Adhesive Film

Abstract: The present application relates to an adhesive film which can be used for sealing or encapsulating an organic electronic element. An illustrative example of an adhesive film may comprise an adhesive layer on the surface thereof having one or more grooves for discharging air.

Patent Information

Application #

Filing Date

09 May 2014

Publication Number

41/2015

Publication Type

INA

Invention Field

POLYMER TECHNOLOGY

Status

Email

patent@depenning.com

Parent Application

Applicants

LG CHEM LTD.

128 Yeoui daero Yeongdeungpo gu Seoul 150 721

Inventors

1. YOO Hyun Jee

5 102 LG Employee Apt. Doryong dong Yuseong gu Daejeon 305 340

2. CHANG Suk Ky

7 401 Science ville 257 14 Wonchon dong Yuseong gu Daejeon 305 370

3. SHIM Jung Sup

4 1304 Hangaram Apt. Tanbang dong Seo gu Daejeon 302 762

4. CHO Yoon Gyung

2 108 LG Employee Apt. 386 1 Doryong dong Yuseong gu Daejeon 305 340

5. LEE Seung Min

3 503 LG Employee Apt. 388 11 Doryong dong Yuseong gu Daejeon 305 340

Specification

Documents

Application Documents

#	Name	Date
1	1676-2014.pdf	2014-05-13
2	1676-2014 OTHERS.pdf	2014-05-13
3	1676 form 5.pdf	2014-05-13
4	1676 form 3.pdf	2014-05-13
5	3520-CHENP-2014 POWER OF ATTORNEY 31-10-2014.pdf	2014-10-31
6	3520-CHENP-2014 FORM-1 31-10-2014.pdf	2014-10-31
7	3520-CHENP-2014 CORRESPONDENCE OTHERS 31-10-2014.pdf	2014-10-31
8	3520-CHENP-2014 FORM-3 07-11-2014.pdf	2014-11-07
9	3520-CHENP-2014 CORRESPONDENCE OTHERS 07-11-2014.pdf	2014-11-07
10	3520-CHENP-2014-FER.pdf	2018-07-11
11	3520-CHENP-2014-AbandonedLetter.pdf	2019-01-16

Search Strategy

1	SearchStrategy_18-05-2018.pdf