Description:FORM 2

The Patents Act, 1970
(39 of 1970)
&
The Patents Rules, 2003

COMPLETE SPECIFICATION
(See sec 10 and rule 13)

AN APPARATUS, SYSTEM AND METHOD FOR DATACENTER OPTIMIZATION BY DIELECTRIC BASED DATACENTER COOLING

METAEDGE PLATFORMS PRIVATE LIMITED
37, SHANTI NAGAR, MANORAMAGANJ, INDORE,
MADHYA PRADESH - 452001, INDIA.

The following specification particularly describes the invention and the manner in which it is to be performed.

TECHNICAL FIELD OF INVENTION
The present invention relates to an apparatus, system and method for Datacenter optimization by dielectric based datacenter cooling. The apparatus for datacenter optimization consists of a tank enclosure holding the disc spaces for servers and a working fluid encapsulating the individual server units. The temperature of the working fluid is regulated by a control unit in the adjacent cooling distribution unit. The data optimization system comprising an apparatus for dielectric based cooling employing a method of optimization of datacenter, provides` a low cost, energy efficient, reliable and eco-friendly solution for datacenter optimization.
BACKGROUND AND PRIOR ART OF THE INVENTION
Reference is taken from US9232678B titled, “Modular, scalable, expandable, rack-based information handling system” which relates to modular, scalable, and expandable rack-based information handling system (RIHS) presents a design featuring a rack assembly with a front bay chassis for accommodating various sizes of IT gear and a separate rear bay for power and cooling components supporting the operation of IT gear. Additionally, the rack assembly includes a power and management chassis housing a power and management module for rack-level power and management. The system incorporates a modular configuration of fan modules in the rear bay to facilitate block-level cooling for adjacent IT gear blocks.
In contrast, the proposed invention’s liquid immersion cooling system provides an alternative approach for cooling IT gear. The proposed apparatus submerges servers in a dielectric liquid, leveraging natural convection for efficient heat dissipation without the need for a modular fan configuration or separate power and cooling components. The proposed design offers a streamlined and space-efficient solution for liquid immersion cooling, making it well-suited for data center applications.
Reference is taken from ES2797738T3 titles, “Integrated high-density server chamber with HVAC UPS backup” that teaches about an integrated high-density server chamber (HDSV) system comprising one or more server modules adapted to receive one or more rows of server rack (s)and provide electrical and communication connectivity for equipment computer and electrical systems arranged. While this patent application emphasizes the utilization of traditional server racks, the proposed invention takes a groundbreaking step by submerging these racks in dielectric liquid, a departure from conventional air-cooled systems. The liquid immersion cooling proposed in the present invention with the absence of air conditioning reliance, distinguishes it from the one taught in ES2797738T3 . the proposed invention relies on a dry cooler as its heat exchanger, diverging from the cited patent's use of an HVAC system.
Reference is taken from CN1121052. 38B titled “Liquid cooling system for server and control method thereof” which teaches about server equipment facilities, in particular to a liquid cooling system for a server and a control method thereof, which are used for realizing the micro- adjustment of the working environment of the server and ensuring that the server is in the optimal working temperature environment. The cited patent utilizes a cold plate system, while the proposed model specifically incorporates a heat exchanger.
Reference is taken from US 20230180444 A1 titled, ‘ADJUSTABLE FLUID COUPLING IN DATACENTER COOLING SYSTEMS’ which teaches about Systems and methods for cooling a datacenter with , a flow controller adapter of a cooling manifold is to interchangeably receive a flow controller of a plurality of flow controllers, wherein a flow controller adapter is associated with a rack-side flow controller and with a tube there between and is configured to be movable within cooling manifold to allow different positions for mating a flow controller with a server-side flow controller of server tray or box. Whereas the proposed invention relates to system, apparatus and method for datacenter optimization by utilizing a liquid immersion cooling system, which involves submerging servers directly in a cooling liquid.
The present invention presents a device that allows the cooling of servers, with the help of a Di-electric fluid that enables heat transfer from the servers at a rapid rate. The primary cooling of dielectric is achieved by circulating (through one conduit or pipe) it into a heat exchanger that transfers that heat to water (second cooling liquid) that’s running alongside the fluid concentrically in adjacent conduit. The water then releases its heat via the heat exchanger. The second cooling liquid (water) has a secondary distribution system comprising pumps, valves, temperature sensors, pressure sensors, flowmeters and a separate cooling mechanism. The heated water is circulated into an external cooling system, to cool the water and circulated back to the heat exchanger to resume the process of primary cooling of the dielectric. The now cooled dielectric fluid is entered back into the tank in order to maintain the optimum temperature for the servers to function in. The proposed system also has an n+1 redundant pump set-up to ensure continuous and optimum working of the datacenter.
The present invention provides a low cost, energy efficient, reliable and eco friendly solution of cooling servers in a datacenter and achieve optimization of datacenter efficiency.
OBJECT OF THE INVENTION
The main objective of the invention is to provide an apparatus for Datacenter Optimization by dielectric based cooling of datacenter.
Another objective of the invention is to provide a Datacenter Optimization system based on dielectric cooling of datacenters.
