The present invention relates to the field of well glass apparatus, and in particular, relates to
utilizing light emitting diodes in the well glass apparatus.
BACKGROUND
2 In an emerging era of rapid development in electronic technology, advancement in product
design, appearance, and more obvious sophisticated electronic components used in the
products is observed. A continuous development is recognized in field of light emitting
diodes (hereinafter ‘LED’) too. Generally, these features are reflected in placement of the
LEDs to have enhanced coverage area, luminous capability, high reliability, and improved
production efficiency.
3 Nowadays, well glass apparatus uses LED lighting to illuminate areas and surfaces.
Generally, in the well glass apparatus, the LEDs are mounted on a metal core printed circuit
board. These designs provide a comparable superiority over previously designed well glass
structures. The LEDs which are mounted on the PCB substrate try to meet high precision,
high efficiency and high reliability requirements. Further, it is easy to implement automation
in these structures. Moreover, an emerging trend of development of these assemblies results
in saving of energy and longer life time. This is due to its increased efficiency. Moreover,
these LED assemblies possess environmental benefits too. Due to these benefits, the
structures having the LEDs mounted on the PCB substrate is in a great demand today and
finds many applications. Various applications of such structures include but may not be
limited to lighting of surfaces and lighting of homes.
4 However, present LED based well glass housings illuminate the surfaces only up to an
extent. The presently designed well glass housings fail to provide luminance to a larger
angle. More particularly, these housings do not scatter light in all directions, thereby leading
to inefficient and reduced luminance capabilities. Further, the present well glass housings
increases junction temperature of the LEDs. The junction temperature is highest operating
temperature of a semiconductor in an electronic device. More particularly, the junction
temperature of LEDs is its highest operating temperature in the LED based well glass
housing. The increased junction temperature drastically affects lumen maintenance of the
LEDs placed in the well glass apparatus.
5 In light of the above stated discussion, there is a need for a well glass apparatus that could
overcome the above stated disadvantages. Further, the well glass apparatus should scatter the
light rays in all directions.
SUMMARY
6 In an aspect of the present disclosure, a well glass apparatus is provided. The well glass
apparatus includes a base, a plurality of plates, a plurality of metal core printed circuit boards
and a plurality of lighting assemblies. First end of the base is electrically coupled with a first
arrangement. The first arrangement is a power supply module. The base is a cylindrical
assembly. The plurality of plates is connected to second end of the base. Each of the
plurality of plates is a triangular plate that converges in a vertically inverted pyramidal
configuration. The plurality of metal core printed circuit boards rests on the corresponding
plurality of plates along a corresponding axis of each of the plurality of plates. Each of the
plurality of metal core printed circuit boards includes a thermally conductive and electrically
insulating layer. Each of the plurality of lighting assemblies is adhered to the corresponding
plurality of metal core printed circuit boards via the thermally conductive and electrically
insulating layer. The plurality of lighting assemblies includes a plurality of light emitting
diodes.
7 In an embodiment of the present disclosure, the well glass apparatus includes a top cover.
The top cover encloses the well glass apparatus.
8 In an embodiment of the present disclosure, the thermally conductive and electrically
insulating layer is a ceramic insulating layer.
9 In an embodiment of the present disclosure, each of the plurality of metal core printed circuit
boards is greased with a thermal paste for transferring dissipated heat to a heat sink.
10 In an embodiment of the present disclosure, each of the plurality of metal core printed circuit
boards includes an aluminium substrate. The aluminium substrate is wired with one or more
tinned copper tracks.
11 In an embodiment of the present disclosure, each of plurality of lighting assemblies includes
fifteen series combination arrangements of the plurality of light emitting diodes.
12 In an embodiment of the present disclosure, each of the plurality of light emitting diodes is
arranged on each of the plurality of metal core printed circuit boards.
13 In an embodiment of the present disclosure, the well glass apparatus includes a fixing
structure. The fixing structure includes a plurality of holes fixed on each of the plurality of
metal core printed circuit boards.
14 In an embodiment of the present disclosure, each of the plurality of metal core printed circuit
boards is connected to each other in the well glass apparatus.
15 In an embodiment of the present disclosure, each of the plurality of metal core printed circuit
boards works in series with each other in the well glass apparatus.
