Claims:We Claim:
1. An electronic device (100) comprising:
a circuit board (101);
a plurality of electronic components (102) operatively disposed on said circuit board (101);
a conductive outer casing (103) enclosing said plurality of electronic components (102) disposed on said circuit board (101); and
one or more support members (105) housed within the conductive outer casing (103) and configured to support and elastically displace the circuit board (101) for establishing thermal contact of one or more electronic components (102b, 102c) of the plurality of electronic components (102) disposed on the circuit board (101) with the conductive outer casing (103).
2. The electronic device (100) as claimed in claim 1, wherein the one or more support members (105) includes one or more support bars (106).
3. The electronic device (100) as claimed in claim 1, wherein the circuit board (101) is disposed over the one or more support members (105), with a portion of a lower surface of the circuit board (101) being in contact with the one or more support members (105).
4. The electronic device (100) as claimed in claim 2, wherein each of said one or more support bars (106) is rigid and provided with a plurality of elastic members (108).
5. The electronic device (100) as claimed in claim 4, wherein the plurality of elastic members (108) are inserted into corresponding holes (109) formed in each of said one or more support bars (106), wherein at least a portion of each elastic member of the plurality of elastic members (108) extends out from one end of said corresponding holes (109).
6. The electronic device (100) as claimed in claim 4, wherein said at least a portion of each elastic member of the plurality of elastic members (108) is held to be in contact with a base (107d) of one or more corresponding slots (107).
7. The electronic device (100) as claimed in claim 1, wherein the one or more support members (105) are inserted into one or more corresponding slots (107) formed in corresponding inner walls (103b) of the conductive outer casing (103).
8. The electronic device (100) as claimed in claim 1, wherein the one or more support members (105) includes one or more elastic support plates (110).
9. The electronic device (100) as claimed in claim 9, wherein the one or more elastic support plates (110) is made of spring steel.
10. The electronic device (100) as claimed in claim 8, wherein the one or more elastic support plates (110) is inserted into corresponding slots (107) formed in corresponding inner walls (103b) of the conductive outer casing (103).
11. A method for installing a circuit board (101) of an electronic device (100), said electronic device (100) comprising:
the circuit board (101);
a plurality of electronic components (102) operatively disposed on said circuit board (101);
a conductive outer casing (103) enclosing said plurality of electronic components (102) disposed on said circuit board (101); and
one or more support members (105) housed within the conductive outer casing (103);
wherein the method of installation of the circuit board (101) involves the steps of:
installing the one more support members (105) including one or more support bars (106) comprising a plurality of elastic members (108) into corresponding slots (107) formed in corresponding walls (103b) of the conductive outer casing (103), by sliding the one or more support bars (105) into the corresponding slots (107);
pre-compressing the one or more support members (105) using an external tool, while simultaneously placing the circuit board (101) over the one or more support members (105); and
sliding the circuit board (101) over the one or more support members (105) and within the corresponding slots (107) of the outer conductive casing (103). , Description:TECHNICAL FIELD
[0001] The present subject matter generally relates to an electronic device and particularly but not exclusively relates to an installation assembly for the electronic components of the electronic device.
BACKGROUND OF THE INVENTION
[0002] Typically, electronic devices, electrical systems such as control systems, power controls, switches etc. generate lot of heat during operation. To avoid damage to the device as a whole or to any of the components of such devices/systems, heat must be dissipated. Commonly, the electronic device comprises an outer casing made of highly conductive thermal material placed in thermal contact with a heat exchange member, which in turn is held to be in thermal contact with various internal electronic components of the electronic device for dissipating heat generated by the various internal components.
[0003] In order to ensure that heat is effectively dissipated from the electronic device, it is essential to ensure that the heat generating electronic component is reliably secured to be in thermal contact with the heat exchange member. Further, there is also a need to ensure that there is no air gap between an upper surface of the various internal components and an inner surface/roof of the outer casing, in order to ensure that heat is effectively transmitted to the metallic casing. For example, the electronic components on a circuit board of the electronic device are kept in thermal contact with a heat exchange member disposed along a left and right sides, on an inner side of the outer casing by means of fasteners or clips. Therefore, the front, rear and side surfaces of the electronic components are kept in thermal contact with the heat exchange member disposed within the outer casing, wherein the heat exchange member is in thermal contact with the outer casing. However, due to their large size, some of the electronic components such as transformers are not held in thermal contact with the heat exchange members. Transformers typically generate a lot of heat and it is required that heat generated by the transformers is dissipated outside.
