at least a portion of the electronic device for dissipating heat transferred by the device to the surrounding environment.
[0003] In order to ensure that heat is effectively dissipated from the electronic device, it is essential to ensure that the heat generating electronic component is reliably secured to be in thermal contact with said heat exchange member. Various techniques have been used to secure at least a portion of the electronic device including heat generating electronic components thereof to said heat exchange member. A known technique involves the use of fasteners in the form of screws and bolts to secure said heat generating components to said heat exchange member. However, use of screws proves to be cumbersome as accessing the screws for fastening is difficult due to interference of other neighboring components within the electronic device in addition to potential risk of accidental damage to the delicate electronic components, circuit boards etc. Moreover, using screws for securing said heat generating electronic components to said heat exchange member proves to be a time-consuming process.

BRIEF DESCRIPTION OF THE DRAWINGS
[0004] The detailed description described with reference to the accompanying figures. The same numbers have been used throughout the drawings to reference like features and components.
[0005] Fig.1 is an exploded view depicting parts of an electronic device in accordance with an embodiment of the present subject matter.
[0006] Fig.2a is a top perspective view of at least a portion of said electronic device illustrating assembly of at least one electronic component to a heat exchange member of said electronic device in accordance with an embodiment of the present subject matter.
[0007] Fig.2b is a cross sectional view of at least a portion of said electronic device depicting assembly of at least one electronic component to a heat exchange member of said electronic device in accordance with an embodiment of the present subject matter.
[0008] Fig.3 is a perspective view of a single unit of clip member in accordance with an embodiment of the present subject matter.
[0009] Fig.4 is an enlarged cross-sectional view of at least a portion of said electronic device depicting an assembled condition of said electronic component with said heat exchange member.
[00010] Fig.5 is a perspective view of at least a portion of said electronic device depicting an assembled condition of a plurality of electronic components with said heat exchange member as per an embodiment of the present subject matter.
[00011] Fig.6 is a perspective view of at least two clip members integrated with one another to form an integrated clip member as per an embodiment of the present subject matter.
[00012] Fig.7 is an exploded view depicting assembly of said integrated clip member over said electronic components to thermally connect said components with said heat exchange member.

DETAILED DESCRIPTION
[00013] Typically, electronic devices used in electronic products are designed to conduct heat from a circuit board holding a plurality of electronic components to an external surface portion thereof. Such electronic devices may be designed to be connected to heat exchange members which act as a heat transfer medium to conduct heat from body of said devices to the surrounding environment through external surface of said devices. Said heat exchange member must be held in thermal contact with constituent electronic components of the electronic device, such constituent electronic components being heat generating components such as transistors disposed in the circuit board of the electronic devices. A reliable securing means has to be provided for securing a plurality of heat generating electronic components to said heat exchange member.
[00014] A known technique for securing said heat generating electronic components to said heat exchange member involves the use of a clip member formed with a dimple. Provision of a dimple in said clip member enables in ensuring that each unit of said electronic components is secured through interference fit with a groove formed in said heat exchange member. Also, provision of said dimple enables in ensuring that said clip member enters straight into said groove without undergoing any deviation. However, use of said clip members provided with a dimple results in exertion of excessive compressive forces on each unit of said heat generating electronic components being secured to said heat exchange member. Moreover, the above-described drawback of said clip member prevents usage of multiple number of such clips over multiple number of units of said electronic components, as the overall compressive forces exerted would be too high, causing damage to said components. Additionally, each unit of said clip member is subjected to movements due to vibrations. Therefore, it is desirable that said clip members are not subjected to movements due to vibrations as well as impart adequate downward holding force to avoid undesirable movement of the parts.
[00015] Besides providing a reliable means for securing said electronic components to said heat exchange member, there is also a need for providing a simple, an inexpensive and user-friendly means for securing said electronic components to said heat exchange member.
[00016] With the above objectives in view, the present subject matter, provides a mounting assembly for securing at least two electronic components of an electronic device with a heat exchange member. Particularly, as per one embodiment, the present subject matter seeks to provide a means for permanently securing at least two electronic components to the heat exchange member of said electronic device using a simple and user-friendly mounting assembly.
