WE CLAIM:
1. A method of forming structure on a component, comprising:
providing a component having a first surface;
adhering powder to the first surface; and
directing a beam from a directed energy source to fuse the powder in a pattern corresponding to a layer of the structure.
2. The method as claimed in claim 1 further comprising repeating in a cycle the steps of depositing and fusing to build up the structure in a layer-by layer fashion.
3. The method as claimed in claim 2, wherein the repeating cycle of depositing and fusing results in the component including both fused and un-fused powder, the method further comprising removing the un-fused powder.
4. The method as claimed in claim 1, wherein the first surface is non-planar.
5. The method as claimed in claim 1, wherein the powder is adhered to the first surface by:
applying an adhesive to the first surface; and

applying powder to the adhesive.
6. The method as claimed in claim 5 further comprising removing excess powder after the powder is applied to the adhesive.
7. The method as claimed in claim 1, wherein the component comprises a metal alloy.
8. The method as claimed in claim 1, wherein the powder comprises a metal alloy.
9. A method of forming a cooling channel on a component, comprising:
providing a component having a first surface;
adhering powder to the first surface;
directing a beam from a directed energy source to fuse the powder in a predetermined pattern; and
repeating in a cycle the steps of depositing and fusing to build up the structure in a layer-by layer fashion, wherein the structure includes spaced-apart walls which define at least one open channel therebetween.
10. The method as claimed in claim 9 further comprising forming at

least one coolant supply hole in the component communicating with the at least one open channel.
11. The method as claimed in claim 9 further comprising forming a
cover spanning the at least one open channel.
12. The method as claimed in claim 11 further comprising:
leaving un-fused powder in the at least one open channel;
forming the cover; and
removing the un-fused powder.
13. The method as claimed in claim 12 further comprising forming at least one exit film hole through the cover communicating with the channel.
14. The method as claimed in claim 11, wherein the cover is formed by:
adhering powder over the channels;
directing a beam from a directed energy source to fuse the powder in a pattern corresponding to a layer of the cover; and
repeating in a cycle the steps of depositing and fusing to build up the cover in a layer-by layer fashion.

15. The method as claimed in claim 9, wherein the first surface is non-planar.
16. The method as claimed in claim 9, wherein the powder is adhered to the first surface by:
applying an adhesive to the first surface; and
applying powder to the adhesive.
17. The method as claimed in claim 16 further comprising removing excess powder after the powder is applied to the adhesive.
18. The method as claimed in claim 9, wherein the component comprises a metal alloy.
19. The method as claimed in claim 9, wherein the powder comprises a metal alloy.