Claims:We Claim:
1. An enclosure 100 for a circuit board 200, the enclosure 100 is having a receptacle 300 and a cover 400 characterized in that the enclosure 100 comprising:
a multi-planar channel 340 configured peripherally on atleast the receptacle 300 or the cover 400 to adapt a gasket 500 thereon, the gasket 500 positively fits inside the channel 340 to ensure the sealing of the enclosure 100 when the cover 400 snap-fit with the receptacle 300 during the assembly of the circuit board 200.

2. The enclosure 100 as claimed in claim 1, wherein the channel 340 is a double-wall configuration of the receptacle 300 or the cover 400 to adapt the gasket 500 therein.

3. The enclosure 100 as claimed in claim 1, wherein the gasket 500 is integral to the cover 400 and/or to the receptacle 300.

4. The enclosure 100 as claimed in claims 1 and 3, wherein the gasket 500 is multi-material injection moulded with a rib 410 extending from an inner portion of the cover 400, such that the gasket 500 and the cover 400 are integral.

5. The enclosure 100 as claimed in claim 4, wherein the multi-material injection mould can be a 2-k mould or overmould.

6. The enclosure 100 as claimed in claim 1, wherein a snap-fit arrangement 320 is configured on the receptacle 300, the snap-fit arrangement 320 extends from an inner portion of the receptacle 300 for locking the circuit board 200 with the receptacle 300 for assembling the circuit board 200;

7. The enclosure 100 as claimed in claim 1, wherein a plurality of flanges 350 are arranged peripherally on an outer wall of the receptacle 300, the flanges 350 are adapted to snap-fit with respective grooves/openings 400a configured on the cover 400 to ensure uniform compression of the gasket 500 between the cover 400 and the receptacle 300.

8. The enclosure 100 as claimed in claim 1, wherein the inner periphery of the receptacle 300 has engaging elements 360 with protrusions which are arranged in different orientations to engage with notches on the cover 400 to prevent wrong orientation of the enclosure 100 assembly.

9. The enclosure 100 as claimed in claim 1, wherein the gasket 500 may have a “Z” shape in sectional view to accommodate inside the channel 340 to prevent the flow path of dust particles and water inside the enclosure 100.

10. The enclosure 100 as claimed in claim 1, wherein the gasket 500 is a soft component or a flexible component made of thermoplastic polyurethane.
, Description:Field of the Invention

[0001] The present invention relates to an enclosure. More particularly, the present invention relates to an enclosure for an electronic control unit.

Background of the Invention

[0002] Circuit boards are moisture-sensitive device. If the circuit board or PCB is exposed to moisture, it adversely affects the life of the PCB. Moisture brings with it several potential problems. When the PCB has absorbed moisture, soldering can cause the moisture to expand and delaminate, or partially separate, the board’s layers. This will cause the PCB to fail either during testing or in the field. Moisture can also lead to oxidation or diffusion, which can cause component corrosion or physical cracking, respectively.

[0003] The changes in temperature can cause expansion and shrinkage if the board absorbs even a small amount of moisture. Hence these PCB’s are integrated inside a housing which can maintain a consistent temperature and keep moisture to a minimum. Further, many of the circuit boards used inside a vehicle are also vulnerable to vibrations caused by the vehicle movement. For example, the PCB’s used in reverse park assist sensor of a vehicle is exposed to environmental conditions as well as the vibrations. Currently, these PCBs are arranged inside a housing filled with a potting material and a cover for protecting the PCB. The potting materials have a higher degree of temperature when filling inside the housing.

[0004] Hence, the temperature of the Potting material and the flow of the potting material may damage the electronic circuit of the sensor assembly. Hence, the utilization of potting material is not advisable. Further, in some cases, the housing and the cover may be sealed with an elastic seal placed between. These seals are vulnerable to several environmental conditions which eventually affects the working of the circuit boards.

[0005] Therefore, there is a requirement of an enclosure which overcomes few or all the drawbacks of the existing enclosures.

