Claims:I/We Claim:

1. An electronic product (100) comprising:
an electronic assembly (102) comprising:
a plurality of electronic components (215) mounted on at least one base member (201a, 201b), and
a heat dissipation assembly (212) in thermal contact with the electronic components (215) of the electronic assembly (102);
a casing (101) with a plurality of open ends (101a) for enclosing the electronic assembly (102);
a plurality of end covers (103, 104) to cover the open ends (101a) of the casing (101); and
at least one adapter (209, 210) mounted to at least one of the heat dissipation assembly (212) and the at least one base member (201a, 201b) for positioning the electronic assembly (102) within the casing (101).
2. The electronic product (100) as claimed in claim 1, wherein the plurality of electronic components (215) of the electronic assembly (102) are at least one of a plurality of transistors, a plurality of capacitors, a plurality of resistors, and at least one voltage converter board arranged in a predetermined sequence on the at least one base member (201a, 201b).
3. The electronic product (100) as claimed in claim 1, wherein the heat dissipation assembly (212) comprises a plurality of heat transfer bridges (203, 204, 205, 206, 207, 208) communicably coupled to a pair of cooling rails (202a, 202b) and spread in a longitudinal direction and a lateral direction of the at least one base member (201a, 201b).
4. The electronic product (100) as claimed in claim 1, wherein the at least one adapter (209, 210) is removably attached to a top surface and a bottom surface of the at least one base member (201a, 201b) at a plurality of mounting locations.
5. The electronic product (100) as claimed in claim 3, wherein the at least one adapter (209, 210) is removably attached to at least one of the plurality heat transfer bridges (204, 206) on a top surface and a side surface, and to the pair of cooling rails (202a, 202b) on a side surface and a bottom surface at a plurality of mounting locations (302, 303, 304, 305, 306, 309, 310, 311, 312, 313).
6. The electronic product (100) as claimed in claim 1, wherein the at least one adapter (209, 210) extends along the longitudinal direction of the at least one base member (201a, 201b).
7. The electronic product (100) as claimed in claim 1, wherein the at least one adapter (209, 210) comprises a top section (401), a bottom section (402), and a vertical section (403) formed together to form a C-shaped cross section.
8. The electronic product (100) as claimed in claim 7, wherein the vertical section (402) comprises a dove tail structure (402a) on an external surface along a longitudinal direction of the at least one adapter (209, 210) and a plurality of apertures (402b) on the dove tail structure (402a) for positioning of the electronic assembly (102) in the casing (101) and mounting of the at least one adapter (209, 210) to the heat dissipation assembly (212).
9. The electronic product (100) as claimed in claim 7, wherein the top section (401) comprises a protruding rib (401a) formed in an inner surface and extending along the longitudinal direction of the at least one adapter (209, 210) for establishing contact with the heat dissipation assembly (212).
10. The electronic product (100) as claimed in claim 7, wherein the bottom section (403) comprises a trough (403b) from a flat end (403a) formed in an inner surface of the bottom section (403) and extending along the longitudinal direction of the at least one adapter (209, 210) for establishing contact with at least one of at least one of the pluralities of heat transfer bridges (204, 206) and the at least one base member (201a, 201b).
11. The electronic product (100) as claimed in claim 8, wherein an inner surface of the casing (101) comprises a groove (502) for receiving the dove tail structure of the at least one adapter (209, 210).
12. The electronic product (100) as claimed in claim 1, wherein the at least one adapter (209, 210) is a left adapter (209) and a right adapter (210) extending along the longitudinal direction of the at least one base member (201a, 201b) on opposite sides of the at least one base member (201a, 201b).
13. The electronic product (100) as claimed in claim 12, wherein the left adapter (209, 210) and the right adapter (209, 210) form a plurality of mounting provisions for mounting the plurality of end covers (103, 104) to the open ends (101a) of the casing (101).
14. The electronic product (100) as claimed in claim 3, wherein one of the end covers (103, 104) comprises electrical terminals (314) of the electronic product (100) and an inlet nozzle (211a) for a coolant flowing in the plurality of heat transfer bridges (203-208).
15. The electronic product (100) as claimed in claim 3, wherein one of the end covers (103, 104) comprises an outlet nozzle (211b) for a coolant flowing in the plurality of heat transfer bridges (203-208).
16. The electronic product (100) as claimed in claim 12, wherein the left adapter (603) and the right adapter (604) have an inverted T-shaped cross section and mounted to a bottom surface of a pair of cooling rails (202a, 202b) of the heat dissipation assembly (212) for sliding the electronic assembly (102) into the casing (101).
17. The electronic product (100) as claimed in claim 16, wherein the casing (101) comprises a plurality of reinforcement ribs (603) in an inner bottom surface for strengthening the casing (101) and two receptor ribs (601, 602) for receiving the left adapter (604) and the right adapter (605) during positioning of the electronic assembly (102) in the casing (101).
18. The electronic product (100) as claimed 1, wherein the electronic assembly (102) further comprises a plate member (214) for supporting a plurality of electrical terminals (314) of the electronic product (100).
