Claims:1. A solid-state relay (10), comprising:
a hollow body (60) configured to house a solid-state relay circuit, wherein the hollow body (60) is mounted over a plurality of rail slot (50); and
one or more connectors (30) for power supply is mounted over top layer of the hollow body (60).
2. The solid-state relay (10) as claimed in claim 1, wherein the hollow body (60) is designed as a cuboidal shaped structure.
3. The solid-state relay (10) as claimed in claim 1, wherein the plurality of rail slot (50) and the hollow body (60) is mechanically coupled by a snap-fit design.
4. The solid-state relay (10) as claimed in claim 1, further comprises heat sink (80) plate mechanically coupled to the hollow body (60) configured to absorb heat produced by the solid-state relay (10).
5. The solid-state relay (10) as claimed in claim 1, further comprises an indicating light (40) configured to show status of the solid-state relay (10), wherein the indicating relay (40) is mounted over the top layer of the hollow body (60).
Dated this the 23rd April 2019
Signature

Vidya Bhaskar Singh Nandiyal
IN/PA-2912
Agent for the Applicant

, Description:FIELD OF INVENTION
[0001] Embodiments of a present disclosure relates to a relay, and more particularly to a compact solid-state relay.
BACKGROUND
[0002] Relays are switching devices that open and close circuits electromechanically or electronically. Relays control one electrical circuit by opening and closing electrical contacts in another circuit. Relays use an electromagnet to mechanically operate a switch. Solid-state relays control power circuits with no interior moving parts. The solid-state relays instead use a semiconductor device to perform switching.
[0003] In conventional approach, a solid-state relay uses a guide rail groove for attachment. Here, the guide rail is formed in a left side of the cavity of the solid-state relay body. The solid-state relay has to slide over the guide rail groove. Here, the space taken by the solid-state relay is excessive. Moreover, the cost of individual installation of components of relay is high. Effective way would be to provide a quick installing rail along with a solid-state relay body.
[0004] Hence, there is a need for an improved compact solid-state relay to address aforementioned issues.
BRIEF DESCRIPTION
[0005] In accordance with one embodiment of the disclosure, a solid-state relay is disclosed. The solid state includes a hollow body. The hollow body is configured to house a solid-state relay circuit. Here, the hollow body is mounted over a plurality of rail slot. The solid-state also includes one or more connectors for power supply. The one or more connectors is mounted over top layer of the hollow body.
[0006] To further clarify the advantages and features of the present disclosure, a more particular description of the disclosure will follow by reference to specific embodiments thereof, which are illustrated in the appended figures. It is to be appreciated that these figures depict only typical embodiments of the disclosure and are therefore not to be considered limiting in scope. The disclosure will be described and explained with additional specificity and detail with the appended figures.
BRIEF DESCRIPTION OF THE DRAWINGS
[0007] The disclosure will be described and explained with additional specificity and detail with the accompanying figures in which:
[0008] FIG. 1 is a top-view schematic representation of an embodiment representing a solid-state relay in accordance with an embodiment of the present disclosure;
[0009] FIG. 2 is a side-view schematic representation of an embodiment representing the solid-state relay in accordance with an embodiment of the present disclosure;
[0010] FIG. 3 is a schematic representation of connectors of the solid-state relay in accordance with an embodiment of the present disclosure;
[0011] FIG. 4 is a schematic representation of rail slot with snap-fit design along with a hollow body of the solid-state relay in accordance with an embodiment of the present disclosure;
[0012] FIG. 5 is a schematic representation of a heat sink of the solid-state relay in accordance with an embodiment of the present disclosure;
[0013] FIG. 6 is an exploded-view schematic representation of an embodiment representing a solid-state relay in accordance with an embodiment of the present disclosure; and
[0014] FIG. 7 is a block diagram representation of a circuit of the solid-state relay in accordance with an embodiment of the present disclosure.
