Claims:1. An electronic device (100) comprising:
a chassis (102) configured in the device to accommodate one or more printed circuit boards (PCBs), one or more PCBs comprise a motherboard (104), a power supply board (106) and one or more electronic sub-modules (110-1, 110-2);
one or more rails (202-1, 202-2) configured in the chassis (102), and adapted to receive the corresponding one or more electronic sub-modules (110-1, 110-2);
a heat pipe assembly (208) configured in the one or more electronic sub-modules (110-1, 110-2), the heat pipe assembly comprising:
an extended heat transfer plate (206) impregnated with heat pipes (212) configured to cover the electronic PCBs (204) with the help of heat spreader plates (210) and transport heat through the heat spreader plates (210) and respective walls (114-1 to 114-5) of the device; and
a hybrid cooling chamber (112) coupled to the heat pipe assembly (208), wherein the heat generated from the one or more electronic sub-modules is transferred through the heat pipe assembly (208) to the hybrid cooling chamber (112), wherein the hybrid cooling chamber (112) adapted to expel heat from the one or more electronic sub-modules through fan arrangement (304) and fin assembly (308).
2. The electronic device as claimed in claim 1, wherein said walls (114-1 to 114-5) having at least one rail to guide the one or more electronic submodules, outer portion of the one or more rails is made of a thermally conductive material, wherein the walls are made from a material selected from a group comprising aluminium, copper, alloys, metal matrix composites and any combination thereof.
3. The electronic device as claimed in claim 1, wherein the walls having at least one way of heat dissipating fins, wherein the walls have poor thermal conductivity.
4. The electronic device as claimed in claim 1, wherein said one or more electronic submodules (110-1, 110-2) are packed by the heat spreader plates (210), the heat pipe assembly (208) with the extended heat transfer plate (206) and the heat pipes (212).
5. The electronic device as claimed in claim 1, wherein said heat spreader plates (210) configured to cover the electronic PCB (204) having at least one heat dissipating component, wherein one portion of the heat spreader plate (210) coupled to heat generating component of the electronic PCB with thermal pads (214) and other portion coupled to the heat pipe assembly (208) with the thermal pads (214).
6. The electronic device as claimed in claim 1, wherein said heat pipe assembly (208) having a first portion which is positioned with the one or more electronic submodules separated by the thermal pad (214) and a second portion which is positioned to bottom surface (310) of the hybrid cooling chamber (112).
7. The electronic device as claimed in claim 1, wherein the transition portion of the heat pipe (212) and the extended heat transfer plate (206) are bent at an angle between 1 degree and 20 degrees and the heat pipes (212) are bonded to both the extended portion of the heat transfer plate (206) of the one or more electronic submodules.
8. The electronic device as claimed in claim 1, wherein said hybrid cooling chamber (112) comprises the fan arrangement (304) at respective walls and the fin assembly (308), a top protection cover (108-3) adapted to cover the fin assembly (308) and the fan arrangement (304), wherein a bottom chassis (302) of the hybrid cooling chamber (112) having openings (312-1 to 312-4) to exit the hot air, which is expelled from the fin assembly (308), wherein slot (314) at the respective wall adapted for environmental gasket to protect the one or more PCBs.
9. The electronic device as claimed in claim 1, wherein the fin assembly (308) comprises one or more wavy fins (402-1, 402-2) stacked by the thermal pads (214) to the extended heat transfer plate (206) and the surface (310) of the bottom chassis (302) of the hybrid cooling chamber.
10. The electronic device as claimed in claim 1, wherein the device collects heat from the one or more electronic sub-modules (110-1, 110-2) and transfers the heat from the heat spreader plate (210) passed to the heat pipe assembly (208) and finally to the hybrid cooling chamber (112) by using the thermal pads (214).

, Description:TECHNICAL FIELD
[0001] The present disclosure relates, in general, to a heat management system, and more specifically, relates to an embedded electronic device for advanced heat dissipation.

BACKGROUND
[0002] Industry and governmental entities have developed requirements for operating sophisticated electronics within harsh environments with extreme temperature, shock and vibration. For performing under these conditions, systems typically involve robust and sometimes sealed chassis assemblies, which are called upon to perform with conduction-cooled circuit card assemblies (CCAs) or modules.
