Description:FORM 2
THE PATENTS ACT, 1970
(39 of 1970)
&
The Patents Rules, 2003
COMPLETE SPECIFICATION
[See section 10, Rule 13]

TITLE OF THE INVENTION: A WEARABLE DEVICE

APPLICANT:
TESSERACT IMAGING LIMITED, A CORPORATION ORGANISED AND EXISTING UNDER THE LAWS OF INDIA, WHOSE ADDRESS IS-5 TTC INDUSTRIAL AREA, RELIANCE CORPORATE IT PARK, THANE BELAPUR ROAD, GHANSOLI, NAVI MUMBAI, MAHARASHTRA – 400 701, INDIA

PREAMBLE TO THE DESCRIPTION
THE FOLLOWING SPECIFICATION PARTICULARLY DESCRIBES THE NATURE OF THIS INVENTION AND THE MANNER IN WHICH IT IS TO BE PERFORMED.

FIELD OF THE INVENTION
[0001] The present invention relates to a wearable device and more particularly relates to the wearable device having a heat dissipating mechanism.
BACKGROUND OF THE INVENTION
[0002] Technologies, such as, Extended Reality (XR) which covers representative forms such as, but not limited to, augmented reality, virtual reality, and mixed reality, provide presentation of virtual and/or digital information and simultaneously provide visualization of a real world to a user. These technologies are, of late, finding various applications in fields ranging from shopping to defense to education to engineering and the like. Generally, the user utilizes a wearable device, such as a Head Mounted Display (HMD) device, to interact in the XR environment. Accordingly, there have been multiple developments to allow the user to visualize the real world and virtually interact with the virtual information.
[0003] In this regard, multiple user-interactive elements and respective electrical components are positioned within the wearable device to allow the user to visualize and interact with the real world. During operation of the wearable device, the electrical components positioned therein tend to generate heat within the wearable device, and as such compromising on safety and performance of the wearable device.
[0004] In order to ensure safety of the wearable device and the user of the wearable device is not compromised due to heat generated by the electrical components, multiple additional arrangements/components are generally embedded within the wearable device. One example of such arrangement/component involves utilization of at least one fan disposed within the wearable device. However, by disposing the fan therein, weight of the wearable device increases and in turn results in a bulkier wearable device leading to discomfort to the user. Further, positioning of the fan within the wearable device, may create designing issues such as, reducing space for positioning other components, and the overall design of the wearable device may have to be changed in order to implement the fan within the wearable device.
[0005] Even if the additional arrangement/component such as the fan is implemented therein, the heat dissipated from the electric components may still be transferred to one or more surfaces of the wearable device, which is in contact with the user leading to overheating of the one or more surfaces, resulting in discomfort to the user and even triggering safety concerns to the user. Due to which, the user maybe prevented from using the wearable device for a prolonged period due to overheating.
[0006] In view of the above, there is a dire requirement for a wearable device having an efficient heat dissipating mechanism in order to overcome at least the above indicated problems.
BRIEF SUMMARY OF THE INVENTION
[0007] One or more embodiments of the present invention provides a wearable device and a method for assembling the wearable device.
[0008] In one aspect of the invention, a wearable device is provided. The wearable device includes a housing having a first exterior surface and a second exterior surface facing a user of the wearable device and a real world environment, respectively, when the wearable device is worn by the user. The wearable device further includes at least one electrical component arranged within the housing and a conductive plate thermally coupled to the at least one electrical component. A heat dissipating element is mounted on the conductive plate and is adapted to absorb heat generated by the at least one electrical component. The wearable device further includes a support structure having a first end and a second end. The first end is thermally coupled to the conductive plate and the second end is thermally coupled to a rear side of the second exterior surface. As such, the support structure is adapted to transfer heat generated by the at least one electrical component to the second exterior surface of the housing.
[0009] In another aspect of the invention, a method is provided. The method includes arranging at least one electrical component within a housing of a wearable device and thermally coupling a conductive plate to the at least one electrical component. The method further includes mounting a heat dissipating element on the conductive plate. The heat dissipating element is adapted to absorb heat generated by the at least one electrical component. Furthermore, the method includes thermally coupling a first end of a support structure to the conductive plate and a second end of the support structure to a rear side of the second exterior surface. As such, the support structure is adapted to transfer heat generated by the at least one electrical component to the second exterior surface of the housing.
[0010] Other features and aspects of this invention will be apparent from the following description and the accompanying drawings. The features and advantages described in this summary and in the following detailed description are not all-inclusive, and particularly, many additional features and advantages will be apparent to one of ordinary skill in the relevant art, in view of the drawings, specification, and claims hereof. Moreover, it should be noted that the language used in the specification has been principally selected for readability and instructional purposes, and may not have been selected to delineate or circumscribe the inventive subject matter, resort to the claims being necessary to determine such inventive subject matter.