[00017] According to one embodiment of the present subject matter, the electronic device as described herein comprises a circuit board, a plurality of electronic components such as transistors disposed on said circuit board, a heat exchange member held to be in thermal contact with said plurality of electronic components and a conductive outer casing made of highly conductive material for enclosing said circuit board along with said plurality of electronic components disposed therein and said heat exchange member. Particularly, while the provision of the heat exchange member held to be in thermal contact with said plurality of electronic components ensures that heat is transferred from said plurality of electronic components to the heat exchange member; the provision of the heat exchange member in thermal contact with said outer casing ensures that heat transferred to the heat exchange member is dissipated to the surroundings through said outer casing.
[00018] As per an aspect of the present subject matter, a mounting assembly involving the use of at least two clip members is used for securing at least two electronic components of said plurality of electronic components to said heat exchange member. Each unit of said clip members are assembled over each unit of electronic component to be held in thermal contact with at least a portion of said heat exchange member by press fitting. Particularly, each unit of said clip members is formed with a flange at a point of contact of said clip members with at least a portion of said heat exchange member. Further, each unit of said clip members is also formed with a lancing protrusion in a central region of a rear tongue portion thereof. When each unit of said clip members is assembled over each unit of said electronic components, said lancing protrusion presses against a rear portion of each unit of said electronic components and exerts compressive forces thereon. At the same time, a front tongue portion of said clip members expands so that only a lower section of said front tongue portion comes in contact with a front body portion of each unit of said electronic components. Thus, the design of each unit of said clip members enables in ensuring that only adequate amount of compressive forces are exerted on each unit of said electronic components, while ensuring that said clip members are non-removably secured to at least a portion of the heat exchange member, so that in turn said electronic component are reliably secured to the heat exchange member even when the electronic device experiences vibrations due to vehicle movements or due to movements of the product in which the electronic components are installed. Moreover, the above-mentioned design configuration of each unit of said clip members also ensures that the amount of force required to assemble each unit of said clip members over each unit of said electronic components is very less. Thus, the process of assembly of said electronic components with the heat exchange member is made easy and convenient, while also reducing the time required for assembly. Further, since each unit of said clip members exerts only adequate amount of compressive forces, multiple number of said clip members can be disposed over multiple units of said electronic components, disposed one next to the other to secure said multiple units of said electronic components to the heat exchange member without causing any damage to said electronic components. Thus, exertion of adequate downward retaining force is ensured while also ensuring that no damage is caused to the electronic components.
[00019] As per an aspect of the present subject matter, the heat exchange member is formed with a clip holding channel to receive said clip members used to secure said electronic components to the heat exchange member. Further, said heat exchange member is provided with a guiding surface formed just above said holding channel in order to guide said rear tongue portion of each unit of said clip members into said channel. Thus, the provision of said guiding surface facilitates easy assembly of said clip members used to secure said electronic components to the heat exchange member.
[00020] Various other features and advantages of the invention are described in detail below with reference to the accompanying drawings. In the drawings, like reference numbers generally indicate identical, functionally similar, and/or structurally similar elements.
