Advanced Flipchip Join Package

Abstract: A method of attaching an integrated circuit die to a substrate, comprising: applying solder bumps to contact areas; placing the inverted integrated circuit die in a desired location such that the solder bumps are in contact with contact areas of the integrated circuit die and the substrate; heating the solder bumps to mount the die such that the bumps form a connection between the substrate and the integrated circuit; and under filling a gap between the mounted integrated circuit die and the substrate by injecting a molding compound into a molding die positioned over the mounted integrated circuit die.

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