, Description:TECHNICAL FIELD
[0001] The present subject matter relates to an electronic product. More particularly and not exclusively, it pertains to construction of the electronic product for it to be easily assembled and vibration and shock proof.

BACKGROUND
[0002] In recent years, processor-based systems and computer systems have found widespread application in any engineering domain. The processor-based systems are temperature and vibration sensitive. The processor-based systems are susceptible to vibrations during their lifetime, which may lead to functional failure and fatigue damage to it. To be deployed in rugged environments, such as, in power trains of electric vehicles and hybrid electric vehicles, efficient heat dissipation and thermal management needs to be done in the processor based systems and it needs to be packaged in a manner that it can withstand the external shocks and vibrations. The construction of the processor-based systems is thus critical to its longevity, safety, serviceability, and maintainability and also the application in which it is employed.

BRIEF DESCRIPTION OF DRAWINGS
[0003] The detailed description is described with reference to the accompanying figures. The same numbers are used throughout the drawings to reference like features and components.
[0004] Figs. 1A-1B exemplarily illustrate a front perspective view and a partially exploded view of an electronic product;
[0005] Figs. 2A-2B exemplarily illustrate a top perspective view and a bottom perspective view of an electronic assembly exemplarily illustrated in Figs. 1A-1B;
[0006] Figs. 3A-3B exemplarily illustrate partial exploded views of the electronic assembly with adapters;
[0007] Figs. 4A-4B exemplarily illustrate a front and a rear perspective views of an embodiment of one of the adapters of the electronic product;
[0008] Fig. 5 exemplarily illustrates a sectional view of the electronic product taken about AA’ axis in Fig. 1;
[0009] Fig. 6 exemplarily illustrates a partial exploded view of an embodiment of the electronic product; and
[00010] Fig. 7 exemplarily illustrates a bottom exploded view of the electronic assembly.

DETAILED DESCRIPTION OF THE INVENTION
[00011] In the following description, numerous specific details are set forth to provide a thorough understanding of the embodiments. One skilled in the relevant art will recognize, however, that the techniques described herein can be practiced without one or more of the specific details, or with other methods, components, materials, etc. In other instances, well-known structures, materials, or operations are not shown or described in detail to avoid obscuring certain aspects.
[00012] It is contemplated that the disclosure in the present invention may be applied to any vehicle without defeating the spirit of the present subject matter. The detailed explanation of the constitution of parts other than the present invention which constitutes an essential part has been omitted at suitable places.
[00013] In electric/ hybrid electric vehicles, the parts of the electric drive train, such as, one or more controllers, one or more inverters, power boards, voltage converter boards, etc., tend to get heated up and may fail to function after a certain number of use cycles causing discomfort to the rider of the vehicle, during normal usage and/or prolonged operation. Sometimes, the continuous heating up may also lead to fire propagation in the electric drive train, leading to a catastrophic failure of the electric drive train and the vehicle. Thus, there is a need to effectively dissipate the generated heat in the parts and efficiently cool the parts for good performance and longevity as well as to arrest propagation of fire, if any, for the safety of a product employing the components, such as, the vehicle.
[00014] Based on the output wattage of the electric or hybrid electric vehicle, the number, size, and technical specifications, of the parts in the vehicle, vary. Each of these parts has multiple electrical and electronic components, such as, capacitors, transistors, resistors, etc., whose specifications and ratings also vary. For a higher wattage of the electric drive train of the vehicle, the electrical and electronic components vary in quantity, in size, in ratings, and other technical specifications. With the increased sizes and numbers, the positioning of the electrical and electronic components in the various parts of the electrical drive train is difficult and needs to be performed optimally. With the increased size, density and wattage of the number of the electrical and electronic components in the part, the part or the electronic product becomes bulkier and difficult to assemble, service, and maintain in the vehicle.
[00015] In case, the casing of the electronic product experiences vibrations, it transmits the vibrations to the electronic components affecting the functionality of the electronic product in long run. Loose packaging of the electronic components can compromise cycle life of the electronic product. The vibrations may also set exothermic reactions within the electronic product resulting in release of smoke or toxic gases and high-pressure events leading to a catastrophic failure of the electronic product. A reliable packaging of the electronic product is needed for mechanical stability, durability, thermal stability, vibration isolation, and impact resistance of the electronic product.
[00016] The electrical and electronics components, such as, the ICs, transistors, capacitors, resistors, etc., are usually mounted and soldered to one or more PCB boards. The mounting of these components on the PCB board should not make it heavy, clumsy, congested and difficult for assembly, troubleshooting, maintenance, and replacement. However, if the functionality to be achieved demands numerous such components, it is inevitable for the PCB boards to get bulkier and difficult to assemble with a casing.
[00017] For example, in a conventional design of a PCB based electronic product, such as, a low power controller, the capacity of the controller is low. However, the weight of the electronic components is also low due to the low power rating of the electronic components. Further, such low power controllers are only used in low powered vehicle. Additionally, the electronic components on the PCB exert pressure on the PCB board and the board itself functions as a load bearing member. However, these PCB based low power controllers cannot meet the demands of high-power applications, such as, an electric or a hybrid electric vehicle. These high-power applications require a high power rated electronic product, such as, a high power rated controller.
