1 FORM 2 THE PATENTS ACT, 1970 (39 of 1970) & THE PATENTS RULES, 2003 COMPLETE SPECIFICATION [See section 10, Rule 13] ADHESIVE MEMBER, ADHESION METHOD, AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE CASING; MITSUBISHI ELECTRIC CORPORATION, A CORPORATION ORGANISED AND EXISTING UNDER THE LAWS OF JAPAN, WHOSE ADDRESS IS 7-3, MARUNOUCHI 2-CHOME, CHIYODA-KU, TOKYO 100-8310, JAPAN THE FOLLOWING SPECIFICATION PARTICULARLY DESCRIBES THE INVENTION AND THE MANNER IN WHICH IT IS TO BE PERFORMED. 2 Description Technical Field [0001] The present invention relates to an 5 adhesive member, an adhesion method using the above-mentioned adhesive member, and a method of manufacturing an electronic device casing using the above-mentioned adhesion method. 10 Background Art [0002] A metal casing used as a casing of an electronic device is disclosed in Patent Literature 1. The metal casing includes a casing main body made of metal, and metal components such as a side wall portion, bosses, and a rib. Each of the 15 metal components is joined to the casing main body with a conductive adhesive containing metal powder. Citation List Patent Literature 20 [0003] [PTL 1] JP 2003-258445 A Summary of Invention Technical Problem [0004] When adherend members are adhered to each other with 25 an adhesive as in the metal casing, the adhesive is applied to 3 one of the adherend members, and the other of the adherend members and the one of the adherend members are bonded to each other via the adhesive. In general, after the adherend members are bonded to each other, positions of the adherend members are not adjusted. This is because it is difficult 5 to shift the positions of the adherend members in contact with the adhesive, or because when the positions of the adherend members in contact with the adhesive are shifted, the amount of the adhesive becomes partially insufficient due to a flow of the adhesive, with the 10 result that sink marks or bubbles are formed in the cured adhesive layer. Thus, positional alignment of the adherend members is required to be performed so as to prevent contact of the other of the adherend members with the adhesive before the adherend members are bonded to each other. Thus, there is a 15 problem in that, when the adherend members are to be adhered to each other, it is difficult to accurately perform positional alignment of the adherend members. [0005] The present invention has been made to solve the problem described above, and has an object to provide an adhesive 20 member, an adhesion method, and a method of manufacturing an electronic device casing, which enable accurate positional alignment of adherend members. Solution to Problem 25 [0006] According to the present invention, an adhesive 4 member includes: a first pin portion to be inserted into a first hole formed in a first adherend member; a second pin portion which is to be inserted into a second hole formed in a second adherend member to be adhered to the first adherend member, and is formed coaxially with the first pin portion; 5 and a flange portion which is formed using an adhesive, and is mounted to a side surface of the first pin portion or a side surface of the second pin portion in a flange shape. According to the present invention, an adhesion method 10 includes adhering the first adherend member and the second adherend member to each other using the adhesive member of the present invention. According to the present invention, a method of manufacturing an electronic device casing includes manufacturing 15 an electronic device casing using the adhesion method of the present invention. Advantageous Effects of Invention [0007] According to the present invention, it is possible 20 to perform accurate positional alignment of the adherend members. Brief Description of Drawings [0008] FIG. 1 is a sectional view for schematically illustrating a configuration of an adhesive member according to 25 a first embodiment. 5 FIG. 2 is a sectional view for illustrating a flow of a process of adhering a first adherend member and a second adherend member to each other using the adhesive members according to the first embodiment. FIG. 3 is a sectional view for illustrating 5 a flow of a process of adhering the first adherend member and the second adherend member to each other using the adhesive members according to the first embodiment. FIG. 4 is a sectional view for illustrating a flow of a 10 process of adhering the first adherend member and the second adherend member to each other using the adhesive members according to the first embodiment. FIG. 5 is a sectional view for illustrating a flow of a process of adhering the first adherend member and the second 15 adherend member to each other using the adhesive members according to the first embodiment. FIG. 6 is a view for illustrating a schematic configuration of an electronic device casing manufactured using the adhesive members according to the first embodiment, and application 20 examples of the electronic device casing. FIG. 7 is a sectional view for schematically illustrating a configuration of an adhesive member according to a second embodiment. FIG. 8 is a sectional view