TECHNICAL FIELD:
The present disclosure relates to the field of non-destructive technology. Particularly, but not exclusively, the present disclosure relates to a system for non-destructive testing. Further embodiments of the present disclosure discloses system and method for determining a amount of binder in a component.

BACKGROUND OF THE DISCLOSURE:

Generally, non-destructive or non-invasive inspection (NDI) of components involves thorough examination of a structure without harming or damaging the structure or without significant disassembly. Non-destructive inspection is typically preferred to avoid labor, and costs associated with removal of a part for inspection. Non-destructive inspection is advantageous for many applications in which a thorough inspection of the exterior and/or interior of a structure is required. For example, non-destructive inspection is commonly used in the metallurgical industries to inspect various properties of the component and also to determine any type of internal or external damage or defects (flaws) in the materials. Inspection may be performed after the component has been manufactured and before it has been put into service, including field testing, to validate the integrity and fitness of the component. In the field, testing the component for interior defects is an uphill task, and may require destruction of the component. This introduces additional time and labor.

For a composite material manufactured through powder metallurgy route, non-invasive tests form a major part of inspection for uniformity of mixture of the composite materials. In the powder metallurgy process, the mixture of two or more components are mixed with some binder material, then compacted in a die and finally sintered in a furnace. During sintering process, a metallurgical bond is formed between mixture of composite material along with the binder. For example, the tungsten carbide powder may be mixed with some binder material such as cobalt or nickel, then compacted in a die and finally sintered in a furnace. The tungsten-carbide component thus manufactured have very high hardness and finds its applications especially in metal machining, metal forming tools, mining and cutting tips for saw blades etc. Also because of its good thermal conduction property, wear resistance and strength along with high hardness, makes this material an excellent choice for roll rings used in the production of wire rods, plain bars and deformed bars etc. at high rolling speeds. In such components, the percentage of binder contributes largely in controlling the mechanical properties of the components. Density, Young Modulus, wear resistance, compressive strength decreases with increase in percentage of binder which ultimately affects the life span of the components. Generally, the components may be supplied by manufacturers along with a datasheet and are inspected at the plant end only for checking physical dimensions and damages. These components are then sent for further operation before subjecting it to actual operation. Thus, in components where the binder percentage is more, it may undergo unscheduled roll breakage, reduction in pass life, variation in wear pattern which may lead to major concerns for the operators. Therefore, there is no technique to verify the quality of supplied components on site, thus making it difficult to determine the said factors.

The present disclosure is directed to overcome one or more limitations stated above.

SUMMARY OF THE DISCLOSURE

One or more shortcomings of the conventional method are overcome by process as claimed and additional advantages are provided through the provision of processes as claimed in the present disclosure.

Additional features and advantages are realized through the techniques of the present disclosure. Other embodiments and aspects of the disclosure are described in detail herein and are considered a part of the claimed disclosure.

In one non-limiting embodiment of the disclosure, a system for determining percentage of binder in a component is disclosed. The system includes a plurality of acoustic sensor associated with the component at a pre-defined positions. A processing unit is communicatively coupled to the plurality of acoustic sensors. The processing unit is configured to activate each of the plurality acoustic sensors to transmit a wave signal through the component and receive a reflected wave signal corresponding to each of the plurality of acoustic sensors. The processing unit determines a velocity of the received wave signal corresponding to each of the plurality of acoustic sensors. The processing unit determines percentage of the binder in the component by comparing the determined velocity corresponding to each of the plurality of acoustic sensors with predefined velocities. The pre-defined velocities are indicative to the percentage of binder in the component.

In an embodiment of the disclosure, the velocity is determined based on time of flight of the wave signal along a pre-defined thickness of the component.

In an embodiment of the disclosure, the pre-defined data includes percentage of binder in the component which is calibrated in the system.

In an embodiment of the disclosure, the system includes an analyzer associated with the processing unit. The Analyzer is configured to analyse the reflected wave signal corresponding to each of the plurality of acoustic sensors and compare the velocity of the reflected wave signal with pre-defined velocities.

