DESC:FIELD
The present disclosure relates to the field of emission spectroscopy of thin wires. Particularly, the present disclosure relates to the field of wire adaptors used in optical emission spectroscopy of thin wires.
BACKGROUND
The background information herein below relates to the present disclosure but is not necessarily prior art.
Generally, optical emission spectroscopy (OES) is used for analysis of elemental composition of metals. A wide range of elements varying within a wide range of concentration (measured in ppm), can be accurately measured with high precision and within low detection limits. The spectral range that is useful for OES is from 130 nm up to 800 nm of wavelength of emitted light.
An optical spectrum analyzer has three essential components: a source of electricity, an optical system and a computing system. The source of electricity is usually a high-voltage source that excites a sample by passing an electrical discharge, causing the sample to vaporize on the surface and emit a light comprising characteristic wavelengths. The optical system, usually comprising a diffraction grating, spatially separates the wavelengths to direct them to corresponding detectors. The detectors measure the intensity of the wavelength. The data from the detectors is sent to the computing system for processing, and producing user-accessible results of the analysis, in the form of data or graphics displayed on a screen or printed on a hard sheet.
Various sizes and shapes of samples, such as melts in metal production industries, to tubes, plates, rods, wires and so on, in metal processing industries, are required to be analyzed using optical emission spectroscopy.
In case of thin wires of sizes of the order of 0.1 mm to 1 mm, the samples are difficult to handle. Especially, it is difficult to hold the surface of the wire samples at a constant distance from the electrode in a spark chamber, due to the thin cross-section. Further, even if multiple wires are placed side-by-side, due to the curvature of the wires, they tend to slide or roll onto one another.
As a result of improper loading of thin wire samples, the spark gets interrupted, leading to inconsistency in the results given by the OES analysis.
It is also required that the means for holding the metal wire sample be electrically conductive, so that the wire sample to be analyzed acts as an electrode.
Therefore, there is felt a need of a means for holding a bunch of thin wires to be analyzed by an optical emission spectrometer, which allows obtaining consistent results of the analysis, and which alleviates the aforementioned drawbacks of prior art, while fulfilling the desired criteria.
OBJECTS
Some of the objects of the present disclosure, which at least one embodiment herein satisfies, are as follows:
A primary object of the present disclosure is to provide a holding means for spectrum analysis of thin wires.
Another object of the present disclosure is to provide a holding means for spectrum analysis of thin wires, that holds a bunch of thin wires in a stable manner.
Yet another object of the present disclosure is to provide a holding means for spectrum analysis of thin wires, that allows obtaining consistent results of the analysis.
Still another object of the present disclosure is to provide a holding means for spectrum analysis of thin wires, that makes the thin wires electrically conductive.
Still another object of the present disclosure is to provide a holding means for spectrum analysis of thin wires, that allows ease of loading of wire samples.
Other objects and advantages of the present disclosure will be more apparent from the following description, which is not intended to limit the scope of the present disclosure.
SUMMARY
The present disclosure envisages an adaptor for spectrum analysis of thin wires. The adapter is configured to hold, in a spark chamber of a spectroscopy apparatus, a plurality of samples of thin wires in a flat layout with adjacent wires abutting each other, such that a flat plane passes through the longitudinal axis of each thin wire sample. The adaptor comprises a casing and an aligner. The casing is configured to enclose and support the thin wire samples and has an aperture for exposing the wire samples to an electric spark produced in the spark chamber for generation of an emission spectrum. The aligner is configured to retain the thin wire samples in a planar configuration, and also to prevent the thin wire samples from rolling onto one another.
In a preferred embodiment, the casing has a box-shaped body with a cavity for receiving the aligner and the separator, and a base plate defined along the operative bottom surface of the cavity and configured to support the thin wire samples. The aperture is provided on the base plate.
In a preferred embodiment, the aligner is a collapsible assembly of plates and pins, and is laterally insertable within the cavity for aligning adjacently placed thin wire samples. The aligner comprises two outer plates, two inner plates, a first set of aligner pins, a second set of aligner pins, a first set of aligner springs and a second set of aligner springs. The first outer plate and the second outer plate are placed parallel to each other. Similarly, the inner plates are positioned between the outer plates. The first inner plate and the second inner plate are placed parallel to the outer plates, with the first inner plate positioned between the second inner plate and the second outer plate. The first set of aligner pins couple the first outer plate to the first inner plate. The aligner pins are perpendicular to the surface of the first outer plate and slidably pass through the second inner plate. The second set of aligner pins couple the second outer plate and the second inner plate. The separator pins are perpendicular to the surface of the second outer plate and slidably pass through the first inner plate. The first set of aligner springs is fitted on the operative outer surface of the first inner plate, perpendicular to the surface of the first inner plate. The second set of aligner springs is fitted on the operative outer surface of the second inner plate, perpendicular to the surface of the second inner plate. The inner plates, are, thus, configured to be pushed towards each other to exert an operative horizontal force to align the thin wire samples parallel to each other, on fitment of the aligner in the adapter. The aligner pins are configured to retain the thin wire samples in a single plane in cooperation with the base plate of the casing.
