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An Aluminium Alloy Composition For High Strength And High Thermal Conductivity Applications

Abstract: ABSTRACT AN ALUMINIUM ALLOY COMPOSITION FOR HIGH STRENGTH AND HIGH THERMAL CONDUCTIVITY APPLICATIONS The Aluminum alloy composition comprising Silicon (Si) in an amount of 0.4 ± 0.05%, Iron (Fe) in an amount of 0.1 ± 0.05%, Copper (Cu) in an amount not exceeding 0.1%, Manganese (Mn) in an amount not exceeding 0.01%, Magnesium (Mg) in an amount of 0.5%, Chromium (Cr) in an amount not exceeding 0.03%, Zinc (Zn) in an amount not exceeding 0.04%, Aluminum-Titanium-Boron (AlTi5B) in an amount of 0.04-0.05%, Other elements in an amount not exceeding 0.015%, Aluminum (Al) constituting the balance of the composition, Vanadium (V) in an amount of 0.15-0.25%, Carbon (C) in an amount of 0.2-0.3%. Said aluminum alloy is formed using an electromagnetic technique with its micro/nano reinforcements and a yield strength increase attributable to mechanisms including grain refinement, the Orowan mechanism, thermal expansion coefficient mismatch, and load-bearing capability of reinforcement particles. FIGURE 5

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Patent Information

Application #
Filing Date
23 September 2022
Publication Number
13/2024
Publication Type
INA
Invention Field
METALLURGY
Status
Email
Parent Application

Applicants

KALYANI TECHNOFORGE LIMITED
S. NO. 72-76, BEHIND SIPOREX (I) LTD. MUNDHWA, PUNE - 411 036, MH, INDIA

Inventors

1. SUJATHA PUSHPAKANTH
Kalyani Centre For Manufacturing Innovation, Survey No: 15, Ahead Renuka Mata Mandir, Keshavnagar, Pune - 411 036, MH
2. SANJEET KUMAR
Kalyani Centre For Manufacturing Innovation, Survey No: 15, Ahead Renuka Mata Mandir, Keshavnagar, Pune - 411 036, MH
3. SUBHASHIS BANERJEE
Kalyani Centre For Manufacturing Innovation, Survey No: 15, Ahead Renuka Mata Mandir, Keshavnagar, Pune - 411 036, MH
4. SHARNYA PRAKASH
Kalyani Centre For Manufacturing Innovation, Survey No: 15, Ahead Renuka Mata Mandir, Keshavnagar, Pune - 411 036, MH
5. ASHISH S DEHADRAI
Kalyani Centre For Manufacturing Innovation, Survey No: 15, Ahead Renuka Mata Mandir, Keshavnagar, Pune - 411 036, MH
6. PARAG PRADEEP DOL
Kalyani Centre For Manufacturing Innovation, Survey No: 15, Ahead Renuka Mata Mandir, Keshavnagar, Pune - 411 036, MH
7. ANIKET MILIND
Kalyani Centre For Manufacturing Innovation, Survey No: 15, Ahead Renuka Mata Mandir, Keshavnagar, Pune - 411 036, MH

Specification

FORM 2
THE PATENTS ACT, 1970
(39 of 1970)
&
THE PATENT RULES, 2003
COMPLETE SPECIFICATION
(See Section 10 and Rule 13)
AN ALUMINIUM ALLOY COMPOSITION FOR
HIGH STRENGTH AND HIGH THERMAL
CONDUCTIVITY APPLICATIONS
KALYANI TECHNOFORGE LIMITED
An Indian Company having registered address at: S. No. 72-76, Behind Siporex (I) Ltd. Mundhwa, Pune 412036, Maharashtra
THE FOLLOWING SPECIFICATION PARTICULARLY DESCRIBES THE INVENTION AND THE MANNER IN WHICH IT IS TO BE PERFORMED.