BRIEF DESCRIPTION OF THE DRAWINGS
[0011] Reference will be made to embodiments of the invention, examples of which may be illustrated in the accompanying figures. These figures are intended to be illustrative, not limiting. The accompanying figures, which are incorporated in and constitute a part of the specification, are illustrative of one or more embodiments of the disclosed subject matter and together with the description explain various embodiments of the disclosed subject matter and are intended to be illustrative. Further, the accompanying figures have not necessarily been drawn to scale, and any values or dimensions in the accompanying figures are for illustration purposes only and may or may not represent actual or preferred values or dimensions. Although the invention is generally described in the context of these embodiments, it should be understood that it is not intended to limit the scope of the invention to these particular embodiments.
[0012] FIG. 1 is an exemplary illustration of a wearable device, according to one or more embodiments of the present invention;
[0013] FIG. 2a is an exemplary illustration of the wearable device of FIG. 1 including a heat dissipating assembly, according to one or more embodiments of the present invention;
[0014] FIG. 2b is an exemplary illustration of the wearable device of FIG. 1 including the heat dissipating assembly, according to one or more embodiments of the present invention
[0015] FIG. 3 is a top sectional view of the wearable device of FIG. 1, according to one or more embodiments of the present invention; and
[0016] FIG. 4 is a flow chart of a method for assembling the wearable device of FIG. 1, according to one or more embodiments of the present invention.
DETAILED DESCRIPTION OF THE INVENTION
[0017] Reference will now be made in detail to specific embodiments or features, examples of which are illustrated in the accompanying drawings. Wherever possible, corresponding or similar reference numbers will be used throughout the drawings to refer to the same or corresponding parts. References to various elements described herein, are made collectively or individually when there may be more than one element of the same type. However, such references are merely exemplary in nature. It may be noted that any reference to elements in the singular may also be construed to relate to the plural and vice-versa without limiting the scope of the invention to the exact number or type of such elements unless set forth explicitly in the appended claims. Moreover, relational terms such as first and second, and the like, may be used to distinguish one entity from the other, without necessarily implying any actual relationship or between such entities.
[0018] Various embodiments of the invention provide a wearable device and a method for assembling the wearable device.
[0019] In one aspect of the invention, a wearable device is provided. The wearable device includes a housing having a first exterior surface and a second exterior surface facing a user of the wearable device and a real world environment, respectively, when the wearable device is worn by the user. The wearable device further includes at least one electrical component arranged within the housing and a conductive plate thermally coupled to the at least one electrical component. A heat dissipating element is mounted on the conductive plate and is adapted to absorb heat generated by the at least one electrical component. The wearable device further includes a support structure having a first end and a second end. The first end is thermally coupled to the conductive plate and the second end is thermally coupled to a rear side of the second exterior surface. As such, the support structure is adapted to transfer heat generated by the at least one electrical component to the second exterior surface of the housing.
[0020] In another aspect of the invention, a method is provided. The method includes arranging at least one electrical component within a housing of a wearable device and thermally coupling a conductive plate to the at least one electrical component. The method further includes mounting a heat dissipating element on the conductive plate. The heat dissipating element is adapted to absorb heat generated by the at least one electrical component. Furthermore, the method includes thermally coupling a first end of a support structure to the conductive plate and a second end of the support structure to a rear side of the second exterior surface. As such, the support structure is adapted to transfer heat generated by the at least one electrical component to the second exterior surface of the housing.
[0021] In view of the above, below indicated are few technical advantages/technical effects derived from the same.
[0022] The heat dissipating assembly of the wearable device and a method thereof is adapted to dissipate heat efficiently and effectively toward a real world environment without affecting a user of the wearable device. By doing so, the user of the wearable device is not impacted by the dissipated heat.
[0023] Further, the wearable device is compact in nature, due to non-embedding the same with multiple additional components, such as fans, to aid in dissipation of the heat. Thus, the wearable device is not bulky in nature. In addition, not equipping the wearable devices with the multiple additional components reduces the manufacturing costs, and thus aids in achieving economic significance.
[0024] A heat dissipating element as disclosed herein is adapted to spread the heat evenly across the second exterior surface of the wearable device and thereby eliminating risks of formation of hotspots on the wearable device and enhances comfort for the user of the wearable device.