[00021] Fig.1 is an exploded view depicting parts of the electronic device 100 as per an embodiment of the present subject matter. In the present embodiment, said electronic device 100 is a control device, used for controlling various vehicle subsystems or parts based on vehicle operating conditions. In another embodiment, said electronic device 100 can be a control device or any other functional component used in electronic goods/products such as mobile phones, washing machines etc. The electronic device 100 as per the present embodiment comprises a circuit board 101, a plurality of electronic components 102 operatively disposed on said circuit board 101, and a conductive outer casing 103 enclosing said plurality of electronic components 102 disposed on said circuit board 101 along with a heat exchange member 104. The circuit board 101 together with said plurality of electronic components 102 functionally contribute to the operation of said electronic device 100. In the present embodiment, said electronic components 102 include transistors, capacitors and the like, which are heat generating components. It is important that the heat generated by said components 102 is dissipated to the surroundings, in order to ensure efficient performance of the electronic device 100. The heat exchange member 104 and said outer casing 103 together contribute in dissipation of heat to the outside. Whereas said heat exchange member 104 transfers heat from said electronic components 102 to said outer casing 103, said outer casing 103 dissipates heat received from the heat exchange member 104 to the outside. In the present embodiment, said outer casing 103 is provided with cooling fins 103a, which facilitate heat dissipation. In order to ensure heat dissipation, said electronic components 102 are held in thermal contact with the heat exchange member 104, and the heat exchange member 104 is held in direct thermal contact with said outer casing 103. Both, the heat exchange member 104 and said outer casing 103 are made of thermally conductive material. In the present embodiment, the heat exchange member 104 and said outer casing 103 are made up of a highly conductive material such as a metal. Whereas in one embodiment, the heat exchange member 104 is integrally formed with said outer casing 103, in another embodiment the heat exchange member 104 is attached to said outer casing 103. Thus, direct thermal contact is established between said outer casing 103 and the heat exchange member 104.
[00022] Figs.2a-2b illustrate a mounting assembly used for securing said electronic components to the heat exchange member so that said electronic components are held in thermal contact with the heat exchange member. Fig.2a illustrates a top perspective view of at least a portion of said electronic device illustrating assembly of at least one electronic component to the heat exchange member in accordance with an embodiment of the present subject matter. In the present embodiment and as may be seen in Fig.2a, at least two clip members 105 are used to secure at least two units of electronic components of said plurality of electronic components 102 to at least a portion of the heat exchange member 104, so that said units of said components 102 are held to be in thermal contact with at least a portion of the heat exchange member 104. Said clip members 105 are assembled from a top side of each unit of said components 102.
[00023] Further, as may be seen in Fig.2b, each unit of said clip members 105 are assembled by sliding them over a guiding surface 104a of said heat exchange member 104 so that said clip members 105 are guided to get permanently located into a clip holding channel 104b of said heat exchange member 104 when force is exerted on said clip members 105 for securing them to each unit of said electronic components 102. Said clip holding channel 104b is integrally formed in body of said heat exchange member 104 and runs throughout length of said heat exchange member 104. In the present embodiment, said guiding surface 104a is formed just above the position of said clip holding channel 104b. Particularly in the present embodiment, said guiding surface 104a is formed at an angle in the range of 40°-50° with respect a top surface 104c of said heat exchange member 104. Said guiding surface 104a also extends throughout length of the heat exchange member 104 and runs parallely to said clip holding channel 104b. Provision of said guiding surface 104a not only aids in guiding at least a portion of each unit of said clip members 105, but also enables flexing of a front tongue portion 105a of each unit of said clip members 105, when a rear tongue portion 105b presses against said guiding surface 104a. Flexing of said front tongue portion 105a allows said front tongue portion 105a to come in contact with only a front surface of each unit of said electronic components 102.
[00024] Fig.3 illustrates a perspective view of a single unit of said clip members 105 in accordance with an embodiment of the present subject matter. As may be seen, each unit of said clip members 105 is hook shaped and comprises said front tongue portion 105a and said rear tongue portion 105b. Particularly, a central region of said rear tongue portion 105b is provided with a lancing protrusion 105d, wherein said protrusion 105d extends rearwards from a surface of said rear tongue portion 105b.
[00025] Further, at a rear base section 105e of said rear tongue portion 105b, a flange 105f is formed. Particularly, said rear base section 105e of said rear tongue portion 105b is a point of contact of said clip members 105 with at least a portion of the heat exchange member 104, in an assembled condition of said clip members 105. More particularly, said flange 105f is designed to remain in contact with at least a portion of the heat exchange member 104 in an assembled condition of said clip members 105 over said electronic components, securing said electronic components 102 to the heat exchange member 104. In the present embodiment, said flange 105f is formed at an angle of about 90° with respect to a rear base surface 105g of said rear tongue portion 105b. For example, the angle formed by the flange 105f with respect to the rear base surface 105g is in the range of 85-95°.