for illustrating a flow of a 25 process of adhering the first adherend member and the second 6 adherend member to each other using the adhesive members according to the second embodiment. FIG. 9 is a sectional view for illustrating a flow of a process of adhering the first adherend member and the second adherend member to each other using the 5 adhesive members according to the second embodiment. FIG. 10 is a sectional view for illustrating a flow of a process of adhering the first adherend member and the second adherend member to each other using the adhesive members 10 according to the second embodiment. FIG. 11 is a sectional view for illustrating a flow of a process of adhering the first adherend member and the second adherend member to each other using the adhesive members according to the second embodiment. 15 FIG. 12 is a sectional view for schematically illustrating a configuration of an adhesive member according to a third embodiment. FIG. 13 is a sectional view for illustrating a flow of a process of adhering the first adherend member and the second 20 adherend member to each other using the adhesive members according to the third embodiment. FIG. 14 is a sectional view for illustrating a flow of a process of adhering the first adherend member and the second adherend member to each other using the adhesive members 25 according to the third embodiment. 7 FIG. 15 is a sectional view for illustrating a flow of a process of adhering the first adherend member and the second adherend member to each other using the adhesive members according to the third embodiment. FIG. 16 is a sectional view for illustrating 5 a flow of a process of adhering the first adherend member and the second adherend member to each other using the adhesive members according to the third embodiment. FIG. 17 is a sectional view for schematically illustrating 10 a configuration of an adhesive member according to a fourth embodiment. FIG. 18 is a sectional view for illustrating a flow of a process of adhering the first adherend member and the second adherend member to each other using the adhesive members 15 according to the fourth embodiment. FIG. 19 is a sectional view for illustrating a flow of a process of adhering the first adherend member and the second adherend member to each other using the adhesive members according to the fourth embodiment. 20 FIG. 20 is a sectional view for illustrating a flow of a process of adhering the first adherend member and the second adherend member to each other using the adhesive members according to the fourth embodiment. FIG. 21 is a sectional view for illustrating a flow of a 25 process of adhering the first adherend member and the second 8 adherend member to each other using the adhesive members according to the fourth embodiment. FIG. 22 is a sectional view for schematically illustrating a configuration of an adhesive member according to a fifth 5 embodiment. FIG. 23 is a sectional view for illustrating a flow of a process of adhering the first adherend member and the second adherend member to each other using the adhesive members according to the fifth embodiment. 10 FIG. 24 is a sectional view for illustrating a flow of a process of adhering the first adherend member and the second adherend member to each other using the adhesive members according to the fifth embodiment. FIG. 25 is a sectional view for illustrating a flow of a 15 process of adhering the first adherend member and the second adherend member to each other using the adhesive members according to the fifth embodiment. FIG. 26 is a sectional view for illustrating a flow of a process of adhering the first adherend member and the second 20 adherend member to each other using the adhesive members according to the fifth embodiment. FIG. 27 is a sectional view for schematically illustrating a configuration of an adhesive member according to a sixth embodiment. 25 FIG. 28 is a sectional view for illustrating a flow of a 9 process of adhering the first adherend member and the second adherend member to each other using the adhesive members according to the sixth embodiment. FIG. 29 is a sectional view for illustrating a flow of a process of adhering the first adherend member 5 and the second adherend member to each other using the adhesive members according to the sixth embodiment. FIG. 30 is a sectional view for illustrating a flow of a process of adhering the first adherend member and the second 10 adherend member to each other using the adhesive members according to the sixth embodiment. FIG. 31 is a sectional view for illustrating a flow of a process of adhering the first adherend member and the second adherend member to each other using the adhesive members 15 according to the sixth embodiment. FIG. 32 is a sectional view for illustrating a flow of a process of adhering the first adherend member and the second adherend member to each other using the adhesive members according to the sixth embodiment. 20 FIG. 33 is a sectional view for schematically illustrating a configuration of an adhesive member according to a seventh embodiment. FIG. 34 is a sectional view for schematically illustrating a modification example of the configuration of the adhesive 25 member according to the seventh embodiment. 