Another objective of the present invention is to provide a method for datacenter optimization.
Another object of the present invention is to provide a low cost solution of datacenter optimization by an apparatus for cooling servers by submerging in dielectric medium.
Another object of the present invention is to provide an efficient temperature management system to keep the dielectric-submerged servers at a set temperature so as to let them continuously perform optimally.
Another objective is to provide a reliable and eco-friendly datacenter optimization system.
Another objective is to provide a system of data optimization using n+1 redundancy feature with the inclusion of two pumps for continuous and seamless operation of the Datacenter.
SUMMARY OF THE INVENTION
The present invention relates to “An apparatus for datacenter optimization by dielectric based datacenter cooling”, comprising a tank enclosure with stackable discs, a cooling distribution unit, a control unit, a secondary cooling liquid and a working fluid encapsulating the stackable disc spaces; wherein,
the tank enclosure has
-slots for housing stackable discs of independently operating servers;
-a working fluid encapsulating the stackable disc spaces;
-a weir portion adjacent to one wall of the tank enclosure; which is connected to a primary outlet flow valve;
-a power distribution unit for power management;
-inlet and outlet flow meters and valves for regulation of working fluid distribution; and
the cooling distribution unit houses the control unit and comprises of plurality of temperature sensors pressure sensors and flow meters ; a plate heat exchanger; plurality of pumps, plurality of valves for flow regulation; and vents for temperature regulation of plate heat exchanger; and the cooling distribution unit is housed in a separate unit adjacent to the tank enclosure;
the control unit controls
-the flow of working fluid in and out of the tank enclosure;
-the flow of secondary cooling liquid in and out of the plate heat exchanger;
-the temperature inside the tank enclosure, T1;
- the working of plurality of pumps in redundancy mode; and
- the working of primary and secondary , inlet and outlet flowmeters and valves;
the heat exchanger
-is a plate heat exchanger;
-comprises of separate conduits, for secondary cooling liquid and working liquid, adjacent to each other, covering the entire tank in concentric orientation; and
-is connected with working fluid circulation pumps at inlet and outlet through primary inlet and outlet temperature sensors & pressure valves;
-is connected with a secondary cooling liquid distribution system comprising secondary inlet and outlet valves, temperature and pressure sensors, flow meters and an external cooling system having a water pump, a reservoir; and a heat exchanger with cooling mechanism ( dry cooler set-up)
-the flowmeters, temperature and pressure sensors are placed adjacent to primary and secondary inlet and outlet valves.
In an embodiment, the control unit
-is selected from microcontroller, microprocessor, Raspberry Pi, Arduino ;
- receives inputs from primary and secondary inlet and outlet temperature and pressure sensors and flow meters;
-sends the control signal to primary and secondary inlet and outlet flow meters and valves;
-receives inputs from plurality of pumps and maintains the pumps in redundancy mode;
-regulates the temperature inside the tank enclosure within the permissible limit.
In yet another embodiment, the working fluid is a dielectric.
In another embodiment, the cooling of server discs of datacenter is done by the working fluid through natural convection.
In yet another embodiment, the temperature of the tank enclosure is regulated by the control unit through controlled circulation of working liquid.
In another embodiment, the controlled circulation means circulation of hot working fluid from the tank enclosure to the heat exchange unit of the circulation distribution unit and cooled working fluid from circulation distribution unit to the tank enclosure.
In another embodiment, the secondary cooling liquid is water.
In yet another embodiment, the secondary cooling liquid has its own cooling mechanism.
The present invention also relates to “A datacenter optimization system” comprising an apparatus for dielectric cooling of datacenter, plurality of server units working independently of each other, a working liquid, a cooling distribution unit, a heat exchanger, plurality of temperature sensors, pressure sensors and flow meters and valves, plurality of pumps, a secondary cooling liquid and a controller; wherein,
- the apparatus for dielectric cooling of datacenter has a tank enclosure to house plurality of server units;
- the apparatus for dielectric cooling of datacenter is equipped to contain the plurality of server units submerged in the working fluid;
- the apparatus for dielectric cooling of datacenter is equipped with a weir portion connected to a primary outlet valve that regulates the outflow of hot working fluid;
- the apparatus for dielectric cooling has a cooling distribution unit adjacent to the tank enclosure;
- the cooling distribution unit is equipped with
-plurality of temperature sensors and valves connected to the controller;
-plurality of flow meters and valves to adjust the flow of the working fluid and secondary cooling liquid into the conduits of the heat exchanger;
-adjacent conduits for working fluid and secondary cooling liquid such that the working fluid cools down through convection by the cooling liquid conduits; and
-the controller
-controls the temperature inside the enclosure;
-controls the operation of plurality of pumps and valves;
-regulates the flow of working liquid in and out of the tank enclosure;
-regulates the flow of secondary cooling liquid in the conduits of the heat exchanger;
-receives temperature from primary and secondary sensors and flow rates from primary and secondary flow meters; and
-sends control signals to
-primary outlet valve to circulate hot working fluid out of the tank enclosure;
-primary inlet valve to circulate cooler working fluid into the tank enclosure;
-external inlet valve to circulate secondary cooling liquid into the heat exchanger;
-secondary outlet valve to circulate secondary cooling liquid to external cooling unit ; and
-activates the redundant pump in an event of fault in active pump.
