Claims:1. A sensor assembly 100 mountable on a vehicle, the sensor assembly 100 includes a sensor 10 generating sensing signals, an electronic circuit 20 connected with the sensor 10 for receiving the sensing signals therefrom, a housing 30 having a first receptacle 32 configured to accommodate the sensor 10 therein hermetically and a second receptacle 34 configured to accommodate the electronic circuit 20 therein; and a lid 40 for covering the second receptacle 34 by mounting thereon, the lid 40 characterizing:
a base 42 with an inner side 42a and an outer side 42b; and
a lining 44 is integrally configured around a periphery of the inner side 42a of the base 42 with the base 42 by a multi-material injection molding process.

2. The sensor assembly 100 as claimed in claim 1, wherein the sensor 10 is an obstacle detection sensor or a parking sensor or a proximity sensor or a Hall Effect sensor is capable of detecting an obstacle in a travel path of the vehicle and generates sensing signals accordingly.

3. The sensor assembly 100 as claimed in claim 1, wherein the sensor assembly 100 includes:
one or more locking pins 80a, 80b, 80c & 80d extending from each side wall 34a or 34b or 34c or 34d of the second receptacle 34 outwardly therefrom;
one or more engaging openings 90a, 90b, 90c & 90d configured on the lid 40,
wherein upon mounting the lid 40 on the second receptacle 34, the locking pins 80a, 80b, 80c & 80d engages with respective engaging openings 90a, 90b, 90c & 90d to configure a snap-fit arrangement 95 therebetween.

4. The sensor assembly 100 as claimed in claim 1, wherein the electronic circuit 20 is connected with the sensor 10 through a wire 50.

5. The sensor assembly 100 as claimed in claim 4, wherein the housing 30 includes a passage 60 configured between the first receptacle 32 and the second receptacle 34 for routing the wire therein.

6. The sensor assembly 100 as claimed in claim 1, wherein the base 42 is made from a hard material, and the lining 44 is made from a flexible material such as Thermoplastic polyurethane (TPU).

7. The sensor assembly 100 as claimed in claim 1, wherein when the lid 40 is mounted on the second receptacle 34, the lining 44 is sandwiched between the base 42 and flanges 45 extending from sidewalls 34a, 34b, 34c & 34d of the second receptacle 34 for sealing the second receptacle 34.
, Description:Field of the Invention

[0001] The present invention relates to a sensor assembly. More specifically, the present invention relates to a sensor assembly, which can be mountable on a vehicle for sensing and process the specific parameters.

Background of the Invention

[0002] Parking sensors are generally mounted on a vehicle, which helps in sensing the presence of an obstacle in a travel path of a vehicle when the vehicle is moving in a reverse direction. Generally, these sensors are assembled in assemblies. The assemblies generally include a housing with receptacles for accommodating these sensors. Further, the housing also includes receptacles to accommodate electronic circuits therein, which are connected with these sensors to receive sensing signals therefrom. The receptacles are generally sealed with covers or potting (encapsulation) materials for protecting the electronic circuits from the external environment.

[0003] Generally, the potting materials have a higher degree of temperature when filling inside the housing. So while pouring the potting material into the housing for sealing the receptacles, the temperature of the potting material and the flow of the potting material may damage the electronic circuit of the sensor assembly. Further, while curing (solidification) of the potting materials, the potting materials may compress. This compression also damages the structural components of the sensor assembly. For conducting specific testing and analysis of a sensor, which is assembled in existing sensor assemblies, potting materials of the sensor assembly needs to be removed. The removal of potting material can again lead to harm of elements on the electronic circuits.

[0004] EP2879128 describes a housing for the ultrasonic sensor. In the housing, the receptacles are sealed with a sealing ring and a cover. The sealing ring and the cover are different structural elements. The housing includes the number of structural elements in the construction. Hence assembling operations of the sensor assembly (the housing) is tedious. Further, the additional sealing will increase the weight of the sensor assembly, thereby increasing the vibration of the sensors, which affects the performance and the life of the sensors.