10 FIG. 35 is a sectional view for schematically illustrating a configuration of an adhesive member according to an eighth embodiment. FIG. 36 is a sectional view for schematically illustrating a configuration of an adhesive member according 5 to a ninth embodiment. Description of Embodiments [0009] First Embodiment 10 An adhesive member, an adhesion method, and a method of manufacturing an electronic device casing according to a first embodiment are described. FIG. 1 is a sectional view for schematically illustrating a configuration of an adhesive member 11 according to this embodiment. As illustrated in FIG. 1, the 15 adhesive member 11 according to this embodiment includes a first pin portion 30, a second pin portion 40, and a flange portion 50. The adhesive member 11 is a member used for adhesion between a first adherend member 100 and a second adherend member 110 described later. 20 [0010] The first pin portion 30 has, for example, a columnar shape. An axial direction of the first pin portion 30 is an upand- down direction in FIG. 1. The first pin portion 30 includes a bottom portion 31, a distal end portion 32, and a side surface 33. The bottom portion 31 is one axial end portion of the first 25 pin portion 30, and is an end portion connected to the second 11 pin portion 40. The distal end portion 32 is the other axial end portion of the first pin portion 30. The distal end portion 32 is located below the bottom portion 31 in FIG. 1. The distal end portion 32 is formed in a flat surface shape perpendicular to the axial direction. The side surface 33 5 is located between the bottom portion 31 and the distal end portion 32, and is formed in a cylindrical surface shape. A portion between the side surface 33 and the distal end portion 32 is round-chamfered as required. The first pin portion 30 is inserted into a first 10 hole 101, which is described later, formed in the first adherend member 100 from the distal end portion 32 side. The first pin portion 30 is formed using metal or resin. Similarly to the flange portion 50, the first pin portion 30 may be formed using an adhesive. 15 [0011] The second pin portion 40 is formed integrally with the first pin portion 30, and has a columnar shape coaxial with the first pin portion 30. The second pin portion 40 has a diameter φ2 larger than a diameter φ1 of the first pin portion 30. The second pin portion 40 includes a bottom portion 41, a 20 distal end portion 42, and a side surface 43. The bottom portion 41 is one axial end portion of the second pin portion 40, and is an end portion connected to the first pin portion 30. The distal end portion 42 is the other axial end portion of the second pin portion 40. The distal end portion 42 is located above the 25 bottom portion 41 in FIG. 1. The distal end portion 42 is formed 12 in a flat surface shape perpendicular to the axial direction. The side surface 43 is located between the bottom portion 41 and the distal end portion 42, and is formed in a cylindrical surface shape. A portion between the side surface 43 and the distal end portion 42 is round-chamfered 5 as required. [0012] An inner peripheral portion of the bottom portion 41 of the second pin portion 40 is connected to the bottom portion 31 of the first pin portion 30. An annular step surface 41a is formed on an outer peripheral portion of the bottom portion 41 10 by a difference between the diameter φ2 of the second pin portion 40 and the diameter φ1 of the first pin portion 30. The step surface 41a is a flat surface perpendicular to the axial direction of the second pin portion 40. The second pin portion 40 is inserted into a second hole 111, which is described later, 15 formed in the second adherend member 110 from the distal end portion 42 side. The second pin portion 40 is inserted into the second hole 111 of the second adherend member 110 after the first pin portion 30 is inserted into the first hole 101 of the first adherend member 100. The second pin portion 40 is formed using, 20 for example, the same material as the first pin portion 30. [0013] The first pin portion 30 and the second pin portion 40 mainly have a function to perform positional alignment of the first adherend member 100 and the second adherend member 110. It is preferred that the first pin portion 30 and the second pin 25 portion 40 have a strength that withstands stress generated 13 between the first adherend member 100 and the second adherend member 110 in a period until an adhesive layer 60 described later is formed between the first adherend member 100 and the second adherend member 110. After the adhesive layer 60 is formed, the strength of an adherend in which the first adherend 5 member 100 and the second adherend member 110 are adhered to each other is obtained by the adhesive layer 60. Thus, the first pin portion 30 and the second pin portion 40 are not required to be treated as a strength member for obtaining the strength of the adherend. 