[0004] A known art involves the use of thermal pads or thermal paste for establishing thermal contact of some of the electronic components with the conductive outer casing. Typically, thermal pads are inserted into gaps present between the various internal components of the electronic device and the outer casing in order to fill up the gaps around the various internal components, especially between the roof of the casing and the upper surface of the electronic components. Insertion of thermal pads between the upper surface of the electronic components and the roof of the casing often results in some damage to the surfaces/edges of the electronic components. Moreover, use of thermal pads/thermal paste proves to be cumbersome, thereby increasing the time required for assembling the electronic components of the electronic device. The use of thermal pads/thermal paste is also expensive.
[0005] Therefore, there is a need for providing an alternate means for establishing thermal contact of some of the electronic components and the roof of the outer casing while overcoming all the above-mentioned problems and other problems known in the art.
BRIEF DESCRIPTION OF THE DRAWINGS
[0006] The detailed description described with reference to the accompanying figures. The same numbers have been used throughout the drawings to reference like features and components.
[0007] Fig.1 is an exploded view depicting parts of an electronic device in accordance with an embodiment of the present subject matter.
[0008] Fig.2 is a perspective exploded view depicting assembly of one or more support members into a conductive outer casing of the electronic device in accordance with an embodiment of the present subject matter.
[0009] Fig.3a. is an exploded view depicting constituent members of a support member in accordance with a first embodiment of the present subject matter.
[00010] Fig.3b is a detailed perspective view of the support member in accordance with a first embodiment of the present subject matter.
[00011] Fig.4 is an exploded perspective view depicting an assembly of a circuit board of the electronic device in accordance with an embodiment of the present subject matter.
[00012] Fig.5 is a cross sectional view of the electronic device depicting its constituent plurality of electronic components in accordance with a first embodiment of the present subject matter.
[00013] Fig.6a is a cross sectional view of the electronic device depicting its constituent plurality of electronic components in accordance with a second embodiment of the present subject matter.
[00014] Fig.6b is a detailed perspective view of the support member in accordance with a second embodiment of the present subject matter.

DETAILED DESCRIPTION BACKGROUND OF THE INVENTION
[00015] Typically, electronic devices are designed to conduct heat from a circuit board holding a plurality of electronic components to an external surface portion thereof. Such electronic devices include heat exchange members which act as a heat transfer medium to conduct heat from body of said electronic components to the surrounding environment through the external surface of said devices. Said heat exchange members are held in thermal contact with constituent electronic components of the electronic device, such constituent electronic components being heat generating components such as transistors, transformers etc. disposed on the circuit board of the electronic devices. A reliable securing means is provided for securing the plurality of electronic components to said heat exchange members and for thereby establishing thermal contact so that heat generated by the plurality of electronic components is diffused to the outside. Typically, fasteners or clips are used to secure the plurality of electronic components to the heat exchange members for establishing thermal contact of the electronic components with the heat exchange members. Particularly, the use of clips/fasteners only aid in establishing thermal contact of side and/or front and/or rear surfaces of each of the electronic components with the heat exchange members, and through the heat exchange members with an outer conductive casing of the electronic device. However, due to variation in their shape and size, it is difficult to establish thermal contact of some of the electronic components with the heat exchange members. This happens to be one of the crucial challenges to enable flexibility in the design of the casing to incorporate various sizes of electronic components inside it while still being able to hold the components securely in a rigid manner & at the same time provide an effective heat removal or heat energy dissipation mechanism for the electronic device as a whole. For example, electronic components such as transformers disposed on the circuit board and which are typically large in size are not secured to the heat exchange members. However, since transformers are one of the highest heat generating components on the circuit board, it is essential to ensure that there is thermal contact of the transformers with at least a portion of the outer conductive casing so that the heat generated by the transformers is diffused to the casing and from the casing to the outside. Typically, thermal pads or thermal paste are used to establish thermal contact of the transformers with a roof or a wall of the outer conductive casing. Particularly, the thermal pads are inserted in gaps present between the roof of the casing and an upper surface of the transformers. However, during insertion of thermal pads, the transformers and other electronic components surrounding the transformers often tend to get damaged, affecting the overall performance of the electronic device. Moreover, use of thermal pads/thermal paste is also cost intensive. Therefore, there is a need for providing an improved means for establishing thermal contact between an upper surface of the electronic components and the roof of the casing while overcoming all the above-mentioned problems and other problems known in the art.