[0005] US9176220 & JP2012198107 describe an ultrasonic sensor having a transducer and a circuit board. The sensor includes a cover to seal a receptacle having an electronic circuit therein. But, sealing efficacy of these sensors is less.

[0006] Therefore, there is a need for a sensor assembly, which overcomes few or all of the drawbacks of the prior art.
Objects of the Invention

[0007] An object of the present invention is to provide a sensor assembly mountable on a vehicle.

[0008] Another object of the present invention is to provide a sensor assembly mountable on a vehicle, which seals an electronic circuit of the sensor assembly efficiently.

[0009] Yet another object of the present invention is to provide a sensor assembly mountable on a vehicle, which reduces complexity in conducting specific testing and analysis of the sensor assembly.

[0010] One more object of the present invention is to provide a sensor assembly mountable on a vehicle, which is simple in construction.

[0011] Further, one more object of the present invention is to provide a sensor assembly mountable on a vehicle, which has minimal or negligible vibration when the vehicle is moving.

Summary of the invention

[0012] According to the present invention, there is provided with a sensor assembly mountable on a vehicle. The sensor assembly includes a sensor, an electronic circuit, a housing and a lid. The sensor is generating sensing signals. In an embodiment, the sensor is an obstacle detection sensor or a parking sensor or a proximity sensor or a Hall Effect sensor, which is capable of detecting an obstacle in a travel path of the vehicle and generates the sensing signals accordingly.

[0013] The electronic circuit is connected with the sensor through a wire. The electronic circuit is connected with the sensor for receiving the sensing signals therefrom.

[0014] The housing is having a first receptacle and a second receptacle. The first receptacle is configured to accommodate the sensor therein hermetically. Similarly, the second is configured to accommodate the electronic circuit therein. Further, the housing includes a passage configured between the first receptacle and the second receptacle for routing the wire therein.

[0015] The lid is covering the second receptacle by mounting thereon. The lid includes a base with an inner side and an outer side. Further, a lining is integrally configured around a periphery of the inner side of the base by overmolding with the base. In an embodiment, the lining is integrally configured around a periphery of the inner side of the base by a Multi-material injection molding process or by a 2K molding process.

[0016] In a preferred embodiment, the base is made from a hard material, and the lining is made from a flexible material such as Thermoplastic polyurethane (TPU). Further, when the lid is mounted on the second receptacle, the lining is sandwiched between the base and flanges extending from sidewalls of the second receptacle for sealing the second receptacle.

[0017] Further, the sensor assembly includes one or more locking pins extending from each sidewall of the second receptacle 34 outwardly therefrom. Furthermore, the sensor assembly includes one or more engaging openings configured on the lid. Upon mounting the lid on the second receptacle, the locking pins engage with respective engaging openings by a snap-fit arrangement therebetween for sealing the second receptacle.

Brief Description of the Drawings

[0018] The advantages and features of the present invention will be understood better with reference to the following detailed description and claims taken in conjunction with the accompanying drawings, wherein like elements are identified with like symbols, and in which:

[0019] Figure 1 shows an exploded view of a sensor assembly mountable on a vehicle in accordance with the present invention;

[0020] Figures 2a & 2b show isometric views of the assembled sensor assembly of figure 1;

[0021] Figure 2c shows a perspective view of the sensor assembly shown in figures 2a & 2b mountable to a mounting frame of a vehicle;

[0022] Figure 3 shows an exploded view of a lid of the sensor assembly of figure 1;

[0023] Figure 4 shows a perspective view of the assembled lid shown in figure 4a;

[0024] Figure 5 shows a perspective exploded view of the housing and the lid shown in 4b and figure 1;

[0025] Figure 6 shows a flow chart of steps carried out in a method for assembling the sensor assembly shown in figures 1, 2a & 2b ;

Detail Description of the Invention

[0026] An embodiment of this invention, illustrating its features, will now be described in detail. The words "comprising, "having, "containing," and "including," and other forms thereof, are intended to be equivalent in meaning and be open-ended in that an item or items following any one of these words is not meant to be an exhaustive listing of such item or items or meant to be limited to only the listed item or items.