Objects of the Invention

[0006] An object of the present invention is to provide an enclosure for an electronic control unit.

[0007] Another object of the present invention is to provide an enclosure for an electronic control unit, which secures the circuit board from moisture and vibrational damages.

[0008] Yet another object of the present invention is to provide an enclosure for an electronic control unit, which eliminates the need for special equipment required for dispensing the potting compound.

[0009] One more object of the present invention is to provide an enclosure for an electronic control unit, which eliminates the handling of a separate part on the assembly.

[0010] Further object of the present invention is to provide an enclosure for an electronic control unit, which is economical and robust in construction.

Summary of the invention

[0011] According to the present invention, an enclosure for a circuit board in accordance with the present invention is illustrated. The circuit board or a PCB may be a part of an electronic control unit of a vehicle. The enclosure encapsulates the circuit board, which is vulnerable to moisture or vibrations. The enclosure includes a receptacle and a cover. The receptacle and the cover has a snap to fit configuration which enables the cover and the receptacle to attach thereby configuring the enclosure.

[0012] Further, the receptacle may include a guiding member, a snap-fit arrangement, a plurality of pins and a multiplanar channel (hereinafter referred to as the channel). The guiding member is an elongated member extending transversely from an inner portion of the receptacle. The receptacle may include two guiding members arranged diagonally opposite to each other. The guiding members have chamfers on top of each of the guiding members such that while assembling the PCB, the guiding members pass through the respective grooves in the PCB for securing the PCB on the receptacle.

[0013] Further, the snap-fit arrangement may lock the circuit board with the receptacle. The snap-fit arrangement includes two extending members extending from the inner portion of the receptacle. The extending members are arranged diagonally and aligned opposite to the guiding members. Further, the plurality of pins is also arranged vertically on the base of the receptacle. Specifically, the plurality of pins may extend from the inner portion of the receptacle for engaging and or selectively soldering the circuit board. The plurality of pins is soldered therewith the PCB after assembling the PCB on the receptacle.

[0014] The enclosure further includes a gasket. The gasket is a sealant arranged between the cover and the receptacle. The gasket is arranged on the channel configured on the receptacle. The gasket may be a soft component or a flexible component made of thermoplastic polyurethane. The channel is configured peripherally on the receptacle to adapt the gasket such that the gasket positively fits inside the channel when assembling the enclosure. The channel may be a double wall configuration of the receptacle to accommodate the gasket inside securely. In another embodiment, the channel may be configured on the cover to secure the gasket therein. The channel may allow the gasket to seal the receptacle and the cover together, thereby securing the PCB. The gasket may have a “Z” shape in sectional view to accommodate inside the channel to prevent the flow path of dust particles and water inside the enclosure.

[0015] Further, in an embodiment, the gasket may be removably arranged between the cover and the receptacle. The gasket may be arranged on the channel of the receptacle, and the cover snap-fit with the receptacle during the assembly of the circuit board. Specifically, a rib extending from an inner portion of the cover compresses the gasket to fit inside the channel positively and thereby ensuring sealing of the enclosure.

[0016] Further, in another embodiment, the gasket may be integral to the cover of the enclosure. Specifically, the gasket may be multi-material injection moulded, specifically 2k moulded with the inner portion of the cover. The gasket may be 2k moulded with a rib extending from an inner portion of the cover, such that the gasket and the cover are integral. Similarly, in another embodiment, the gasket may be over-moulded with the rib extending from an inner portion of the cover, such that the gasket and the cover are integral. It may be obvious to a person skilled in the art to configure the gasket integral with the cover using any other multi-material injection moulding process or by using alternatives such as adhesives or fasteners and the like.
[0017] Further, in an embodiment, the gasket may be integral to the receptacle. Specifically, the gasket may be multi-material injection moulded (2k moulded or over-moulded) with a rib extending from an inner portion of the receptacle, such that the gasket and the receptacle are integral. In such an embodiment, the channel may be configured on the cover to adapt the gasket therein. Further, the receptacle is arranged with a plurality of flanges which extends from the outer periphery of the receptacle. The flanges are adapted to snap-fit with respective groves/openings configured on the cover. The flanges may ensure uniform compression of the gasket between the cover and the receptacle.