10 [0014] The flange portion 50 is mounted to the side surface 43 of the second pin portion 40 in a flange shape. The flange portion 50 is formed, for example, in an annular shape so as to surround the entire periphery of the side surface 43. The flange portion 50 is formed using an adhesive. The flange portion 50 15 is in a solid state at normal temperature, for example, at 27°C. That is, the state of the adhesive forming the flange portion 50 at normal temperature is a solid or a fluid having a high viscosity to such a degree that its own shape is maintained. The adhesive forming the flange portion 50 is not easily deformed 20 only by contact with the first adherend member 100 and the second adherend member 110, which are described later, and has a property that a high adhesive strength is not exhibited at normal temperature. As the adhesive, for example, a reaction-curable hot-melt adhesive or a thermosetting adhesive which is solid at 25 normal temperature is used. 14 [0015] The flange portion 50 is formed in a plate shape along a plane perpendicular to the axial direction of the first pin portion 30 and the second pin portion 40. The flange portion 50 includes a surface 51 located on the first pin portion 30 side, and a surface 52 located on a side opposite 5 to the surface 51. The surface 51 is formed, for example, on the same plane as the step surface 41a. A thickness of the flange portion 50 in the axial direction is smaller than a length of the second pin portion 40 in the axial direction. Further, the thickness of 10 the flange portion 50 in the axial direction is larger than a thickness of the adhesive layer 60 described later. The flange portion 50 may be mounted to the side surface 33 of the first pin portion 30. Further, the flange portion 50 may be mounted across the side surface 33 and the side surface 43. 15 [0016] Next, a process of adhering the first adherend member 100 and the second adherend member 110 to each other using the adhesive members 11 according to this embodiment is described. FIG. 2 to FIG. 5 are sectional views for illustrating a flow of a process of adhering the first adherend member 100 and the 20 second adherend member 110 to each other using the adhesive members 11 according to this embodiment. In FIG. 2 to FIG. 5, two adhesive members 11 are used for the adhesion between the first adherend member 100 and the second adherend member 110, but the number of the adhesive members 11 may be three or more. 25 Further, both the first adherend member 100 and the second 15 adherend member 110 illustrated in FIG. 2 to FIG. 5 have a flat plate shape, but the shapes of the first adherend member 100 and the second adherend member 110 are not limited to the flat plate shape. [0017] As illustrated in FIG. 2, the first 5 holes 101 are formed in a surface 100a being an adhesion surface of the first adherend member 100. The first holes 101 are each a hole into which the first pin portion 30 of the adhesive member 11 is to be inserted so as to perform positional alignment of the first 10 adherend member 100 and the second adherend member 110. The first holes 101 penetrate from the surface 100a to a surface 100b which is a surface opposite to the surface 100a. That is, a depth dimension of the first hole 101 is equal to a distance between the surface 100a and the surface 100b. The depth 15 dimension of the first hole 101 is smaller than a length dimension of the first pin portion 30 in the axial direction. The first pin portion 30 is formed, for example, so as to have a fitting relationship with the first hole 101. Examples of the fitting relationship include clearance fitting, interference 20 fitting, and intermediate fitting are given. Further, the first hole 101 has a diameter smaller than the diameter φ2 of the second pin portion 40. Although the two first holes 101 are illustrated in FIG. 2, the number of the first holes 101 may be three or more. 25 [0018] The second holes 111 are formed in a surface 110a 16 being an adhesion surface of the second adherend member 110. The second holes 111 are each a hole into which the second pin portion 40 of the adhesive member 11 is to be inserted so as to perform positional alignment of the first adherend member 100 and the second adherend member 110. The 5 second holes 111 penetrate from the surface 110a to a surface 110b which is a surface opposite to the surface 110a. That is, a depth dimension of the second hole 111 is equal to a distance between the surface 110a and the surface 110b. The depth dimension of the second 10 hole 111 is smaller than a length dimension of the second pin portion 40 in the axial direction. Although the two second holes 111 are illustrated in FIG. 2, the number of the second holes 111 may be three or more. [0019] In the process of adhering the first adherend member 15 100 and the second adherend member 110 to each other, first, as illustrated in FIG. 3, the first pin portion 30 of each adhesive member 11 is inserted into the first hole 101 of the first adherend member 100. An insertion depth of the first pin portion 30 is limited to a certain depth by contact of the step surface 20 41a of the second pin portion 40 or the surface 51 of the flange portion 50 with the surface 100a of the first adherend member 