DESC:CROSS-REFERENCE TO RELATED APPLICATIONS
[0001] The application claims priority from an Indian Provisional Application Number: 202341039969 filed on 12-06-2023, the complete disclosures of which, are herein incorporated by reference.
BACKGROUND
Technical Field
[0002] The present disclosure relates to battery packs, and more particularly to a system for mounting a Battery Management System (BMS) in a battery pack.
Description of the Related Art
[0003] A vehicle plays a major role in the life of human beings because the vehicle provides freedom to commute anywhere people need to. Nowadays, electric vehicles are unavoidable due to the increased demand for fossil fuels. Electric vehicles are powered by electricity from a battery pack that is in-built into the vehicle.
[0004] The battery pack includes a plurality of cells. As used herein, the cell is a device that stores and converts chemical energy into electrical energy. The plurality of cells may release heat energy at the time of charging and discharging. The released heat energy affects the battery pack which may lead to fire accidents and a thermal runaway. So, monitoring the plurality of cells is an extremely crucial task. To monitor the plurality of cells in the battery pack, the battery pack includes a Battery Management System (BMS) but positioning the BMS is a complex task.
[0005] In a conventional approach, automobile manufacturers struggled to dissipate heat energy from the battery pack, and the BMS. So, the automobile manufacturers increased the area of the heatsink to improve the heat dissipation ratio. The increased area of the heatsink may increase the material requirement of the heatsink which makes the battery pack expensive, and heavier.
[0006] In the conventional approach, the automobile manufacturers position the BMS outside the battery pack. Once the BMS is positioned outside, then the BMS will be affected by atmospheric factors (E.g., temperature, dust, water, wind).
[0007] In the conventional approach, there is no course of action to protect the BMS from heat energy generated from the plurality of cells during charging and discharging. Furthermore, the conventional method does not have any solution to solve the better utilization of space. So, the conventional methods are not efficient in solving the above-mentioned problems.
[0008] Hence, there remains a need for an improved system for mounting a battery management system in a battery pack and therefore address the aforementioned issues.
SUMMARY
[0009] Accordingly, the embodiments herein disclose a system for mounting a battery management system (BMS) in a battery pack. A bottom battery casing includes a cell portion, a BMS portion, and a separating member. The cell portion is configured to include a battery stack-up. The BMS portion includes a heat-conducting structure and the BMS. The BMS portion provides space for the heat-conducting structure and the BMS. The heat-conducting structure is configured to transfer the heat generated by one or more components of the BMS, towards one or more walls of the BMS portion of the bottom battery casing by a conduction process. The heat-conducting structure includes a first thermal interface material, a heat sink, and a second thermal interface material. The first thermal interface material is positioned between one or more walls of the BMS portion and the heat sink. The heat sink is positioned between the first thermal interface material and the second thermal interface material. The heat sink is configured to position the BMS. The heat sink includes one or more BMS mounting points. The one or more BMS mounting points are configured to couple the BMS to the heat sink, and the second thermal interface material to the heat sink. The separating member is configured to separate the bottom battery casing into the cell portion and the BMS portion.
[0010] In one embodiment, the first thermal interface material and the second thermal interface material include a thermal pad, a thermal paste, a silicon pad, a gap pad, a thermal grease, and a thermal gap filler.
[0011] In another embodiment, the BMS includes a first layer and a second layer. The first layer is placed between the second thermal interface material and the second layer. The BMS includes one or more components. The first layer includes the one or more components that generate more heat energy than the second layer.
[0012] In yet another embodiment, the one or more BMS mounting points include a first set of BMS mounting points, a second set of BMS mounting points, and a third set of mounting points. The first set of BMS mounting points and the second set of BMS mounting points are configured to couple the second thermal interface material to the heat sink. The second set of BMS mounting points is configured to couple the BMS to the heat sink. The first set of BMS mounting points and the second set of BMS mounting points are configured to couple the first layer of the BMS to the heatsink. The second set of BMS mounting points is configured to couple the second layer of the BMS to the heatsink. The third set of BMS mounting points is configured to couple the heat-conducting structure to the bottom battery casing.
[0013] In yet another embodiment, the heat sink is made of thermally conductive materials.
[0014] In yet another embodiment, the first thermal interface material is compressed against the one or more walls of the BMS portion of the bottom battery casing to transfer heat which is generated from the BMS. The one or more walls include a front wall, a rear wall, a left-side wall, and a right-side wall.