In an embodiment of the disclosure, the plurality of acoustic sensors (103) is configured to transmit sinusoidal wave signal

In an embodiment of the disclosure, the component is a composite material. The component is made of tungsten-carbide.

In an embodiment of the disclosure, the binder is at least one of cobalt and nickel.

In an embodiment of the disclosure, the processing unit determines the percentage of binder at a plurality of locations of the component based on the reflected wave signal from each of the plurality of acoustic sensors positioned at the pre-defined positions to determine homogeneity of binder in the component.

In an embodiment of the disclosure, the system includes a display unit associated with the processing unit. The processing unit is configured to indicate the percentage of binder at the plurality of locations of the component through the display unit.

In an embodiment of the disclosure, the system includes a transmitter communicatively coupled to each of the plurality of acoustic sensors and the processing unit. The transmitter is configured to send an electric pulse to the plurality of acoustic sensors.

In another non-limiting embodiment of the disclosure, a method for determining percentage of binder in a component is disclosed. The method comprises activating by a processing unit, a plurality of acoustic sensors to transmit a wave signal through the component and receive a reflected wave signal corresponding to each of the plurality of acoustic sensors. Also, the method includes determining by the processing unit, velocity of the received wave signal corresponding to each of the plurality of acoustic sensors. The method includes determining by a processing unit, percentage of the binder in the component by comparing the determined velocity corresponding to each of the plurality of acoustic sensors with pre-defined velocities, wherein the pre-defined velocities are indicative of percentage of binder in the component.

In an embodiment of the disclosure, the method includes determining the percentage of binder at a plurality of locations in the component based on the reflected wave signal from each of the plurality of acoustic sensors positioned at the pre-defined positions to determine homogeneity of binder in component.

In an embodiment of the disclosure, the method includes displaying by display unit the percentage of binder in the component on a display unit.

It is to be understood that the aspects and embodiments of the disclosure described above may be used in any combination with each other. Several of the aspects and embodiments may be combined together to form a further embodiment of the disclosure.

The foregoing summary is illustrative only and is not intended to be in any way limiting. In addition to the illustrative aspects, embodiments, and features described above, further aspects, embodiments, and features will become apparent by reference to the drawings and the following detailed description.

BRIEF DESCRIPTION OF THE ACCOMPANYING FIGURES

The novel features and characteristic of the disclosure are set forth in the appended claims. The disclosure itself, however, as well as a preferred mode of use, further objectives and advantages thereof, will best be understood by reference to the following detailed description of an illustrative embodiment when read in conjunction with the accompanying figures. One or more embodiments are now described, by way of example only, with reference to the accompanying figures wherein like reference numerals represent like elements and in which:

FIG.1 illustrates a schematic view of a system used for determining percentage of binder in a component, in accordance with an embodiment of the present disclosure.

FIG.2 illustrates a flowchart of a method of determining percentage of binder in the component, in accordance with an embodiment of the present disclosure.

The figures depict embodiments of the disclosure for purposes of illustration only. One skilled in the art will readily recognize from the following description that alternative embodiments of the structures and methods illustrated herein may be employed without departing from the principles of the disclosure described herein.
DETAILED DESCRIPTION

The foregoing has broadly outlined the features and technical advantages of the present disclosure in order that the detailed description of the disclosure that follows may be better understood. Additional features and advantages of the disclosure will be described hereinafter which form the subject of the claims of the disclosure. It should be appreciated by those skilled in the art that the conception and specific embodiment disclosed may be readily utilized as a basis for modifying or designing other structures for carrying out the same purposes of the present disclosure. It should also be realized by those skilled in the art that such equivalent processes do not depart from the spirit and scope of the disclosure as set forth in the appended claims. The novel features which are believed to be characteristic of the disclosure, both as to its organization and method of operation, together with further objects and advantages will be better understood from the following description when considered in connection with the accompanying figures. It is to be expressly understood, however, that each of the figures is provided for the purpose of illustration and description only and is not intended as a definition of the limits of the present disclosure. It will be readily understood that the aspects of the present disclosure, as generally described herein, and illustrated in the figures, can be arranged, substituted, combined, and designed in a wide variety of different configurations, all of which are explicitly contemplated and make part of this disclosure.