[0025] The wearable device having the heat dissipating mechanism ensures that the heat generated by the at least one electrical component is directed towards the real world and thereby ensuring efficient operation of the at least one electrical component and the wearable device.
[0026] FIG. 1 illustrates an exemplary illustration of a wearable device 100, according to one or more embodiments of the present invention. For the purpose of illustration and description, the wearable device 100, as per a preferred embodiment of the present invention, is embodied as a Head Mounted Display (HMD). However, in alternate embodiments, the wearable device 100 may be one of, but not limited to, a smart watch without deviating from the scope of the present disclosure.
[0027] In this regard, the wearable device 100 includes a frame 105, a first temple 110, and a second temple 115. Each of the first and the second temple 110, 115 is adapted to be coupled to the frame 105 of the wearable device 100 via fasteners. Each of the first and the second temple 110, 115 is adapted to aid in positioning of the wearable device 100 on a head of a user. In an embodiment, the wearable device 105 includes only a single frame which is adapted to position the wearable device 100 on the head of the user.
[0028] Referring to FIGS. 2a and 2b, FIGS. 2a and 2b illustrates a heat dissipating assembly 205 of the wearable device 100, according to one or more embodiments of the present invention. The wearable device 100, or more specifically each of the frame 105 and the first and the second temple 110, 115 of the wearable device 100, includes a housing 210. For the purpose of the explanation, the housing 210 within the frame 105 of the wearable device 105 is considered, as illustrated in FIG.2, and should nowhere be construed as limiting the scope of the present disclosure. In this regard, the housing 210 includes a first exterior surface 215 and a second exterior surface 220 facing the user of the wearable device 100 and a real world environment, respectively. A front side 215a of the first exterior surface 215 is made of thermally non-conductive materials, such as but not limited to, plastics. A rear side 215b of the first exterior surface 215 is made of thermally conductive materials, such as, but not limited to, graphene sheet, with x-y planar conductivity as a lining to reduce hotspot formation thereon. The second exterior surface 220 is made of a conductive material, such as graphene sheets.
[0029] In an embodiment, the housing 210 includes at least one user interaction element 225 (as shown in FIG. 1) positioned thereon. The at least one user interaction element 225 is configured to provide an immersive experience in an Extended Reality (XR) environment to the user. In order to facilitate operation of the at least one user interaction element 225, the housing 210 includes at least one electrical component 230, hereinafter referred to as “the electrical component 230”, electrically coupled to the at least one user interaction element 225. The electrical component 230 is at least one of, but not limited to, transistor, diode, resistor, capacitor and integrated circuit (IC) chips arranged on printed circuit boards (PCB). In one embodiment, the electrical component 230 is adapted to be positioned in proximity to the at least one user interaction element 225. As such, the PCB including the electrical component 230 is coupled to a mounting unit 235 of the at least one user interaction element 225. In another embodiment, the PCB including the electrical component 230 is mounted on the mounting unit 235 such that the PCB is angularly inclined towards the second exterior surface 220 of the housing 210. In yet another embodiment, the electrical components 230 may be coupled to a mounting unit (not shown) of one of the first and the second temple 110, 115 of the wearable device 100.
[0030] The wearable device 100 further includes the heat dissipating assembly 205 positioned within the housing 210. The heat dissipating assembly 205 includes a conductive plate 240 and a heat dissipating element 245. The conductive plate 240 is adapted to be thermally coupled to the electrical component 230. The conductive plate 240 is preferably made of a material, such as, but not limited to, copper, and is adapted to absorb heat generated by the electrical component 230.
[0031] More specifically, the conductive plate 240 is thermally coupled to the electrical components 230 via a first thermal interface element 250. The first thermal interface element 250 is adapted to aid in enhancing the thermal conduction by reducing thermal resistance between the electrical component 230 and the conductive plate 240. In a preferred embodiment, the first thermal interface element 250 is made of silicone. In alternate embodiments, the first thermal interface material 250 is one of, but not limited to, a thermal filler, a thermal paste, a thermal adhesive, a thermal tape, and phase-change materials (PCM).
[0032] The heat dissipating element 245 of the heat dissipating assembly 205 is mounted on the conductive plate 240. The heat dissipating element 245 is adapted to provide a dual phase cooling within the housing 210, or more specifically, is adapted to dissipate the heat generated by the electrical component 230 via the conductive plate 240 and the first thermal interface element 250 towards the real world environment. In this regard, in a preferred embodiment, the heat dissipating element 245 is a heat pipe. Accordingly, the heat pipes are made of materials such as, but not limited to, copper. In an alternate embodiment, the heat dissipating element 245 is a vapor chamber. Further, although the present embodiment is described with respect to a single heat dissipating element 245, it is to be noted that the heat dissipating assembly 230 may include more than one heat dissipating elements 245 positioned therein, without deviating from the scope of the present disclosure.