TECHNICAL FIELD
[001] The present invention relates generally to a field of Aluminum alloy and more particularly relates to the Aluminum alloy composition for high strength and high thermal conductivity applications.
BACKGROUND
[002] A 6063 is an aluminum alloy, with magnesium and silicon as the alloying elements. The standard controlling its composition is maintained by the Aluminum Association. It has generally good mechanical properties and is heat treatable and weldable. It is similar to the British aluminum alloy HE9. 6063 is the most common alloy used for aluminum extrusion. It allows complex shapes to be formed with very smooth surfaces fit for anodizing. There are various prior arts for producing an aluminum alloy product and the resulting product having improved combinations of strength and corrosion resistance.
[003] One method includes providing an alloy consisting essentially of about 6-16% zinc, about 1.5-4. 5% magnesium, about 1-3% copper, one or more elements selected from zirconium, chromium, manganese, titanium, vanadium and hafnium, the total of said elements not exceeding about 1%, the balance aluminum and incidental impurities. The alloy is then solution heat treated; precipitation hardened to increase its strength to a level exceeding the as-solution heat treated strength level by at least about 30% of the difference between as-solution heat treated strength and peak strength; subjected to treatment at a sufficient temperature or temperatures for improving its corrosion resistance properties; and again precipitation hardened to raise its yield strength and produce a high strength, highly corrosion resistant alloy product. Another method discloses an alloy

product having improved combinations of strength, density, toughness and corrosion resistance, said alloy product consisting essentially of about 7.6 to 8.4% zinc, about 1.8 to 2.2% magnesium, about 2 to 2.6% copper and at least one element selected from zirconium, vanadium and hafnium present in a total amount not exceeding about 0.5%, preferably about 0.05 to 0.25% zirconium, the balance aluminum and incidental elements and impurities.
[004] The alloy product, suitable for aerospace applications, exhibits high yield strength, at least about 10% greater yield strength than its 7X50-T6 counterpart, with good toughness and corrosion resistance properties typically comparable to or better than those of its 7X50- T76 counterpart. Upper wing members made from this alloy typically have a yield strength over 84 ksi, good fracture toughness and an EXCO exfoliation resistance level
SUMMARY
[005] Embodiments of the present disclosure present technological improvements as solutions to one or more of the above-mentioned technical problems.
[006] Before the present subject matter relating to the Aluminum alloy composition for high strength and high thermal conductivity, it is to be understood that this application is not limited to the particular composition described, as there can be multiple possible embodiments which are not expressly illustrated in the present disclosure. It is also to be understood that the terminology used in the description is for the purpose of describing the implementations or versions or embodiments only and is not intended to limit the scope of the present subject matter.

[007] In an embodiment of the present invention, an Aluminum alloy composition for high strength and high thermal conductivity applications is disclosed. The Aluminum alloy composition comprising Silicon (Si) in an amount of 0.4 ± 0.05%, Iron (Fe) in an amount of 0.1 ± 0.05%, Copper (Cu) in an amount not exceeding 0.1%, Manganese (Mn) in an amount not exceeding 0.01%, Magnesium (Mg) in an amount of 0.5%, Chromium (Cr) in an amount not exceeding 0.03%, Zinc (Zn) in an amount not exceeding 0.04%, Aluminum-Titanium-Boron (AlTi5B) in an amount of 0.04-0.05%, Other elements in an amount not exceeding 0.015%, Aluminum (Al) constituting the balance of the composition, Vanadium (V) in an amount of 0.15-0.25%, Carbon (C) in an amount of 0.2-0.3%. Said aluminum alloy is formed using an electromagnetic stirring technique comprising bottom pouring casting, with its micro/nano reinforcements and a yield strength increase attributable to mechanisms including grain refinement, the Orowan mechanism, thermal expansion coefficient mismatch, elastic modulus difference, and load-bearing capability of reinforcement particles.
[008] This summary is provided to introduce aspects related to the Aluminum alloy. This summary is not intended to identify essential features of the claimed subject matter nor is it intended for use in determining or limiting the scope of the present subject matter.
BRIEF DESCRIPTION OF THE ACCOMPANYING DRAWINGS
[009] The foregoing detailed description of embodiments is better understood when read in conjunction with the appended drawings. For the purpose of illustrating the disclosure, there is shown in the present document example constructions of the disclosure; however, the disclosure is not limited to the specific compositions or method disclosed in the document and the drawings.

[0010] The present disclosure is described in detail with reference to the accompanying figures. In the figures, the left-most digit(s) of a reference number identifies the figure in which the reference number first appears. The same numbers are used throughout the drawings to refer various features of the present subject matter.
[0011] Figure 1 illustrates a microstructure of a control sample, in accordance with an embodiment of the present subject matter.
[0012] Figure 2 illustrates a microstructure of a vanadium sample, in accordance with an embodiment of the present subject matter.
[0013] Figure 3 illustrates comparison at high X between a control sample and a vanadium sample, in accordance with an embodiment of the present subject matter.
[0014] Figure 4 illustrates a graph depicting values of a thermal conductivity with respect to temperature for Aluminum alloy, in accordance with an embodiment of the present subject matter.
[0015] Figure 5 illustrates the strong and anisotropic bonding of C based nano-materials, in accordance with an embodiment of the present subject matter.
[0016] In the above accompanying drawings, a non-underlined number relates to an item identified by a line linking the non-underlined number to the item. When a number is non-underlined and accompanied by an associated arrow, the non-underlined number is used to identify a general item at which the arrow is pointing.
[0017] Further, the figures depict various embodiments of the present subject matter for purposes of illustration only. One skilled in the art will