[0018] Also, the inner periphery of the receptacle may have engaging elements with protrusions which are arranged in different orientations to engage with notches on the cover to prevent wrong orientation of the enclosure assembly.

Brief Description of the Drawings

[0019] The advantages and features of the present invention will be understood better with reference to the following detailed description and claims taken in conjunction with the accompanying drawings, wherein like elements are identified with like symbols, and in which:

[0020] Figure 1 illustrates an exploded view of an enclosure for an electronic control unit in accordance with the present invention;

[0021] Figure 2 illustrates another exploded view of the enclosure with a gasket integral on a cover of the enclosure;

[0022] Figure 3 illustrates a schematic representation of a circuit board secured inside a receptacle of the enclosure;

[0023] Figure 4 illustrates a schematic representation of an extending member locking with grooves of the circuit board;

[0024] Figure 5 illustrates a perspective view of the receptacle with the circuit board assembled therein;

[0025] Figure 6 illustrates a side sectional view of the enclosure in the assembled position with the gasket being arranged between the cover and the receptacle;

[0026] Figure 7 illustrates the arrangement of gasket moulded with the cover in accordance with the present invention; and

[0027] Figure 8 illustrates a side sectional view of the enclosure in the assembled position with the gasket being moulded with the cover of the enclosure.
Detailed Description of the Invention

[0028] An embodiment of this invention, illustrating its features, will now be described in detail. The words "comprising, "having, "containing," and "including," and other forms thereof, are intended to be equivalent in meaning and be open ended in that an item or items following any one of these words is not meant to be an exhaustive listing of such item or items, or meant to be limited to only the listed item or items.

[0029] The terms “first,” “second,” and the like, herein do not denote any order, quantity, or importance, but rather are used to distinguish one element from another, and the terms “an” and “a” herein do not denote a limitation of quantity, but rather denote the presence of at least one of the referenced item.

[0030] The disclosed embodiments are merely exemplary of the invention, which may be embodied in various forms.

[0031] Referring to figures 1 and 2, an enclosure 100 for a circuit board 200 in accordance with the present invention is illustrated. In the present embodiment, the circuit board 200 is a part of an electronic control unit of a vehicle. The enclosure 100 encapsulates the circuit board 200 (figure 3) therein. The circuit board 200 is vulnerable to moisture or vibrations, therefore it is encapsulated in the enclosure 100. In the present embodiment, the electronic control unit is a control unit for a reverse park assist sensor arrangement for a vehicle. The circuit board 200 or PCB 200 (printed circuit board), of the electronic control unit has a lot of delicate circuits which has to be secured inside the enclosure 100 for better durability. Hereinafter circuit board 200 will be referred to as the PCB 200.

[0032] In the present embodiment, the enclosure 100 includes a receptacle 300 and a cover 400. The receptacle 300 and the cover 400 configures the enclosure 100 covered by the walls of the receptacle 300 and the cover 400. The enclosure 100 is hollow. More specifically, the receptacle 300 and the cover 400 has a snap to fit configuration which enables the cover 400 and the receptacle 300 to attach thereby configuring the enclosure 100.