[0015] In yet another embodiment, the second thermal interface material is compressed between the BMS and the heat sink.
[0016] In yet another embodiment, the one or more BMS mounting points are constructed in a manner to compress the second thermal interface material towards the heat sink for better thermal conduction, and structural rigidity.
[0017] In yet another embodiment, the one or more BMS mounting points include one or more fasteners, a gusset, and a bracket.
[0018] In yet another embodiment, the one or more walls of the BMS portion and the bottom battery casing act as a heat sink.
[0019] These and other aspects of the embodiments herein will be better appreciated and understood when considered in conjunction with the following description and the accompanying drawings. It should be understood, however, that the following descriptions, while indicating preferred embodiments and numerous specific details thereof, are given by way of illustration and not of limitation. Many changes and modifications may be made within the scope of the embodiments herein without departing from the invention thereof, and the embodiments herein include all such modifications.
BRIEF DESCRIPTION OF DRAWINGS
[0020] The embodiments herein will be better understood from the following detailed description with reference to the drawings, in which:
[0021] FIG. 1 illustrates a system for mounting a battery management system (BMS) according to an embodiment as disclosed herein; and
[0022] FIG. 2 illustrates a perspective view of a BMS mounting plate with a BMS according to an embodiment as disclosed herein.
[0023] It may be noted that to the extent possible, like reference numerals have been used to represent like elements in the drawing. Further, those of ordinary skill in the art will appreciate that elements in the drawing are illustrated for simplicity and may not have been necessarily drawn to scale. For example, the dimension of some of the elements in the drawing may be exaggerated relative to other elements to help to improve the understanding of aspects of the invention. Furthermore, the elements may have been represented in the drawing by conventional symbols, and the drawings may show only those specific details that are pertinent to the understanding the embodiments of the invention so as not to obscure the drawing with details that will be readily apparent to those of ordinary skill in the art having benefit of the description herein.

DETAILED DESCRIPTION OF PREFERRED EMBODIMENTS
[0024] In the following description, for the purposes of explanation, various specific details are set forth in order to provide a thorough understanding of embodiments of the present disclosure. It will be apparent, however, that embodiments of the present disclosure may be practiced without these specific details. Several features described hereafter can each be used independently of one another or with any combination of other features. An individual feature may not address all of the problems discussed above or might address only some of the problems discussed above. Some of the problems discussed above might not be fully addressed by any of the features described herein.
[0025] The ensuing description provides exemplary embodiments only and is not intended to limit the scope, applicability, or configuration of the disclosure. Rather, the ensuing description of the exemplary embodiments will provide those skilled in the art with an enabling description for implementing an exemplary embodiment. It should be understood that various changes may be made in the function and arrangement of elements without departing from the spirit and scope of the disclosure as set forth.
[0026] The word “exemplary” and/or “demonstrative” is used herein to mean serving as an example, instance, or illustration. For the avoidance of doubt, the subject matter disclosed herein is not limited by such examples. In addition, any aspect or design described herein as “exemplary” and/or “demonstrative” is not necessarily to be construed as preferred or advantageous over other aspects or designs, nor is it meant to preclude equivalent exemplary structures and techniques known to those of ordinary skill in the art. Furthermore, to the extent that the terms “includes,” “has,” “contains,” and other similar words are used in either the detailed description or the claims, such terms are intended to be inclusive in a manner similar to the term “comprising” as an open transition word without precluding any additional or other elements.
[0027] Reference throughout this specification to “one embodiment” or “an embodiment” or “an instance” or “one instance” means that a particular feature, structure, or characteristic described in connection with the embodiment is included in at least one embodiment of the present disclosure. Thus, the appearances of the phrases “in one embodiment” or “in an embodiment” in various places throughout this specification are not necessarily all referring to the same embodiment. Furthermore, the particular features, structures, or characteristics may be combined in any suitable manner in one or more embodiments.
[0028] The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the disclosure. As used herein, the singular forms “a”, “an” and “the” are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will be further understood that the terms “comprises” and/or “comprising,” when used in this specification, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof. As used herein, the term “and/or” includes any and all combinations of one or more of the associated listed items.
[0029] The accompanying drawings are used to help easily understand various technical features and it should be understood that the embodiments presented herein are not limited by the accompanying drawings. As such, the present disclosure should be construed to extend to any alterations, equivalents, and substitutes in addition to those which are particularly set out in the accompanying drawings. Although the terms first, second, etc. may be used herein to describe various elements, these elements should not be limited by these terms. These terms are generally only used to distinguish one element from another.