[00016] With the above objectives in view, the present subject matter, provides an electronic device comprising a circuit board on which a plurality of electronic components are operatively disposed, a conductive outer casing enclosing said plurality of electronic components, and one or more support members housed within the conductive outer casing and supporting the circuit board for establishing thermal contact of one or more electronic components disposed on the circuit board with the conductive outer casing. Particularly, the one or more support members includes support bars over which the circuit board holding the plurality of electronic components is disposed.
[00017] As per one embodiment of the present subject matter, the one or more support bars is provided with a plurality of elastic members. In particular, the plurality of elastic members is inserted into corresponding holes formed in each of said one or more support bars. The corresponding holes are formed along a length of a top surface of each of said one or more support bars, with equal spacing between all the corresponding holes. Further, the plurality of elastic members are inserted in a manner such that at least a portion of each of the plurality of elastic members extends out of one end of said corresponding holes. Once the plurality of elastic members are inserted into the corresponding holes, the one or more support bars are inserted into corresponding slots formed in corresponding inner walls of the conductive outer casing. For example, in the present embodiment, the one or more support bars fitted with the plurality of elastic members is slid into corresponding slots formed in left and right side walls of the conductive outer casing. Further, the circuit board is assembled over the one or more support bars. For example, in the present embodiment, the circuit board is slid over the support bars. Particularly, in the present embodiment, the support bars are simultaneously compressively held by means of an external tool while the circuit board is being slid over the support bars. Thus, the circuit board is slid through the corresponding slots which also receive the one or more support bars. Pressing down the one or more support bars while installing the circuit board causes compression of each of the plurality of elastic members. The same plurality of elastic members begin to expand once the pressure over the one or more support bars is released and the circuit board is installed. As the plurality of elastic members begin to expand, the one or more support bars disposed below the circuit board causes the circuit board to rise upwards. Owing to an upward movement of the circuit board, the plurality of electronic components operatively disposed on the circuit board also rise upwards towards an inner surface of a roof of the conductive outer casing. As a result, some of the relatively taller/larger electronic components of the plurality of electronic components including transformers disposed on the circuit board come into contact with inner surface of a roof of the conductive outer casing. Thus, direct thermal contact of one or more electronic components with the inner surface of the roof of the conductive outer casing is established. Once one or more electronic components of the plurality of electronic components come in contact with the roof of the conductive outer casing, the upward movement of the circuit board is stopped and the circuit board is held in position over the one or more support bars.
[00018] According to another embodiment of the present subject matter, the one or more support bars includes one or more elastic support plates, wherein the elastic support plates is made of spring steel. The one or more elastic support plates is inserted into the corresponding slots formed in the left and right side walls of the conductive outer casing. An external tool is used compress the one or more elastic bars while the circuit board is being installed by being slid over the one or more elastic bars. Pressing down the one or more elastic support plates while installing the circuit board causes compression of each of the elastic support plates. The same elastic support plates begin to expand once the pressure over the one or more elastic support plates is released and the circuit board is installed. As the one or more elastic support plates begin to expand, the circuit board disposed over the one or more elastic support plates begins to rise upwards. Owing to an upward movement of the circuit board, the plurality of electronic components operatively disposed on the circuit board also show upward movement towards an inner surface of a roof of the conductive outer casing. As a result, some of the relatively taller/larger electronic components of the plurality of electronic components including transformers disposed on the circuit board come into contact with inner surface of a roof of the conductive outer casing. Thus, direct thermal contact of one or more electronic components with the inner surface of the roof of the conductive outer casing is established. Once one or more electronic components of the plurality of electronic components come in contact with the roof of the conductive outer casing, the upward movement of the circuit board is stopped and the circuit board is held in position over the one or more elastic support plates. As per an alternate embodiment, the electronic components can be configured to come in contact with any side wall of the casing & the casing may be configured in various shapes e.g. cuboid, sphere etc.
[00019] The electronic device as per the present subject matter also comprises one or more heat exchange members disposed above the corresponding slots holding the one or more support members, with two or more electronic components of the plurality of electronic components being held in thermal contact with the one or more heat exchange members. Thus, while some of the electronic components are held in direct thermal contact with the inner surface of the roof of the conductive outer casing, other electronic components are held in thermal contact with the one or more heat exchange members.