BRIEF DESCRIPTION OF THE FIGURES
16 Having thus described the invention in general terms, reference will now be made to the
accompanying drawings, which are not necessarily drawn to scale, and wherein:
17 FIG. 1 illustrates a front view of a well glass apparatus, in accordance with various
embodiments of the present disclosure;
18 FIG. 2A illustrates a top view of the well glass apparatus, in accordance with various
embodiments of the present disclosure;
19 FIG. 2B illustrates a side view of the well glass apparatus, in accordance with various
embodiments of the present disclosure;
20 FIG. 3 illustrates a first metal core printed circuit board, in accordance with various
embodiments of the present disclosure;
21 FIG. 4A illustrates a driver plate of the well glass apparatus, in accordance with various
embodiments of the present disclosure;
22 FIG. 4B illustrates a top view of driver housing, in accordance with various embodiments of
the present disclosure;
23 FIG. 5 illustrates a top cover of the well glass apparatus, in accordance with various
embodiments of the present disclosure;
24 FIG. 6 illustrates a net, in accordance with various embodiments of the present disclosure;
25 FIG. 7A illustrates a housing gasket, in accordance with various embodiments of the present
disclosure;
26 FIG. 7B illustrates a glass gasket, in accordance with various embodiments of the present
disclosure; and
27 FIG. 7C illustrates a driver housing gasket, in accordance with various embodiments of the
present disclosure.
DETAILED DESCRIPTION
28 It should be noted that the terms "first", "second", and the like, herein do not denote any
order, quantity, or importance, but rather are used to distinguish one element from another.
Further, the terms "a" and "an" herein do not denote a limitation of quantity, but rather denote
the presence of at least one of the referenced item.
29 FIG. 1 illustrates front view of a well glass apparatus 100, in accordance with various
embodiments of the present disclosure. The well glass apparatus 100 is a casing and/or an
enclosure for light emitting diode (LED) lamps or any other LED based lights. The LED
lamps have LEDs fitted inside a bulb, lamp or any other lighting device. The LED lights are
high-intensity artificial lights used to illuminate surfaces, areas and the like. In an
embodiment of the present disclosure, the well glass apparatus 100 is a 35 Watts glass
apparatus.
30 The well glass apparatus 100 includes a base 102, a plurality of plates 104, a plurality of
metal core printed circuit boards 106 and a plurality of lighting assemblies 108. Further, the
plurality of plates 104 includes a first plate 104a, a second plate 104b and a third plate 104c.
Further, the plurality of metal core printed circuit boards 106 includes a first metal core
printed circuit board 106a, a second metal core printed circuit board 106b and a third metal
core printed circuit board 106c. The plurality of lighting assemblies 108 includes a first
lighting assembly 108a, a second lighting assembly 108b and a third lighting assembly 108c.
31 The base 102 provides support to the well glass apparatus 100. The base 102 is a cylindrical
assembly. First end of the base 100 is electrically coupled with a first arrangement. The first
arrangement is a power supply module. The power supply module is adapted to supply
power to the well glass apparatus 100. In an embodiment of the present disclosure, the well
glass apparatus 100 consumes the power in a range of 38.0-38.5 Watts.
32 The first plate 104a, the second plate 104b and the third plate 104c extends downward from a
periphery of the base 102. Second end of the base 102 connects and/or supports each of the
plurality of plates 104. In an embodiment of the present disclosure, the first plate 104a, the
second plate 104b and the third plate 104c are made of aluminium die casted alloys. The
aluminium di-casting alloys are alloys made from di-casting of the aluminium metal. The dicasting
is a process that forces a molten metal (herein ‘aluminium’) into a mold cavity by
application of high pressure. Further, each of the plurality of plates 104 is a triangular
shaped plate. Furthermore, each of the plurality of plates 104 converge in vertically inverted
pyramidal configuration. In simpler terms, the first plate 104a, the second plate 104b and the
third plate 104c meet at a point and form a pyramid shape structure of plates.
33 Each of the plurality of metal core printed circuit boards 106 rests on the corresponding
plurality of plates 104 along a corresponding axis of each of the plurality of plates 104. In
simpler terms, the first metal core printed circuit board 106a rests on the first plate 104a
along a first axis. The second metal core printed circuit board 106b rests on the second plate
104b along a second axis. The third metal core printed circuit board 106c rests on the third
plate 104c along a third axis.