In an embodiment, the body of the aligner has receiving holes configured thereon for receiving and supporting the aligner pins of the aligner.
In a preferred embodiment, the aligner is insertable through the casing and partially into the cavity.
In a preferred embodiment, the adaptor includes a separator configured to constrain the horizontal displacement of the inner plates of the aligner to maintain a predetermined separation between the inner plates.
In an embodiment, the separator comprises a foot, a head, a telescopic trunk and at least one separator spring. The foot has an operative outer surface profile configured to separate the inner plates, of the aligner. The head is configured to be pressed from an operative top. The telescopic trunk is configured to couple the head with the foot. The separator spring is configured to bias the head away from the foot.
In an embodiment, the separator includes a plurality of second pins configured to support the separator spring.
In an embodiment, the adaptor includes a locking plate for holding the separator in a locked state against the force exerted by the separator spring.
In an embodiment, the adaptor includes a lid which forms a box-type enclosure together with the casing, the aligner and the separator.
BRIEF DESCRIPTION OF THE ACCOMPANYING DRAWING
An adaptor for spectrum analysis of thin wires, of the present disclosure, will now be described with the help of the accompanying drawing, in which:
Figure 1 illustrates a typical spectroscopy apparatus used for emission spectroscopy;
Figure 2A illustrates an isometric view of the wire adaptor, in accordance with an embodiment of the present disclosure;
Figure 2B illustrates another isometric view of the wire adaptor of Figure 2A;
Figure 3 illustrates an exploded view of the wire adaptor, in accordance with an embodiment of the present disclosure;
Figures 4A, 4B and 4C illustrate details of a casing, an aligner and a separator of Figure 3;
Figure 5 illustrates an isometric view of an aligner and a separator of Figure 4B and Figure 4C in an operative configuration;
Figure 6 illustrates an isometric view of a casing and an aligner of Figure 4A and Figure 4B in a closed position;
Figure 7 illustrates an isometric view of the casing and the aligner of Figure 6 in an open position;
Figure 8 illustrates an isometric view of a casing and an aligner of Figure 4A and Figure 4B in an operative configuration;
Figure 9 illustrates a bottom view of the operative configuration of the casing and the aligner of Figure 8; and
Figures 10A and 10B illustrate a bottom view of the wires held in the adaptor before burning and after burning respectively.
LIST OF REFERENCE NUMERALS
10 spectroscopy apparatus
11 electrical system and optical system assembly
11a sample mounting table
12 computing and display system
100 wire adaptor
110 casing
111 body
112 cavity
113 base plate
114 aperture
115a, 115b, 115c, 115d receiving holes
120 aligner
121a, 121b first and second outer plates
122a, 122b first and second inner plates
123a, 123b, 123c, 123d aligner pins
124a, 124b, 124c, 124d aligner springs
130 separator
131 foot
132 telescopic trunk
133a, 133b separator pins
134a separator spring
135 head
140 lid
200 bunch of sample wires
210 contacting sample wire
215 burnt patch
DETAILED DESCRIPTION
Embodiments, of the present disclosure, will now be described with reference to the accompanying drawing.
Embodiments are provided so as to thoroughly and fully convey the scope of the present disclosure to the person skilled in the art. Numerous details are set forth, relating to specific components, and methods, to provide a complete understanding of embodiments of the present disclosure. It will be apparent to the person skilled in the art that the details provided in the embodiments should not be construed to limit the scope of the present disclosure. In some embodiments, well-known processes, well-known apparatus structures, and well-known techniques are not described in detail.
The terminology used, in the present disclosure, is only for the purpose of explaining a particular embodiment and such terminology shall not be considered to limit the scope of the present disclosure. As used in the present disclosure, the forms “a”, “an” and “the” may be intended to include the plural forms as well, unless the context clearly suggests otherwise. The terms “comprises”, “comprising”, “including” and “having” are open ended transitional phrases and therefore specify the presence of stated features, elements, modules, units and/or components, but do not forbid the presence or addition of one or more other features, elements, components, and/or groups thereof.