[0003] These modules themselves are environmentally protected by enclosure within shell-like structures incorporating conduction frames or a three-dimensional conduction plate, which conduct an electronically evolved heat energy to oppositely disposed sides or edge regions. When positioned within a chassis, the module engages a backplane as well as the oppositely disposed card slots or channels of robust thermally conductive conduction rails. The sides or edge regions of the modules are retained in substantial compression against the card slots by an expandable retaining device such as a wedge lock. With such compressive contact at the rail channels or slots, conductive heat transfer is provided from the modules into the conduction rail assemblies. These assemblies, in turn, are coupled in a heat transfer relationship with chassis-mounted finned heat sinks.
[0004] An existing enclosure and method for housing electrical components include walls provided about the electrical components, the walls having poor thermal conductivity. At least one thermal transport device extends through at least one respective wall. At least one thermal transport device has a first portion which is positioned, within the enclosure, a second portion which is positioned outside of the enclosure and a transition portion, which connects the first portion to the second portion. At least one thermal transport device has a high effective thermal conductivity and provides a high thermal conductivity path for heat energy to pass from within the enclosure to outside the enclosure. Another existing method and system configured for dissipating thermal energy from conduction-cooled circuit card assemblies in which thermal energy is directed into proximate heat sink assemblies and additionally is conveyed by heat pipes to one or more remote heat sink assemblies. Yet another existing sealed cabinet includes an independent cooling air duct for each module.
[0005] While the earlier conduction-based systems functioned adequately in carrying out heat dissipation, as electronic systems including power supplies have become more complex and functionally elaborate, heat generation at the modules has been seen to substantially increase and the conventional thermal conduction systems have been unable to perform adequately. Some conduction-cooled circuit card assembly installations are provided at locations having access to liquid cooling facilities, which can be employed to accommodate the higher heat loads now being encountered. However, such facilities may be vulnerable to harsh environments, or may not be available or acceptable for a variety of reasons. For instance, if liquid cooling facilities are not already available on a given platform, designers may not wish to add them. Industrial entities engaged in developing the air flow-based conduction-cooled circuit card assemblies have resorted to such regressive design approaches as depopulating card-carrying components, lowering clock speeds and the like to ameliorate the problem.
[0006] Although multiple devices and systems exist today, these devices and systems suffer from significant drawbacks Therefore, it is desired to develop an improved and standardised heat management system by solving the problems.

OBJECTS OF THE PRESENT DISCLOSURE
[0007] An object of the present disclosure relates, in general, to a heat management system, and more specifically, relates to an embedded electronic device for advanced heat dissipation.
[0008] Another object of the present disclosure is to provide a device that increases heat transfer through surfaces.
[0009] Another object of the present disclosure is to provide a device that increases heat transfer from composite structures.
[0010] Another object of the present disclosure is to provide a device that overcomes mechanical limitations.
[0011] Another object of the present disclosure is to provide a device that decreases weight and increases heat transfer efficiency
[0012] Yet another object of the present disclosure is to provide a device that enables good environmental adaptability such as high and low temperature, shock, vibration, damp heat, salt spray and electromagnetic interference (EMI)/ electromagnetic compatibility (EMC).

SUMMARY
[0013] The present disclosure relates, in general, to a heat management system, and more specifically, relates to an embedded electronic device for advanced heat dissipation.
[0014] Earlier conduction-based systems functioned adequately in carrying out heat dissipation, as electronic systems including power supplies have become more complex and functionally elaborate, heat generation at the modules has been seen to substantially increase and the conventional thermal conduction systems have been unable to perform adequately. The main objective of the present disclosure is to solve the technical problem as recited above by transferring heat from the PCB to the casing of the submodules heat spreader plates, which in turn is conducted to the top cover of the chassis with the help of the heat pipe assembly. Electronic submodules are packed by the heat spreader plate, which is designed as a standardized small form factor. The heat from the PCB is transferred from the heat spreader plates to the heat pipe assembly and to the hybrid cooling chamber and the output air can dissipate the heat from the sidewall of the base chassis fins.