34 Each of the plurality of metal core printed circuit boards 106 mechanically supports and
electrically connects various electronic components by utilizing conductive tracks, pads and
other features which are laminated onto a non-conductive substrate. In an embodiment of the
present disclosure, each of the plurality of metal core printed circuit boards 106 is made of
the aluminium di-casting alloys. The aluminium di-casting alloys are the alloys made from
the di-casting of the aluminium metal. The di-casting is the process that forces the molten
metal (herein ‘aluminium’) into the mold cavity by the application of high pressure (as
illustrated above).
35 Further, each of the plurality of metal core printed circuit boards 106 includes an aluminium
substrate. The aluminium substrate is wired with one or more tinned copper tracks.
36 In addition, each of the plurality of metal core printed circuit boards 106 is a metallic board
that can bear large mechanical loads, high temperature, high level of dimensional stability
and the like. Each of the plurality of metal core printed circuit boards 106 includes a
thermally conductive and electrically insulating layer. The thermally conductive and
electrically insulating layer is a ceramic layer. Further, each of the plurality of metal core
printed circuit boards is greased with a thermal paste for transferring dissipated heat to a heat
sink. In an embodiment of the present disclosure, thermal conductivity of the greased
plurality of metal core printed circuit boards is 1W/Mk.
37 In an embodiment of the present disclosure, the first metal core printed circuit board 106a,
the second metal core printed circuit board 106b and the third metal core printed circuit
board 106c are connected to each other in the well glass apparatus 100.
38 In another embodiment of the present disclosure, the first metal core printed circuit board
106a, the second metal core printed circuit board 106b and the third metal core printed
circuit board 106c work in series with each other in the well glass apparatus 100.
39 Further, each of the plurality of lighting assemblies 108 remains adhered to the
corresponding plurality of metal core printed circuit boards 106 via the thermally conductive
and electrically insulating layer. In simpler terms, the first lighting assembly 108a is bonded
to the first metal core printed circuit board 106a, the second lighting assembly 108b is
bonded to the second metal core printed circuit board 106b and the third lighting assembly
108c is bonded to the third metal core printed circuit board 106c.
40 Each of the plurality of lighting assemblies 108 includes a plurality of light emitting diodes.
A light emitting diodes is p-n junction diode that emits light on getting activated. In an
embodiment of the present disclosure, placement of each of the plurality of lighting
assemblies 108 on the pyramidal configuration of the plurality of plates 104 helps to scatter
light in all directions. In an embodiment of the present disclosure, number of the plurality of
light emitting diodes utilized by the well glass apparatus 100 is fifteen.
41 In an embodiment of the present disclosure, junction temperature of the plurality of light
emitting diodes is less than 80 degree Celsius.
42 In an embodiment of the present disclosure, each of the plurality of lighting assemblies 108
includes fifteen series combination arrangements of the plurality of light emitting diodes. In
an embodiment of the present disclosure, each of the plurality of light emitting diodes has a
color temperature of 6500 Kelvin.
43 In an embodiment of the present disclosure, each of the plurality of light emitting diodes is
arranged on each of the plurality of metal core printed circuit boards 106.
44 In an embodiment of the present disclosure, the well glass apparatus 100 includes a fixing
structure. The fixing structure includes a plurality of holes fixed on each of the plurality of
metal core printed circuit boards 106. In an embodiment of the present disclosure, the fixing
structure fixes each of the plurality of metal core printed circuit boards 106 on the
corresponding plurality of plates 104. In another embodiment of the present disclosure, the
fixing structure fixes each of the plurality of lighting assemblies 108 on the corresponding
plurality of metal core printed circuit boards 106.
45 FIG. 2A illustrates a top view of the well glass apparatus 100, in accordance with various
embodiments of the present disclosure. It may be noted that to illustrate system elements of
FIG. 2A, references will be made to the system elements of FIG. 1. The top view of the
well glass apparatus 100 depicts a wiring 200 inside the base 102. In an embodiment of the
present disclosure, the base 102 is a ceramic lamp holder. The ceramic is an inorganic
substance formed by intense heating and subsequent cooling. The ceramic is made from
different compounds of a metal and a non-metal.
46 The wiring 200 are electrically graded copper wirings fitted inside the base 102. The base
102 is connected to the power supply module (as illustrated in detailed description of FIG. 1)
through the wiring 200. The power supply module supplies power to the well glass apparatus
100. In an embodiment of the present disclosure, the well glass apparatus 100 consumes the
power in a range of 38.0-38.5 Watts (as illustrated in detailed description of FIG. 1).