The present invention also relates to “a method for datacenter optimization by dielectric based cooling of a datacenter”, comprising
a) initialization of tank enclosure by detecting the level of working fluid inside the tank enclosure and setting the temperature of the working fluid inside the tank enclosure to T1;
b) detecting by the primary temperature sensor, any change in the temperature T2 inside the weir portion of the tank enclosure and sending the information to the controller;
c) sending by controller, a flow control signal to the primary outlet flow meter to activate the flow of working fluid outside the tank enclosure through the primary outlet valve and into the cooling distribution unit;
d) receiving a third control signal by the secondary inlet flowmeter to regulate the flow of secondary fluid inside the conduits of the heat exchanger;
e) stabilizing the temperature of working fluid by adjusting the inlet and outlet of the secondary flow meter to adjust the flow of secondary cooling liquid inside the heat exchanger till the temperature of the working fluid entering the tank enclosure through primary inlet valve is within a permissible range of the set temperature, T1.
f) receiving a second control action by the primary inlet flowmeter inside the cooling distribution system to circulate the cooled working fluid into the tank enclosure through primary inlet valve;
g) regulating seamless movement of working fluid and secondary cooling liquid to ensure optimal performance of the datacenter by regulating the operation of valves and pumps.
In an embodiment, stabilizing the temperature of working fluid is done by the controller by comparing the current temperature T2 of working fluid in the weir portion, and set temperature T1 and sending the corrective flow control signal to secondary inlet flow valve, to increase flow of secondary liquid in the conduits of the heat exchanger such that temperature becomes, T1 + ?T; wherein
?T= {T2-T1} ? ET ; wherein ET is the range of permissible error in Temperature .
In an embodiment, ET, the range of permissible error in Temperature of working fluid that is rushed in through the inlet valve is 1-3 degree Celsius.
In an embodiment the heat exchanger is selected from welded plate heat exchanger, shell and tube heat exchanger, convection heat exchanger, plate fin heat exchanger, cross flow heat exchanger, double flow heat exchanger.
In another embodiment, the components of cooling distribution unit are assembled.
In yet another embodiment the components of the cooling distribution unit are integrated inside one unit.
In an embodiment the cooling mechanism of secondary cooling liquid consists of a reservoir, pump and a cooling means.
In another embodiment the working liquid is immersion cooling fluid.
In yet another embodiment the secondary cooling fluid/liquid is a dielectric.
In another embodiment the plurality of motors and pumps are operated in redundant array structure.
BRIEF DESCRIPTION OF THE DRAWINGS
Fig 1 shows an the apparatus of Datacenter Optimization (1). It shows the apparatus with the cross section of the tank enclosure (11) and cooling distribution unit (12). The apparatus consists of a power distribution unit (16), slots for housing servers (14) and a working fluid (19). Plurality of individual server units (13) can be housed inside the tank enclosure (11). The cooling distribution unit (12) also houses a control unit (18).
Fig 2 shows the complete structure (200) of the Apparatus of Datacenter Optimization by dielectric cooling. The Tank enclosure houses the server units (13). The cooling distribution unit (12) comprises of a control Unit ( 18), a heat exchanger (24) , plurality of pumps (21, 22) connected to the control unit (18) by control cables (25) and forming a redundant array of pumping system.
Fig 3 shows the Datacenter Optimization system (300). The Tank enclosure (11) houses server units (13) that are immersed in working liquid/fluid (19). The control unit (18) senses the temperature of the working liquid (19) at the weir portion (17), T2, through primary temperature sensor and compares it with set temperature of the tank, T1, and sends control signal to flow meters, pumps and valves to regulate the flow of working fluid (19) and secondary liquid (20) to maintain the temperature within allowable limits.
Fig. 4 shows an embodiment of the interconnection (400) of valves and other connections of the cooling distribution unit (12). The pumps (21 & 22) work in redundant array model with one of the pumps active at one time. The valves 34(a & b) regulate the circulation of working fluid from the pumps. The primary inlet valve (31) lets the cooled working fluid inside the tank enclosure(11). Primary Temperature sensors , pressure sensors, flowmeters (T1, P1, M1) and secondary (T2, P2, M2) are provided near to the primary inlet (31) and outlet (32) valves.
Fig. 5 shows another embodiment (500) of the cooling distribution unit (12).The secondary cooling liquid is inlet through inlet pipe (46) which is connected to a reservoir through secondary inlet valve (36). The temperature (T3) and pressure (P3) sensors and flow meter (M3) are provided near the valve (36). The heated water is circulated outside the cooling distribution unit (12) through a secondary outlet valve (33) by means of an outlet pipe (47) to an external cooling system (51) comprising a reservoir (42), water pump (41), heat exchanger (43) with external cooling means (not shown).
DETAILED DESCRIPTION OF THE INVENTION
The invention relates to an apparatus (1) for datacenter optimization by dielectric based datacenter cooling comprising a tank enclosure (11) with stackable discs of servers (13) , a cooling distribution unit (12), a control unit (18), a secondary cooling liquid (20) and a working fluid (19) encapsulating the stackable disc spaces.