Embodiments of the present disclosure discloses a system for determining percentage of binder in a component. The system may be configured to test the percentage of binder in the component by a non-destructive or non-invasive testing methods. The system of the present disclosure enables assessing the quality of components before using the component for required operation. Also, the system enables detection of percentage of binder in the components at a faster rate.

In an embodiment, the system of the present disclosure includes a plurality of acoustic sensors that may be associated with the component. The plurality of acoustic sensors may be communicatively connected to the component and may be provisioned at pre-determined positions. The plurality of acoustic sensors may be configured to transmit wave signals into the component. In an embodiment, the plurality of acoustic sensors may also be configured to receive a reflected wave signal from the component. Further, each of the plurality of acoustic sensors may be communicatively coupled to a processing unit. The processing unit is configured to activate each of the plurality of acoustic sensors to transmit and receive the wave signals corresponding to each of the plurality of acoustic sensors. A transmitter may also be provided in association with the processing unit and each of the plurality of acoustic sensors. In an embodiment, the transmitter may be configured to send an electric pulse to each of the plurality of acoustic sensors when triggered by a signal received from the processing unit. The plurality of acoustic sensors transmits the wave signal into the component and receive a reflected wave signal.

In an embodiment, the reflected wave signal which may be received by the plurality of acoustic sensors are transmitted to the processing unit. The processing unit may be configured to analyze a time of flight data of the wave signal and the distance travelled by the wave signal in the component. In an embodiment, the distance travelled by the wave signal may be equal to the thickness of the component. Using the time of flight data and the distance travelled by the wave signal, the processing unit may calculate velocity of the wave signal traveled in the component. Further, the processing unit may compare the velocity of the wave signal with a pre-defined velocities calibrated in the system. In an embodiment, the pre-defined velocities may correspond to the percentage of binder in a known component. Thus, based on the determined velocity, the processing unit determines the percentage of binder in the component. In an embodiment, the percentage of binder in the component may be displayed on a display unit coupled to the processing unit. In some embodiments, the processing unit may analyze the velocities of wave signal corresponding to each of the plurality of acoustic sensors. Analyzing the velocities of wave signal corresponding to each of the plurality of acoustic sensors enables determination of homogeneity of the binder in the component.

The terms “comprises”, “comprising”, or any other variations thereof used in the specification, are intended to cover a non-exclusive inclusion, such that an assembly that comprises a list of components or steps does not include only those components or steps but may include other components or steps not expressly listed or inherent to such setup or method. In other words, one or more elements in an assembly proceeded by “comprises… a” does not, without more constraints, preclude the existence of other elements or additional elements in the assembly.

Henceforth, the present disclosure is explained with the help of one or more figures of exemplary embodiments. However, such exemplary embodiments should not be construed as limitation of the present disclosure.

The following paragraphs describe the present disclosure with reference to FIGS.1 and 2. In the figures, the same element or elements which have similar functions are indicated by the same reference signs.

FIG.1 is an exemplary embodiment of the present disclosure, which shows a schematic view of a system (100) used for determining percentage of binder in a component (104). In an embodiment, the component (104) maybe a composite component. The component (104) may be made of a mixture of two or more materials. In some embodiment, the component (104) may be manufactured using mixture of tungsten and carbide materials. The component (104) may be manufactured by processes such as but not limiting to powder metallurgical process. In some embodiments, during the manufacture of the component (104) using mixture of two or more elements, a binder may be added to the mixture. The binder may act as a binding agent for the mixture of two or more materials that may be used to manufacture the component (104). In an embodiment, the binder used may be such as but not limiting to cobalt and nickel. During the process, the mixture of two or more materials that may be used in manufacturing of the component (104) along with the binder may be molded into the desired shape. Upon moulding the mixture of two or more materials, it may be subjected to sintering process i.e. the compacted mixture may be heated to bind the mixture of materials and thus form the component (104). In the present disclosure, the component (104) manufactured may be a ring roll made of materials such as but not limiting to tungsten-carbide mixture along with cobalt as the binder. The use of tungsten-carbide ring-rolls maybe seen in steel industries. These ring rolls may be used on stretch reducing mills. The mechanical properties of the components manufactured by the above described process may significantly be affected by the percentage of binder present in the component (104). In an embodiment, if the percentage of binder in the component (104) of pre-determined thickness is more, it may affect the stiffness, young’s modulus, density, wear resistance and compressive strength of the component (104) thus produced. Thus, it may be important to have a quality control over the percentage of binder in each of the component (104) produced by the above described process. The system (100) of the present disclosure may be used to determine the percentage of binder in the component (104) without destructing the component. Also, the system (100) of the present disclosure may be configured to determine the homogeneity of the binder in the component (104).

