Abstract: ABSTRACT AN ELECTRONIC ASSEMBLY An electronic assembly (100) is described. The electronic assembly includes a circuit board (102) having a heat generating circuit element (104) that generates heat during operation and a rear cover (106) to mount the circuit board (102). The rear cover (106) includes a body portion (108) made of a non-conductive material and an end plate (112) made of a heat conducting material. The body portion (108) has a central cavity (110) and the end plate (112) is disposed into the central cavity (110). The end plate (112) includes a heat collecting region and a heat dissipating region. FIG. 1A
Claims:AS ATTACHED , Description:AS ATTACHED
| # | Name | Date |
|---|---|---|
| 1 | 202141040426-STATEMENT OF UNDERTAKING (FORM 3) [06-09-2021(online)].pdf | 2021-09-06 |
| 2 | 202141040426-FORM 1 [06-09-2021(online)].pdf | 2021-09-06 |
| 3 | 202141040426-DRAWINGS [06-09-2021(online)].pdf | 2021-09-06 |
| 4 | 202141040426-DECLARATION OF INVENTORSHIP (FORM 5) [06-09-2021(online)].pdf | 2021-09-06 |
| 5 | 202141040426-COMPLETE SPECIFICATION [06-09-2021(online)].pdf | 2021-09-06 |
| 6 | 202141040426-Proof of Right [16-09-2021(online)].pdf | 2021-09-16 |
| 7 | 202141040426-FORM-26 [21-10-2021(online)].pdf | 2021-10-21 |
| 8 | 202141040426-FORM 18 [27-08-2025(online)].pdf | 2025-08-27 |