[00018] The high power rated controllers are bulkier and have heavier electrical and electronic components assembled on a PCB board. The PCB board bears the weight of the heavier, denser, and larger components mounted on it and may give away after some operation cycles due to the vibrations the electronic product is susceptible. As the PCB fails, the electronic product may fail subsequently resulting in a catastrophe in the high-power applications. Also, assembly of such PCBs within a casing needs additional tooling and utmost care while doing it, thereby increasing man-hours in assembly, servicing, troubleshooting, and maintenance.
[00019] Also, the load from the PCB board is not transferred to the casing as the PCB board fails to be in contact with the walls of the casing. The PCB board with larger and heavier electronic components may dislocate within the casing when the electronic product is susceptible to shock and vibration and may move in the lateral and vertical direction within the casing. To arrest such lateral and vertical movement, the electronic product may require additional components, such as shock absorbers within the casing. The shock absorbers are typically positioned at the corners of the PCB board within the casing. Even if the movement is arrested, only localized transfer of load takes place from the PCB board to the casing, leaving the PCB board with a higher probability of failing due to weight. There is a need for a support structure in the electronic product that can transfer load from the PCB to the casing as well as arrest movement of the PCB board, without requiring multiple additional components.
[00020] Existing packaging of the electronic components within a casing employs a packaging material which can withstand raised temperatures and pressures. However, the packaging material needs to be uniformly distributed along the length of the casing using a fastening means. Such packaging material increases the weight, the manufacturing cost, and the assembling cost of the electronic assembly. Also, while loading or unloading the PCB board into the casing, the packaging material may hinder the ease in pushing in or pulling out of the electronic assembly from the casing. To address this problem, the packaging material has to be made firm and rigid to not deform, while loading and unloading of the electronic assembly.
[00021] Also, in conventional high power rated electronic products, there may be multiple PCB boards stacked together. These multiple PCB boards with respective electronic components have individual heat generation that is taken care by individual thermal pads around each of the PCB board. This again makes the electronic product bulkier with additional heat extraction members and their assembly, servicing, and maintenance tedious.
[00022] Also, with the increased rated specifications of the electrical and electronic components, such as, maximum voltage specification, frequency band of operation, etc., in high wattage vehicles, the heat dissipation from the electrical and electronic components also increases. If in case the components are located very proximal to each other, apart from inaccessibility, there are high chances of propagation of the generated heat from one component to another, leading to grave increase in the temperature of the PCB board. The components may fail to function beyond a rated temperature, the electrical connections on the PCB board may fail, and the PCB board may get structurally deformed, etc., at higher temperatures. The components may ignite and cause a fire and the fire may propagate, leading to a catastrophic failure of the electric drive train as well as the vehicle employing it. Overall, there exists a problem of potential safety risk to the vehicle and its user. There is a need for a common heat dissipation assembly for the multiple PCB boards and the electronic components mounted on them, within the electronic product.
[00023] As per known art, the electronic products or vehicle parts, such, inverters, converters, power board, controller, etc., in the electric drive train are provided with a sacrificial member that melts down and creates a space between the electrical and electronic components to arrest propagation of fire. However, probability of the sacrificial member being non-functional at the time of need makes this mechanism not effective. Despite employing the sacrificial member, there still exists a need for extracting heat from the individual components to reduce the probability of drastic increase in the temperatures of the components and the PCB board in a failsafe manner.
[00024] In an implementation for cooling of the electronic product, and in turn the components constituting the electronic assembly, a heat exchange member is in thermal contact with the casing of the electronic product and forced convection is employed. The heat dissipated from the electrical and electronic components on the PCB has to traverse through air-filled gap between the components and the casing. The heat transfer between the components and the casing may not be efficient since air is a poor conductor of heat. In order to ensure that heat is effectively dissipated from the components, it is essential to ensure that the heat generating components are reliably secured to be in thermal contact with the heat exchange member proximal to the casing. Another existing implementation employs liquid cooling for thermal management in the electronic product or the electronic assembly of the electronic product. The electronic product or the electronic assembly as a whole may be immersed into a liquid coolant. However, the liquid coolant is stagnant and efficiency of cooling of the electronic assembly is substantially less. In case of forced liquid flow for cooling individual electrical and electronic components, the electronic product becomes more complex, undesirably larger to package and also adds to the cost. Also there exists a challenge of enabling the coolant to reach all the hot zones while maintaining a compact layout. There exists a need for an active cooling system that dissipates the heat from each of the electrical and electronic components of the electronic assembly, yet not making the electronic assembly undesirably bulky.
[00025] Also, the casing of the electronic product, where high thermal emission is witnessed, is either casted or machined, which are both high in cost and have complex requirements in tooling and infrastructure. The casing produced also may be porous and not so strong to sustain repeated cycles of shock and vibration. There is a requirement to have a casing to house one or more PCB boards that can sustain repeated cycles of inadvertent shocks and vibrations.