[0030] Accordingly, the embodiments herein disclose a system for mounting a battery management system (BMS) in a battery pack. A bottom battery casing includes a cell portion, a BMS portion, and a separating member. The cell portion is configured to include a battery stack-up. The BMS portion includes a heat-conducting structure and the BMS. The BMS portion provides space for the heat-conducting structure and the BMS. The heat-conducting structure is configured to transfer the heat generated by one or more components of the BMS, towards one or more walls of the BMS portion of the bottom battery casing by a conduction process. The heat-conducting structure includes a first thermal interface material, a heat sink, and a second thermal interface material. The first thermal interface material is positioned between one or more walls of the BMS portion and the heat sink. The heat sink is positioned between the first thermal interface material and the second thermal interface material. The heat sink is configured to position the BMS. The heat sink includes one or more BMS mounting points. The one or more BMS mounting points are configured to couple the BMS to the heat sink, and the second thermal interface material to the heat sink. The separating member is configured to separate the bottom battery casing into the cell portion and the BMS portion.
[0031] Referring now to the drawings and more particularly to FIGS. 1 to 2, where similar reference characters denote corresponding features consistently throughout the figure, these are shown as preferred embodiments.
[0032] FIG. 1 illustrates a system 101 for mounting a Battery Management System (BMS) in a battery pack according to an embodiment as disclosed herein. The system 101 includes a bottom battery casing 100. The bottom battery casing 100 includes a cell portion 102, a BMS portion 104, and a separating member 106.
[0033] The cell portion 102 of the bottom battery casing 100 includes a battery stack-up (not shown in the figure). The cell portion 102 of the bottom battery casing 100 is configured to provide space for the battery stack-up. The cell portion 102 of the bottom battery casing 100 includes a plurality of cells (which is not shown in the figure). As used herein, the plurality of cells may be connected in a series, a parallel, or a combination of both to provide the desired voltage, capacity, or power density. Further, the cell portion 102 is configured to transfer the heat generated by the plurality of cells from the bottom battery casing 100 to the outside of the battery pack. In one embodiment, the cell portion 102 is configured to transfer the heat generated by the plurality of cells from the bottom battery casing 100 to the outside of the battery pack via PCM.
[0034] The BMS portion 104 of the bottom battery casing 100 includes a heat-conducting structure 108 and a Battery Management System (BMS) 110. The BMS portion 104 of the bottom battery casing 100 is configured to provide the space for the heat-conducting structure 108 and the BMS 110. The BMS portion 104 of the bottom battery casing 100 is in a predetermined shape.
[0035] The heat-conducting structure 108 is configured to transfer the heat generated by one or more components of the BMS 110, towards one or more walls 112 of the BMS portion 104 of the bottom battery casing 100 by a (heat) conduction process. In one embodiment, the one or more walls of the BMS portion 104 act as a heat sink. In another embodiment, the bottom battery casing 100 acts as the heat sink. As used herein, the conduction process is defined as a process by which heat energy is transmitted through collisions between neighboring atoms or molecules. As used herein, the heat sink is defined as a component that increases the heat flow away from a hot device. In another embodiment, the one or more walls 112 of the BMS portion 104 include a front wall 112A of the BMS portion 104, a rear wall 112B of the BMS portion 104, a left-side wall 112C of the BMS portion 104, and a right-side wall 112D of the BMS portion 104.
[0036] The separating member 106 is configured to separate the bottom battery casing 100 into the cell portion 102 and the BMS portion 104. The separating member 106 is configured to prevent the flow of heat generated in the plurality of cells to the BMS portion 104.
[0037] FIG. 2 illustrates an exploded view of the heat-conducting structure 108 and the BMS 110 according to an embodiment as disclosed herein. The heat-conducting structure 108 includes a first thermal interface material 202, a heat sink 204, and a second thermal interface material 206. The BMS portion 104 of the bottom battery casing 100 is in a predetermined shape. The first thermal interface material 202 is positioned between the one or more walls 112 of the BMS portion 104, and the heat sink 204. In one embodiment, the first thermal interface material 202 includes, but not limited to, a thermal pad, a thermal paste, a silicon pad, a gap pad, a thermal grease, a thermal gap filler, and the like. The first thermal interface material 202 is compressed against the one or more walls 112 of the BMS portion 104 of the bottom battery casing 100 to transfer the heat which is generated from the BMS 110.