[0033] Further, the receptacle 300 has a flat base which includes a guiding member, in the present embodiment, two guiding members 310, 312 are shown, a snap-fit arrangement 320, a plurality of pins 330 and a multi-planar channel (hereinafter referred as the channel 340). The guiding members 310, 312 are elongated members extending transversely from an inner portion 300a of the receptacle 300. In the present embodiment and as shown in figure 5, the receptacle 300 includes two guiding members 310, 312 arranged diagonally opposite to each other. The guiding members 310, 312 has chamfers on top of each of the guiding members 310, 312, such that while assembling the PCB 200, the guiding members 310, 312 passes through the respective grooves 210, 212 in the PCB 200 for securing the PCB 200 on the receptacle 300. The receptacle 300 also has a cavity 302 to arrange a park assist sensor (not shown) therewithin, as shown in figure 2.
[0034] Further, the snap-fit arrangement 320 locks the circuit board 200 with the receptacle 300, as shown in figures 4 and 5. The snap-fit arrangement 320 includes two extending members 322, 324 extending from the inner portion of the receptacle 300. The extending members 322, 324 are arranged diagonally and aligned opposite to the guiding members 310, 312, as shown in figure 3. The extending members 322, 324 has a locking portion 320a (figure 4) on a top portion, the locking portion 320a locks with the respective grooves 320b of the PCB 200 during the assembly of the PCB 200 on the receptacle 300.

[0035] Further, the plurality of pins 330 are also arranged vertically on the base of the receptacle 300, as shown in figure 1. Specifically, the plurality of pins 330 extends from an inner portion of the receptacle 300 for engaging and or selectively soldering the PCB 200 thereto. The plurality of pins 330 are soldered therewith the PCB 200 after assembling the PCB 200 on the receptacle 300, as shown in figure 3. Referring again to figures 1 and 2, the enclosure 100 includes a gasket 500. The gasket 500 is a sealant arranged between the cover 400 and the receptacle 300. The gasket 500 facilitates to seal the enclosure 100 to prevent the exposure of the PCB 200 to the moisture. In the present embodiment, the gasket 500 is a soft component or a flexible component made of thermoplastic polyurethane.

[0036] Further, the gasket 500 is arranged on the channel 340 configured on the receptacle 300, as shown in figures 1 and 7. The channel 340 is configured peripherally on the receptacle 300 to adapt the gasket 500 such that the gasket 500 positively fits inside the channel 340 when assembling the enclosure 100. The channel 340 is a double-wall configuration on the receptacle 300 to securely accommodate the gasket 500 therein. Specifically, the channel 340 has a multi-planar section to secure the gasket 500. The gasket 500 may have a “Z” shape in a sectional view as shown in figure 8 to accommodate inside the channel 340 to prevent the flow path of dust particles and water inside the enclosure 100. In another embodiment, the channel 340 may be configured on the cover 200 to secure the gasket 500 therein. The gasket 500 seals assembly of the receptacle 300 and the cover 400 together for securing the PCB 200 against moisture. It may be obvious to a person skilled in the art to configure more than one channel 340 on the cover 400 or on the receptacle 300.

[0037] Further, in a first embodiment, as shown in figure 1 and figure 6, the gasket 500 is removably arranged between the cover 400 and the receptacle 300. The gasket 500 is arranged on the channel 340 of the receptacle 300, as shown in figure 3 and the cover 400 snap-fit with the receptacle 300 during the assembly of the PCB 200. Specifically, a rib 410 extending from an inner portion of the cover 400 compresses the gasket 500 to positively fit inside the channel 340 and thereby ensuring sealing of the PCB 200 in the enclosure 100.

[0038] Further, in a second embodiment, as shown in figures 2 and 8, the gasket 500 is integral to the cover 400 of the enclosure 100. Specifically, the gasket 500 is multi-material injection moulded, specifically 2k moulded with the inner portion of the cover 400. 2K moulding is a multi-material injection moulding process used to produce complicated moulded parts from two different materials by moulding plastic around a preformed metal or plastic insert. Specifically, a first material is injected into a mould in order to make the initial piece of the product, followed by a second injection of a second material that is compatible with the initial injection-moulded piece. The two plastic resins then form a molecular bond, and the multi-resin moulded part is cooled and ejected. In this embodiment, the first material is used to make the cover 400 and the second material for the gasket 500 such that after the 2k moulding process, the cover 400 and the gasket 500 adhere to each other. Specifically, the gasket 500 is 2k moulded with a rib 410 extending from an inner portion of the cover 400, such that the gasket 500 and the cover 400 are integral.