As shown in the Fig 1, the tank enclosure (11) comprises slots (14) for housing stackable discs of independently operating servers (13). It has a working fluid (19) encapsulating the stackable disc spaces. i.e the tank enclosure is filled with a dielectric to a level where it submerges the stackable disc spaces of servers (13). The tank enclosure (11) has a power distribution unit (16) for power management of the apparatus (1), which is located above the dielectric level.
The tank enclosure has a weir portion (17) adjacent to one wall of the tank enclosure (11). The weir (17) is connected to a primary outlet flow valve (32) which is adjacent to a primary outlet temperature sensor (T2), a pressure sensor (P2) a flow meter (M2) etc. The hot dielectric rises to the weir portion (17). The flowmeter (M2) receives a first control signal from the control unit (18) to flush the hot dielectric out of the tank enclosure (11). The hot dielectric (19) is sent out of the tank enclosure (11) through the primary outlet valve (32).
The apparatus (1) has inlet (31) and outlet (32) flow valves with temperature (T1, T2) and pressure sensors (P1, P2) and flow meters (M1, M2) for regulation of working fluid(19) distribution.
The cooling distribution unit (12) is adjacent to the tank enclosure (11). It houses the control unit (18) and comprises of plurality of temperature sensors (T1, T2, T3, T4); pressure sensors (P1, P2, P3, P4), flow meters (M1, M2, M3, M4), a heat exchanger (24); plurality of pumps (21, 22), plurality of valves ( 31, 32, 33, 34a, 34b, 35, 36) for flow regulation; and vents (44) for temperature regulation of heat exchanger (24).
The control unit (18) controls the flow of working fluid (19) in and out of the tank enclosure (11); the flow of secondary cooling liquid (20) in and out of the heat exchanger (24); regulates the temperature inside the tank enclosure (11) and controls the working of plurality of pumps (21, 22) in redundancy mode and the working of primary and secondary; inlet and outlet flow meters (M1, M2,M3, M4) and valves.
The control unit (18) receives inputs from primary inlet and outlet (T1, T2) and secondary inlet and outlet (T3, T4) temperature sensors and flow meters. The control unit processes the control action signals based on the inputs from the primary outlet temperature sensor (T2), secondary outlet temperature sensor (T4), plurality of pumps (21, 22) etc. These control signals are corrective measures to ensure optimum performance of the datacenter cooling system.
The control unit (18) can be a microcontroller, a microprocessor, a Raspberry Pi, an Arduino or any other computing device with a processor and storage.
The control unit (18) sends the control signal to primary and secondary; inlet and outlet flow meters to regulate the flow of working fluid and secondary cooling fluid as well as send command signal to initiate switching to redundant pump in case of fault in active pump. As soon as the controller detects fault in the active pump it commands the redundant unit to switch over the operation.
In an embodiment the heat exchanger (24) of the cooling distribution unit (11) is a plate heat exchanger.
It comprises of separate conduits, for secondary cooling liquid (20) and working liquid (19), adjacent to each other, covering the entire tank in concentric orientation. It is connected with working fluid circulation pumps at primary inlet and outlet through temperature and pressure sensors & pressure valves and is connected with a secondary cooling liquid distribution system (40) comprising secondary inlet and outlet valves, temperature (T3,T4)& pressure sensors (P3,P4) and flow meters (M3, M4), an external cooling system (51) comprising a water pump (41), a reservoir (42) and heat exchanger (dry cooler set-up) with an external cooling means.
The Control unit (18) sets the temperature inside the tank enclosure to be T1. The submerged server units (13) dissipate heat into the dielectric/working liquid (19) submerging them. The hot dielectric (19) rises to the weir portion (17) of the tank (11). The temperature sensor (T2) senses that the current temperature T2 and sends this information to control unit (18). For optimum operation, a permissible range of T1 is set by the control unit. The control unit compares T2 with set temperature T1 and if T2 is above the set temperature range of T1, the control unit (18) activates the suction valve of the flow meter (M2) and the hot dielectric is rushed out of the tank enclosure through the primary outlet valve (32) .
The primary outlet valve (32) is connected to the cooling distribution unit (12) through pipes. The pipes inside the cooling distribution unit (12) takes the hot dielectric (19) into one conduit of the heat exchanger (24). The heat exchanger (24) has a network of two conduits running adjacent to each other in a concentric distribution. The second conduit carries the secondary cooling liquid (20), e.g. water inside the heat exchanger (24). The second conduit is regulated by a water distribution system (40) comprising secondary inlet (36) and outlet valves (33), temperature sensors (T3,T4), secondary flowmeters (M3, M4), and an external cooling system (51) comprising a reservoir (42), a water pump (41), a heat exchanger (43) and an external cooling means. Vents (44) are provided for cooling the secondary cooling liquid distribution system (40). The internal connections of the cooling distribution unit (12) are clearly shown in Fig. 4 and Fig. 5. The pipes inside the cooling distribution unit (12) are secured with the help of flanges (43). Water (20) is inlet into the CDU (12) through inlet pipe (47) and heated water is outlet to external cooling system (51), through the external pipe (46) through a valve (33) which can be operated manually as well.