[0015] In an aspect of the present disclosure, the present disclosure relates to an electronic device comprising a chassis configured in the device to accommodate one or more printed circuit boards (PCBs), one or more PCBs comprise a motherboard, a power supply board and one or more electronic sub-modules, one or more rails configured in the chassis, and adapted to receive the corresponding one or more electronic sub-modules. A heat pipe assembly configured in the one or more electronic sub-modules, the heat pipe assembly comprising an extended heat transfer plate impregnated with heat pipes configured to cover the electronic PCBs with the help of heat spreader plates and transport heat through the heat spreader plates and respective walls of the device and a hybrid cooling chamber coupled to the heat pipe assembly, wherein the generated heat from the one or more electronic sub-modules is transferred through the heat pipe assembly to the hybrid cooling chamber, wherein the hybrid cooling chamber adapted to expel heat from the one or more electronic sub-modules through fan arrangement and fin assembly.
[0016] According to an embodiment, the walls having at least one rail to guide the one or more electronic submodules, outer portion of the one or more rails is made of a thermally conductive material, wherein the walls are made from a material selected from a group comprising aluminium, copper, alloys, metal matrix composites and any combination thereof.
[0017] According to an embodiment, the walls having at least one way of heat dissipating fins, wherein the walls have poor thermal conductivity.
[0018] According to an embodiment, the one or more electronic submodules are packed by the heat spreader plates the heat pipe assembly with the extended heat transfer plate and the heat pipes.
[0019] According to an embodiment, the heat spreader plates configured to cover the electronic PCB having at least one heat dissipating component, wherein one portion of the heat spreader plate coupled to heat generating component of the electronic PCB with thermal pads and other portion coupled to the heat pipe assembly with the thermal pads.
[0020] According to an embodiment, the heat pipe assembly having a first portion which is positioned with the one or more electronic submodules separated by the thermal pad and a second portion which is positioned to bottom surface of the hybrid cooling chamber.
[0021] According to an embodiment, the transition portion of the heat pipe and the extended heat transfer plate are bent at an angle between 1 degree and 20 degrees and the heat pipes are bonded to both the extended portion of the heat transfer plate of the one or more electronic submodules.
[0022] According to an embodiment, the hybrid cooling chamber comprises the fan arrangement at respective walls and the fin assembly, wherein top protection cover adapted to cover the fin assembly and the fan arrangement, wherein a bottom chassis of hybrid cooling chamber having openings to exit the hot air, which is expelled from the fin assembly, wherein slot at the respective wall adapted for environmental gasket to protect the one or more PCBs.
[0023] According to an embodiment, the fin assembly comprises one or more wavy fins stacked by the thermal pads to the extended heat transfer plate and wall of the bottom chassis of the hybrid cooling chamber.
[0024] According to an embodiment, the device collects heat from the one or more electronic sub-modules and transfers the heat from the heat spreader plate to the heat pipe assembly and finally to the hybrid cooling chamber by using the high conductive thermal pads.
[0025] Various objects, features, aspects, and advantages of the inventive subject matter will become more apparent from the following detailed description of preferred embodiments, along with the accompanying drawing figures in which like numerals represent like components.

BRIEF DESCRIPTION OF THE DRAWINGS
[0026] The following drawings form part of the present specification and are included to further illustrate aspects of the present disclosure. The disclosure may be better understood by reference to the drawings in combination with the detailed description of the specific embodiments presented herein.
[0027] FIG. 1A illustrates an exemplary isometric assembled view of the environmentally sealed electronic device, in accordance with an embodiment of the present disclosure.
[0028] FIG. 1B illustrates an isometric exploded view of the environmentally sealed electronic device, in accordance with an embodiment of the present disclosure.
[0029] FIG. 2A illustrates an isometric view of the base chassis, in accordance with an embodiment of the present disclosure.
[0030] FIG. 2B illustrates a simplified exploded view of electronic sub-modules, in accordance with an embodiment of the present disclosure.
[0031] FIG. 2C illustrates airflow view of the standardised heat pipe assembly for the standardised electronic module, in accordance with an embodiment of the present disclosure.
[0032] FIG. 3A illustrates an exploded view of a hybrid cooling chamber assembly, in accordance with an embodiment of the present disclosure.