[0039] Similarly, in another embodiment (not shown), the gasket 500 is multi-material injection moulded, specifically over-moulded with the rib 410 extending from an inner portion of the cover 400, such that the gasket 500 and the cover 400 are integral. Overmoulding is a multi-material injection moulding process of adding an additional layer of material over an already existing piece or part. Typically, the substrate material (the first piece in what will be bonded and mechanically interlocked with other materials) is placed into an injection moulding tool, at which the over mould material is shot into or around the substrate. When the overmould materials solidify, the two materials become joined together as a single part. In this embodiment, the substrate material is used to make the cover 400 and the over mould material for the gasket 500 such that after the over-moulding process, the cover 400 and the gasket 500 adhere to each other. It may be obvious to a person skilled in the art to configure the gasket 500 integral with the cover 400 using any other multi-material injection moulding process or by using alternatives such as adhesives or fasteners and the like.

[0040] Further, in an embodiment (not shown), the gasket 500 may be integral to the receptacle 300. Specifically, the gasket 500 may be multi-material injection moulded (either 2k moulded or over-moulded) with a rib 410 extending from an inner portion of the receptacle 300, such that the gasket 500 and the receptacle 300 are integral. In such embodiment, the channel 340 is configured on the cover 400 to adapt the gasket 500 therein.

[0041] Further, in an embodiment (not shown), the cover 400 and the receptacle 300 both may have the channel 340 configured on the periphery to adapt the gasket 500 removably in between. In another embodiment (now shown), the receptacle 300 or the cover 400 may have multiple channels 340 configured on the periphery of the receptacle 300 or the cover 400. The gasket 500 positively fits inside the channel 340 to ensure the sealing of the enclosure 100 when the cover 400 snap-fit with the receptacle 300 during the assembly of the PCB 200.

[0042] Further referring to figure 3, the inner periphery of the receptacle 300 has engaging elements 360 with protrusions which are arranged in different orientations to engage with notches (not shown) on the cover 400 to prevent wrong orientation of the enclosure 100 assembly. For example, in one portion of the receptacle 300 may have two engaging elements, 360 and the other side has a single engaging element 360, as shown in figure 3. Symmetrical notches (not shown) are arranged on the cover 400 such that the engaging elements 360 engage with the respective notches to prevent the wrong orientation of the enclosure 100.

[0043] Further, the receptacle 300 is arranged with a plurality of flanges 350 which extends from the outer periphery of the receptacle 300. The flanges 350 are adapted to snap-fit with respective grooves/openings 400a configured on the cover 400. The locking of the flanges 350 with the grooves 400a ensures uniform compression of the gasket 500 between the cover 400 and the receptacle 300. In this embodiment, at least 10 flanges 350 are snap-fit with the respective grooves 400a to attach the cover 400 and the receptacle 300. It may be obvious to a person skilled in the art to attach the cover 400 with the receptacle 300 using any other fastening methods.

[0044] Therefore the present invention has an advantage of providing the enclosure 100 for an electronic control unit which secures the circuit board from moisture and vibrational damages. The enclosure 100 eliminates the need for special equipment required for dispensing the potting compound. It also eliminates the handling of a separate part on the assembly. Also, the enclosure is economical and robust in construction.
[0045] The foregoing descriptions of specific embodiments of the present invention have been presented for purposes of illustration and description. They are not intended to be exhaustive or to limit the present invention to the precise forms disclosed, and obviously many modifications and variations are possible in light of the above teaching. The embodiments were chosen and described in order to best explain the principles of the present invention and its practical application, and to thereby enable others skilled in the art to best utilize the present invention and various embodiments with various modifications as are suited to the particular use contemplated. It is understood that various omissions and substitutions of equivalents are contemplated as circumstances may suggest or render expedient, but such omissions and substitutions are intended to cover the application or implementation without departing from the scope of the claims of the present invention.