[0033] The wearable device 100 further includes a support structure 260 positioned within the housing 210. The support structure 260 includes a first end 265 and a second end 270. The first end 265 of the support structure 260 is thermally coupled to the conductive plate 240 and the second end 270 of the support structure 260 is thermally coupled to a rear side 220a of the second exterior surface 220 of the housing 210. In an embodiment, the first end 265 is thermally coupled to the conductive plate 240 and the second end 270 is thermally coupled to the rear side 220a of the second exterior surface 220 via a second thermal interface element (not shown). The second thermal interface element is adapted to aid in enhancing the thermal conduction by reducing thermal resistance between the support structure 260, the heat dissipating element 245, and the rear side 220a of the second exterior surface 220. In a preferred embodiment, the first thermal interface element 250 is an adhesive tape adapted to adhere the first end 265 to the conductive plate 240 and the second end 270 to the rear side 220a of the second exterior surface 220. In alternate embodiments, the second thermal interface element is one of, but not limited to, a thermal filler, a thermal paste, a thermal adhesive, a thermal tape, and phase-change materials (PCM).
[0034] As mentioned earlier, the heat dissipating element 245 is adapted to be mounted on the conductive plate 240. More specifically, the heat dissipating element 245 is mounted on the conductive plate 240 by leaving an air gap 280 between a proximal end 285 of the heat dissipating element 245 and a rear side 215b of the first exterior surface 215 of the housing 210 of the wearable device 100. In a preferred embodiment, due to mounting the heat dissipating element 245 on the conductive plate 240, leaves the air gap 280 of at least 2mm between the proximal end 285 of the heat dissipating element 245 and a rear side 215b of the first exterior surface 215 of the housing 210, advantageously, achieving optimal resistance to transfer of heat.
[0035] More specifically, the air gap 280 provides a spacing between the proximal end 285 and the rear side 215b. Accordingly, a direct conduction of heat between the heat dissipating element 245 and the rear side 215b is eliminated as there exists no direct contact between the heat dissipating element 245 and the rear side 215b. Also, the air gap 280 of at least 2mm aids in insulation of transfer of heat by increasing a thermal resistance to the convection of heat, and thereby achieving optimal resistance to transfer of heat towards the rear side 215b. As such, with respect to the illustrated embodiment, the air gap 280, advantageously, ensures that the heat is directed towards the rear side 220a of the second exterior surface 220, or more specifically towards the real world and not towards the user.
[0036] In addition, in one embodiment, as the conductive plate 240 is thermally coupled to the electrical component 230 coupled to the mounting unit 235 of the at least one user interaction element 225, the heat dissipating assembly 205 may be disposed at a pre-defined angle. The pre-defined angle is dependent on a position and orientation of the at least one user interaction element 225 within the housing 210. Accordingly, the heat dissipating assembly 205 is disposed such that the heat dissipating element 245 is angularly inclined towards the rear side 220a of the second exterior surface 220 of the housing 210.
[0037] In an alternate embodiment, such as when the housing 210 is disposed within at least one of the first and the second temple 110, 115, the heat dissipating assembly 205 may be positioned parallel to the rear side 220a of the second exterior surface 220 of the housing 210.
[0038] With reference to FIG. 2a, FIG. 2b, and FIG. 3, an operation of the wearable device 100 is explained. The at least one interaction element 225 is operated utilizing the electrical component 230. During operation, the electrical component 230 is adapted to generate heat. The heat thus generated is transferred to the conductive plate 240 via the first thermal interface element 250. The heat dissipating element 245 and the support structure 260 is mounted on the conductive plate 240. Accordingly, the heat dissipating element 245 is adapted to absorb the heat from the conductive plate 240.
[0039] As mentioned earlier, in the preferred embodiment, the heat dissipation element 245 is the heat pipe. In this regard and as is well known in the art, the heat pipe includes a wick provided therein. During operation, working fluid is adapted to move through the wick from a condenser portion of the heat pipe to an evaporator portion of the heat pipe. As the working fluid passes through the evaporator portion, the working fluid vaporizes. The vapor, so formed, is thereafter transferred to the condenser portion of the heat pipe. Accordingly, the vapor condenses, thereby releasing the heat at the condenser portion of the heat pipe. More specifically, the evaporator portion of the heat pipe is positioned in contact with the conductive plate 240. As the working fluid passes through the evaporator portion of the heat pipe, the working fluid tends to vaporize. Subsequent to evaporation, the vapor passes through the heat pipe toward the condenser portion. The condenser portion is positioned at a proximal distance from the rear side 215b of the first exterior surface 215. As the vapor flows through the condenser portion, the vapor condenses, thereby releasing the latent heat and achieving the dual phase cooling.