100. When the first pin portion 30 and the first hole 101 are in a fitting relationship, the first pin portion 30 can be prevented from easily coming off from the first hole 101. Thus, 25 at least in a process from insertion of the first pin portion 30 17 into the first hole 101 to formation of the adhesive layer 60, the adhesive member 11 can be fixed to the first adherend member 100. Through insertion of the first pin portion 30 into the first hole 101, the flange portion 50 formed using an adhesive is arranged on the surface 100a of the first adherend 5 member 100. [0020] Next, as illustrated in FIG. 4, the surface 110a of the second adherend member 110 is opposed to the surface 100a of the first adherend member 100, and a portion protruding from the flange portion 50 in the second pin portion 40 of each adhesive 10 member 11 is inserted into the second hole 111 of the second adherend member 110. As a result, planar positional alignment of the first adherend member 100 and the second adherend member 110 is performed. An insertion depth of the second pin portion 40 at this point is limited to a certain depth by contact of the 15 surface 52 of the flange portion 50 with the surface 110a of the second adherend member 110. [0021] In the state illustrated in FIG. 4, the flange portion 50 is sandwiched by the surface 100a of the first adherend member 100 and the surface 110a of the second adherend 20 member 110. In this state, a high adhesive strength is not exhibited in the adhesive forming the flange portion 50. Thus, before the curing of the adhesive progresses, the second adherend member 110 can be temporarily removed from the first adherend member 100. Thus, even after the second adherend member 110 is 25 temporarily placed on the first adherend member 100, and the 18 second adherend member 110 is brought into contact with the flange portion 50, fine adjustment of the position of the second adherend member 110 can be easily performed. Thus, positional alignment of the first adherend member 100 and the second adherend member 110 can be performed accurately 5 and easily. [0022] Next, as illustrated in FIG. 5, the adhesive layer 60 is formed between the first adherend member 100 and the second adherend member 110. For example, when the flange portion 50 is formed using a thermosetting adhesive, the flange portion 50 is 10 heated. When the thermosetting adhesive is heated, the viscosity of the thermosetting adhesive is once lowered so that fluidity is given to the thermosetting adhesive. When the thermosetting adhesive flows, the planar formation range of the flange portion 50 is increased, and a thickness of the flange portion 50 is 15 reduced. After that, the thermosetting adhesive is cured by heat. As a result, the adhesive layer 60 illustrated in FIG. 5 is formed between the first adherend member 100 and the second adherend member 110. When the flange portion 50 is to be heated, a method of entirely heating the first adherend member 100 and 20 the second adherend member 110 in a thermostatic chamber or a method of locally hating the vicinity of the adhesive member 11 by a small-sized heater or a small-sized lamp is used. [0023] When the flange portion 50 is formed using a hotmelt adhesive, the hot-melt adhesive is melted by heating the 25 flange portion 50. As a result, the planar formation range of 19 the flange portion 50 is increased, and the thickness of the flange portion 50 is reduced. After that, the flange portion 50 is cooled up to normal temperature so that the hot-melt adhesive is cured. As a result, the adhesive layer 60 illustrated in FIG. 5 is formed between the first adherend member 5 100 and the second adherend member 110. [0024] The surplus of the melted adhesive flows into the gap between the first pin portion 30 and the first hole 101 and the gap between the second pin portion 40 and the second hole 10 111 to be cured. As a result, the side surface 33 of the first pin portion 30 and an inner wall surface of the first hole 101 are firmly fixed to each other, and the gap between the first pin portion 30 and the first hole 101 is closed. Further, the side surface 43 of the second pin portion 40 and an inner wall 15 surface of the second hole 111 are firmly fixed to each other, and the gap between the second pin portion 40 and the second hole 111 is closed. As a result, the sealability and the rigidity of the adherend in which the first adherend member 100 and the second adherend member 110 are adhered to each other can 20 be improved. [0025] Each of the first pin portion 30 and the second pin portion 40 may have a groove or a hole for allowing flow of the adhesive. The groove is formed in each of the side surface 33 of the first pin portion 30 and the side surface 43 of the second 25 pin portion 40. The hole is formed through each of the first 20 pin portion 30 and the second pin portion 40. With the formation of the groove or the hole, the flow of the surplus of the adhesive can be effectively controlled. Thus, the gap between the first pin portion 30 and the first hole 101 and the gap between the second pin portion 40 and the second hole 5 111 can be more reliably closed by the adhesive. [0026] When a closed-cell adhesive that expands during curing, that is, an adhesive that expands into closed-cell foam during curing is used, the adhesive that flows into the gap 10 between the first pin portion 30 and the first hole 101 and the gap between the second pin portion 40 and the second hole 111 expands to be cured. As a result, those gaps can be reliably closed, thereby being capable of further improving the sealability of the adherend. 