The system (100) includes a plurality of acoustic sensors (103). In an embodiment, each of the plurality of acoustic sensors (103) may be associated with the component (104). Each of the plurality of sensors (103) may be disposed at a pre-defined positions on at least one end of the component (104). In an embodiment, the plurality of acoustic sensors (103) may be piezoelectric sensors, electret sensors or fiber-optic sensors, however, not limited to any of this particular sensors. In the present disclosure, each of the plurality of acoustic sensors (103) may be piezoelectric sensors. In an embodiment, each of the plurality of acoustic sensors (103) may be mounted on the component (104). In an embodiment, each of the plurality of acoustic sensors (103) may be configured to transmit and receive wave signals.

The system (100) further includes a processing unit (102). The processing unit (102) may be communicatively coupled or connected to the plurality of acoustic sensors (103). In an embodiment, the processing unit (102) may be communicatively connected to the plurality of acoustic sensors (103) through a transmitter (not shown). The processing unit (102) may be configured to activate the transmitter to send electrical pulse to each of the plurality of acoustic sensors (103). The plurality of acoustic sensors (103) may convert the electrical pulse into wave signals and transmit the wave signal into the component (104). In an embodiment, each of the plurality of acoustic sensors (103) may be configured to receive a wave signal that may be reflected back from the component (104). Upon receiving the reflected wave signal, the plurality of acoustic sensors (103) may convert the wave signal into a processing unit (102) readable electronic pulse. In an embodiment, the processing unit (102), the transmitter (not shown) and the plurality of acoustic sensors (103) may be communicatively connected to a driver circuit (not shown). The driver circuit may be positioned in line between the processing unit (103) and the plurality of acoustic sensors (103). The driver circuit may be configured to strengthen the electric pulse before transmitting it to the plurality of acoustic sensors (103).

The system (100) also includes an analyzer (102a) that may be associated with the processing unit (102). In some embodiments, the analyzer (102a) may form an integral part of the processing unit (102). In another embodiment, the analyzer (102a) may be externally coupled to the processing unit (102). The analyzer (102a) may be configured to analyze the received electric pulse from the reflected wave signal. Also, the analyzer (102a) may be configured to perform an act of comparing the analyzed values with the values calibrated in the system (100) and thus determine the percentage of binder and the homogeneity of the binder in the component (104). In an embodiment, the system (100) may be calibrated with pre-defined values of velocity of the wave signal i.e. including time of flight data of the wave signal in a known component (104) of pre-defined thickness. A plurality of components in which the percentage of binder and thickness is known may be taken and tested in the system (100) and the velocities corresponding to the percentage of binder may be stored in the processing unit (102). In some embodiments, a memory unit may be associated with the processing unit (102) to store the values of percentage of the binder. In an embodiment, the calibration process may be performed before the system (100) is used for determining the percentage of binder in the component (104). The system (100) further includes a display unit (101) that may be communicatively coupled to the processing unit (102) and displays the percentage of binder and the homogeneity of the binder in the component (104). In an embodiment, the homogeneity of the binder in the component (104) may be determined by analyzing and comparing the velocities corresponding to each of the plurality of acoustic sensors (103) at different positions on the component (104). In an embodiment, the deviation of velocities at different positions when compared with the calibrated velocities indicate homogeneity of binder in the component.