[0027] The terms “first,” “second,” and the like, herein do not denote any order, quantity, or importance, but rather are used to distinguish one element from another, and the terms “an” and “a” herein do not denote a limitation of quantity, but rather denote the presence of at least one of the referenced item.

[0028] The disclosed embodiments are merely exemplary of the invention, which may be embodied in various forms.

[0029] Referring to figures 1, 2a & 2b, various views of a sensor assembly 100 mountable on a vehicle (not shown) in accordance with the present invention are illustrated. The sensor assembly 100 includes a sensor 10, an electronic circuit 20, a housing 30 and a lid 40. In an embodiment, the sensor assembly 100 can be mountable in a mounting bracket 200 of the vehicle using a bezel 210, as shown in figure 2c. More specifically, the sensor assembly 100 is mounted on a rear side of the vehicle.

[0030] In an embodiment, the sensor 10 is an obstacle detection sensor or a parking sensor. The obstacle detection sensor can be a proximity sensor or a Hall Effect sensor capable of detecting an obstacle in a travel path of the vehicle and generates the sensing signals accordingly. In alternative embodiment, the sensor 10 can be a Temperature Sensor or an Accelerometer or an IR Sensor (Infrared Sensor) or a Pressure Sensor or a Light Sensor or an Ultrasonic Sensor or a Smoke, Gas and Alcohol Sensor or a Touch Sensor or a Colour Sensor or a Humidity Sensor or a Tilt Sensor and the like, which is configured to sense a specific parameter and generate sensing signals accordingly. It may be obvious to a person skilled in the art to arrange any other sensor 10 inside the sensor assembly 100.

[0031] Referring back to figure 1, the electronic circuit 20 is configured on a Printed circuit board (PCB) or a microchip. In the present embodiment, the electronic circuit 20 is connected with the sensor 10 through a wire 50. The electronic circuit 20 is connected with the sensor 10 for receiving the sensing signals therefrom.

[0032] The electronic circuit 20 includes a predefined set of hardware and software for receiving and processing the sensing signals received from the sensor 10 and sending processed signals to predefined destinations through an outlet wire (not shown). The outlet wire is routed in an output conduit 70 of the housing 30. The predefined destinations can be a central processor or any such receiving units of the vehicle configured to receive the processed signals thereat, which is obvious to a person ordinarily skilled in the art.

[0033] Referring back to figure 1, the housing 30 is having a first receptacle 32 and a second receptacle 34. The first receptacle 32 is configured to accommodate the sensor 10 therein hermetically. The sensor 10 is hermetically sealed in the first receptacle 32 through a rubber grommet 12. Similarly, the second receptacle 34 is configured to accommodate the electronic circuit 20 therein.

[0034] Further, the housing 30 includes a passage 60 configured between the first receptacle 32 and the second receptacle 34 for routing the wire 50 therein if the first receptacle 32 and the second receptacle 34 need to be connected by the wire 50.

[0035] Referring now to figures 3 and 4, various views of the lid 40 of the sensor assembly 100 in accordance with the present invention are illustrated. The lid 40 is covering the second receptacle 34 by mounting thereon (refer figure 5). More specifically, the lid 40 is configured to cover the opening 33a of the second receptacle 34. The lid 40 includes a base 42 with an inner side 42a and an outer side 42b. Further, a lining 44 is integrally configured around a periphery of the inner side 42b of the base 42 by a Multi-material injection molding process such as overmolding or a 2K molding process with the base 42.

[0036] Overmolding is a process of adding a layer of material over an existing piece or part. Typically, the existing part (substrate material) is placed into an injection molding tool. The layer material is shot into or around the existing part. When the overmold layer material solidifies, the two materials become joined together as a single part. Similarly, the lining is integrally configured around a periphery of the inner side 42b of the base 42 by overmolding. In a preferred embodiment, the lining 44 is integrally configured around a periphery of the inner side 42b of the base 42 by a Multi-material injection molding process specifically by a 2K molding process. With the 2K molding process (technology), it is possible to make a one-piece component comprising regions with different material properties and/or regions made of different materials. The 2K molding process is well known to the person skilled in the art and will therefore not described herein.