[0016] Further, those skilled in the art will appreciate that elements in the figures are illustrated for simplicity and may not have necessarily been drawn to scale. Furthermore, in terms of the construction of the device, one or more components of the device may have been represented in the figures by conventional symbols, and the figures may show only those specific details that are pertinent to understanding the embodiments of the present disclosure so as not to obscure the figures with details that will be readily apparent to those skilled in the art having the benefit of the description herein.
DETAILED DESCRIPTION
[0017] For the purpose of promoting an understanding of the principles of the disclosure, reference will now be made to the embodiment illustrated in the figures and specific language will be used to describe them. It will nevertheless be understood that no limitation of the scope of the disclosure is thereby intended. Such alterations and further modifications in the illustrated online platform, and such further applications of the principles of the disclosure as would normally occur to those skilled in the art are to be construed as being within the scope of the present disclosure.
[0018] The terms "comprises", "comprising", or any other variations thereof, are intended to cover a non-exclusive inclusion, such that a process or method that comprises a list of steps does not include only those steps but may include other steps not expressly listed or inherent to such a process or method. Similarly, one or more devices or sub-systems or elements or structures or components preceded by "comprises... a" does not, without more constraints, preclude the existence of other devices, sub-systems, elements, structures, components, additional devices, additional sub-systems, additional elements, additional structures or additional components. Appearances of the phrase "in an embodiment", "in another embodiment" and similar language throughout this specification may, but not necessarily do, all refer to the same embodiment.
[0019] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those skilled in the art to which this disclosure belongs. The system, methods, and examples provided herein are only illustrative and not intended to be limiting.
[0020] In the following specification and the claims, reference will be made to a number of terms, which shall be defined to have the following meanings. The singular forms “a”, “an”, and “the” include plural references unless the context clearly dictates otherwise.
[0021] Embodiments of the present invention relates to a solid-state relay. The solid state includes a hollow body. The hollow body is configured to house a solid-state relay circuit. Here, the hollow body is mounted over a plurality of rail slot. The solid-state also includes one or more connectors for power supply. The one or more connectors is mounted over top layer of the hollow body.
[0021] FIG. 1 is a top-view schematic representation of an embodiment representing a solid-state relay (10) in accordance with an embodiment of the present disclosure. As used herein, the term “solid-state relay” is an electronic switching device that switches on or off when an external voltage is applied across the relay control terminals. FIG. 2 is a side-view schematic representation of an embodiment representing the solid-state relay (10) in accordance with an embodiment of the present disclosure. FIG. 6 is an exploded-view schematic representation of an embodiment representing a solid-state relay (10) in accordance with an embodiment of the present disclosure.
[0022] The solid-state relay (10) includes a hollow body (60). The hollow body (60) is configured to house a solid-state relay circuit. In one embodiment, the hollow body (60) is composed of polycarbonate. In such embodiment, the hollow body (60) may withstand temperature in the range of 150 degree centigrade. In another embodiment, the solid-state relay circuit meets UL 94V-0 Flame Retardant standard. As used herein, “flame retardants” refer to a variety of substances that are added to combustible materials to prevent fires from starting or to slow the spread of fire and provide additional escape time.
[0023] In one embodiment, the hollow body (60) is designed as a cuboidal shaped structure. In such embodiment, the cavity of the cuboidal shaped structure houses the circuit of the solid-state relay (10).
[0024] Furthermore, in one embodiment, the hollow body (60) is mounted over a plurality of rail slot (50). In such embodiment, the plurality of rail slot (50) includes a DIN rail. As used herein, the term “DIN rail” is a metal rail of a standard type widely used for mounting circuit breakers and industrial control equipment inside equipment racks. In another embodiment, the DIN slot is of 35 mm. In one embodiment, rail slot (50) is more compact as the solid-state relay is not guided into the groove.
[0025] In another such embodiment, the rail slot (50) may be specifically designed for one specific body of the solid-state relay. In such exemplary embodiment, the rail slot (50) and the body make the solid-state relay (10) compact.