The dielectric (19) in the first conduit transfers its heat to the water (20) in second conduit through convection and when the temperature sensor (T1) senses that the temperature of the dielectric is within the allowable range of set temperature T1, the dielectric (19) is transported back to the tank enclosure (11) through primary inlet valve (31) located near the bottom of the tank enclosure.
The control unit (18) directs the flowmeters through control action signals to transport dielectric (19) and water (20) in and out of the heat exchanger unit (24) of the cooling distribution unit (12).
The temperature of the tank enclosure (11) is regulated by the control unit (18) through controlled circulation of working liquid (19). The controlled circulation means circulation of hot working fluid from the tank enclosure (11) to the heat exchanger (24) of the cooling distribution unit (12) and cooled working fluid from cooling distribution unit (12) to the tank enclosure (11).
In other words, the present invention introduces a sustainable server cooling solution that leverages Di-electric fluid for rapid heat transfer. This compact innovation employs a dual-stage heat exchange process, utilizing a specialized heat exchanger with concentric water conduits to efficiently dissipate heat from conduits carrying the working fluid. The heated water is directed to an external cooling system (51) comprising a small external heat exchanger (43) with a cooling means, reducing its temperature before returning to the initial heat exchanger (24) to sustain the cooling cycle. This compact system ensures optimal server temperatures, offering an energy-efficient and space-saving solution for datacenters with limited room for equipment and cooling mechanisms.
The present invention also relates to a datacenter optimization system (300) as shown in fig 3, comprising an apparatus (1) for dielectric cooling of datacenter, plurality of server units (13) working independently of each other, a working liquid (19), a cooling distribution unit (12), a heat exchanger (24) with temperature (T1, T2, T3, T4) and pressure sensors (P1, P2, P3, P4) and flow meters (M1,M2,M3,M4) and valves (31,32, 33, 36), a secondary cooling liquid (20) and a controller(18). The system comprises of an apparatus(1) for dielectric cooling of datacenter, having a tank enclosure (11) to house plurality of server units (13).
The apparatus (1) for dielectric cooling of datacenter is equipped to contain the plurality of server units(13) submerged in the working fluid (19). The apparatus (1) for dielectric cooling of datacenter is equipped with a weir portion (17) connected to a primary outlet valve (32) and a temperature sensor (T2). It has a cooling distribution unit (12) outside the tank enclosure (11) with temperature sensors, pressure sensors, flow meters and flow valves.
The cooling distribution unit (12), of the datacenter optimization system (300) is equipped with flow meters and valves to adjust the flow of the working fluid (19) and secondary cooling liquid (20) into the conduits of the heat exchanger. It is equipped with adjacent conduits for working fluid and secondary cooling liquid such that the working fluid cools down through convection by the cooling liquid conduits.
The controller (18) of the data optimization system is a control unit (19) housed inside the cooling distribution unit (12). It controls the temperature inside the tank enclosure (11); regulates the flow of working liquid (19) in and out of the tank enclosure (11); regulates the flow of secondary cooling liquid (20) in the conduits of the heat exchanger (24); receives from primary (T1, T2) and secondary (T3, T4) inlet and outlet temperature sensors and flow rates from primary(M1, M2) and secondary(M3, M4) inlet and outlet flow meters; and sends control signals to primary, secondary and external flow meters. It also regulates the plurality of pumps (21,22) in redundancy mode.
The system has a network of pumps (21, 22) and valves (31, 32, 33, 34a, 34b, 35, 36) to ensure smooth flow of working liquid (19) and secondary cooling liquid (20) in and out of the tank enclosure (11) and cooling distribution unit (12) for a continuous operation of the system. The primary outlet valve (32) regulates the flow of dielectric at weir portion (17), while primary inlet valve (31) regulates entry of cooled dielectric back to tank enclosure (11). The plurality of pumps (21, 22) are connected to the control module (18), which monitors and regulates their operation to ensure efficiency and reliability of the system. The valves used are motorized butterfly valves and motorized ball valves and are regulated by the control unit (18). The valves 34(a), 34(b) and 35 regulate the flow of dielectric on receiving corrective control signal from the control unit (18).
Also, the continuous operation is achieved by implementing an "n+1 redundancy" approach within its motors and pumps to ensure the continuous and seamless operation of the device, even in the face of unforeseen hardware failures. This innovative method involves incorporating redundant motor/pump units beyond the standard operational requirement (n), thereby creating a backup (21/22) that can seamlessly take over in the event of a primary motor/pump failure. This unique redundancy strategy enhances the device's reliability, as it maintains optimal performance and operational efficiency even when individual motor/pump units experience unexpected malfunctions or breakdowns. The control unit/controller/ control module (18) regulates the working of the redundant motors and pumps, during fault, for seamless operation.
The advantages of n+1 Redundancy include :
1. Continuous Operation and Minimal Downtime: The inclusion of a redundant motor/pump ensures that the system can maintain continuous operation even if a primary motor/pump unit fails. This failover mechanism minimizes downtime, providing a seamless transition to the backup motor/pump without interrupting the cooling process.