[0033] FIG. 3B illustrates a bottom isometric view of a hybrid cooling chamber assembly, in accordance with an embodiment of the present disclosure.
[0034] FIG. 3C illustrates an air flow movement of the hybrid cooling chamber, in accordance with an embodiment of the present disclosure.
[0035] FIG. 3D is a simplified exploded view of a fin assembly of the hybrid cooling module without top cover of the hybrid cooling module, in accordance with an embodiment of the present disclosure.

DETAILED DESCRIPTION
[0036] The following is a detailed description of embodiments of the disclosure depicted in the accompanying drawings. The embodiments are in such detail as to clearly communicate the disclosure. If the specification states a component or feature “may”, “can”, “could”, or “might” be included or have a characteristic, that particular component or feature is not required to be included or have the characteristic.
[0037] As used in the description herein and throughout the claims that follow, the meaning of “a,” “an,” and “the” includes plural reference unless the context clearly dictates otherwise. Also, as used in the description herein, the meaning of “in” includes “in” and “on” unless the context clearly dictates otherwise.
[0038] The present disclosure relates, in general, to a heat management system, and more specifically, relates to an embedded electronic device for advanced heat dissipation. The present disclosure is directed to improved and standardised heat management system and processes. More particularly, the present invention is directed to systems, which utilize hybrid cooling methods to provide high conductive paths for heat energy through walls of an enclosure. The standard form factor describes typically a system that revolves around a defined mode of construction with a set of defined standards. The approach defines how the standard chassis can be catered to multipurpose application with very minimal modifications to cater to the requirements of ground applications, shipborne and airborne applications employing the mode of advanced thermal management employing conduction, convection and (or) with the possibility of using phase change materials at critical interfaces.
[0039] The process of conduction, forced convection and radiation is employed for enhancing the thermal performance of the unit. The primary thermal path is provided mainly by employing the process of conduction. The heat from the PCB is carried on to the casing of the submodules heat spreader plates, which in turn is conducted to the top cover of the chassis with the help of the heat pipe assembly. Electronic submodules are packed by the heat spreader plate, which is designed as a standardized small form factor. The heat from the PCB is transferred from the heat spreader plates to the heat pipe assembly and to the hybrid cooling chamber and the output air can dissipate the heat from the sidewall of the base chassis fins. The heat from the PCB is maintained at a relatively lower temperature due to sub-module heat spreader plates, the heat pipe assembly and the hybrid cooling chamber. The hybrid cooling chamber may dissipate the heat from the heat pipe assembly with the forced air-cooling impinging on the sides, aided using high Revolutions Per Minute (RPM) miniature fans and the stacked wavy fins. The present disclosure can be described in enabling detail in the following examples, which may represent more than one embodiment of the present disclosure.
[0040] The advantages achieved by the device 100 of the present disclosure can be clear from the embodiments provided herein. The device increases heat transfer through surfaces, increases heat transfer from composite structures, overcomes mechanical limitations, decreases weight and increases heat transfer efficiency. The device enables good environmental adaptability such as high and low temperature, shock, vibration, damp heat, salt spray and electromagnetic interference (EMI)/ electromagnetic compatibility (EMC). The description of terms and features related to the present disclosure shall be clear from the embodiments that are illustrated and described; however, the invention is not limited to these embodiments only. Numerous modifications, changes, variations, substitutions, and equivalents of the embodiments are possible within the scope of the present disclosure. Additionally, the invention can include other embodiments that are within the scope of the claims but are not described in detail with respect to the following description.
[0041] FIG. 1A illustrates an exemplary isometric assembled view of the environmentally sealed electronic device, in accordance with an embodiment of the present disclosure.
[0042] Referring to FIG. 1A and FIG. 1B, sealed electronic device 100 (also referred to as embedded electronic device) for advanced heat dissipation. FIG. 1B shows an exploded view of an improved standardised environmentally sealed electronic device 100, according to aspects of the present disclosure. The device 100 can include chassis 102, standard motherboard 104, power supply board 106, protective covers (108-1 to 108-3), standardised plug-in electronic sub-modules (110-1, 110-2), hybrid cooling chamber 112, walls (114-1 to 114-5) and the environmentally sealed gaskets (not shown). The device 100 can be employed in multipurpose applications with very minimal modifications to cater to the requirements of ground applications, shipborne and airborne applications.