readily recognize from the following discussion that alternative embodiments of the structures and methods illustrated herein may be employed without departing from the principles of the present subject matter described herein.
DETAILED DESCRIPTION
[0018] Some embodiments of this disclosure, illustrating all its features, will now be discussed in detail. The words "comprising," "having," "containing," and "including," and other forms thereof, are intended to be equivalent in meaning and be open ended in that an item or items following any one of these words is not meant to be an exhaustive listing of such item or items or meant to be limited to only the listed item or items. It must also be noted that as used herein and in the appended claims, the singular forms "a," "an," and "the" include plural references unless the context clearly dictates otherwise. Although an Aluminum alloy composition for high strength and high thermal conductivity applications, similar or equivalent to those described herein can be used in the practice or testing of embodiments of the present disclosure, the exemplary, an Aluminum alloy composition for high strength and high thermal conductivity applications is now described.
[0019] Various modifications to the embodiment will be readily apparent to those skilled in the art and the generic principles herein may be applied to other embodiments. For example, although the present disclosure will be described in the context of an Aluminum alloy composition for high strength and high thermal conductivity applications, one of ordinary skill in the art will readily recognize that a composition can be utilized in any situation where there is an alloy necessary to provide as a composite for battery case. Thus, the present disclosure is not intended to be limited to the

embodiments illustrated but is to be accorded the widest scope consistent with the principles and features described herein.
[0020] In an embodiment, as described above in one embodiment, an Aluminum alloy composition for high strength and high thermal conductivity applications is provided. The present invention discloses the Aluminum alloy developed with a nano and micro – reinforcement. The nano and micro reinforcements have a size distribution of 50-100 nm. Due to the use of micro and nano reinforcement thermal conductivity of the Aluminum alloy increases up to 12%. The Aluminum alloy without reinforcement shows average thermal conductivity of 180 W/m-K. The Aluminum alloy disclosed in the present invention exhibits 220 W/m-K even at 100 °C that is significant improvement to dissipate the heat at higher rate during in-service condition.
[0021] The Aluminum alloy composition comprising Silicon (Si) in an amount of 0.4 ± 0.05%, Iron (Fe) in an amount of 0.1 ± 0.05%, Copper (Cu) in an amount not exceeding 0.1%, Manganese (Mn) in an amount not exceeding 0.01%, Magnesium (Mg) in an amount of 0.5%, Chromium (Cr) in an amount not exceeding 0.03%, Zinc (Zn) in an amount not exceeding 0.04%, Aluminum-Titanium-Boron (AlTi5B) in an amount of 0.04-0.05%, Other elements in an amount not exceeding 0.015%, Aluminum (Al) constituting the balance of the composition, Vanadium (V) in an amount of 0.15-0.25%, Carbon (C) in an amount of 0.2-0.3% and Nickel (Ni) in an amount not exceeding 0.02%. Vanadium is used along with Aluminum, silicon, Iron, Copper, Magnesium and carbon to obtain aluminum alloy for developing High conductivity, High strength and reduction in weight. Addition of 0.1 -0.2 wt% of Vanadium can significantly improve the Yield Strength.

[0022] The aluminum alloy is formed using an electromagnetic stirring technique comprising bottom pouring casting, characterized by its micro/nano reinforcements and a yield strength increase attributable to mechanisms including grain refinement, the Orowan mechanism, thermal expansion coefficient mismatch, elastic modulus difference, and load-bearing capability of reinforcement particles. The electromagnetic stirring technique specifically utilizes a frequency range of 200-300 kHz for the bottom pouring casting which ensures the uniform dispersion of particles in the melt and reduce dross, increase melt yield. The squeeze process is performed at a temperature range of 600-650°C. For the Aluminum alloy disclosed in the present disclosure, a yield strength increase is in the range of 18-20% when compared to a similar aluminum alloy without the micro/nano reinforcements.
[0023] Generally, Ultimate Tensile Strength stands same in all the formulations whereas Yield Strength increases by the addition of Vanadium and significantly while nano-micro reinforcements are further added subsequently. Another grade of material like non-ferrous only; Al based composites provides 60% improvement in mechanical strength in the developed alloy.
[0024] To develop the high strength, high thermal conductivity Al alloy the plan of action taken is:
• Lab scale trials
• Three formulations
• Squeeze casted
• One alloy and two composites
• Metallurgical characterizations