2. Enhanced Reliability and Performance: By incorporating n+1 redundancy, the system significantly enhances its reliability. This strategic redundancy ensures that the cooling performance and operational efficiency remain optimal, even during unforeseen hardware failures.
3. Operational Consistency and System Stability: The n+1 redundancy approach provides a robust safeguard against hardware-related disruptions. This contributes to maintaining operational consistency and overall system stability, ensuring that the cooling system functions reliably under various conditions.
4. System Longevity and Efficiency: The redundancy mechanism not only protects the system from immediate hardware failures but also extends the overall longevity of the cooling system. By reducing the likelihood of complete system shutdowns, the n+1 redundancy contributes to prolonged and efficient operation.
This solution provides a robust failover mechanism, minimizing downtime, maintaining operational consistency, and safeguarding the device against hardware-related disruptions, ultimately contributing to enhanced system stability and longevity. This also presents a novel and inventive approach to ensuring the uninterrupted functionality of devices through the strategic implementation of redundant motor/pump systems.
The present invention also relates to a method (600) of data optimization which begins with initialization of tank enclosure by detecting the level of working fluid inside the tank enclosure and setting the temperature of the working fluid inside the tank enclosure to T1. Then, the primary temperature sensor detects the temperature T2 inside the weir portion (17) of the tank enclosure (11) and sends the information to the controller (18). The controller/ control unit (18) communicates with the valves, sensors, flowmeters and pumps through control cables (25). The controller sends a flow control signal to the primary flow meter to activate the flow of working fluid (19) outside the tank enclosure through the primary outlet valve (32) and into the cooling distribution unit (12). The controller also sends third control signal to the external flowmeter to regulate the flow of secondary fluid inside the conduits of the heat exchanger (24).
The cooling distribution unit, on receiving the control signal from the controller (18), stabilizes the temperature of working fluid by adjusting the inlet and outlet of the external flow meter (36, 33) to adjust the flow of secondary cooling liquid (20) inside the heat exchanger (24) till the temperature of the working fluid (19) entering the tank enclosure (11) through primary inlet valve (31) is within the allowable range of the set temperature, T1.
The controller (18) further sends a second control action signal to the primary inlet flowmeter (M1) to circulate the cooled working fluid (19) back into the tank enclosure (11) through primary inlet valve (31).
The seamless regulation of working fluid (19) and secondary cooling liquid (20) by the control unit (18), ensures the stability of the datacenter cooling system.
The stabilizing the temperature of working fluid is done by the controller (18) by comparing the current temperature T2 of working fluid in the weir portion (17) (sensed by primary outlet temperature sensor (T2)), and set temperature T1, processing a corrective flow control signal and sending the corrective flow control signal to secondary inlet flow valve (36), to increase flow of secondary liquid (20) in the conduits of the heat exchanger (24) such that the temperature in the working fluid conduit is reduced to T1 + ?T; where ?T= {T2-T1} ? ET ; wherein ET is the range of permissible error in Temperature.
In an embodiment, the system of datacenter optimization uses dielectric such as immersion cooling fluids e.g. ENEOS, XG Galden, Florinert, Shell Diala S4, Dianalene and others. as a working liquid for the purpose of cooling the servers inside the tank enclosure of the datacenter.
In another embodiment the system uses other dielectric liquids such as hydrocarbons (mineral, synthetic, biological oils), silicone fluid, or fluorocarbons (fully engineered liquids), as working liquid.
The proposed datacenter optimization system finds Applications in Health Care, Educational Institutions, Private and Governmental DC enterprises, Defence, AI and Super-computing, as well as Private Sector.
The description, drawings and examples only illustrate embodiments of the present invention and should not be construed in limiting the scope of the invention.
ADVANTAGES
1. The present invention supports the decentralization of data by allowing for the distribution of data processing tasks across multiple locations rather than relying on a single, centralized data center. This enhances data security, reduces latency, and ensures better load balancing. It also mitigates risks associated with data breaches and failures at a single site, providing a more robust and resilient data infrastructure.
2. The present invention utilizes cutting-edge green technology that significantly reduces the carbon footprint of data centers. By employing liquid immersion cooling, the system operates with greater energy efficiency and minimizes the use of harmful refrigerants. This results in zero carbon emissions during cooling processes, aligning with global sustainability goals and promoting an eco-friendly approach to data center management.
3. Conventional data center cooling systems often rely on air conditioning, which is energy-intensive and less efficient. The present system uses liquid immersion cooling that offers a sustainable alternative by using non-conductive coolants to directly absorb heat from hardware. This method is much more efficient, reduces energy consumption, and decreases environmental impact, making it a superior choice for long-term sustainability.
4. By adopting the proposed method, data-centers can achieve significant savings on both capital expenditures (Capex) and operational expenditures (Opex). The system's efficiency reduces the need for extensive HVAC systems and associated infrastructure, lowering initial setup costs. Additionally, its operational efficiency results in lower energy bills and reduced maintenance costs, leading to ongoing financial benefits, thus provides an economical solution.
5. The liquid immersion cooling method of the present invention ensures that hardware operates within optimal temperature ranges, reducing thermal stress and preventing overheating. This results in a dramatic decrease in hardware failure rates, enhancing the longevity and reliability of data center equipment.