15 [0027] Further, when the flange portion 50 is formed using an adhesive of a type that requires application of pressure, the first adherend member 100 and the second adherend member 110 are pressed in a direction in which the first adherend member 100 and the second adherend member 110 approach each other. When 20 the flange portion 50 is pressed, the planar formation range of the flange portion 50 is increased, and the thickness of the flange portion 50 is reduced. As a result, the adhesive layer 60 illustrated in FIG. 5 is formed between the first adherend member 100 and the second adherend member 110. 25 [0028] Through the above process, the first adherend member 21 100 and the second adherend member 110 are adhered to each other through intermediation of the adhesive layer 60. In this embodiment, with use of the first pin portion 30 and the second pin portion 40 of the adhesive member 11 itself, positional alignment of the first adherend member 5 100 and the second adherend member 110 can be performed. Further, even after the second adherend member 110 is brought into contact with the flange portion 50, fine adjustment of the position of the second adherend member 110 can be performed. Thus, positional alignment 10 of the first adherend member 100 and the second adherend member 110 can be performed accurately and easily. Further, in this embodiment, positional alignment of the first adherend member 100 and the second adherend member 110 can be performed without additionally using a positioning pin. Thus, the quality of the 15 adherend can be improved while suppressing manufacturing cost of the adherend in which the first adherend member 100 and the second adherend member 110 are adhered to each other. [0029] The adhesive member 11 according to this embodiment can be used in, for example, the process of adhering the adherend 20 members to each other in a manufacturing process of the electronic device casing. FIG. 6 is a view for illustrating a schematic configuration of an electronic device casing 200 manufactured using the adhesive members 11 according to this embodiment, and application examples of the electronic device 25 casing 200. As illustrated in FIG. 6, the electronic device 22 casing 200 is formed by adhering the adherend members to each other using a plurality of adhesive members 11. The electronic device casing 200 accommodates electric components therein. The electronic device casing 200 is mounted to, for example, a railway vehicle 201, an aircraft 202, an 5 automobile 203, an elevating machine 204, or a household electrical appliance 205. [0030] As described above, the adhesive member 11 according to this embodiment includes the first pin portion 30, the second pin portion 40, and the flange portion 50. The first pin portion 10 30 is inserted into the first hole 101 formed in the first adherend member 100. The second pin portion 40 is inserted into the second hole 111 formed in the second adherend member 110 to be adhered to the first adherend member 100. The second pin portion 40 is formed coaxially with the first pin portion 30. 15 The flange portion 50 is formed using an adhesive. The flange portion 50 is mounted to the side surface 33 of the first pin portion 30 or the side surface 43 of the second pin portion 40 in the flange shape. [0031] According to this configuration, with use of the 20 first pin portion 30 and the second pin portion 40 of the adhesive member 11 itself, positional alignment of the first adherend member 100 and the second adherend member 110 can be performed. Thus, positional alignment of the first adherend member 100 and the second adherend member 110 can be performed 25 accurately and easily. 23 [0032] In the adhesive member 11 according to this embodiment, the diameter φ1 of the first pin portion 30 is smaller than the diameter φ2 of the second pin portion 40. According to this configuration, the insertion depth of the first pin portion 30 with respect to the first hole 5 101 can be limited to a certain depth. [0033] In the adhesive member 11 according to this embodiment, each of the first pin portion 30 and the second pin portion 40 is formed using metal or resin. According to this 10 configuration, the strength of each of the first pin portion 30 and the second pin portion 40 can be improved. Further, each of the first pin portion 30 and the second pin portion 40 may be formed using an adhesive. [0034] In the adhesive member 11 according to this 15 embodiment, the first pin portion 30 is formed so as to have a fitting relationship with the first hole 101. According to this configuration, the first pin portion 30 can be prevented from easily coming off from the