[00020] Thus, the design and construction of the electronic device as per the present subject matter ensures that all the electronic components operatively disposed on the circuit board are held to be in thermal contact directly or indirectly with the conductive outer casing so that heat generated by the plurality of electronic components is effectively dissipated to the outside without the need for using thermal pads or thermal paste. Eliminating the use of thermal pads aids in ensuring that no collateral damage is caused to the electronic components during its installation. Moreover, assembly time involved in assembling the various components of the electronic device is also minimised.
[00021] Various other features and advantages of the invention are described in detail below with reference to the accompanying drawings. In the drawings, like reference numbers generally indicate identical, functionally similar, and/or structurally similar elements.
[00022] Fig.1 is an exploded view depicting parts of the electronic device 100 as per an embodiment of the present subject matter. In the present embodiment, said electronic device 100 is a charger device, used for charging a battery. The electronic device 100 as per the present embodiment comprises a circuit board 101, a plurality of electronic components 102 operatively disposed on said circuit board 101, and a conductive outer casing 103 enclosing said plurality of electronic components 102 disposed on said circuit board 101. The conductive outer casing also encloses one or more heat exchange members 104. The circuit board 101 together with said plurality of electronic components 102 functionally contribute to the operation of said electronic device 100. In the present embodiment, said electronic components 102 include transistors 102a, transformers 102b, capacitors 102c, and the like, which are heat generating components. It is important that the heat generated by said components 102 is dissipated to the surroundings, in order to ensure efficient performance of the electronic device 100. The one or more heat exchange members 104 and said outer casing 103 together contribute in dissipation of heat to the outside. Whereas, said heat exchange members 104 transfer heat from said electronic components 102 to said outer casing 103, said outer casing 103 dissipates heat received from the heat exchange members 104 to the outside. In the present embodiment, said outer casing 103 is provided with cooling fins 103a, which facilitate heat dissipation. In order to ensure heat dissipation, some electronic components including transistors 102a are held in thermal contact with the heat exchange members 104, and the heat exchange members 104 are in turn held in direct thermal contact with said outer casing 103. Further, some other electronic components such as the transformers 102b and capacitors 102c, which are large in size/dimensions and which cannot be connected to the one or more heat exchange members 104 are directly held in thermal contact with the conductive outer casing 103. Both, the heat exchange members 104 and said outer casing 103 are made of thermally conductive material. In the present embodiment, the heat exchange members 104 and said outer casing 103 are made up of a highly conductive material such as a metal. Whereas in one embodiment, the heat exchange members 104 are integrally formed with said outer casing 103, in another embodiment the heat exchange members 104 are attached to said outer casing 103. Thus, direct thermal contact is established between said outer casing 103 and the heat exchange members 104. In the present embodiment, the heat exchange members 104 are formed with a holding channel 120 each that enables the assembly of certain holding members for holding some electronic components 102a of the plurality of electronic components 102 in thermal contact with the heat exchange members 104. Further, one or more electronic components (102b, 102c) of the plurality of electronic components 102 are held in direct thermal contact with the conductive outer casing 103.
[00023] Fig.2-Fig.6b exemplify the means by which the one or more electronic components are held to be in direct thermal contact with the conductive outer casing. For example Fig.2 illustrates one or more support members 105 for providing support for the circuit board 101 (shown in Fig.1) as per an aspect of the present subject matter. As seen in Fig.2 and as per a first embodiment of the present subject matter, the one or more support members 105 includes one or more support bars 106 configured to be inserted into corresponding slots 107 formed in corresponding inner walls 103b of the conductive outer casing 103 of the electronic device 100.
[00024] Fig.3a illustrates an exploded view depicting the constituent members of the one or more support bars 106 in accordance with the first embodiment of the present subject matter. As seen in Fig.3a, the one or more support bars 106 are rigid bars. The one or more support bars 106 are configured to receive a plurality of elastic members 108. Particularly, the one or more support bars 106 have corresponding holes 109 to receive a elastic member each of the plurality of elastic members 108. In the present embodiment, each hole is disposed to be equidistant from the neighbouring holes, with all the holes being disposed along a length of a top surface 106a of the one or more support bars 106. Further, each of the holes are formed to be through-holes so that the holes 109 open on a bottom surface 106b (shown in Fig.3b) of each of the one or more support bars 106.