[00026] Therefore, there exists a need for an improved design of an electronic product that is durable, can sustain shocks and vibrations, with efficient and effective heat transfer from the electrical and electronic components which additionally provides ease and safety during assembly, use, maintenance, and servicing of the electronic assembly, while curtailing fire propagation and overcoming all problems disclosed above as well as other problems of known art.
[00027] In an embodiment of the present invention, an electronic product is disclosed. The electronic product comprises an electronic assembly, a casing, at least one adapter, and a plurality of end covers. The electronic assembly comprises a plurality of electronic components mounted on at least one base member and a heat dissipation assembly in thermal contact with the electronic components of the electronic assembly. The casing encloses the electronic assembly and has a plurality of open ends and the plurality of end covers cover the open ends of the casing. The at least one adapter is mounted to at least one of the heat dissipation assembly and the at least one base member for positioning the electronic assembly within the casing.
[00028] In an embodiment, the electronic components of the electronic assembly are at least one of a plurality of transistors, a plurality of capacitors, a plurality of resistors, and at least one voltage converter board arranged in a predetermined sequence on the at least one base member. In an embodiment, the heat dissipation assembly comprises a plurality of heat transfer bridges communicably coupled to a pair of cooling rails and spread in a longitudinal direction and a lateral direction of the at least one base member. In an embodiment, the at least one adapter is removably attached to the plurality heat transfer bridges on a top surface and a side surface, and to the pair of cooling rails on a side surface and a bottom surface at a plurality of mounting locations. In another embodiment, the at least one adapter is removably attached to a top surface and a bottom surface of the at least one base member at a plurality of mounting locations. The at least one adapter extends along the longitudinal direction of the at least one base member.
[00029] In an embodiment, the at least one adapter comprises a top section, a bottom section, and a vertical section formed together to form a C-shaped cross section. The vertical section comprises a dove tail structure on an external surface along a longitudinal direction of the at least one adapter and a plurality of apertures on the dove tail structure for positioning of the electronic assembly in the casing and mounting of the at least one adapter to the heat dissipation assembly. The top section comprises a protruding rib formed in an inner surface and extending along the longitudinal direction of the at least one adapter for establishing contact with the heat dissipation assembly. The bottom section comprises a trough from a flat end formed in an inner surface and extending along the longitudinal direction of the at least one adapter for establishing contact with at least one of at least one of the pluralities of heat transfer bridges and the at least one base member.
[00030] The at least one adapter is a left adapter and a right adapter extending along the longitudinal direction of the at least one base member on opposite sides of the at least one base member. The left adapter and the right adapter form a plurality of mounting provisions for mounting the plurality of end covers to the open ends of the casing. In an embodiment, the left adapter and the right adapter have an inverted T-shaped cross section and mounted to a bottom surface of the pair of cooling rails of the heat dissipation assembly for sliding the electronic assembly into the casing.
[00031] In an embodiment, an inner surface of the casing comprises a groove for receiving the dove tail structure of the at least one adapter. One end cover comprises electrical terminals of the electronic product and an inlet nozzle for a coolant flowing in the plurality of heat transfer bridges. Another end cover comprises an outlet nozzle for a coolant flowing in the plurality of heat transfer bridges.
[00032] In an embodiment, the casing comprises a plurality of reinforcement ribs in an inner bottom surface for strengthening the casing and two receptor ribs for receiving the left adapter and the right adapter during positioning of the electronic assembly in the casing. In another embodiment, the electronic assembly further comprises a plate member for supporting a plurality of electrical terminals of the electronic product.
[00033] The adapters are structurally strong support structure for uniform distribution of load across the electronic product. These load bearing adapters are made of metal to take the entire load and fasten to all the major load members (casing) in a secure way. The structurally competent internal electronic assembly can be slid inside the casing using the adapters, thereby resulting easy assembly, servicing, and maintenance. The adapters also arrest vertical and lateral movements of the electronic assembly within the casing.
[00034] The present subject matter is further described with reference to accompanying figures. It should be noted that the description and figures merely illustrate the principles of the present subject matter. Various arrangements may be devised that, although not explicitly described or shown herein, encompass the principles of the present subject matter. Moreover, all statements herein reciting principles, aspects, and examples of the present subject matter, as well as specific examples thereof, are intended to encompass equivalents thereof.
[00035] The foregoing disclosure is not intended to limit the present disclosure to the precise forms or particular fields of use disclosed. As such, it is contemplated that various alternate embodiments and/or modifications to the present disclosure, whether explicitly described or implied herein, are possible in light of the disclosure. Having thus described embodiments of the present disclosure, a person of ordinary skill in the art will recognize that changes may be made in form and detail without departing from the scope of the present disclosure. Thus, the present disclosure is limited only by the claims.