47 FIG. 2B illustrates a side view of the well glass apparatus 100, in accordance with various
embodiments of the present disclosure. It may be noted that to illustrate system elements of
FIG. 2B, references will be made to the system elements of FIG. 1 and FIG. 2A. The side
view of the well glass apparatus 100 show the base 102 along with the wiring 200. Further,
the side view of the well glass apparatus 100 display the first plate 104a, the first metal core
printed circuit board 106a and the first lighting assembly 108a.
48 The first metal core printed circuit board 106a resides on the first plate 104a. The first metal
core printed circuit board 106a mechanically supports and electrically connects the various
electronic components by utilizing the conductive tracks, the pads and the other features
which are laminated onto the non-conductive substrate. In addition, the first metal core
printed circuit board 106a is made of the aluminium di-casting alloys (as described in the
detailed description of FIG. 1). Moreover, the first metal core printed circuit board 106a
includes the thermally conductive and electrically insulating layer (as illustrated in the
detailed description of FIG. 1).
49 Further, the first lighting assembly 108a is bonded to the first metal core printed circuit board
106a via the thermally conductive and electrically insulating layer. The first lighting
assembly 108a includes one or more diodes from the plurality of light emitting diodes.
50 It may be noted that in FIG. 2B, the side view of the well glass apparatus 100 display the
first plate 104a, the first metal core printed circuit board 106a and the first lighting assembly
108a; however those skilled in the art would appreciate that the side view of the well glass
apparatus 100 may display the second plate 104b, the second metal core printed circuit board
106b and the second lighting assembly 108b. Further, the side view of the well glass
apparatus 100 may display the third plate 104c, the third metal core printed circuit board
106c and the third lighting assembly 108c.
51 FIG. 3 illustrates the first metal core printed circuit board 106a, in accordance with various
embodiments of the present disclosure. It may be noted that to illustrate system elements of
FIG. 3, references will be made to the system elements of FIG. 1, FIG. 2A and FIG. 2B.
52 The first metal core printed circuit board 106a rests on the first plate 104a along the first
axis. The first metal core printed circuit board 106a mechanically supports and electrically
connects the various electronic components by utilizing the conductive tracks, the pads and
the other features which are laminated onto the non-conductive substrate. In an embodiment
of the present disclosure, the first metal core printed circuit board 106a is made of the
aluminium di-casting alloys. The aluminium di-casting alloys are the alloys made from the
di-casting of the aluminium metal. The di-casting is the process that forces the molten metal
(herein ‘aluminium’) into the mold cavity by the application of high pressure (as illustrated in
FIG. 1 and FIG. 2B).
53 Further, the first metal core printed circuit board 106a includes the aluminium substrate. The
aluminium substrate is wired with the one or more tinned copper tracks (as illustrated in FIG.
1). Furthermore, the first metal core printed circuit board 106a includes the fixing structure.
The fixing structure includes the plurality of holes fixed on the first metal core printed circuit
board 106a. In an embodiment of the present disclosure, the fixing structure connects the
first metal core printed circuit board106a with the first plate 104a. In another embodiment of
the present disclosure, the fixing structure connects the first lighting assembly 108a with the
first metal core printed circuit board 106a.
54 In addition, the first metal core printed circuit board 106a is the metallic board that can bear
large mechanical loads, high temperature, high level of dimensional stability and the like.
The first metal core printed circuit board 106a includes the thermally conductive and
electrically insulating layer. The thermally conductive and electrically insulating layer is the
ceramic non-conductive layer. Further, each of the plurality of metal core printed circuit
boards is greased with the thermal paste for transferring the dissipated heat to the heat sink
(as illustrated in FIG. 1 and FIG. 2B).
55 Further, the first lighting assembly 108a is bonded to the first metal core printed circuit board
106a via the thermally conductive and electrically insulating layer. The first lighting
assembly 108a includes the plurality of light emitting diodes. The light emitting diode is p-n
junction diode that emits light on getting activated (as illustrated in FIG. 1).
56 It may be noted that in FIG. 3, the first plate 104a , the first metal core printed circuit board
106a and the first lighting assembly 108a are shown; however those skilled in the art would
appreciate that the second plate 104b , the second metal core printed circuit board 106b and
the second lighting assembly 108b can also be shown. It may also be noted that in the FIG.
3, the first plate 104a, the first metal core printed circuit board 106a and the first lighting
assembly 108a are shown; however those skilled in the art would appreciate that the third
plate 104c , the third metal core printed circuit board 106c and the third lighting assembly
108c can also be shown.