[00025] Further, as may be seen in Fig.3b, each elastic member of the plurality of elastic members 108 are inserted into the corresponding holes 109. The length of each elastic member of the plurality of elastic members 108 is maintained so that at least a portion of each elastic member extends out from the bottom surface 106b of each of the one or more support bars 106. The one or more support bars 106 thus assembled with the plurality of elastic members 108 is inserted into the corresponding slots 107 (shown in Fig.2) formed in corresponding inner walls 103b (shown in Fig.2) of the conductive outer casing 103 (shown in Fig.2) of the electronic device 100 (shown in Fig.2). The one or more support bars 106 are assembled in a manner such that the portion of each of the elastic members 108 extending from the bottom surface 106b of the one or more support bars 106 is held to be in contact with a base 107d (shown in Fig.5) of the corresponding slots 107 (shown in Fig.5).
[00026] Fig.4 illustrates a perspective view of the electronic device 100 depicting the assembly of the circuit board 101 as per an aspect of the present subject matter. As may be seen in Fig.4, the circuit board 101 is assembled over the one or more support bars 106 previously assembled in the corresponding slots 107 formed in the conductive outer casing 103. The previously assembled one or more support bars 106 are compressed using an external tool (not shown) while assembling/installing the circuit board 101, so that the one or more support bars 106 are pushed downwards in the corresponding slots 107 and the circuit board 101 is assembled over the one or more support bars 106 in the corresponding slots 107.
[00027] Thus, a method of installation of the circuit board 101 involves installing the one more support members 105 including one or more support bars 106 comprising a plurality of elastic members 108 into corresponding slots 107 formed in corresponding walls 103b of the conductive outer casing 103, by sliding the one or more support bars 105 into the corresponding slots 107; pre-compressing the one or more support members 105 using an external tool, while simultaneously placing the circuit board 101 over the one or more support members 105; and sliding the circuit board 101 over the one or more support members 105 and within the corresponding slots 107 of the outer conductive casing 103.
[00028] Fig.5 illustrates a cross sectional view of the electronic device depicting an assembled state of the plurality of electronic components constituting the electronic device. As may be seen, the circuit board 101 is assembled over the one or more support bars 106. The elastic action of the plurality of elastic members 108 causes the elastic members 108 which were previously compressed to expand, causing the circuit board 101 disposed over the one or more support bars 106 encompassing the plurality of elastic members 108 to move upwards towards an inner surface of the roof 103c of the conductive outer casing 103. In other words, the one or more support members 105 including the one or more support bars 106 comprising a plurality of elastic members 108 cause elastic displacement of the circuit board 101. As a result, one or more electronic components which are relatively taller such as transformers 102b come in contact with the inner surface of the roof 103c of the conductive outer casing 103, thereby enabling direct thermal contact of one or more electronic components of the plurality of electronic components 102 with the conductive outer casing 103 of the electronic device. Therefore, heat dissipation from one of the largest heat generating components in the electronic device to the outside is ensured. Based on the weight of the circuit board 101 holding the plurality of electronic components 102, the diameter of each elastic member of the plurality of elastic members 108 is determined, so that the plurality of elastic members 108 do not get compressed due to the weight of the circuit board 101. Moreover, the size of the corresponding slots 107 is also maintained in a manner so that there is some space available for the upward movement of the circuit board 101.
[00029] Fig.6a illustrates a cross sectional view of the electronic device depicting the assembled condition of the electronic components constituting the electronic device as per a second embodiment of the present subject matter. In the second embodiment, the circuit board 101 is assembled over one or more support members 105 including one or more elastic plates 110 (shown in Fig.6b). The one or more elastic plates 110 is made of spring steel and is inserted into corresponding slots 107 formed in corresponding inner walls of the conductive outer casing 103. The one or more elastic plates 110 are compressed while assembling the circuit board 101, so that when the circuit board 101 is assembled over them, the circuit board 101 moves upwards towards an inner surface of the roof 103c of the electronic device 100 due to expansion of the one or more elastic plates. Thus, direct thermal contact of one or more of the electronic components of the plurality of electronic components 102 with the conductive outer casing 103 is established.
[00030] In other embodiments, one may combine the present invention along with thermal pads or paste in various permutations & combinations to further augment the thermal dissipation without deviating from the scope of the present invention.
[00031] As can be made out from the teachings of the present subject matter, the use of one or more support members for supporting the circuit board enables establishment of thermal contact of some of the electronic components disposed on the circuit board directly with the conductive outer casing, without the need for using thermal pads/thermal paste. The teachings of the present subject matter offer a cost effective and reliable solution for ensuring effective heat dissipation from the electronic device, thereby ensuring the electronic components do not undergo any damage. Thus, charging and discharging effectiveness of the electronic device such as charger is also ensured.
[00032] Improvements and modifications may be incorporated herein without deviating from the scope of the invention.