first hole 101. Further, in the adhesive member 11 according to this embodiment, the second pin 20 portion 40 may be formed so as to have a fitting relationship with the second hole 111. [0035] In the adhesive member 11 according to this embodiment, the first pin portion 30 has the groove formed in the side surface or the hole formed through the first pin portion 25 30. According to this configuration, the flow of the adhesive 24 can be effectively controlled. Further, in the adhesive member 11 according to this embodiment, the second pin portion 40 may have a groove formed in the side surface or a hole formed through the second pin portion 40. [0036] In the adhesive member 11 5 according to this embodiment, the flange portion 50 is in the solid state at normal temperature. According to this configuration, the adhesive member 11 can be easily handled. Further, according to this configuration, the second adherend member 110 in contact with 10 the flange portion 50 can be prevented from sticking to the flange portion 50. [0037] In the adhesive member 11 according to this embodiment, the flange portion 50 is formed using the thermosetting adhesive or the hot-melt adhesive. According to 15 this configuration, fluidity can be given by heating the flange portion 50, thereby being capable of forming the adhesive layer 60 between the first adherend member 100 and the second adherend member 110. [0038] In the adhesive member 11 according to this 20 embodiment, the flange portion 50 is formed using the closedcell adhesive that expands during curing. According to this configuration, the gap between the first pin portion 30 and the first hole 101 and the gap between the second pin portion 40 and the second hole 111 can be reliably closed. 25 [0039] The adhesion method according to this embodiment 25 includes adhering the first adherend member 100 and the second adherend member 110 to each other using the adhesive member 11 according to this embodiment. According to this configuration, with use of the first pin portion 30 and the second pin portion 40 of the adhesive member 11 itself, positional 5 alignment of the first adherend member 100 and the second adherend member 110 can be performed. Thus, positional alignment of the first adherend member 100 and the second adherend member 110 can be performed accurately and easily. 10 [0040] The method of manufacturing an electronic device casing according to this embodiment includes manufacturing the electronic device casing 200 using the adhesion method according to this embodiment. According to this configuration, in a manufacturing process of the electronic device casing 200, 15 positional alignment of the first adherend member 100 and the second adherend member 110 can be performed accurately and easily. [0041] Second Embodiment An adhesive member and an adhesion method according to a second embodiment are described. FIG. 7 is a sectional view for 20 schematically illustrating a configuration of an adhesive member 12 according to this embodiment. The adhesive member 12 according to this embodiment is different from the adhesive member 11 according to the first embodiment in the configuration of the first pin portion 30. Description of configurations 25 similar to those of the first embodiment is omitted. 26 [0042] As illustrated in FIG. 7, the first pin portion 30 of the adhesive member 12 includes a pair of claw portions 34 to be fixed to the first adherend member 100. Each of the claw portions 34 includes a flexible portion 34a that extends from the bottom portion 41 of the second pin portion 5 40 along the axial direction and has flexibility, and a protruding portion 34b formed at a distal end of the flexible portion 34a. The flexible portion 34a passes through the first hole 101 when the first pin portion 30 is inserted into the first hole 101. The 10 protruding portion 34b is caught on the surface 100b of the first adherend member 100 when the first pin portion 30 is inserted into the first hole 101. The number of the claw portions 34 may be three or more. [0043] FIG. 8 to FIG. 11 are sectional views for 15 illustrating a flow of a process of adhering the first adherend member 100 and the second adherend member 110 to each other using the adhesive members 12 according to this embodiment. In the process of adhering the first adherend member 100 and the second adherend member 110 to each other, first, as illustrated in FIG. 20 8 and FIG. 9, the first pin portion 30 of each adhesive member 12 is inserted into the first hole 101 of the first adherend member 100. An insertion depth of the first pin portion 30 is limited to a certain depth by contact of the step surface 41a of the second pin portion 40 or the surface 51 of the flange portion 25 50 with the surface 100a of the first adherend member 100. 