An integrated circuit (300) comprises: a digital feedback control circuit to adjust the impedance of an interface circuit output buffer based, at least in part, on having adjusted the impedance of a non-data signal output buffer (330) coupled to an external impedance.A method of adjusting the impedance of an interface circuit output buffer comprises the steps of: digitally adjusting the impedance of a non-data signal output buffer coupled to an external impedance, and digitally adjusting the impedance of the interface circuit output buffer based, at least in part, on the digitally adjusted impedance of the non-data signal output buffer.
BACKGROUND OF THE INVENTION
1. Field of the invention.
The present invention relates to an integrated circuit and a method of
adjusting the impedance of an interface circuit output buffer and, more
particularly, to control circuits to adjust component impedance based, at least
in part, on the impedance of an external coupling.
2. Background Information
Circuitry to interface between components of a digital system, such as for
a microprocessor system or a server system, for example are well-known.
However, increasing signal speeds, such as on the order of 500 megabit transfers
per second, have made these interface circuits increasingly complex. For
example, due to increasing signal speeds, it may be desirable to match
impedances between components of the system, such as between a transmitting
amplifier and a controlled impedance signal coupling in a server system, to
reduce the amount of signal reflection that may occur.
Impedance control circuits, such as described above, are well-known.
However, it would be desirable to have an economic on-chip implementation of a
feedback control circuit in which the circuit impedance being adjusted or
controlled may be updated even while digital signal samples are being
transmitted via the interface circuitry.
SUMMARY OF THE INVENTION
Briefly, in accordance with one embodiment of the invention an
integrated circuit includes: a digital feedback control circuit to adjust the
impedance of an interface circuit output buffer based, at least in part, on having
adjusted the impedance of a non-data signal output buffer coupled to an
external impedance.
Briefly, in accordance with another embodiment of the invention, a
method of digitally adjusting the impedance of an interface circuit output buffer
comprises: digitally adjusting the impedance of a non-data signal output buffer
coupled to an external impedance, and digitally adjusting the impedance of the
interface circuit output buffer based, at least in part, on the digitally adjusted
impedance of the non-data signal output buffer.
Accordingly, the present invention provides an integrated circuit
comprising : a digital feedback control circuit to adjust the impedance of an
interface circuit output buffer based, at least in part, on having adjusted the
impedance of a non-data signal output buffer coupled to an external impedance.
The present invention also provides a method of adjusting the impedance
of an interface circuit output buffer comprising the steps of: digitally adjusting the
impedance of a non-data signal output buffer coupled to an external impedance ;
and digitally adjusting the impedance of the interface circuit output buffer based,
at least in part, on the digitally adjusted impedance of the non-data signal output
buffer.
BRIEF DESCRIPT ION OF THE ACCOMPANYING DRAWINGS.
The subject matter regarded as the invention is particularly pointed out
and distinctly claimed in the concluding portions of the specification. The
invention, however, both as to organization and method of operation, together
with objects, features and advantages thereof, may best be understood by a
reference to the following detailed description when read with the accompanying
drawings in which:
FIG. 1 is a schematic diagram illustrating two alternative methods of
termination;
FIG. 2 is a block diagram illustrating an embodiment of an impedance
control circuit in accordance with the invention;
FIG. 3 is a circuit diagram illustrating the output buffer of FIG. 2 in
greater detail;
FIG. 4 is a block diagram illustrating a portion of the embodiment of
FIG. 2 in greater detail;
FIG. 5 is a block diagram illustrating a portion of the embodiment of
FIG. 2 in greater detail;
FIG. 6 is a block diagram illustrating a portion of the embodiment of
FIG. 2 in greater detail;
FIG. 7 is a plot showing the current vs. voltage (I/V) characteristic of a
typical metal-oxide semiconductor (MOS) transistor;
FIG. 8 is a circuit diagram illustrating a portion of the embodiment of
FIG. 3 in greater detail.
DETAILED DESCRIPTION OF THE INVENTION
In the following detailed description, specific details are set forth in order
to provide a thorough understanding of the invention. However, it will be
understood by those skilled in the relevant art that the present invention may be
practiced without these specific details. In other instances, well-known methods,
procedures, components, and circuits have not been described in detail so as not
to obscure the present invention.
As silicon processing technology advances, the speed of logic
components made from silicon continues to increase. As a result, it is desirable
to have high speed interface circuitry to transfer electrical signals, such digital
signals, into and out of integrated circuit chips capable of operating at these
increased speeds. To transmit high speed electrical signals with interface
circuitry, it is desirable that a properly terminated, controlled impedance circuit
be employed. Termination circuits or structures to accomplish this may be
implemented either on-chip or off-chip; however, typically, on-chip termination
techniques provide cost and speed advantages over off-chip termination
techniques.