[0040] Subsequently, the latent heat released by the heat pipe is directed towards the rear side 220a of the second exterior surface 220. More specifically, the air gap 280 between the proximal end 285 of the heat pipe (heat dissipating element 245) and the rear side 215b of the first exterior surface 215 ensures no direct contact, and thereby no direct conduction, between the heat pipe and the rear side 215b, thereby providing optimal resistance to the transfer of the latent heat towards the rear side 215a. In addition, as the heat pipe is positioned facing towards the rear side 220a of the second exterior surface 220, the latent heat is directed towards the rear side 220a of the second exterior surface 220 along a convection path 295 as indicated by arrows illustrated in the FIG. 2b. As the second exterior surface 220 is made of thermally conductive material, the second exterior surface 220 absorbs the heat and dissipates the heat to the real world environment, thereby providing a natural convection.
[0041] The heat absorbed by the conductive plate 240 is transferred to the support structure 260. In this regard, the second end 270 of the support structure 260 is thermally coupled to the conductive plate 240 via the second thermal interface element. Further, the first end 265 of the support frame 260 is thermally coupled to the rear side 220a of the second exterior surface 220. Owing to the coupling, the heat is transferred from the conductive plate 240 to the rear side 220a of the second exterior surface 220. Further, as the second exterior surface 220 is made of thermally conductive material, the second exterior surface 220 absorbs the heat and dissipates the heat to the real world environment along a conduction path 290 as indicated by arrows illustrated in FIG. 2b.
[0042] In addition, the heat pipe, advantageously, aids in spreading the heat across the rear side 220a of the second exterior surface 220, thereby providing conduction of heat via the second exterior surface 220, By doing so, advantageously, eliminates formation of hotspots and allows usage of the wearable device 100 for extended periods.
[0043] As such, owing to the arrangement of the heat dissipating element 245 and the support structure 260 and thermal conductivity of the second exterior surface 220, the heat generated by the electrical component 230 is dissipated towards the real world, and not towards the user of the wearable device 100.
[0044] FIG. 4 is a flow chart of a method 400 for assembling the wearable device 100, according to one or more embodiments of the present invention. For the purpose of description, the method 400 is described with the embodiments as illustrated in FIGs 2-3. Further, in order to avoid repetition and for the sake of brevity, the description for the FIGs 2-3 should be referred and should nowhere be construed as limiting the scope of the present disclosure.
[0045] At step 405, the method 400 includes the step of arranging at least one electrical component 230 within a housing 210 of a wearable device 100.
[0046] At step 410, the method 400 includes the step of thermally coupling a conductive plate 240 to the at least one electrical component 230.
[0047] At step 415, the method 400 includes the step of mounting a heat dissipating element 245 on the conductive plate 240. The conductive plate is adapted to absorb heat generated by the at least one electrical component 230. Further, the heat dissipating element 245 is adapted to be mounted on the conductive plate 240 leaving the air gap 280 between the proximal end 285 of the heat dissipating element 245 and the rear side 215b of the first exterior surface 215 of the housing 210 of the wearable device 100. In a preferred embodiment, due to mounting the heat dissipating element 245 on the conductive plate 240, leaves the air gap 280 of at least 2mm between the proximal end 285 of the heat dissipating element 245 and the rear side 215b of the first exterior surface 215 of the housing 210 for, advantageously, achieving optimal resistance to transfer of heat.
[0048] At step 420, the method 400 includes the step of thermally coupling a first end 265 of a support structure 260 to the conductive plate 240 and a second end 270 of the support structure 260 to a rear side 220a of a second exterior surface 220. The support structure 260 is adapted to transfer heat generated by the at least one electrical component 230 to the second exterior surface 220 of the housing 210.
[0049] Various embodiments disclosed herein are to be taken in the illustrative and explanatory sense and should in no way be construed as limiting of the present invention. While aspects of the present invention have been particularly shown and described with reference to the embodiments above, it will be understood by those skilled in the art that various additional embodiments may be contemplated by the modification of the disclosed machines, systems and methods without departing from the scope of what is disclosed. Such embodiments should be understood to fall within the scope of the present invention as determined based upon the claims and any equivalents thereof.
, Claims:CLAIMS:
We Claim:
1. A wearable device comprising:
a housing having a first exterior surface and a second exterior surface facing a user of the wearable device and a real world environment, respectively, when the wearable device is worn by the user;
at least one electrical component arranged within the housing;
a conductive plate thermally coupled to the at least one electrical component;
a heat dissipating element mounted on the conductive plate and adapted to absorb heat generated by the at least one electrical component; and
a support structure having a first end and a second end, the first end thermally coupled to the conductive plate and the second end thermally coupled to a rear side of the second exterior surface, the support structure adapted to transfer heat generated by the at least one electrical component to the second exterior surface of the housing.