[00036] In the foregoing specification, the disclosure has been described with reference to specific embodiments. However, as one skilled in the art will appreciate, various embodiments disclosed herein can be modified or otherwise implemented in various other ways without departing from the spirit and scope of the disclosure. Accordingly, this description is to be considered as illustrative and is for the purpose of teaching those skilled in the art the manner of making and using various embodiments of the disclosure. It is to be understood that the forms of the disclosure herein shown and described are to be taken as representative embodiments. Equivalent elements, materials, processes or steps may be substituted for those representatively illustrated and described herein. Moreover, certain features of the disclosure may be utilized independently of the use of other features, all as would be apparent to one skilled in the art after having the benefit of this description of the disclosure. Expressions such as “including”, “comprising”, “incorporating”, “consisting of”, “have”, “is” used to describe and claim the present disclosure are intended to be construed in a non-exclusive manner, namely allowing for items, components or elements not explicitly described also to be present. Reference to the singular is also to be construed to relate to the plural.
[00037] Further, various embodiments disclosed herein are to be taken in the illustrative and explanatory sense, and should in no way be construed as limiting of the present disclosure. All joinder references (e.g., attached, affixed, coupled, connected, etc.) are only used to aid the reader's understanding of the present disclosure, and may not create limitations, particularly as to the position, orientation, or use of the systems and/or methods disclosed herein. Therefore, joinder references, if any, are to be construed broadly. Moreover, such joinder references do not necessarily infer that two elements are directly connected to each other.
[00038] Additionally, all numerical terms, such as, but not limited to, “first”, “second”, “third”, “primary”, “secondary”, “main” or any other ordinary and/or numerical terms, should also be taken only as identifiers, to assist the reader's understanding of the various elements, embodiments, variations and/or modifications of the present disclosure, and may not create any limitations, particularly as to the order, or preference, of any element, embodiment, variation and/or modification relative to, or over, another element, embodiment, variation and/or modification.
[00039] It will also be appreciated that one or more of the elements depicted in the drawings/figures can also be implemented in a more separated or integrated manner, or even removed or rendered as inoperable in certain cases, as is useful in accordance with a particular application. Additionally, any signal hatches in the drawings/figures should be considered only as exemplary, and not limiting, unless otherwise specifically specified.
[00040] The embodiments of the present invention will now be described in detail with reference to the accompanying drawings.
[00041] Figs. 1A-1B exemplarily illustrate a front perspective view and a partially exploded view of an electronic product 100. The electronic product 100 may be used in high power rated applications, such as, a part of an IC engine-based vehicle, or part of a drive train of an electric vehicle or a hybrid electric vehicle. The vehicle may be a two-wheeled vehicle, a three wheeled or a multi-wheeled vehicle, such as, a passenger car, a passenger bus, a load carrying truck, etc. The electronic product 100 may be an inverter, a controller, a power conditioning circuit, a voltage converter, etc., of the drive train of the vehicle. The electronic product 100 comprises one or more electronic assemblies, such as, 102 (shown in Fig. 1B). An electronic assembly 102 is a congregation of a multiple electrical and electronic components connected to each other to achieve a defined function, such as, stepping down voltages, converting AC voltage to DC voltage, etc. As exemplarily illustrated, the electronic product 100 comprises a casing 101 enclosing the electronic assembly 102 with the electrical and electronic components and a pair of end covers 103, 104. The casing 101 is a hollow geometry cover with open ends enclosing the electronic assembly 102. End covers 103, 104 of the electronic products 100 close the open ends, such as, 101a (shown in Figs. 2A-2B) of the casing 101. In an embodiment, the end covers, such as, a first end cover 103 and a second end cover 104 and the casing 101 have mounting provisions to be fastened together at the open ends 101a, using attachment means. The second end cover 104 has provisions 104a for the external electrical terminals 314 (shown in Fig. 3A) of the electronic assembly 100. The first end cover 103 seals the casing 101 on the other side. In an embodiment, an outer surface of the casing 101 may comprise a plurality of fins 105 for thermal management of the electronic product 100. In another embodiment, the outer surface of the casing 101 may comprise a dovetail pattern that facilitates in easy mounting and removal of the electronic product 100 in a designated space in an application, such as, the vehicle. In an embodiment, an inner surface of the casing 101 may comprise a dovetail pattern that facilitates in easy mounting and removal of the electronic assembly 102 into and out of the casing 101 for accessing the mounted electrical and electronic components. In an embodiment, the inner surface of the casing 101 may comprise a groove.