Referring now to FIG.2 in conjunction with FIG.1, it is a flow chart illustrating the method of determining the percentage of binder in the component (104). In operation, when the operator desires to determine or perform a quality test of the component (104), the operator may use the system (100) in the following method.

As shown at block 200, the processing unit (102) may activate the plurality of acoustic sensors (103), thereby trigger the transmitter to emit electrical pulse to the plurality of acoustic sensors (103). The plurality of acoustic sensors (103) may receive the electrical pulse, convert the electric pulse into a wave signal that may be capable of travelling through the component (104). In an embodiment, the wave signal may be a sound wave. In an embodiment, the plurality of acoustic sensors (103) may be configured to transmit a sinusoidal wave signal. The plurality of acoustic sensors (103) may transmit the wave signals into the component (104). In an embodiment, the wave signal may be transmitted from one end of the component (104).

As shown at block 202, the wave signal may travel from the transmitted end to another end of the component (104). Further, the wave signal may be reflected back from another end of the component (104). The reflected wave signals may be sensed by the plurality of acoustic sensors (103). The wave signals received by the plurality of acoustic sensors (103) may be converted into electrical pulse and transmitted to the processing unit (102). As shown at block 203, the processing unit (102) along with the analyzer (102a) analyzes the values of the wave signal transformed into electrical pulse. A time of flight data of the wave signal and a distance travelled by the wave signal in the component (104) may be analyzed by the processing unit (102). Further, the processing unit (102) may determine the velocity of the wave signal using the time of flight data and the distance travelled by the wave signal in the component (104). In an embodiment, the distance travelled by the wave signal may be equal to thickness of the component (104). Further, the processing unit (102) may compare the determined velocities of the wave signal with the calibrated velocities or pre-defined velocities. In an embodiment, the pre-defined velocities may correspond to various percentage of binders. Upon comparison of the determined velocity with the pre-defined velocities, the processing unit (102) may determine the percentage of binder in the component (104) and display the same on the display unit (101). In an embodiment, the processing unit (102) may be configured to analyze the wave signal corresponding to each of the plurality of acoustic sensors (103). Analyzing the wave signal corresponding to each of the plurality of acoustic sensors (103) enables the system (100) to determine the homogeneity of the binder in the component (104). In an embodiment, the processing unit (102) may be configured to receive reflected wave signal from different positions on the component (104). Further, the processing unit (102) may analyze and compare the wave signal corresponding to each the plurality of acoustic sensors (103) to determine homogeneity of the binder in the component (104). In an embodiment, the deviation of velocities at different positions when compared with the calibrated velocities indicate homogeneity of binder in the component

The system (100) of the present disclosure enables non-destructive detection or determination of the percentage of binder in the component (104). Also, the system (100) enables faster detection of the percentage of binder in the component (104) unlike the conventional means of testing. The system (100) may be retrofitted on to the component (104) to enable onsite health monitoring which aids in better predictive maintenance.

In an embodiment of the disclosure, the processing unit (102) may be a centralized control unit, or a dedicated control unit associated with the system (100). The control unit may be implemented by any computing systems that is utilized to implement the features of the present disclosure. The control unit may be comprised of a processing unit. The processing unit may comprise at least one data processor for executing program components for executing user- or system-generated requests. The processing unit may be a specialized processing unit such as integrated system (bus) controllers, memory management control units, floating point units, graphics processing units, digital signal processing units, etc. The processing unit may include a microprocessor, such as AMD Athlon, Duron or Opteron, ARM’s application, embedded or secure processors, IBM PowerPC, Intel’s Core, Itanium, Xeon, Celeron or other line of processors, etc. The processing unit may be implemented using a mainframe, distributed processor, multi-core, parallel, grid, or other architectures. Some embodiments may utilize embedded technologies like application-specific integrated circuits (ASICs), digital signal processors (DSPs), Field Programmable Gate Arrays (FPGAs), etc.