57 FIG. 4A illustrates a driver plate 400 of the well glass apparatus 100, in accordance with
various embodiments of the present disclosure. It may be noted that to illustrate system
elements of FIG. 4A, references will be made to the system elements of FIG. 1, FIG. 2A,
FIG. 2B and FIG. 3. The driver plate 400 is mounted on a driver of the first arrangement of
the well glass apparatus 100. The driver regulates power to each of the plurality of light
emitting diodes. Further, the driver maintains power and current flowing through a circuit
during temperature changes in the circuit. In an embodiment of the present disclosure,
voltage range of the driver is 36-56 Volts and current supplied by the driver is 0.7 Amperes.
58 The driver plate 400 is an aluminium di-casted plate. The aluminium di-casting is the
process that forces the aluminium into the mold cavity by the application of high pressure (as
illustrated in detailed description of FIG. 1 and FIG. 2B). In an embodiment of the present
disclosure, the driver plate 400 may be fitted in a plastic enclosure.
59 FIG. 4B illustrates a top view of driver housing 402, in accordance with various
embodiments of the present disclosure. It may be noted that to illustrate system elements of
FIG. 4B, references will be made to the system elements of FIG. 1, FIG. 2A, FIG. 2B, FIG.
3 and FIG. 4A. The driver housing 402 is a cylindrical housing. The driver housing 402
rests on the driver plate 400. Moreover, the driver plate 400 rests on the base 102.
60 The driver housing 402 includes the driver circuit that regulates the current and power
supplied to each of the plurality of light emitting diodes of each of the plurality of lighting
assemblies 108 (as illustrated in detailed description of FIG. 4A). Further, the driver in the
driver housing 402 is an active power factor correction (APFC) driver. The APFC driver
provides an excellent power factor of greater than 0.9. Furthermore, the APFC driver
provides short-circuit protection, over voltage protection and the like.
61 FIG. 5 illustrates a top cover 500 of the well glass apparatus 100, in accordance with various
embodiments of the present disclosure. It may be noted that to illustrate system elements of
FIG. 5, references will be made to the system elements of FIG. 1, FIG. 2A, FIG. 2B, FIG.
3, FIG. 4A and FIG. 4B. The top cover is a glass enclosure for the well glass apparatus 100.
62 The top cover 500 is made of a borosilicate glass. The borosilicate glass is a glass having
silica and boron trioxide as main constituents. The borosilicate glass has low coefficient of
thermal expansion that makes the top cover 500 resistant to thermal shock and thermal stress.
In an embodiment of the present disclosure, the top cover 500 has a coefficient of thermal
expansion in a range of ~3 × 10−6/ C at 20 degree Celsius. The low coefficient of thermal
expansion of the glass of the top cover 500 increases lumen maintenance of the plurality of
light emitting diodes of the plurality of lighting assemblies 108.
63 In an embodiment of the present disclosure, diameter of the top cover 500 is in a range of 5
millimeters to 5.5 millimeters. In an embodiment of the present disclosure, the top cover 500
can withstand rapid temperature variations. Moreover, when subjected to uneven
temperature variations, the top cover 500 tends to crack into larger pieces rather than
shattering.
64 FIG. 6 illustrates a net 600, in accordance with various embodiments of the present
disclosure. It may be noted that to illustrate system elements of FIG. 6, references will be
made to the system elements of FIG. 1, FIG. 2A, FIG. 2B, FIG. 3, FIG. 4A, FIG. 4B and
FIG. 5.
65 The net 600 is a covering net that covers the well glass apparatus 100. In an embodiment of
the present disclosure, the net 600 encloses the top cover 500. The net 600 is made of steel
due to which the net 600 is resistant to corrosion. The net 600 provides an additional
protection to the well glass apparatus 100.
66 FIG. 7A illustrates a housing gasket 700, in accordance with various embodiments of the
present disclosure. It may be noted that to illustrate system elements of FIG. 7A, references
will be made to the system elements of FIG. 1, FIG. 2A, FIG. 2B, FIG. 3, FIG. 4A, FIG.
4B, FIG. 5 and FIG. 6.
67 The housing gasket 700 connects the base 102 with the pyramidal configuration formed by
the plurality of plates 104. Further, the housing gasket 700 connects the base 102 and the
pyramidal configuration with toggles. The housing gasket 700 maintains ingress protection.
The ingress protection includes protection against dust, accidental contact and the like. The
housing gasket 700 is made of silicon.