[00042] Figs. 2A-2B exemplarily illustrate a top perspective view and a bottom perspective view of the electronic assembly 102 exemplarily illustrated in Figs. 1A-1B. The electronic assembly 102 comprises one or more base members 201a, 201b for mounting multiple electronic components, such as, 215. The base members 201a, 201b can be seen to positioned one below the other and fastened together. Each of the base members 201a, 201b may be for a different function such as voltage conversion, voltage inversion, etc. In an embodiment, the pins 215a of the electronic components 215 are inserted into openings on the base members 201a, 201b and the pins 215a are soldered to the base members 201a, 201b. Each of the base members 201a, 201b may be a printed circuit board (PCB), a bread board, an insulated metal substrate (IMS) board, etc. The base member 201a, 201b may be, and not limited to, a multi-layered PCB, a rigid PCB, flexible PCB, single layer PCB, aluminum backed PCB, etc. The electronic components 215 are mounted in a predetermined sequence on the base members 201a, 201b and accompanied by a heat dissipation assembly 212 of the electronic assembly 102. The heat dissipation assembly 212 is in thermal contact with the electronic components 215 to extract and dissipate the heat generated by the components 215. The longitudinal direction of the base members 201a, 201b is indicated by the arrow Y-Y’ and the lateral direction of the base members 201a, 201b is indicated by the arrow X-X’. The electronic components 215 are positioned along the lateral direction and the longitudinal direction of the base members 201a, 201b in the predetermined sequence. The electronic components 215 are, for example, transistors, such as, BJTs, MOSFETs, capacitors, resistors, ICs, voltage converter board, etc. The components of the heat dissipation assembly 212 are spread in the lateral direction and the longitudinal direction of the base members 201a, 201b to remain in thermal contact with the electronic components 215.
[00043] The heat dissipation assembly 212 comprises a plurality of heat transfer bridges 203, 204, 205, 206, 207, 208 and two cooling rails 202a, 202b positioned along the longitudinal direction of the base members 201a, 201b. The cooling rails 202a, 202b are positioned proximal to the longitudinal sides of the base member 201a, 201b and extend in the longitudinal direction. The cooling rails 202a, 202b carry coolant along the longitudinal direction of the base member 201a, 201b. The coolant in the cooling rails 202a, 202b flows through the heat transfer bridges 203-208 to extract heat from the transistors, the capacitors, and the voltage converter respectively and cool the components 215. The heat transfer bridges 203-208 extend between the cooling rails 202a, 202b in the lateral direction of the base member 201a, 201b.
[00044] The cooling rail 202a comprises an inlet nozzle 211a removably engaging with an end and an end cap removably engaging with the other end. Similarly, the cooling rail 202b comprises an outlet nozzle 211b removably engaging with an end and an end cap with the other end. The inlet nozzle 211a and the outlet nozzle 211b to be in longitudinally opposite directions. In an embodiment, the inlet nozzle 211a and the outlet nozzle 211b are in the same direction. The coolant flows into the cooling rail 202a through the inlet nozzle 211a and flows out of the cooling rail 202b through the outlet nozzle 211b. The temperature of the coolant exiting from the outlet nozzle 211b is substantially higher than the temperature of the coolant entering through the inlet nozzle 211a, due to the amount of heat carried away by the coolant while exiting through the outlet nozzle 211b. In an embodiment, the coolant exiting from the outlet nozzle 211b may be cooled and re-circulated into the inlet nozzle 211a through an external recirculation line. The coolant may be water, ethylene glycol, etc.
[00045] In an embodiment, the sides of the base members 201a, 201b are slid into side mounting provisions of the cooling rails 202a, 202b for positioning the cooling rails 202a, 202b proximal to the longitudinal sides of the base members 201a, 201b. In an embodiment, the cooling rails 202a, 202b have mounting provisions 213 on top to removably attach the cooling rails 202a, 202b to the base members 201a, 201b using attachment means, such as, fasteners. The electronic product 100 further comprises a plate member 214 onto which the internal connection of the electrical terminals 314 (shown in Figs. 3A-3B) of the electronic product 100 end. This plate member 214 holds the electrical terminals 314 sturdy. Further, the electronic product 100 comprises at least one adapter 209, 210 for positioning or assembling the electronic assembly 102 within the casing 101.
[00046] Figs. 3A-3B exemplarily illustrate partial exploded views of the electronic assembly 102 with the adapters 209, 210. The adapters, a left adapter 209 and a right adapter 210 are mounted to the heat dissipation assembly 212 or at least one of the base members 201a or 201b. Each of the adapters 209, 210 is removably attached to the heat transfer bridges 204, 206 at mounting locations 304, 305 and 302, 303 on a side surface of the heat transfer bridges 204, 206 using fasteners 307 and at mounting locations 309, 310 on a top surface of the heat transfer bridges 204, 206. Also, the adapters 209, 210 are removably attached to the cooling rails 202a, 202b at mounting locations 306, 311 on a top surface of the cooling rails 202a, 202b and at mounting locations 312, 313 on a bottom surface of the cooling rails 202a, 202b using a plurality of fasteners 301 and 308.
[00047] The adapters 209, 210 extend along the longitudinal direction of the base members 201a, 202b. In an embodiment, the adapters 209, 210 are removably attached to a top surface and a bottom surface of the base members 201a, 201b at pre-defined mounting locations. On the top surface of the cooling rails 202a, 202b the adapters 209, 210 are connected on the mounting locations 306, 311 provided on a side surface of raised openings 216 of the cooling rails 202a, 202b. Each of the cooling rails 202a, 202b on a top surface has the raised openings 216 at predetermined locations for equalizing pressure of the coolant in the cooling rails 202a, 202b for facilitating smooth flow of the coolant from the cooling rail 202a towards the cooling rail 202b through the bridges 203-208. On the bottom surface of the cooling rails 202a, 202b, the adapters 209, 210 are connected on the mounting locations 312, 313 provided on a bottom surface of the mounting provisions 213 of the cooling rails 202a, 202b.