In some embodiments, the processing unit may be disposed in communication with one or more memory devices (e.g., RAM, ROM etc.) via a storage interface. The storage interface may connect to memory devices including, without limitation, memory drives, removable disc drives, etc., employing connection protocols such as serial advanced technology attachment (SATA), integrated drive electronics (IDE), IEEE-1394, universal serial bus (USB), fiber channel, small computing system interface (SCSI), etc. The memory drives may further include a drum, magnetic disc drive, magneto-optical drive, optical drive, redundant array of independent discs (RAID), solid-state memory devices, solid-state drives, etc.

Furthermore, one or more computer-readable storage media may be utilized in implementing embodiments consistent with the present disclosure. A computer-readable storage medium refers to any type of physical memory on which information or data readable by a processor may be stored. Thus, a computer-readable storage medium may store instructions for execution by one or more processors, including instructions for causing the processor(s) to perform steps or stages consistent with the embodiments described herein. The term “computer-readable medium” should be understood to include tangible items and exclude carrier waves and transient signals, i.e., are non-transitory. Examples include random access memory (RAM), read-only memory (ROM), volatile memory, non-volatile memory, hard drives, CD ROMs, DVDs, flash drives, disks, and any other known physical storage media.

It is to be understood that a person of ordinary skill in the art may develop a system of similar configuration without deviating from the scope of the present disclosure. Such modifications and variations may be made without departing from the scope of the present invention. Therefore, it is intended that the present disclosure covers such modifications and variations provided they come within the ambit of the appended claims and their equivalents.

Equivalents

With respect to the use of substantially any plural and/or singular terms herein, those having skill in the art can translate from the plural to the singular and/or from the singular to the plural as is appropriate to the context and/or application. The various singular/plural permutations may be expressly set forth herein for sake of clarity.

It will be understood by those within the art that, in general, terms used herein, are generally intended as "open" terms (e.g., the term "including" should be interpreted as "including but not limited to," the term "having" should be interpreted as "having at least," the term "includes" should be interpreted as "includes but is not limited to," etc.). It will be further understood by those within the art that if a specific number of an introduced claim recitation is intended, such an intent will be explicitly recited in the claim, and in the absence of such recitation no such intent is present. For example, as an aid to understanding the description may contain usage of the introductory phrases "at least one" and "one or more" to introduce claim recitations. However, the use of such phrases should not be construed to imply that the introduction of a claim recitation by the indefinite articles "a" or "an" limits any particular claim containing such introduced claim recitation to inventions containing only one such recitation, even when the same claim includes the introductory phrases "one or more" or "at least one" and indefinite articles such as "a" or "an" (e.g., "a" and/or "an" should typically be interpreted to mean "at least one" or "one or more"); the same holds true for the use of definite articles used to introduce claim recitations. In addition, even if a specific number of an introduced claim recitation is explicitly recited, those skilled in the art will recognize that such recitation should typically be interpreted to mean at least the recited number (e.g., the bare recitation of "two recitations," without other modifiers, typically means at least two recitations, or two or more recitations). Furthermore, in those instances where a convention analogous to "at least one of A, B, and C, etc." is used, in general such a construction is intended in the sense one having skill in the art would understand the convention (e.g., "a system having at least one of A, B, and C" would include but not be limited to systems that have A alone, B alone, C alone, A and B together, A and C together, B and C together, and/or A, B, and C together, etc.). In those instances where a convention analogous to "at least one of A, B, or C, etc." is used, in general such a construction is intended in the sense one having skill in the art would understand the convention (e.g., "a system having at least one of A, B, or C" would include but not be limited to systems that have A alone, B alone, C alone, A and B together, A and C together, B and C together, and/or A, B, and C together, etc.). It will be further understood by those within the art that virtually any disjunctive word and/or phrase presenting two or more alternative terms, whether in the description, or drawings, should be understood to contemplate the possibilities of including one of the terms, either of the terms, or both terms. For example, the phrase "A or B" will be understood to include the possibilities of "A" or "B" or "A and B."