6. The proposed invention enables data centers to achieve power densities up to ten times higher than traditional air-cooled systems. This means that more computing power can be packed into the same physical space, increasing the efficiency and capacity of data centers without the need for additional real estate.
7. Power Usage Effectiveness (PUE) is a measure of data center efficiency, with lower values indicating better performance. The present system has a PUE as low as 1.03, reflecting its superior efficiency in converting power into computational output while minimizing energy losses in the cooling process.
8. The proposed invention offers a cost-effective cooling solution by reducing the need for expensive and complex air conditioning systems. Its efficient cooling capabilities lower energy consumption and maintenance costs, providing significant savings over the lifespan of the data center.
9. With implementation of the proposed system, data centers experience increased functional reliability due to its consistent and effective cooling performance. This reliability ensures that data center operations remain uninterrupted and that critical systems are always maintained at optimal temperatures, reducing the risk of downtime.
10. The compact nature of the apparatus of the proposed invention requires less physical space compared to traditional cooling methods. This efficient use of space allows for higher computing densities and more streamlined data center designs, maximizing the use of available real estate.
11. The proposed system sustainable and user-friendly. It uses environment friendly cooling technology that reduces energy consumption and carbon emissions. The straightforward installation and maintenance processes makes it easy to use and manage.
12. The proposed system is capable of maintaining optimal cooling performance even under adverse weather conditions. Unlike traditional air-cooled systems that may struggle with extreme temperatures and humidity, the liquid immersion cooling of the present invention provides consistent and reliable operation, ensuring data center stability in diverse environmental conditions
, Claims:We Claim :
1. An apparatus (1) for datacenter optimization by dielectric based datacenter cooling comprising a tank enclosure (11) with stackable discs (13), a cooling distribution unit (12), a control unit (18), a secondary cooling liquid (20) and a working fluid (19) encapsulating the stackable disc spaces;
wherein,
the tank enclosure (11) comprises:
- slots (14) for housing stackable discs of independently operating servers;
- a working fluid (19) encapsulating the stackable disc spaces;
- a weir portion (17) adjacent to one wall of the tank enclosure;
wherein,
the weir is connected to a primary outlet flow valve (32);
- a power distribution unit (16) for power management;
- inlet and outlet flow meters (M1, M2) and valves (31, 32) for regulation of working fluid (19) distribution; and
the cooling distribution unit (12) houses the control unit (12) and comprises of plurality of temperature sensors (T1, T2, T3, T4); pressure sensors (P1, P2, P3, P4) and flow meters (M1, M2, M3, M4); plurality of pumps (21, 22), plurality of valves (31, 32, 33, 34a, 34b, 35, 36) for flow regulation; a plate heat exchanger (24); and vents (44) for temperature regulation of plate heat exchanger;
wherein the said cooling distribution unit (12) is housed in a separate unit adjacent to the tank enclosure (11); and wherein;
- the control unit (18) controls
a) the flow of working fluid (19) in and out of the tank enclosure (11);
b) the flow of secondary cooling liquid (20) in and out of the plate heat exchanger (24); and
c) the temperature inside the tank enclosure, T1;
d) the working of plurality of pumps (21, 22) in redundancy mode;
e) the working of primary and secondary; inlet and outlet flow meters (M1, M2, M3, M4) and valves (31, 32, 33, 34a, 34b, 35, 36); and
- the heat exchanger (24)
o is a plate heat exchanger;
o comprises of separate conduits, for secondary cooling liquid (20) and working liquid (19), adjacent to each other, covering the entire heat exchanger unit in concentric orientation; and
o is connected with working fluid circulation pumps at inlet and outlet through primary inlet and outlet temperature sensors & pressure valves;
o is connected with a secondary cooling liquid distribution system (40) comprising secondary inlet and outlet valves (33, 36), temperature (T3, T4) and pressure (P3, P4) sensors, flow meters (M3, M4) and an external cooling system (51) with a water pump (41), a reservoir (42), heat exchanger (43) and a cooling mechanism ; and
- flow meters (M1, M2, M3, M4), temperature sensors (T1, T2,T3, T4), and pressure sensors (P1, P2, P3,P4) are placed adjacent to primary and secondary inlet (31, 33)and outlet (32, 36)valves.
2. The apparatus (1) for datacenter optimization by dielectric based datacenter cooling, as claimed in claim 1, wherein the control unit (18)
- is selected from microcontroller, microprocessor, Raspberry Pi, Arduino;
- receives inputs from primary and secondary inlet and outlet temperature (T1, T2, T3, T4) and pressure sensors (P1,P2,P3,P4) and flow meters (M1, M2,M3,M4);
- sends control signals to primary and secondary inlet and outlet flow meters and valves;
- receives inputs from plurality of pumps (21, 22) and maintains the pumps in redundancy mode;
- regulates the temperature inside the tank enclosure (T1) within the permissible limit.
3. The apparatus (1) for datacenter optimization by dielectric based datacenter cooling, as claimed in claim 1, wherein the working fluid (19) is a dielectric.
4. The apparatus (1) for datacenter optimization by dielectric based datacenter cooling, as claimed in claim 1, wherein the cooling of server discs (13) of datacenter is done by the working fluid (19) through natural convection.