[0043] The electronic device 100 can include an environmentally sealed enclosure that includes printed circuit boards (PCBs), which are assembled into multiple modular subassemblies (110-1, 110-2) and then assembled into the base chassis 102, which are cooled by a hybrid cooling method i.e., conduction, convection and phase change heat transfer. Subassembly modules (110-1, 110-2) comprise PCB 204 that is covered by heat spreader plate 210, a heat pipe assembly 208 with an extended heat transfer plate 206 impregnated with heat pipes 212, which is extended to the base plane and can have contact with hybrid cooling chamber 112 shown in FIG. 2B and 2C respectively. The standard form factor is based on a defined mode of construction, which shall be utilized for multipurpose applications that require very minimal modifications.
[0044] The environmentally sealed electronic device 100 may be configured in a variety of ways. The example of implementation is illustrated in FIG. 1A and FIG. 1B, the environmentally sealed electronic device 100 is configured as an electronic system. However, it may be appreciated that the device and techniques described herein are not necessarily limited to use in the depicted environmentally sealed electronic device, but instead may be employed by any commercial device configured to remove more heat from the electronic module or PCB components.
[0045] The electronic device 100 can include the base chassis 102 that can accommodate one or more PCBs, the PCBs can include motherboard 104, power supply board 106, electronic submodules and the like. The motherboard 104, the power supply board 106 and at least one additional output PCB may be assembled into chassis 102 by using fastening screws or any suitable methods. The standard motherboard 104 is installed at the bottom end of chassis 102. The chassis 102 having the mounting provision to mount multiple PCBs such as standard motherboard 104, power supply board 106 and the like. The power supply board 106 is assembled on the sidewall of the base chassis 102 and the power supply board 106 can be plugged into the motherboard 104.
[0046] The protective covers (108-1 to 108-3) can include side protective cover 108-1, bottom protective cover 108-2 and top protective cover 108-3. The side protective cover 108-2 and the bottom protective cover 108-3 are assembled to the base chassis 102 by fasteners after installation/mounting of conductive gaskets or conductive sealing cords to protect the electronic board against environmental and electromagnetic interference (EMI)/electromagnetic compatibility (EMC).
[0047] In an embodiment, the rails (202-1, 202-2) are indicated in FIG. 2A configured in the base chassis 102 and adapted to receive the standardised plug-in electronic sub-modules (110-1, 110-2). The rails (202-1, 202-2) can be modified as per the different requirements of the electronic submodules (110-1, 110-2). The structural material of the outer portion of the conduction rails is made of a thermally conductive material.
[0048] The heat pipe assembly 208 is shown in FIG. 2B and FIG. 2C respectively configured in one or more electronic sub-modules (110-1, 110-2). The one or more electronic submodules (110-1, 110-2) are packed by the heat spreader plate 210, the heat pipe assembly 208 with the extended heat transfer plate 206 and heat pipes 212. The heat transfer plate 206 impregnated with heat pipe 212 shown in FIG. 2C configured to cover the electronic PCBs 204 having at least one heat-dissipating component and transports thermal energy through respective walls (114-1 to 114-5) of the device 100. The walls (114-1 to 114-4) have poor thermal conductivity and configured for assembling the electronic PCBs 204. The walls are made from a material selected from a group comprising aluminium, copper, alloys, metal matrix composites and any combination thereof.
[0049] The heat spreader plate 210 configured to cover the electronic PCB 204 having at least one heat dissipating component, where one portion of the heat spreader plate 210 coupled to heat generating component of the electronic PCB with thermal pad 214 and other portion coupled to the heat pipe assembly 208 with the thermal pad 214. The heat pipe assembly 208 having a first portion which is positioned with the one or more electronic submodules separated by the thermal pad 214 and a second portion which is positioned to bottom surface 310 of the hybrid cooling chamber 112.
[0050] The hybrid cooling chamber 112 can be assembled to the base chassis 102 by fasteners, where the hybrid cooling chamber 112 can include fan arrangement 304 and fin assembly 308 as shown in FIG. 3A that is stacked into base plate 306 of the hybrid cooling chamber 112. The top protection cover 108-3 adapted to cover the fin assembly 308 and fan arrangement 304. The hybrid cooling chamber 112 can include bottom chassis 302 having openings (312-1 to 312-4) shown in FIG. 3B to exit the hot air, which is expelled from the fin assembly 308.