FIG. 1 is a schematic diagram illustrating both source and parallel
termination approaches. Either approach may be employed to implement an
embodiment in accordance with the present invention; however, the embodiment
described hereinafter is implemented as a source termination circuit to capture
cost and speed advantages that may be available with that approach. As
illustrated in FIG. 1, in both approaches, electrical signals, such as digital signals
in this particular embodiment, are communicated from a source driver, such as
110 or 250, to a destination driver, such as 150 or 260. Likewise, these signals
are transmitted via a coupling, such as 140 or 240 having an impedance Z,,.
Performance is improved relative to alternative approaches if the well-known
technique of impedance matching is employed. By matching the impedance of
coupling 140 or 240, electrical signals that may be reflected by the destination
driver are properly terminated. In this context, this means that substantially no
electrical signal reflections occur at the source end of the coupling.
As illustrated in FIG. I, a source termination approach or a parallel
termination approach may be employed. In a source termination approach, the
impedance of the coupling, such as 140, is matched by the impedance of the
source driver, such as 110. In a parallel termination approach, the impedance is
matched via a coupling of the matching impedance, such as 210, to the
impedance of the coupling being matched, such as 240.
Although the invention is not limited in scope in this respect, interface
circuitry may be employed in association with a signal bus, for example, for
operation in either a desktop personal computer or a server configuration, for
example. To obtain speeds that may be desirable for server applications, for
example, impedance matching, such as previously described, may be employed.
However, as previously indicated, cost and speed factors may make use of the
parallel termination approach on a board or elsewhere less desirable than the
source termination approach. Therefore, in this particular embodiment, for
example, the impedance of a driver may be matched to the impedance of an
external coupling to a network, for example, to achieve these desirable signal
speeds.
Where metal-oxide semiconductor (MOS) technologies are employed,
impedance matching may involve matching a given impedance to the impedance
associated with a particular point on a non-linear current-voltage (1/V)
characteristic curve representing the operation of an MOS transistor. Such a
characteristic curve is associated with an MOS transistor where the drain-to-
source current is plotted along the Y-axis versus the drain-to-source voltage
plotted along the X-axis, as illustrated in FIG. 7.
A number of approaches may be employed to perform this impedance
matching and the scope of the invention is not limited to a particular approach,
such as restricting the range of operation of an MOS transistor or employing a
circuit to at least approximately linearize the operation of an MOS transistor;
however, for this particular embodiment, due to ease of implementation, instead,
the impedance to be matched will be matched to a selected point on the MOS
transistor current vs. voltage (I/V) characteristic curve. Such an approach
permits an inverting complementary metal-oxide semiconductor (CMOS) buffer
to be used as an output buffer. However, one disadvantage is that noise sources
resulting in transitions to other portions of the I/V curve, such as the saturation
region of operation of the transistor, will not be properly terminated and,
therefore, may contribute to intersymbol interference.
Approximating the impedance of an external coupling by the impedance
of a CMOS output buffer may be done in a number of ways. For example,
cascoded devices or series gating may be employed. The circuits may be
implemented to allow either digital or analog control. For this particular
embodiment, although the invention is not limited in scope in this respect, a
digital approach is employed due to the potentially noisy environment for the
electronic signals.
In one embodiment, although the invention is not limited in scope in this
respect, a circuit may be implemented using cascodcd devices in series with a
primary output amplifier to adjust or control the effective impedance of the
overall structure. The cascode devices may include multiple, parallel couplings
that may be individually enabled.
The weighting of these devices to adjust the effective impedance of the
output buffer may be accomplished in a variety of ways, although the invention
is not limited in scope to any particular approach. Two frequently employed
approaches include binary weighting and linear weighting. Although overall
device size may affect the available range of impedances that may be
implemented, the resolution of the impedance may be affected by the size of the
smallest device, such as illustrated in FIG. 3, for example. One advantage of
binary weighting is that it permits a larger impedance range for a given
resolution in comparison with linear weighting; however, as will be explained in
more detail hereinafter, it has disadvantages with respect to "on-the-fly"
updating of the impedance.