[0025] The route of melting alloys (newly formulated) with aids of electromagnetic stirring technique, where billets are casted using bottom pouring technology."
The steps can be explained with the following indications:
Melting of Pure Al ►Addition of master alloys into melt ► stirring
and removing the dross/degassing ► Reinforcement of nanomaterial
(Preheated) into the melt pool ► Stirring the melt pool using
electromagnetic induction (so as to generate the turbulence by vortex flow in order to achieve the homogenous dispersion of reinforcements) —► supply the molten material to billet casting machine (bottom pouring) —► Billet making.
[0026] Mechanical properties of the Aluminum alloy disclosed in the invention are:

Sample 0.2%Proof stress (MPa) Ultimate tensile strength (MPa) %EL
Control sample (0) 62.47 125.23 29.83
With Vanadium 68.43 128.17 13.50
Vanadium+nano/micro Reinforcement (2) 74.30 129.53 16.80
[0027] The effect of nano-reinforcement makes it potential candidates having high strength and low weight to increase the service life of component and increase the efficiency of the system under desired service conditions. The alloy disclosed in the present invention solves two purposes

by imparting mechanical and thermal properties to the alloy. This can be explained with following hypothesis:
• The strong and anisotropic bonding and the low mass of the carbon atoms give unique thermal properties to C based nano-materials.
• By imposing either constant heat flux or constant temperature boundary conditions in the hot and cold regions, a steady-state temperature gradient is introduced within the sheet, which is then used to estimate the material thermal conductivity.
Δtotal: The total increase in yield strength
Δ Total = ΔGR + ΔOR + ΔCTE + ΔMod + ΔLoad
where,
- ΔGR : The yield strength increase caused by grain refinement;
- ΔOR, the Orowan contribution to yield strength increase;
- ΔCTE, the contribution to yield strength increase due to generation of geometrically necessary dislocations (GND), that are created during cooling due to mismatch of coefficient of thermal expansion (CTE) of particles and metal matrix;
- ΔMod, the contribution to yield strength increase due to generation of GNDs, that are created during deformation due to different elastic moduli in a deformation process after casting; and
- ΔLoad, the contribution to yield strength increase due to the simple presence of a reinforcement particles with higher strength, being well bonded to the surrounding matrix.
[0028] In another embodiment, the 6063 Aluminum alloy, Vanadium Pentoxide and 2D/3D carbon are collectively used for battery or motor housing. The 6063 Aluminum alloy is an alloy of Aluminum with magnesium and silicon as major ingredients. 2D/3D carbon is used for thermal application such as conductivity or heat transfer.

[0029] The 6063 Al alloy is to be manufactured for the higher mechanical strength, thermal conductivity for EVs component. For 6063 Al alloy formulation, the content of vanadium is very low. The 6063 is wrought alloy series and is applicable for forging, extrusion and stamping process. In one embodiment, the master alloy is melted to achieve desired composition of alloy. The present invention is for static part where high thermal conductivity is required to dissipate the high heat.
[0030] It should be noted that the above advantages and other advantages will be better evident in the subsequent description. Further, in the subsequent section the present subject is better explained with reference to the figures.
[0031] Referring now to the drawings, particularly by their reference numbers, Figure 1 illustrates a microstructure of a control sample, in accordance with an embodiment of the present subject matter. Control sample includes reference materials with a matrix composition close to that of the analyzed samples, that provides benchmark values of the properties for the samples. Using the Keller’s reagent and Weck’s reagent, microstructure of the control sample is examined under 200 µm, 100 µm and 50 µm size microscopic glass.
[0032] Figure 2 illustrates a microstructure of a vanadium sample, in accordance with an embodiment of the present subject matter. Using the Keller’s reagent and Weck’s reagent, microstructure of the Vanadium sample is examined. The microstructure for the Vanadium sample under 200 µm, 100 µm and 50 µm size microscopic glass is observed.