5. The apparatus (1) for datacenter optimization by dielectric based datacenter cooling, as claimed in claim 1, wherein the temperature of the tank enclosure (11) is regulated by the control unit (18) through controlled circulation of working liquid (19).
6. The apparatus (1) for datacenter optimization by dielectric based datacenter cooling, as claimed in claim 1, wherein controlled circulation means circulation of hot working fluid from the tank enclosure (11) to the heat exchange unit (24) of the cooling distribution unit (12) and cooled working fluid (19) from the heat exchanger unit (24) to the tank enclosure (11).
7. The apparatus (1) for datacenter optimization by dielectric based datacenter cooling, as claimed in claim 1, wherein the secondary cooling liquid (20) is water.
8. The apparatus (1) for datacenter optimization by dielectric based datacenter cooling, as claimed in claim 1, wherein secondary cooling liquid (20) has its own cooling mechanism.
9. A datacenter optimization system (300) comprising an apparatus (1) for dielectric cooling of datacenter, plurality of server units (13) working independently of each other, a working liquid (19), a cooling distribution unit (12), a heat exchanger (24) , plurality of temperature sensors, pressure sensors, flowmeters and valves, plurality of pumps, a secondary cooling liquid (20) and a controller (18);
wherein
- the apparatus (1) for dielectric cooling of datacenter has a tank enclosure (11) to house plurality of server units (13);
- the apparatus for dielectric cooling of datacenter is equipped to contain the plurality of server units (13) submerged in the working fluid (19);
- the apparatus for dielectric cooling of datacenter is equipped with a weir portion (17) connected to a primary outlet valve (32) that regulates the outflow of hot working fluid;
- the apparatus for dielectric cooling has a cooling distribution unit (12) adjacent to the tank enclosure (11);

- the cooling distribution unit (12) comprises:
a) plurality of temperature sensors and valves connected to the controller (18);
b) plurality of flow meters and valves to adjust the flow of the working fluid (19) and secondary cooling liquid (20) in and out of the conduits of the heat exchanger (24);
c) adjacent conduits for working fluid and secondary cooling liquid such that the working fluid gets cooled down through convection by the secondary cooling liquid conduits; and

- the controller (18)
a) controls the temperature inside the tank enclosure (11);
b) controls the operation of plurality of pumps and valves;
c) regulates the flow of working liquid (19) in and out of the tank enclosure (11);
d) regulates the flow of secondary cooling liquid (20) in the conduits of the heat exchanger (24);
e) receives temperature from primary and secondary sensors and flow rates from primary and secondary flow meters; and
f) sends control signals to
o primary outlet valve (32) to circulate hot working fluid out of the tank enclosure;
o primary inlet valve to circulate cooler working fluid into the tank enclosure ;
o external inlet valve to circulate secondary cooling liquid into the heat exchanger (24) ;
o secondary outlet valve to circulate secondary cooling liquid to external cooling unit ; and
o activates the redundant pump (22) in an event of fault in active pump (21).
10. A method for datacenter optimization (600) by dielectric based cooling of a datacenter, comprising
i) initialization of tank enclosure by detecting the level of working fluid (19) inside the tank enclosure (11) and setting the temperature of the working fluid (19) inside the tank enclosure to T1;
ii) detecting by the primary temperature sensor(T2), any change in the temperature T2 inside the weir portion (17) of the tank enclosure (11) and sending the information to the controller (18);
iii) sending by controller, a flow control signal to the primary outlet flow meter (M2) to activate the flow of working fluid (19) outside the tank enclosure (11) through the primary outlet valve (32) and into the cooling distribution unit (24);
iv) receiving a third control signal by the secondary inlet flowmeter (M3) to regulate the flow of secondary fluid (20) inside the conduits of the heat exchanger (24);
v) stabilizing the temperature of working fluid (19) by adjusting the secondary inlet (36) and outlet valve (33) to adjust the flow of secondary cooling liquid inside the heat exchanger (24) till the temperature of the working fluid entering the tank enclosure through primary inlet valve is within a permissible range of the set temperature, T1.
vi) receiving a second control action by the primary outlet flowmeter (M1) inside the cooling distribution system (12) to circulate the cooled working fluid (19) into the tank enclosure (11) through primary inlet valve (31);
vii) regulating seamless movement of working fluid (19) and secondary cooling liquid (20) to ensure optimal performance of the datacenter by regulating the operation of valves and pumps.
11. The method for datacenter optimization (600) by dielectric based cooling of datacenter as claimed in claim 10;
wherein stabilizing the temperature of working fluid (19) is done by the controller (18);
- by comparing the current temperature T2 of working fluid in the weir portion (17), and set temperature T1 and
- sending the corrective flow control signal to secondary inlet flow valve (36), to increase flow of secondary liquid in the conduits of the heat exchanger such that temperature of dielectric becomes T1 +?T; wherein
?T= {T2-T1} ? ET ; wherein ET is the range of permissible error in Temperature.
Dated this 12th day of August 2024.

Anjali Menon (IN/PA-2696)
IPRGENIE LLP
(AGENT FOR APPLICANT)