68 FIG. 7B illustrates a glass gasket 702, in accordance with various embodiments of the
present disclosure. It may be noted that to illustrate system elements of FIG. 5B, references
will be made to the system elements of FIG. 1, FIG. 2A, FIG. 2B, FIG. 3, FIG. 4A, FIG.
4B, FIG. 5, FIG. 6 and FIG. 7A.
69 The glass gasket 702 connects the base 102 and the top cover 500. Further, the glass gasket
702 connects the base 102 and the top cover 500 with the toggles. The glass gasket 702
maintains the ingress protection. The ingress protection includes protection against the dust,
the accidental contact and the like. In an embodiment of the present disclosure, the housing
gasket 700 together with the top cover 500 offer excellent protection against the dust and
moisture. Further, the glass gasket 702 is made of silicon that provides greater tear
resistance.
70 FIG. 7C illustrates a driver housing gasket 704, in accordance with various embodiments of
the present disclosure. It may be noted that to illustrate system elements of FIG. 5C,
references will be made to the system elements of FIG. 1, FIG. 2A, FIG. 2B, FIG. 3, FIG.
4A, FIG. 4B, FIG. 5, FIG. 6, FIG. 7A and FIG. 7B.
71 The driver housing gasket 704 connects the base 102 with the driver. Further, the driver
housing gasket 704 connects the base 102 with the driver by the toggles. The driver housing
gasket 704 maintains the ingress protection. The ingress protection includes protection
against the dust, the accidental contact and the like. Further, the driver housing gasket 704 is
made of silicon that provides the greater tear resistance.
72 The well glass apparatus 100 scatters light in all directions. Further, well glass apparatus 100
a desired lumen output.
73 While the disclosure has been presented with respect to certain specific embodiments, it will
be appreciated that many modifications and changes may be made by those skilled in the art
without departing from the spirit and scope of the disclosure. It is intended, therefore, by the
appended claims to cover all such modifications and changes as fall within the true spirit and
scope of the disclosure.

CLAIMS
What is claimed is:
1. A well glass apparatus comprising:
a base, wherein first end of the base being electrically coupled with a first
arrangement, the first arrangement being a power supply module, and wherein the base
being a cylindrical assembly;
a plurality of plates, wherein the plurality of plates being connected to second end
of the base, each of the plurality of plates being a triangular plate, and wherein each of
the plurality of plates converge in vertically inverted pyramidal configuration;
a plurality of metal core printed circuit boards, wherein each of the plurality of
metal core printed circuit boards rests on the corresponding plurality of plates along a
corresponding axis of each of the plurality of plates, wherein each of the plurality of
metal core printed circuit boards comprises a thermally conductive and electrically
insulating layer; and
a plurality of lighting assemblies, wherein each of the plurality of lighting
assemblies being adhered to the corresponding plurality of metal core printed circuit
boards via the thermally conductive and electrically insulating layer, and wherein the
plurality of lighting assemblies comprises a plurality of light emitting diodes.
2. The well glass apparatus as recited in claim 1, further comprising a top cover, the top
cover encloses the well glass apparatus.
3. The well glass apparatus as recited in claim 1, wherein the thermally conductive and electrically
insulating layer being a ceramic insulating layer.
4. The well glass apparatus as recited in claim 1, wherein each of the plurality of metal core
printed circuit boards being greased with a thermal paste for transferring dissipated heat
to a heat sink.
5. The well glass apparatus as recited in claim 1, wherein each of the plurality of metal core
printed circuit boards comprises an aluminium substrate, the aluminium substrate being
wired with one or more tinned copper tracks.
6. The well glass apparatus as recited in claim 1, wherein each of the plurality of lighting
assemblies comprises fifteen series combination arrangements of the plurality of light
emitting diodes.
7. The well glass apparatus as recited in claim 1, wherein each of the plurality of light emitting
diodes being arranged on each of the plurality of metal core printed circuit boards.
8. The well glass apparatus as recited in claim 1, further comprising a fixing structure,
wherein the fixing structure comprises a plurality of holes fixed on each of the plurality
of metal core printed circuit boards.
9. The well glass apparatus as recited in claim 1, wherein each of the plurality of metal core
printed circuit boards being connected to each other in the well glass apparatus.
10. The well glass apparatus as recited in claim 1, wherein each of the plurality of metal core
printed circuit boards works in series with each other in the well glass apparatus.