[00048] The electrical terminals 314 protrude through the plate member 214 and the provisions 104a in the end cover 104. The inlet nozzle 211a and the outlet nozzle 211b also protrude through the end covers 104 and 103 respectively in the assembled condition of the electronic product 100.
[00049] Figs. 4A-4B exemplarily illustrate a front and a rear perspective views of an embodiment of one of the adapters 209, 210 of the electronic products 100. The adapter 210 comprises a top section 401, a bottom section 403, and a vertical section 402 formed together to form a C-shaped cross section. As can be seen, the vertical section 402 comprises a dove tail structure 402a that extends along a longitudinal direction of the base members 201a, 201b on an external surface of the adapter 210 for positioning of the electronic assembly 102 in the casing 101, when the adapter 210 is removably attached to the electronic assembly 102. Further, the vertical section 402 comprises a plurality of apertures 402b on the dove tail structure 402a for mounting the adapter 210 to the heat transfer bridges 204, 206 and the cooling rails 202a, 202b at the mounting locations 302, 303, 304, 305 and 306, respectively.
[00050] The top section 401 comprises a protruding rib 401a formed in an inner surface of the adapter 210 and extending along the longitudinal direction of the adapter 210 for establishing firm mechanical and thermal contact with the heat transfer bridges 204, 206 and the cooling rails 202a, 202b. In the top section mounting provisions 401b for mounting the adapter 210 to the heat transfer bridges 204, 206 at the mounting locations 309, 310 is provided. The bottom section 403 comprises a flat end 403a and a trough 403b formed from the flat end 403a to the vertical section 402 in the inner surface of the adapter 210. The flat end 403a and the trough 403b extend along the longitudinal direction of the adapter 210 for establishing mechanical contact with the heat transfer bridges 204, 206 and the cooling rails 202a, 202b. The shape of the trough 403b corresponds to the shape of the cooling rails 202a, 202b and also the depth of the trough 403b is same as the height of the cooling rails 202a, 202b to receive the cooling rails 202a, 202b within the trough 403b. The mounting provisions 403c to mount it to the cooling rails 202a, 202b at mounting locations 312, 313 is provided in the flat ends 403a.
[00051] Fig. 5 exemplarily illustrates a sectional view of the electronic product 100 taken about AA’ axis in Fig. 1. It is evident that the adapters 209, 210 are C-shaped clamps that are in contact with the heat transfer bridges 204, 206 and the cooling rails 202a, 202b. The groove 502 in the inner surface of the casing 101 receives the dove tail structure 402a of the adapter 209, 210 and allows the clamps 209, 210 with the electronic assembly 102 to be easily slid into the casing 101. The gaps 501a, 501b, 501c, 501d that are formed between the clamps 209, 210 and the heat dissipation assembly 312 at the front and the rear open ends 101a of the casing 101 are used to fasten the end covers 104, 103 to the casing 101.
[00052] Fig. 6 exemplarily illustrates a partial exploded view of an embodiment of the electronic product 100. The construction of the adapters 604, 605 is different from that of the adapters 209, 210 of the electronic product 100 shown in Figs. 1A-1B. The inner bottom surface of the casing 101, as visible, has receptor ribs 601, 602 to receive the left adapter 604 and the right adapter 605. In addition to the receptor ribs 601, 602, the inner surface of the casing also has reinforcement ribs 603 to strengthen the casing 101. The electronic assembly 102 is slid into the casing 101 using the adapters 604, 605 into the receptor ribs 601, 602.
[00053] Fig. 7 exemplarily illustrates a bottom exploded view of the electronic assembly 102 showing the adapters 604, 605 mounted to the bottom surface of the cooling rails 202a, 202b. The adapters 604, 605 are only mounted on the bottom surface using fasteners 701, 702. The adapters 604, 605 have an inverted T-shaped cross section that is received by the receptor ribs 601, 602 for sliding the electronic assembly 102 into the casing 101.
[00054] The electronic product with the electronic assembly and the adapters as disclosed in the present invention provides the following technical advancement in the field of design of electronic products: During normal operation of the electronic products, the temperature of electronic components within rises. During charging, overcharging, and extended operation, the temperatures may drastically rise. In both these conditions, the heat dissipation assembly and its associated components, such as the coolant, the cooling rails, the bridges, extract and dissipate the heat away from the electronic components. The bridges reduce the temperature of the individual electronic components, such as, transistors, capacitors, etc., and subsequently cool the electronic assembly and the electronic product actively and efficiently. The assembly of the bridges along with the electronic components ensures a compact packaging of the electronic assembly and the electronic product.