[0038] The heat sink 204 is positioned between the first thermal interface material 202, and the second thermal interface material 206. The heat sink 204 acts as a BMS mounting plate. The heat sink 204 is configured to position the BMS 110. The heat sink 204 includes one or more BMS mounting points 208. In addition to that, the heat sink 204 is made of one or more thermally conductive materials.
[0039] The one or more BMS mounting points 208 configured to couple (i) the BMS 110 to the heat sink 204, and (ii) the second thermal interface material 206 to the heat sink 204. In one embodiment, the BMS 110 includes, but not limited to, a plurality of layers. In another embodiment, the plurality of layers includes, but not limited to, a first layer 110A, and a second layer 110B. In yet another embodiment, the BMS 110 includes a third layer. The first layer 110A is placed between the second thermal interface material 206, and the second layer 110B. The BMS 110 includes one or more components that generate more heat energy. In one embodiment, the first layer 110A is designed in such a way that includes the one or more components that generate more heat energy than the second layer 110B.
[0040] In another embodiment, the one or more BMS mounting points 208 includes a first set of BMS mounting points 208A, a second set of BMS mounting points 208B, and a third set of BMS mounting points 208C. The first set of BMS mounting points 208A and the second set of BMS mounting points 208B configured to couple the second thermal interface material 206 to the heat sink 204. The second set of BMS mounting points 208B configured to couple the BMS 110 to the heat sink 204. The third set of BMS mounting points 208C configured to couple the heat-conducting structure 108 to the bottom battery casing 100.
[0041] The first set of BMS mounting points 208A and the second set of BMS mounting points 208B configured to couple the first layer 110A of the BMS 110 to the heat sink 204. The second set of BMS mounting points 208B is configured to couple the second layer 110B of the BMS 110 to the heatsink 204. In one embodiment, the one or more BMS mounting points 208 include, but not limited to, one or more fasteners, a gusset, a bracket, and the like. In another embodiment, the first set of BMS mounting points 208A, the second set of BMS mounting points 208B and the third set of mounting points 208C include, but not limited to, one or more fasteners, a gusset, a bracket, and the like. The one or more BMS mounting points 208 are constructed in a manner to compress the second thermal interface material 206 towards the heat sink 204 for better thermal conduction, and structural rigidity.
[0042] The second thermal interface material 206 is positioned between the BMS 110 and the heat sink 204. In one embodiment, the second thermal interface material 206 includes, but not limited to, a thermal pad, a thermal paste, a silicon pad, a gap pad, a thermal grease, a thermal gap filler, and the like. The second thermal interface material 206 is compressed between the BMS 110 and the heat sink 204.
[0043] The heat-conducting structure 108 and the BMS 110 are positioned inside the BMS portion 104 of the bottom battery casing 100. The one or more BMS mounting points 208 are designed to compress the second thermal interface material 206 towards the heat sink 204 for better thermal conduction, and structural rigidity.
[0044] The first thermal interface material 202 is compressed against the one or more walls 112 of the BMS portion 104 of the bottom battery casing 100 to transfer the heat which is generated from the BMS 110. The heat-conducting structure 108 is compressed against the one or more walls 112 of the BMS portion 104 of the bottom battery casing 100 to transfer the heat which is generated from the BMS 110 using the third set of BMS mounting points 208C. The proposed approach increases heat dissipation of the battery pack in Electric vehicles.
[0045] The BMS portion 104 of the bottom battery casing 100 includes at least one breather to maintain the pressure and the temperature level of the battery pack. In one embodiment, the bottom battery casing 100 includes at least one breather. Furthermore, at least one breather is configured to maintain the temperature level of the battery pack by using a convection heat transfer process. In one embodiment, the bottom battery casing 100 of the battery pack includes at least one relief valve. In another embodiment, the BMS portion 104 of the bottom battery casing 100 includes at least one relief valve. In one embodiment, at least one relief valve may be bidirectional or unidirectional.
[0046] Improvements and modifications may be incorporated herein without deviating from the scope of the invention. The foregoing description of the specific embodiments will so fully reveal the general nature of the embodiments herein that others can, by applying current knowledge, readily modify and/or adapt for various applications such specific embodiments without departing from the generic concept, and, therefore, such adaptations and modifications should and are intended to be comprehended within the meaning and range of equivalents of the disclosed embodiments. It is to be understood that the phraseology or terminology employed herein is for the purpose of description and not of limitation. Therefore, while the embodiments herein have been described in terms of preferred embodiments, those skilled in the art will recognize that the embodiments herein can be practiced with modification within the spirit and scope of the appended claims.