27 Further, the protruding portion 34b is caught on the surface 100b of the first adherend member 100. As a result, in a process from insertion of the first pin portion 30 into the first hole 101 to formation of the adhesive layer 60, the adhesive member 12 can be fixed to the first adherend member 5 100. Through insertion of the first pin portion 30 into the first hole 101, the flange portion 50 formed using an adhesive is arranged on the surface 100a of the first adherend member 100. [0044] The process illustrated in FIG. 10 and FIG. 11 is 10 the same as the process of the first embodiment illustrated FIG. 4 and FIG. 5, and hence description thereof is omitted. When the flange portion 50 is formed using a hot-melt adhesive, the adhesive melted by heat flows not only into the gap between the first pin portion 30 and the first hole 101 and the gap between 15 the second pin portion 40 and the second hole 111, but also into the gap between the pair of claw portions 34 to be cured. [0045] As described above, in the adhesive member 12 according to this embodiment, the first pin portion 30 includes the claw portions 34 so as to be fixed to the first adherend 20 member 100. According to this configuration, the first pin portion 30 can be prevented from easily coming off from the first hole 101. [0046] Third Embodiment An adhesive member and an adhesion method according to a 25 third embodiment are described. FIG. 12 is a sectional view for 28 schematically illustrating a configuration of an adhesive member 13 according to this embodiment. The adhesive member 13 according to this embodiment is different from the adhesive member 11 according to the first embodiment in the configuration of the first pin portion 30. Description 5 of configurations similar to those of the first or second embodiment is omitted. [0047] As illustrated in FIG. 12, the first pin portion 30 of the adhesive member 13 has a male thread portion 35. The male thread portion 35 has a configuration in which a male thread 10 and a thread groove are formed on the side surface 33 of the first pin portion 30. [0048] FIG. 13 to FIG. 16 are sectional views for illustrating a flow of a process of adhering the first adherend member 100 and the second adherend member 110 to each other using 15 the adhesive members 13 according to this embodiment. As illustrated in FIG. 13, the first hole 101 of the first adherend member 100 has a female thread portion 102 formed on the inner wall surface of the first hole 101. The female thread portion 102 is formed to be fitted to the male thread portion 35. 20 [0049] In the process of adhering the first adherend member 100 and the second adherend member 110 to each other, first, as illustrated in FIG. 14, the first pin portion 30 of each adhesive member 13 is inserted into the first hole 101 of the first adherend member 100. At this time, the male thread portion 35 25 of the first pin portion 30 is screwed into the female thread 29 portion 102 of the first hole 101. As a result, the adhesive member 13 is coupled to the first adherend member 100 by the threads. Thus, in a process from insertion of the first pin portion 30 into the first hole 101 to formation of the adhesive layer 60, the adhesive member 13 can be 5 fixed to the first adherend member 100. Through insertion of the first pin portion 30 into the first hole 101, the flange portion 50 formed using an adhesive is arranged on the surface 100a of the first adherend member 100. 10 [0050] The process illustrated in FIG. 15 and FIG. 16 is the same as the process of the first embodiment illustrated FIG. 4 and FIG. 5, and hence description thereof is omitted. [0051] As described above, in the adhesive member 13 according to this embodiment, the first pin portion 30 has the 15 male thread portion 35. According to this configuration, the first pin portion 30 can be prevented from easily coming off from the first hole 101. [0052] Fourth Embodiment An adhesive member and an adhesion method according to a 20 fourth embodiment are described. FIG. 17 is a sectional view for schematically illustrating a configuration of an adhesive member 14 according to this embodiment. The adhesive member 14 according to this embodiment is different from the adhesive member 11 according to the first embodiment in a length dimension 25 of each of the first pin portion 30 and the second pin portion 30 40. Description of configurations similar to those of any of the first to third embodiments is omitted. [0053] As illustrated in FIG. 17, a length dimension of the first pin portion 30 of this embodiment in the axial direction is smaller than the length dimension of the first 5 pin portion 30 of the first embodiment in the axial direction. Further, a length dimension of the second pin portion 40 of this embodiment in the axial direction is smaller than the length dimension of the second pin portion 40 of the first embodiment in the axial 10 direction. [0054] FIG. 18 to FIG. 21 are sectional views for illustrating a flow of a process of adhering the first adherend member 100 and the second adherend member 110 to each other using the adhesive members 14 according to this embodiment. As 15 illustrated in FIG. 18, the first holes 101 are formed in the surface 100a of the first adherend member 100. The first holes 101 do not penetrate up to the surface 100b of the first adherend member 100. That is, a depth dimension D1 of the first hole 101 is smaller than a thickness dimension T1 of the first adherend 20 member 100 (D1