[00055] Since the inlet ports and the outlet ports are connected to same set of cooling rails, compact packaging of the heat dissipation assembly and the electronic assembly is feasible. Since the cooling bridges are parallel, the flow through the bridges is balanced. In an embodiment, the flow rates to individual bridges can be varied based on the temperatures of the electronic components being cooled. To maintain continuous flow of the coolant, the pressure in both the cooling rails is equalized using openings in the cooling rails. The design of the electronic assembly with the heat dissipation assembly ensures cooling of all the major thermal contributors in the electronic assembly. The assembly of the electronic components on the base members and the assembly of the components of the heat dissipation assembly are not cumbersome and are guided by the features of the components, such as, the inlet port, the outlet port, the end caps, the nozzles, etc. With a common bridge that cools multiple electronic components, the crowding of the components and their respective heat sinks is avoided, thereby reducing weight of the electronic assembly, number of parts to be assembled, cost of the electronic assembly, and their associated costs.
[00056] Even if the electronic components and the heat dissipation assembly exert pressure on the base members, the base members transfer the load to the adapters indirectly in contact with them and the adapters transfer the load to the external casing. The adapters are packaged in a manner to bear the load from the electronic assembly and help the electronic assembly sustain through multiple cycles of vibrations and shock. The need for additional separate shock absorbers at different locations with the casing is eliminated and two adapters will suffice the purpose of shock absorption. The mounting locations to mount the adapters is not directly on the base members. It is on the heat transfer bridges and the cooling rails that are connected to the base members. So, the adapters do not exert any pressure on the base members that are already loaded, improving longevity of the base members.
[00057] Due to the compact packaging of the electronic assembly and adapters within the casing, the dimensions of the electronic product are also reduced, making space for other additional features in a space crunched vehicle. The components of the electronic product are all modular and can be added to the existing circuit design of the existing electronic product with ease, to achieve prolonged operation of the electronic product, higher efficiency throughout its operation, and avoiding occurrences of any kind of catastrophes in the space crunched applications. The heat dissipation assembly can also function along with existing cooling mechanism of the electronic product. The sealing of the coolant in the bridges is also taken care by the use of the covers on the bridges and the end caps in the cooling rails, to prevent the leakage of the coolant.
[00058] The protruding ribs in the top section and the trough and flat end in the bottom section ensure mechanical contact and thermal contact of the adapters with the cooling rails and heat transfer bridges. The contour of the trough ensures easy guided mounting of the adapters on to the cooling rails. Also, the dove tail structure on the vertical section of the adapters ensures the process of assembly of the electronic assembly within the casing is guided and made simpler, reducing manhours and being cost effective. Also, since the heat dissipation is achieved very effectively in the casing, the casing is manufactured using a cheaper and simpler extrusion process. The fins like structure on the external surface of the casing ensures passive heat transfer from the electronic components and the external environment via the thermal contact with the heat dissipation assembly and the adapters. The components of the heat dissipation assembly are light weight, have features that guide in mounting while assembly, maintenance, and servicing, and are thin so as not to occupy more space, it makes the electronic product compact, as well as safe to use, preventing thermal runaway and elevated operating temperatures. The electronic product with such an electronic assembly has wattage in the range of about 0-50 kW and finds application in space constrained mobile devices, products, vehicle, such, two-wheelers, three-wheelers, or any multi-wheeled vehicle, such passenger trucks that experience lot of shock and vibrations. The components of the electronic assembly are tightly lodged into the base members, the cooling rails are tightly adhered to the electronic components via the adapters and do not get dislodged due to vibration and shocks. The adapters are removably attached on the cooling rails with plurality of screws and bolts. In another embodiment, the adapters can also be fixedly attached on to the cooling rails by welding. The adapters arrest vertical and lateral movement of the electronic assembly with in the casing. The end covers arrest the longitudinal movement of the electronic assembly. No special provisions are provided to mount the end covers and the mounting of the adapters provides a gap for mounting the end covers.
[00059] Thus, the adapters as per present invention provide mechanical stability, thermal stability, durability, vibration isolation, and impact resistance to the electronic product while enabling breaking of trade-off on variety creation versus ease of manufacturing and assembly leading to a reliable electronic product for a powered device along with a robust casing capable of withstanding various loads arising out of its usage as well as its process of assembly cum manufacturing.
[00060] Improvements and modifications may be incorporated herein without deviating from the scope of the invention.


LIST OF REFERENCE NUMERALS
100- Electronic product
101- Casing
101a- open ends
102- Electronic assembly
103- First end cover
104- Second end cover
104a- provision for electrical terminal
105- fins
201a, 201b-Base member
202a, 202b- cooling rails
203-208- heat transfer bridges
209, 210- adapters
211a-inlet nozzle
211b-outlet nozzle
212- heat dissipation assembly
213- opening in cooling rail
214- plate member
215- Electronic components
216-raised opening in cooling rails
301, 307, 308- fasteners
302, 303, 304, 305, 306, 309, 310, 311, 312, 313- mounting locations
314- electrical terminals
401-top section
401a-protruding rib
402- vertical section
402- dove tail structure
403- bottom section
403a- flat end
403b-trough
501a-501d- gaps
502-groove in casing
601, 602- receptor ribs
603- reinforcement ribs
604, 605- inverted T-shaped adapters