Figure 1 shows a typical spectroscopy apparatus used for emission spectroscopy. The spectroscopy apparatus comprises an electrical system and optical system assembly 11 and a computing and display system 12. A sample mounting table 11a is configured on a spark chamber of the electrical system for mounting a metal sample to be tested.
Out of the various sizes and shapes of samples analyzed using optical emission spectroscopy, such as melts, tubes, plates, rods and wires, thin wires of the order of 0.1 mm to 1 mm are difficult to handle. Holding the thin wire samples at a constant distance from the electrode in a spark chamber is a challenge due to the size and the shape of thin wires. Any disturbance in the loading of the thin wire samples causes interruption of the spark, leading to inconsistency in the results given by the OES analysis.
Therefore, primarily there is felt a need of a means for holding a bunch of thin wires to be analyzed by an optical emission spectrometer, which allows obtaining consistent results of the analysis.
The present disclosure envisages an adaptor for spectrum analysis of thin wires. A preferred embodiment of the adaptor, of the present disclosure, for spectrum analysis of thin wires, will now be described with reference to Figure 1 through Figure 10B. The preferred embodiment does not limit the scope and ambit of the disclosure.
The adaptor 100 of the present disclosure is configured to hold a plurality of thin wire samples in a flat layout with the adjacent wires abutting each other. In this arrangement, a flat plane passes through an edge of each thin wire sample. The adaptor 100 comprises a casing 110, an aligner 120 and a separator 130, wherein the aligner 120 and the separator 130 are configured to be fitted into the casing 110 to form a box-type enclosure, as shown in Figures 2A and 2B.
An exploded view of the assembly of the adaptor 100 is shown in Figure 3. The casing 110 receives the aligner 120 followed by the separator 130.
As shown in Figure 4A, the casing 110 has a box-shaped body 111 with a cavity 112 for receiving the aligner 120 and the separator 130. A base plate 113 is defined along the end of the cavity 112, that is opposite in direction to the opening for insertion of the casing 110 and the aligner 120. The wire samples are placed against the base plate 113. An aperture 114 is provided on the base plate 113 for exposing the wire samples. The aligner 120 is a collapsible assembly of plates and pins that is insertable through the casing 110 and partially into the cavity 112 for aligning adjacently placed thin wire samples.
In the embodiment shown in Figure 4B, the aligner 120 comprises two outer plates including a first outer plate 121a and a second outer plate 121b and two inner plates including a first inner plate 122a and a second inner plate 122b.
The first outer plate 121a and the second outer plate 121b are placed parallel to each other. The first inner plate 122a and the second inner plate 122b are positioned between the outer plates and placed parallel to the outer plates, with the first inner plate 122a positioned between the second inner plate 122b and the second outer plate 121b. A first set of aligner pins 123a, 123b couples the first outer plate 121a to the first inner plate 122a. The aligner pins 123a, 123b are perpendicular to the surface of the first outer plate 121a and slidably pass through the second inner plate 122b. A second set of aligner pins 123c, 123d couples the second outer plate 121b to the second inner plate 122b. The aligner pins 123c, 123d are perpendicular to the surface of the second outer plate 121b and slidably pass through the first inner plate 122a. A second set of aligner pins 123c, 123d is fitted on the operative inner surface of the second outer plate 121b, perpendicular to the surface of the second outer plate 121b. A first set of aligner springs 124a, 124b is fitted on the operative outer surface of the first inner plate 122a, perpendicular to the surface of the first inner plate 122a. A second set of aligner springs 124c, 124d is fitted on the operative outer surface of the second inner plate 122b, perpendicular to the surface of the second inner plate 122b. The body 111 of the casing 110 has receiving holes 115a, 115b for receiving and supporting the aligner pins 123a, 123b, 123c, 123d of the aligner 120. The inner plates 122a, 122b are, thus, configured to be pushed towards each other to exert an operative horizontal force to align the thin wire samples parallel to each other, on insertion of the aligner 120 in the adapter 100, and the aligner pins 123a, 123b, 123c, 123d are configured to retain the thin wire samples in a single plane in cooperation with the base plate 113 of the casing 110.
As shown in Figure 4C, the separator 130 comprises a foot 131, a telescopic trunk 132, a plurality of separator pins 133a, 133b, at least one separator spring 134 and a head 135. The foot 131 has an operative outer surface profile that is configured to separate the inner plates 122a, 122b of the aligner 120. The telescopic trunk 132 is configured to couple the head 135 with the foot 131. The separator spring 134 is configured to bias the head 135 away from the foot 131. A locking plate (not shown in Figures) can be provided for holding the separator 130 in a locked state. The separator spring 134 provides for recoil of the head 135 when the separator 130 is released from the locked state thereof. One of the separator pins 133a, 133b is configured to support the separator spring 134.