LIST OF REFERENCE NUMERALS

100: Bottom battery casing
101: System for mounting a battery management system in a battery pack
102: Cell portion
104: Battery management system portion
106: Separating member
108: Heat-conducting structure
110: Battery management system
110A: First layer
110B: Second layer
112: one or more walls
112A: A front wall
112B: a rear wall
112C: a left-side wall
112D: a right-side wall
202: First thermal interface material
204: Heat sink
206: Second thermal interface material
208: One or more BMS mounting points
208A: First set of BMS mounting points
208B: Second set of BMS mounting points
208C: Third set of BMS mounting points
,CLAIMS:CLAIMS
I/We claim:
1. A system (101) for mounting a battery management system (110) in a battery pack comprising:
a bottom battery casing (100);
a cell portion (102) comprises a battery stack-up;
a battery management system portion (104) comprises a heat-conducting structure (108) and the battery management system (110), and provides space for the heat-conducting structure (108) and the battery management system (110),
the heat-conducting structure (108) is configured to transfer the heat generated by one or more components of the battery management system (110), towards one or more walls (112) of the battery management system portion (104) of the bottom battery casing (100) by a conduction process,
wherein the heat-conducting structure (108) comprises a first thermal interface material (202), a heat sink (204), and a second thermal interface material (206), wherein the first thermal interface material (202) is positioned between the one or more walls (112) of the battery management system portion (104), and the heat sink (204), wherein the heat sink (204) is positioned between the first thermal interface material (202), and the second thermal interface material (206),
wherein the heat sink (204) is configured to position the BMS (110), wherein the heat sink (204) comprises one or more BMS mounting points (208), wherein the one or more BMS mounting points (208) configured to couple the BMS (110) to the heat sink (204), and the second thermal interface material (206) to the heat sink (204); and
a separating member (106) is configured to separate the bottom battery casing (100) into the cell portion (102) and the battery management system portion (104).
2. The system (101) as claimed in claim 1, wherein the first thermal interface material (202), and the second thermal interface material (206) comprise a thermal pad, a thermal paste, a silicon pad, a gap pad, a thermal grease, and a thermal gap filler.
3. The system (101) as claimed in claim 1, wherein the BMS (110) comprises a first layer (110A), and a second layer (110B), wherein the first layer (110A) is placed between the second thermal interface material (206), and the second layer (110B), wherein the BMS (110) comprises one or more components, wherein the first layer (110A) comprises the one or more components that generate more heat energy than the second layer (110B).
4. The system (101) as claimed in claim 1, wherein the one or more BMS mounting points (208) comprise a first set of BMS mounting points (208A), a second set of BMS mounting points (208B), and a third set of mounting points (208C), wherein the first set of BMS mounting points (208A) and the second set of BMS mounting points (208B) configured to couple the second thermal interface material (206) to the heat sink (204), wherein the second set of BMS mounting points (208B) configured to couple the BMS (110) to the heat sink (204), wherein the first set of BMS mounting points (208A) and the second set of BMS mounting points (208B) configured to couple the first layer (110A) of the BMS (110) to the heatsink (204), wherein the second set of BMS mounting points (208B) configured to couple the second layer (110B) of the BMS (110) to the heatsink (204), wherein the third set of BMS mounting points (208C) configured to couple the heat-conducting structure (108) to the bottom battery casing (100).
5. The system (101) as claimed in claim 1, wherein the heat sink (204) is made of one or more thermally conductive materials.
6. The system (101) as claimed in claim 1, wherein the first thermal interface material (202) is compressed against the one or more walls (112) of the battery management system portion (104) of the bottom battery casing (100) to transfer the heat which is generated from the BMS (110), wherein the one or more walls (112) comprises a front wall (112A), a rear wall (112B), a left side wall (112C), and a right side wall (112D).
7. The system (101) as claimed in claim 1, wherein the second thermal interface material (206) is compressed between the BMS (110) and the heat sink (204).
8. The system (101) as claimed in claim 1, wherein the one or more BMS mounting points (208) are constructed in a manner to compress the second thermal interface material (206) towards the heat sink (204) for better thermal conduction, and structural rigidity.
9. The system (101) as claimed in claim 1, wherein the one or more BMS mounting points (208) comprise one or more fasteners, a gusset, and a bracket.
10. The system (101) as claimed in claim 1, wherein the one or more walls (112) of the battery management system portion (104) and the bottom battery casing (100) act as the heat sink.