[0037] Further, the outer side 42b of the base 42 may be embossed or printed with several markings thereon, as shown in figure 7d. In a preferred embodiment, the base 42 is made from a hard material, and the lining 44 is made from a flexible material such as Thermoplastic polyurethane (TPU). The hard material can be polybutylene terephthalate (PBT) or polyethylene terephthalate (PET) and the like.

[0038] Further, the sensor assembly 100 includes one or more locking pins 80a, 80b, 80c & 80d extending from each side walls 34a or 34b or 34c or 34d of the second receptacle 34 outwardly therefrom. Furthermore, the sensor assembly 100 includes one or more engaging openings 90a, 90b, 90c & 90d configured on the lid 40. Upon mounting the lid 40 on the second receptacle 34, the locking pins 80a, 80b, 80c & 80d engages with respective engaging openings 90a, 90b, 90c & 90d by a snap-fit arrangement 95 therebetween for sealing the second receptacle 34.

[0039] Further, the sensor assembly 100 includes one or more locking pins 80a, 80b, 80c & 80d extending from each side walls 34a or 34b or 34c or 34d of the second receptacle 34 outwardly therefrom. In the present embodiment, the pin 80a is extending from the sidewall 34c. The pin 80b is extending from the sidewall 34d, the pin 80c is extending from the sidewall 34a, and the pin 80d is extending from the sidewall 3b. Furthermore, the sensor assembly 100 includes one or more engaging openings 90a, 90b, 90c & 90d configured on the lid 40.

[0040] Upon mounting the lid 40 on the second receptacle 34, the locking pins 80a, 80b, 80c & 80d engages with respective engaging openings 90a, 90b, 90c & 90d by the snap-fit arrangement 95 therebetween for sealing the second receptacle 34. Further, the lining 44 seals the second receptacle 34 completely by restricting the minute airflow at the flanges 45 of sidewalls 34a, 34b, 34c and 34d of the second receptacle 34. Therefore, the lid 40 isolates the electronic circuit 20 accommodated in the second receptacle 34 from the environment (encapsulating or potting).

[0041] Referring now to figure 6, a flow chart of steps carried out in a method 300 for assembling the sensor assembly 100 mountable on the vehicle in accordance with the present invention is illustrated. For the sake of brevity, the method 300 is explained in conjunction with the sensor assembly 100.

[0042] The method 300 starts at step 310.

[0043] At step 320, the sensor 10 is accommodated and sealed in the first receptacle 32 of the housing 30 of the sensor assembly 100 hermetically using the rubber grommet 12.

[0044] At step 330, the sensor 10 is connected with the electronic circuit 20 through the wire 50.

[0045] At step 340, the electronic circuit 20 is accommodated and fixed in the second receptacle 34 of the housing 30.

[0046] At step 350, the lid 40 is mounted on the second receptacle 34 for covering the opening 33 and sealing the second receptacle 34 (refer figure 2b). Further, the outer side 42b of the lid 40 can be used for Laser marking or printing or creating embosses and the like as shown in figure 2b.

[0047] The method ends at step 360.

[0048] Therefore, the present invention has the advantage of providing the sensor assembly 100 mountable on the vehicle. The lid 40 of the sensor assembly 100 seals the electronic circuit 20 efficiently. The sensor assembly 100 decreases complexity in carrying out specific testing and analysis of the sensor 10 of the sensor assembly 100. The sensor assembly 100 is simple in construction. The sensor assembly 100 has minimal or negligible vibration when the vehicle is moving.

[0049] The foregoing descriptions of specific embodiments of the present invention have been presented for purposes of illustration and description. They are not intended to be exhaustive or to limit the present invention to the precise forms disclosed, and obviously, many modifications and variations are possible in light of the above teaching. The embodiments were chosen and described in order to best explain the principles of the present invention and its practical application, and to thereby enable others skilled in the art to best utilize the present invention and various embodiments with various modifications as are suited to the particular use contemplated. It is understood that various omissions and substitutions of equivalents are contemplated as circumstances may suggest or render expedient. However, such omissions and substitutions are intended to cover the application or implementation without departing from the spirit or scope of the claims of the present invention.