Figure 5 shows a separator 130 and an aligner 120 in an operative configuration. The bunch 200 of sample wires is pressed against the base plate 113 to be held in an abutting manner and aligned in the same plane by the aligner pins 123a, 123b, 123c, 123d of the aligner 120, while the inner plates 122a, 122b of the aligner 120 are held in an open state by the foot 131 of the separator 130.
Figure 6 shows the casing 110 and the aligner 120, wherein the aligner 120 is in an open state. Figure 7 shows the casing 110 and the aligner 120, wherein the aligner 120 is in an open state.
The locations of the receiving holes 115a, 115b, 115c, 115d in the body 111 and the operative vertical dimension of the inner plates 122a, 122b are configured to provide a clearance equal to the diameter of the thin wire samples. Hence, irrespective of the orientation in which the adaptor is positioned in the sample mounting table 11a, the sample wires do not roll onto one other due to gravity or other forces.
Figure 8 shows the casing 110 and an aligner 120 in an operative configuration, i.e., when the aligner 120 is held in an open state by the separator 130 (which hidden in Figure 8). A sample wire 210 is made to protrude out of the cavity 112 for contacting with the electrode of the electrical system. Figure 9 shows a bottom view of the configuration shown in Figure 8. The contacting sample wire 210 contacts an electrode of the electrical system and the circuit is completed through the electrically conductive material of the entire adaptor 100. Hence, a high-voltage electric discharge is made to pass through the bunch of sample wires 200 to produce emission of the optical radiation characteristic to the material of the sample wires. The radiation is captured by the optical system within the electrical and optical system assembly 11, and the sensed information is relayed to the computing and display system 12 for further processing. The computing and display system 12 generates results of the analysis and displays on a display unit.
In case of very thin wire samples (less than 0.5 mm in diameter), the wire samples must be folded and packed together by twisting to ensure availability of enough material during the spark. The placement of the wire samples in this case is similar to that of the single layer of wires, as shown in Figure 5.
The bunch of sample wires 200 before and after the spark is generated, is shown in Figures 10A and 10B, respectively. A uniform elliptical burnt patch 215 showing discolouration of the wire samples is produced by using the adaptor 100 of the present disclosure, as desired, which signifies that consistent results from the spectroscopy analysis are obtained. By inserting the bunch of sample wires 200 beneath the aligner 120 in a closed state, opening the aligner 120, inserting the separator 130 between the inner plates of the aligner 120 and locking the separator 130 in the locked state, the bunch of sample wires 200 is securely, stably and reliably held in a planar configuration. Thus, the adaptor 100 is easy to assemble and easy to load. By making all the components, i.e., the casing 110, the aligner 120 and the separator 130 of an electrically conductive material, such as stainless steel, use of one of the sample wires as a contacting sample wire for the electrode is facilitated. The wire adapter is completely sealed to ensure a leakage-free environment. As a result, uniformity in sparks can be ensured every time.
The foregoing description of the embodiments has been provided for purposes of illustration and not intended to limit the scope of the present disclosure. Individual components of a particular embodiment are generally not limited to that particular embodiment, but, are interchangeable. Such variations are not to be regarded as a departure from the present disclosure, and all such modifications are considered to be within the scope of the present disclosure.
TECHNICAL ADVANCEMENTS AND ECONOMIC SIGNIFICANCE
The present disclosure described herein above has several technical advantages including, but not limited to, the realization of an adaptor for spectrum analysis of thin wires, that:
• holds a bunch of thin wires in a stable manner;
• allows obtaining consistent results of the analysis;
• allows easy loading of wire samples; and
• is electrically conductive.
The embodiments herein and the various features and advantageous details thereof are explained with reference to the non-limiting embodiments in the following description. Descriptions of well-known components and processing techniques are omitted so as to not unnecessarily obscure the embodiments herein.
The foregoing description of the specific embodiments so fully reveal the general nature of the embodiments herein that others can, by applying current knowledge, readily modify and/or adapt for various applications such specific embodiments without departing from the generic concept, and, therefore, such adaptations and modifications should and are intended to be comprehended within the meaning and range of equivalents of the disclosed embodiments. It is to be understood that the phraseology or terminology employed herein is for the purpose of description and not of limitation. Therefore, while the embodiments herein have been described in terms of preferred embodiments, those skilled in the art will recognize that the embodiments herein can be practiced with modification within the spirit and scope of the embodiments as described herein.
The use of the expression “at least” or “at least one” suggests the use of one or more elements or ingredients or quantities, as the use may be in the embodiment of the disclosure to achieve one or more of the desired objects or results.