2. The wearable device as claimed in claim 1, wherein the heat dissipating element is mounted on the conductive plate leaving an air gap between a proximal end of the heat dissipating element and a rear side of the first exterior surface of the housing.

3. The wearable device as claimed in claim 2, wherein the air gap of at least 2mm is maintained between the proximal end of the heat dissipating element and the rear side of the first exterior surface of the housing for optimal resistance to transfer of heat.

4. The wearable device as claimed in claim 1, wherein the second exterior surface is made of a conductive material.

5. The wearable device as claimed in claim 1, wherein a front side of the first exterior surface is made of thermally non-conductive material and the rear side of the first exterior surface is made of thermally conductive materials with x-y planar conductivity as a lining to reduce hotspots.

6. The wearable device as claimed in claim 1, wherein at least one user interaction element is positioned within the housing and the at least one electrical component is electrically coupled to the at least one user interaction element to aid in operation thereof.

7. The wearable device as claimed in claim 1, wherein the conductive plate is thermally coupled to the at least one electrical component via a first thermal interface element.

8. The wearable device as claimed in claim 7, wherein the heat dissipating element is adapted to absorb heat generated by the at least one electrical component via the first thermal interface element and the conductive plate.

9. The wearable device as claimed in claim 1, wherein the first end of the support structure is thermally coupled to the conductive plate and the second end of the support structure is thermally coupled to the rear side of the second exterior surface via a second thermal interface element.

10. The wearable device as claimed in claim 1, wherein the heat dissipating element is one of a heat pipe and a vapor chamber.

11. A method comprising:
arranging at least one electrical component within a housing of a wearable device;
thermally coupling a conductive plate to the at least one electrical component;
mounting a heat dissipating element on the conductive plate, the heat dissipating element adapted to absorb heat generated by the at least one electrical component; and
thermally coupling a first end of a support structure to the conductive plate and a second end of the support structure to a rear side of the second exterior surface, wherein the support structure is adapted to transfer heat generated by the at least one electrical component to the second exterior surface of the housing.

12. The method as claimed in claim 11, wherein the method further comprises mounting the heat dissipating element on the conductive plate leaving an air gap between a proximal end of the heat dissipating element and a rear side of the first exterior surface of the housing.

Dated this 8th day of June 2022
For,
TESSERACT IMAGING LIMITED
By their Agent

(CHINTHAN JAPHET)
Agent No. IN/PA/2192
K LAW (KRISHNAMURTHY AND CO.)