While various aspects and embodiments have been disclosed herein, other aspects and embodiments will be apparent to those skilled in the art. The various aspects and embodiments disclosed herein are for purposes of illustration and are not intended to be limiting, with the true scope and spirit being indicated in the description.

Referral Numerals:
Description Reference Number
System 100
Display unit 101
Processing unit 102
Analyser 102a
Acoustic sensors 103
Component to be tested 104
Flow chart block 201-203

We claim:

1. A system (100) for determining percentage of binder in a component (104), the system (100) comprising:
a plurality of acoustic sensors (103) associated with the component (104) at pre-defined positions; and
a processing unit (102) communicatively coupled to the plurality of acoustic sensors (103), wherein the processing unit (102) is configured to:
activate each of the plurality of acoustic sensors (103), to transmit a wave signal through the component (104) and receive a reflected wave signal corresponding to each of the plurality of acoustic sensors (103);
determine velocity of the received wave signal corresponding to each of the plurality of acoustic sensors (103); and
determine percentage of the binder in the component (104) by comparing the determined velocity corresponding to each of the plurality of acoustic sensors (103) with a pre-defined velocities, wherein the pre-defined velocities are indicative of the percentage of binder in the component.

2. The system (100) as claimed in claim 1, wherein the velocity is determined based on time of flight of the wave signal along a pre-defined thickness of the component (104).

3. The system (100) as claimed in claim 1, wherein the pre-defined velocities includes percentage of binder in the component (104) which is calibrated in the system (100).

4. The system (100) as claimed in claim 1 comprises an analyzer (102a) associated with the processing unit (102), wherein the analyzer (102a) is configured to analyze the reflected wave signal corresponding to each of the plurality of acoustic sensors (103) and compare the velocity of the reflected wave signal with the pre-defined velocities.

5. The system (100) as claimed in claim 1, wherein the component (104) is a composite material.

6. The system (100) as claimed in claim 1, wherein the component (104) is made of tungsten-carbide.

7. The system (100) as claimed in claim 1, wherein the binder is at least one of cobalt and nickel.

8. The system (100) as claimed in claim 1, wherein the plurality of acoustic sensors (103) are piezoelectric sensors.

9. The system (100) as claimed in claim 1, wherein the processing unit (102) determines the percentage of binder at a plurality of locations of the component (104) based on the reflected wave signal from each of the plurality of acoustic sensors (103) positioned at the pre-defined positions, to determine homogeneity of binder in the component (104).

10. The system (100) as claimed in claim 1 comprises a display unit (101) associated with the processing unit (102), wherein the processing unit (102) is configured to indicate the percentage of binder at the plurality of locations of the component (104) through the display unit (101).

11. The system (100) as claimed in claim 1 comprises a transmitter communicatively coupled to each of the plurality of acoustic sensors (103) and the processing unit (102), wherein the transmitter is configured to send an electric pulse to the plurality of acoustic sensors (103).

12. The system (100) as claimed in claim 1, wherein plurality of acoustic sensors (103) is configured to transmit sinusoidal wave signal.

13. A method (200) for determining the amount of binder in a component (104), the method (200) comprising:
activating, by a processing unit (102), a plurality of acoustic sensors (103), to transmit a wave signal through the component (104) and receive a reflected wave signal corresponding to each of the plurality of acoustic sensors (103);
determining, by a processing unit (102), velocity of the received wave signal corresponding to each of the plurality of acoustic sensors (103); and
determining, by a processing unit (102), percentage of the binder in the component (104) by comparing the determined velocity corresponding to each of the plurality of acoustic sensors (103) with pre-defined velocities, wherein the pre-defined velocities are indicative of the percentage of binder in the component.

14. The method (200) as claimed in claim 12 comprises determining the percentage of binder at a plurality of locations in the component (104) based on the reflected wave signal from each of the plurality of acoustic sensors (103) positioned at the pre-defined positions, to determine homogeneity of binder in the component (104).

15. The method (200) as claimed in claim 12 comprises displaying by the display unit (101) the percentage of binder in the component (104).

16. The method (200) as claimed in claim 12, wherein the component (104) is made of tungsten carbide.