[0051] In an exemplary implementation, the electronic submodules (110-1, 110-2) are to be inserted through the rails (202-1, 202-2) to have proper contact with the motherboard 104. Once device 100 is activated, the submodules (110-1, 110-2) may generate heat and the heat may be transferred through the heat spreader plates 210 of the electronic submodules (110-1, 110-2), passed to the extended heat spreader plate 206 of the heat pipe assembly 208 and to the hybrid cooling chamber 112. The heat generating components of the PCBs 204 and the extended heat transfer plates 206 is separated by the thermal conductive materials such as thermal glue/pads 214 and the heat spreader plate 210 of the electronic sub-modules and the extended heat spreader plate 206 of the heat pipe assembly 208 is separated by thermal conductive materials such as thermal glue/pads 214. In hybrid cooling chamber 112, the heat may be removed through the high-speed miniature fans 304 and the wavy fins 308 assemblies.
[0052] The present disclosure relates to the heat management/transfer assembly, a heat transfer process, and a process of assembling a heat transfer assembly, which can be used for any enclosure, including, but not limited to, an enclosure made from composite material. Embodiments of the present disclosure, in comparison to similar concepts that do not include one or more of the features disclosed herein, increase heat transfer through surfaces, increase heat transfer from composite structures, increase heat transfer through composite surfaces, overcome mechanical limitations, decrease weight, increase heat transfer efficiency, other improvements and advantages, and combinations thereof.
[0053] The purpose of the present disclosure is to complete the structural fixing of the submodules package in a standardized shape and size format plug-in modules, which may pack the PCBs and meet the high power and high heat density of the module. The proposed device 100 provides good environmental adaptability such as high and low temperature, shock, vibration, damp heat, salt spray and EMI/EMC.
[0054] FIG. 2A illustrates an isometric view of the base chassis, in accordance with an embodiment of the present disclosure. Referring to FIG. 2A, the base chassis 102 can include one or more rails (202-1, 202-2) (also referred to as rails, herein) adapted to receive the standardised plug-in electronic modules (110-1, 110-2).
[0055] FIG. 2B illustrates a simplified exploded view of electronic sub-modules, in accordance with an embodiment of the present disclosure. The electronic sub-modules (110-1, 110-2) can include the heat spreader plates 210, electronic PCBs 204 and heat pipe assembly 208 with extended heat transfer plate 206. The combination of heat spreader plates 210 can be used to assemble the electronic PCBs 204 and configured to cover the high heat-generating electronic PCB 204 having at least one heat-dissipating component. One portion of the heat spreader plate 210 coupled to heat generating component of the electronic PCB with thermal pads 214 and other portion coupled to the heat pipe assembly 208 with the thermal pads 214. In an exemplary embodiment, the heat spreader plates can be heat spreader aluminium plate 210. The electronic sub-modules (110-1, 110-2) can be modified in size, shape as per the requirement and can be assembled with the PCBs 204. One end/surface of the heat spreader plate 210 can be assembled into the heat pipe assembly 208 with the help of fasteners after the use of high thermal pad/glue 214 in between the heat spreader plate 210 and the heat pipe assembly 208.
[0056] FIG. 2C illustrates airflow view of the standardised heat pipe assembly for the standardised electronic module, in accordance with an embodiment of the present disclosure. The heat pipe assembly 208, preferably can include extended heat spreader/transfer plate 206, heat pipe 212 and the high conductive thermal interface material i.e., thermal pads 214. Heat spreader/transfer plate 206 and the heat pipes 212 are bonded by epoxy. The transition portion of the heat pipe 212 and the extended heat transfer plate 206 are bent at an angle between 1 degree and 20 degrees and the heat pipes 212 are bonded to both the extended portion of the heat transfer plate 206 of the one or more electronic submodules.
[0057] In an exemplary embodiment, thermal transport devices (also referred to as heat pipes 212, herein) include devices that transports thermal energy using latent heat, constant conductance heat pipes (CCHPs), thermosyphons, loop heat pipes, or any passive, two-phase device, are embedded in thermal communication with, extend through, or penetrate through one or more respective walls (114-1 to 114-5) of the device 100.
