A Process Of Plating Silicon Solar Cell Front Contacts In A Light Induced Plating System With Improved Jig Device

Abstract: The invention relates to a process of plating silicon solar cell front contacts in a light induced plating system with improved jig device the improved jig device comprising a solar cell jig capable of dual mounting of solar cells with titanium connectors for biasing the rear side of the cells; a light source capable of allowing incidence of variable light intensity on the silicon solar cell from outside the bath, disposable in the light induced plating system to allow plating of the solar cell in vertical position; a silver anode in the form of rods, a PPE made LIP tank compatible with the insoluble titanium contact electrode; the method comprising the steps of placing a solar cell vertically in an illuminated electroplating bath having a cyanide-free solution maintained at a constant temperature between 30oC to 40oC; connecting the rear side of said solar cell to a negative electrode of a DC voltage source-rectifier; connecting the positive electrode to a silver anode placed inside the electrolyte, the anode providing the positive silicon (Ag) ions for growth in the silver contact; forming an additional thickness of Ag-plating on the front Ag-grids over the existing seed metal layer due to said growth of positively charged Ag-ions; applying an external voltage between the Ag-anode and the Al-rear contact which forces the Ag-anode to loss electrons so that the back Al layer remains intact, thereby eliminating neither deposition nor dissolution of aluminium contact metal. { FIGURE 1 }

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