[0026] In another embodiment, the plurality of rail slot (50) and the hollow body (60) is mechanically coupled by a snap-fit design. As used herein, the term “snap-fit” is an assembly method used to attach flexible parts, usually plastic, to form the final product by pushing the parts interlocking components together. (as shown in FIG. 4)
[0027] The solid-state relay (10) also includes the one or more connectors (30). The one or more connectors (30) are used for power supply. In one embodiment, the one or more connectors (30) is mounted over top layer of the hollow body (60). In such embodiment, the power supply will be any power input supply. (as shown in FIG. 3)
[0028] Moreover, in one embodiment, the solid-state relay (10) further comprises a heat sink plate (80). The heat sink plate (80) is mechanically coupled to the hollow body (60). The heat sink plate (80) is configured to absorb heat produced by the solid-state relay during operation. In one embodiment, the heat sink plate (80) is designed in the shape of the solid-state relay body. In another embodiment, the heat sink (80) may be an extruded aluminium material for better absorption of heat. In such embodiment, a screw (90) is used for fixing the heat sink (80) to the solid-state relay body (as shown in FIG. 5). In another embodiment, solid state relays can be designed to switch both AC or DC currents by using a silicon-controlled rectifier (SCR), triode for alternating current (TRIAC) (100) and the like.
[0029] In another embodiment, the solid-state relay (10) further comprises an indicating light (40). The indicating light (40) is configured to show status of the solid-state relay (10). The indicating relay (40) is mounted over the top layer of the hollow body (60). In such embodiment, the indicating light (40) may be a light emitting diode specifically designed to indicate status. As used herein, the term “status” indicates working condition of the solid-state relay.
[0030] In an exemplary embodiment, a solid-state relay circuit uses semiconductor property to open or close a circuit. The solid-state relay circuit uses at least one thyristor, metal-oxide-semiconductor field-effect transistor (MOSFET) and insulated-gate bipolar transistor (IGBT). The solid-state relay circuit also uses an electronic component called opto-isolator, which transfers electrical signals between two isolated circuits by using light. Here, no mechanical parts are being used. (as shown in FIG. 7)
[0031] The FIG. 7 provides a block diagram representation of the working principle of the solid-state relay. In one exemplary embodiment, the solid-state relay to operate requires a trigger circuit. This trigger circuit works for Alternating current (AC) or Direct Current (DC) depending upon the customer requirement. The trigger demands less input power as it works with few milli amperes. Either a Direct Current (DC) power supply or a Programmable Logic Controller (PLC) or a Transistor–transistor logic (TTL) gate can drive the trigger circuit.
[0032] There is an attenuator circuit element to control the input to the optical device which provides electrical isolation to avoid any damage to the input electronic gadgets. Here, the relay is suppressed against the electrical surge in the form of noise that create Electromagnetic Interference (EMI) disturbance, hence a protection is built into the relay to overcome this issue. With the above described protection and opto-isolation the device is made to operate without any electrical disturbance.
[0033] Present disclosure of solid-state relay is ergonomically designed and compact for easy installation. Here, the solid-state relay may be supplied as a whole, which comprises the solid-state relay body and DIN slot. Hence, there is no need for external suppliers to supply components. Present disclosure provides a less expensive switching device and typical applications are switching heaters, lamps, solenoids, capacitors and transformer coils.
[0034] Here, the wear and tear of the solid-state relay are absolutely nil as the solid-state relay lacks mechanical parts. The life expectancy is higher than all other conventional relays. Moreover, space taken by the disclosed solid-state relay is also less compared to all other conventional relays.
[0035] While specific language has been used to describe the disclosure, any limitations arising on account of the same are not intended. As would be apparent to a person skilled in the art, various working modifications may be made to the method in order to implement the inventive concept as taught herein.
[0036] The figures and the foregoing description give examples of embodiments. Those skilled in the art will appreciate that one or more of the described elements may well be combined into a single functional element. Alternatively, certain elements may be split into multiple functional elements. Elements from one embodiment may be added to another embodiment. For example, order of processes described herein may be changed and are not limited to the manner described herein. Moreover, the actions of any flow diagram need not be implemented in the order shown; nor do all of the acts need to be necessarily performed. Also, those acts that are not dependant on other acts may be performed in parallel with the other acts. The scope of embodiments is by no means limited by these specific examples.