[0033] Figure 3 illustrates a comparison at high X between a control sample and a vanadium sample, in accordance with an embodiment of the present subject matter.
[0034] Figure 4 illustrates a graph depicting values of a thermal conductivity with respect to temperature for Aluminum alloy, in accordance with an embodiment of the present subject matter. The Aluminum alloy without reinforcement has average thermal conductivity of 180 W/m-K, and the Aluminum alloy disclosed in the present invention alloys exhibits 220 W/m-K even at 100 °C which is significant improvement to dissipate the heat at higher rate during in-service condition.
[0035] Figure 5 illustrates the strong and anisotropic bonding and the low mass of the carbon atoms of C based nano-materials. Figure 5 exhibits the 2D arrangements of the atoms, where there are two parts a & b. Figure 5a shows the perfect stacking of the atoms where heat flows uniformly and at faster pace since there is no defect into it. Secondly, Figure 5b, depicts the various defects at the atomic level, which affects the thermal conductivity of the material. However, in the current invention, the carbon has played significant role in controlling and refining the microstructure, where the uniform dispersion in the matrix has certainly improved the thermal conductivity of the developed alloy. The current invention can be co-related with the Figure 5a, where there is almost perfect arrangement of atoms and the microstructure reveals it as defect free.
[0036] Exemplary embodiments discussed above may provide certain advantages. Though not required to practice aspects of the disclosure, these following advantages may include.

[0037] Some embodiments of the apparatus provide Al alloy for high strength and high thermal conductivity.
[0038] Some embodiments provide an Al alloy as composite for battery case.
[0039] Although the description provides implementations of an Aluminum alloy, it is to be understood that the above descriptions are not necessarily limited to the specific features or methods of apparatus. Rather, the specific features and methods are disclosed as examples of implementations for the Aluminum alloy composition for high strength and high thermal conductivity applications.

We claim:
1 An aluminum alloy composition for high strength and high thermal conductivity applications, comprising:
• Silicon (Si) in an amount of 0.4 ± 0.05%;
• Iron (Fe) in an amount of 0.1 ± 0.05%;
• Copper (Cu) in an amount not exceeding 0.1%;
• Manganese (Mn) in an amount not exceeding 0.01%;
• Magnesium (Mg) in an amount of 0.5%;
• Chromium (Cr) in an amount not exceeding 0.03%;
• Zinc (Zn) in an amount not exceeding 0.04%;
• Aluminum-Titanium-Boron (AlTi5B) in an amount of 0.04-0.05%;
• Other elements in an amount not exceeding 0.015%;
• Aluminum (Al) constituting the balance of the composition;
• Vanadium (V) in an amount of 0.15-0.25%;
• Carbon (C) in an amount of 0.2-0.3%, wherein said aluminum alloy is formed using an electromagnetic stirring technique comprising a bottom pouring casting, characterized by its micro/nano reinforcements and a yield strength increase attributable to a mechanism including grain refinement, an Orowan mechanism, a thermal expansion coefficient mismatch, an elastic modulus difference, and a load-bearing capability of a reinforcement particles.

2. The aluminum alloy composition as claimed in claim 1, wherein the
electromagnetic technique specifically utilizes a frequency range of 200-300
kHz for the bottom pouring casting.
3. The aluminum alloy composition as claimed in claim 1, further
comprising Nickel (Ni) in an amount not exceeding 0.02%.
4. The aluminum alloy composition as claimed in claim 1, wherein the
micro/nano reinforcements have a size distribution of 50-100 nm.
5. The aluminum alloy composition as claimed in claim 1, wherein the yield strength increase is in the range of 5-10% when compared to a similar aluminum alloy without said micro/nano reinforcements.
6. The aluminum alloy composition as claimed in claim 1, wherein the squeeze is performed at a temperature range of 600-650 °C.

Documents

Application Documents

# Name Date
1 202221016126-STATEMENT OF UNDERTAKING (FORM 3) [23-03-2022(online)].pdf 2022-03-23
2 202221016126-PROVISIONAL SPECIFICATION [23-03-2022(online)].pdf 2022-03-23
3 202221016126-FORM 1 [23-03-2022(online)].pdf 2022-03-23
4 202221016126-DRAWINGS [23-03-2022(online)].pdf 2022-03-23
5 202221016126-PostDating-(21-03-2023)-(E-6-61-2023-MUM).pdf 2023-03-21
6 202221016126-FORM-26 [21-03-2023(online)].pdf 2023-03-21
7 202221016126-APPLICATIONFORPOSTDATING [21-03-2023(online)].pdf 2023-03-21
8 202221016126-DRAWING [23-09-2023(online)].pdf 2023-09-23
9 202221016126-COMPLETE SPECIFICATION [23-09-2023(online)].pdf 2023-09-23
10 Abstract1.jpg 2024-02-20
11 202221016126-Proof of Right [06-06-2024(online)].pdf 2024-06-06