[00026] Fig.4 illustrates an enlarged cross-sectional view of at least a portion of said electronic device, depicting an assembled condition of at least one unit of said electronic components with said heat exchange member using said clip members. As may be seen, in an assembled condition of each unit of said clip members 105, said flange 105f gets locked into said clip holding channel 104b and thereby prevents twisting action of each unit of said clip members 105 about said lancing protrusion 105d. Thus, it is ensured that movement of each unit of said clip members 105 due to vibrations is prevented. In addition, provision of said lancing protrusion 105d enables one directional fit of each unit of said clip members 105. In other words, it is ensured that each unit of said clip members 105 is permanently/non-removably attached to at least a portion of the heat exchange member 104, thereby ensuring that there is no possibility of said clip members 105 getting disassembled from said heat exchange member 104 even when the electronic device experience severe vibrations due to vehicle movement. Thus, reliable assembly of each unit of said electronic components 102 with at least a portion of the heat exchange member 104 is ensured. As a result, it is always ensured that each unit of said electronic components 102 remains in thermal contact with at least a portion of the heat exchange member 104. Therefore, heat transfer from each unit of said electronic components 102 to the heat exchange member 104 takes place continuously, ensuring reliable cooling performance of the electronic device.
[00027] Fig.5 depicts said clip members 105 as being assembled to secure a plurality of electronic components 102 to the heat exchange member 104. The design of each unit of said clip members 105 as per the present subject matter makes it feasible to assemble multiple units of said clip members 105 one next to the other in order to secure a plurality of electronic components 102 to the heat exchange member 104 without causing any damage to individual units of said electronic components. For example, the provision of said lancing protrusion 105d (shown in Fig.3) in each unit of said clip members 105, in addition to the provision of guiding surface 104b (shown in Fig.4) in the heat exchange member 104, allows easy flexing of said front tongue portion 105a (shown in Fig.3), for it to expand and get seated over the front surface of each unit of said electronic components 102. The above-described features also contribute in ensuring that only adequate amount of compressive forces are being exerted on each unit of said electronic components, thereby ensuring that no damage is caused to said electronic components 102 due to exertion of excessive compressive forces. In addition, the above-described features also contribute in ensuring that only minimal external (assembly) force is required for assembling said clip members 105 in order to secure said electronic components 102 to the heat exchange member 104.
[00028] Whereas in one embodiment each unit of said clip members 105 are individually assembled, one at a time to secure said electronic components 102 to the heat exchange member 104, in another embodiment said clip members 105 are assembled, all at the same time to secure said electronic components 102 to the heat exchange member 104.
[00029] Fig.6 illustrates a perspective view of at least two clip members integrated with one another to form an integrated clip member as per an embodiment of the present subject matter. In the present embodiment, said integrated clip member 106 is formed by integrating said at least two clip members 105, with a point integration being provided besides said central region of said each unit of said clip members 105. Thus, the integrated clip member 106 may be formed in the form of a single long strip.
[00030] Fig.7 illustrates a top perspective view depicting an assembled condition of said integrated clip member over said electronic components to thermally connect said components with said heat exchange member. An assembly sequence for assembling said integrated clip member 106 involves, firstly sliding said integrated clip member 106 through said clip holding channel 104b of the heat exchange member 104, followed by being pressed with the help of a tool (not shown), so that said electronic components 102 are held to be in thermal contact with the heat exchange member 104. Thus, use of said integrated clip member 106 presents a very simple, convenient and user-friendly way of securing said electronic components 102 to the heat exchange member 104. In addition, use of the integrated clip member 106 reduces assembly time significantly. Assembly using said integrated clip member 106 also helps avoid damage to other nearby electronic components disposed on the circuit board 101, as the chances of said clip member 106 coming in contact with said nearby components is avoided. This is an advantage which is less likely to be achieved while assembling individual units of said clip members.
[00031] As can be made out from the teachings of the present subject matter, the design of said clip members used in the mounting assembly used for securing said electronic components to the heat exchange member of an electronic device is unique and offers several advantages during assembly of said electronic components to the heat exchange member.
[00032] Improvements and modifications may be incorporated herein without deviating from the scope of the invention.