[0058] In the illustrative embodiment shown, the constant conductance heat pipes 212 are passive, two-phase, thermal transport devices, which have extremely high effective thermal conductivities about thousands of W/m-K. In an embodiment, the thermal conductivity of the thermal transport devices 212 is greater than 1 kW/m-K, greater than 10 kW/m-K, greater than 100 kW/m-K, between 1 kW/m-K and 100 kW/m-K, or any combination or sub-combination thereof. The heat pipes assembly 208 serve as thermal vias, which provide a high thermal conductivity path for heat energy to pass from within the electronic submodules (110-1, 110-2) to outside the hybrid electronic chamber 112. The constant conductance heat pipes 212 extend through only a small area of a respective wall (114-1 to 114-5) thereby causing minimal impact on the structural integrity of the wall (114-1 to 114-5) and the submodule enclosure (110-1, 110-2).
[0059] FIG. 3A illustrates an exploded view of a hybrid cooling chamber assembly, in accordance with an embodiment of the present disclosure. Referring to FIG. 3A, the hybrid cooling chamber 112, preferably can include bottom chassis/cover 302, fan arrangement 304 (also referred to as high-speed miniature environmentally sealed fan 304), base plate 306, stacked wavy fin assembly 308 (also referred to as wavy fin 308) and the top protection cover 108-3 (also referred to as top cover/plate 108-3). The bottom chassis/cover 302 having surfaces 310 shown in FIG. 3B may have perfect contact with the extended surface 206 of the heat pipe assembly 208 and the bottom chassis 302 having cut-out/opening (312-1 to 312-4) adapted to exit the hot air, which may be expelled from the wavy fins 308. The airflow movement of the hybrid cooling chamber 112 is shown in the FIG. 3C.
[0060] The hybrid cooling chamber 112 is configured as a heat/thermal management device. However, it may be appreciated that the device and techniques described herein are not necessarily limited to use in the depicted electronic device, but instead may be employed by any device configured to remove heat from the high heat-generating electronic module. For example, the hybrid cooling chamber 112 can be modified as per the requirements such as more submodules can be provided with heat pipes of different sizes and shapes and another way of fan arrangement may be located at sidewall or the top or bottom surface. The hybrid cooling chamber 112 to be assembled to the base chassis 102 by fasteners after plug-in of the electronic sub-modules (110-1, 110-2) with the heat pipe assembly 208 and installation of thermal conductive pad or glue on the extended plate of the heat pipe assembly and installation of the environmentally sealed gasket by utilizing slot 314.
[0061] FIG. 3D is a simplified exploded view of a fin assembly without top cover of the hybrid cooling module, in accordance with an embodiment of the present disclosure. The fin assembly 308 (also referred to as heat sink assembly) can include a first wavy fin 402-1 and second wavy fin 402-2 that are stacked by conductive glue 214 to the extended heat transfer plate 206 and the surface 310 of the bottom chassis 302 of the hybrid cooling chamber. The fin assembly installed into the base plate 306 of the hybrid cooling chamber 112.
[0062] It will be apparent to those skilled in the art that the device 100 of the disclosure may be provided using some or all of the mentioned features and components without departing from the scope of the present disclosure. While various embodiments of the present disclosure have been illustrated and described herein, it will be clear that the disclosure is not limited to these embodiments only. Numerous modifications, changes, variations, substitutions, and equivalents will be apparent to those skilled in the art, without departing from the spirit and scope of the disclosure, as described in the claims.

ADVANTAGES OF THE PRESENT DISCLOSURE
[0063] The present disclosure provides a device that increases heat transfer through surfaces.
[0064] The present disclosure provides a device that increases heat transfer from composite structures.
[0065] The present disclosure provides a device that overcomes mechanical limitations.
[0066] The present disclosure provides a device that decreases weight and increases heat transfer efficiency
[0067] The present disclosure provides a device that enables good environmental adaptability such as high and low temperature, shock, vibration, damp heat, salt spray and electromagnetic interference (EMI)/ electromagnetic compatibility (EMC).