While considerable emphasis has been placed herein on the components and component parts of the preferred embodiments, it will be appreciated that many embodiments can be made and that many changes can be made in the preferred embodiments without departing from the principles of the disclosure. These and other changes in the preferred embodiment as well as other embodiments of the disclosure will be apparent to those skilled in the art from the disclosure herein, whereby it is to be distinctly understood that the foregoing descriptive matter is to be interpreted merely as illustrative of the disclosure and not as a limitation
,CLAIMS:WE CLAIM:
1. An adaptor (100) for spectrum analysis of thin wires, said adapter (100) configured to hold, in a spark chamber of a spectroscopy apparatus, a plurality of sample thin wires in a flat layout with the adjacent wires abutting each other, a flat plane passing through the longitudinal axis of each thin wire sample, said adaptor (100) comprising:
a. a casing (110) configured to enclose and support the thin wire samples and having an aperture (114) for exposing the thin wire samples to an electric spark produced in the spark chamber for generation of an emission spectrum; and
b. an aligner (120) configured to and retain the thin wire samples in a planar configuration and also to prevent the thin wire samples from rolling onto one another.
2. The adaptor (100) as claimed in claim 1, wherein said casing (110) has:
a. a box-shaped body (111) with a cavity (112) for receiving said aligner (120); and
b. a base plate (113) defined along the operative bottom surface of said cavity (112) and configured to support the thin wire samples, said aperture (114) provided on said base plate (113).
3. The adaptor (100) as claimed in claim 1, wherein said aligner (120) is a collapsible assembly of plates and pins, and is laterally insertable within said cavity (112) for aligning adjacently placed thin wire samples, said aligner (120) comprises:
a. two outer plates, including a first outer plate (121a) and a second outer plate (121b), placed parallel to each other;
b. two inner plates including a first inner plate (122a) and a second inner plate (122b), said inner plates positioned between said outer plates and placed parallel to said outer plates, with said first inner plate (122a) positioned between said second inner plate (122b) and said second outer plate (121b);
c. a first set of aligner pins (123a, 123b) coupling said first outer plate (121a) and said first inner plate (122a), said aligner pins (123a, 123b) of the first set being perpendicular to the surface of said first outer plate (121a) and slidably passing through said second inner plate (122b);
d. a second set of aligner pins (123c, 123d) coupling said second outer plate (121b) and said second inner plate (122b), said aligner pins (123c, 123d) of the second set being perpendicular to the surface of said second outer plate (121b) and slidably passing through said first inner plate (122a);
e. a first set of aligner springs (124a, 124b) fitted on the operative outer surface of said first inner plate (122a), perpendicular to the surface of said first inner plate (122a); and
f. a second set of aligner springs (124c, 124d) fitted on the operative outer surface of said second inner plate (122b), perpendicular to the surface of said second inner plate (122b);
said inner plates (122a, 122b), thus, configured to be pushed towards each other to exert an operative horizontal force to align the thin wire samples parallel to each other, on insertion of said aligner (120) in said adapter (100), and said aligner pins (123a, 123b, 123c, 123d) configured to retain the thin wire samples in a single plane in cooperation with said base plate (113) of said casing (110).
4. The adaptor (100) as claimed in claim 3, wherein said body (111) of said aligner (120) has receiving holes 115a, 115b for receiving and supporting said aligner pins (123a, 123b, 123c, 123d) of said aligner (120).
5. The adaptor (100) as claimed in claim 3, wherein said aligner (120) is insertable through said casing (110) and partially into said cavity (112).
6. The adaptor (100) as claimed in claim 3, which includes a separator (130) configured to constrain the horizontal displacement of said inner plates (122a, 122b) of said aligner (120) to maintain a predetermined separation between said inner plates (122a, 122b).
7. The adaptor (100) as claimed in claim 6, wherein said separator (130) comprises:
a. a foot (131) having an operative outer surface profile configured to separate said inner plates (122a, 122b) of said aligner (120);
b. a head (135) configured to be pressed from an operative top thereof;
c. a telescopic trunk (132) configured to couple said head (135) with said foot (131); and
d. at least one separator spring (134) configured to bias said head (135) away from said foot (131).
8. The adaptor (100) as claimed in claim 6, wherein at least one second pin (133a) is configured to support said separator spring (134).
9. The adaptor (100) as claimed in claim 6, which includes a locking plate for holding the separator (130) in a locked state against the force exerted by said separator spring (134).
10. The adaptor (100) as claimed in claim 6, which includes a lid (140) which forms a box-type enclosure together with said casing (110), said aligner (120) and said separator (130).