As previously described, an alternative approach may employ using
series gating to adjust or control the impedance of the output buffer. This
particular approach is employed in the embodiment illustrated in FIG. 3,
although the invention is not limited in scope to this particular approach. The
particular approach employed to implement the output buffer may affect
additional implementation considerations including the size of the smallest leg,
such as due to electrostatic discharge (ESD) sensitivity, and, likewise, the area of
the chip employed by the particular buffer. For example, a cascoded approach
employs a relatively large area in comparison with a series gated approach.
As illustrated in FIG. 3, the amplifier is a multi-legged device with the
input signal being gated with enable signals for the individual legs. In this
context, the term leg refers to the primary transistors employed to implement the
amplifier configuration (e.g., 460, 470, 480, 490, 510, 520, 530 and 540). In
comparison with a cascaded approach, the size of the overall amplifier is
reduced. However, a speed penalty will be incurred because the predrivers, such
as 430 or 440, are more complex, which introduces additional delay.
The slew rate for the electronic digital signals produced may also be
adjusted or controlled. Again, a variety of techniques may be employed,
including analog techniques and digital techniques. For the embodiment
illustrated in FIG. 3, impedance and slew rate adjustment are both incorporated.
In this particular embodiment, a subset of the impedance control couplings are
employed to control slew rate. This particular approach reduces the control
circuitry and coupling in comparison with an approach in which both impedance
control and slew rate control are into the same buffer. In this particular
embodiment, a 4-bit control scheme with a 2-bit slew rate control of the 4-bits is
employed. Slew rate adjustment may be accomplished, for example, using
parallel legs on the predriver for the side of the device that turns on or produces
the electrical digital output signal. For example, for a PMOS predriver, the N-
device has multiple legs. As shown in FIG. 8, which is a detailed view of 450,
devices 700 and 710 have been added in cascode with the predriver N-type MOS
(NMOS) device. Inverters 452 may employ a similar approach using PMOS
devices. Devices 700 and 710 in FIG.8 are used to control the impedance of the
predriver in an approach similar to the approach used to control as the
impedance of the output buffer with devices 460, 470, etc.. This impedance
driving the capacitance of the output buffers, such as due to devices 460, 470,
etc., limits the slew rate of the output buffer. Only the output buffer turn-on slew
rate is controlled in this embodiment because the output buffer is meant to be
used in a source-terminated configuration. Alternatively, if a parallel
termination embodiment were employed, the turn-off slew rate would also be
controlled due at least in part to static current in the coupling.
For the embodiment of an output buffer illustrated in FIG. 3, en3 and
en2 are employed for slew rate adjustment. An offset value between the nominal
values for impedance adjustment and slew rate adjustment may be employed in
the control logic, as described in more detail hereinafter. Therefore, if the
impedance of the predriver is well-controlled, the slew rate of the driver may be
tightly controlled as well.
A digital control loop may be employed to compensate a digitally
controllable buffer, such as previously described, for variations in process and
environment, for example. Although the previously described digitally
controllable buffer may be employed, it will, of course, be appreciated that the
invention is not limited in scope to the particular embodiment described. Any
digitally controllable buffer or even a controllable buffer that is not controllable
digitally may be employed. Since noise is present at the signal sampling
interface illustrated in FIG. 4, it is desirable to limit the loop bandwidth to reduce
the sensitvity to this noise. A filler may be implemented in a variety of ways,
such as at the sampling pin, in this embodiment, the interface of 330, 340, and
360, or in control logic block 310, to limit the loop bandwidth. Another
advantage is that this permits the use of relatively slow circuit components, and
permits the lowering of the sampling rate to allow for metaslability settling time,
as will be described later.
FIG. 2 is a schematic diagram illustrating an embodiment 300 of an
impedance control circuit in accordance with the invention, although the
invention is not limited in scope to this particular embodiment. Embodiment
300 is illustrated as embodied on an integrated circuit (IC) chip, although the
invention is not limited in scope in this respect. As illustrated, an externally
derived clock signal drives the control circuit; however, it is divided down by
divider 442. Output buffer 320 comprises an interface circuit output buffer,
while output buffer 330 comprises a non-data signal or "dummy" output
buffer. A feedback control loop including amplifier 360 and impedance control
logic 310 is coupled to adjust the impedance of output buffer 330 based, at least
in part, on the impedance of external coupling 340. The feedback control
circuit operates to approximately match the impedance of buffer 330 with, in
this particular embodiment, the impedance of external resistor 340. Likewise, in
this embodiment, resistors 370 and 350 effectively establish the voltage signal
reference level for amplifier 360. Impedance control logic 310 based, at least in
part, on the output signal of amplifier 360 controls whether to adjust the
impedance of buffer 330 up or down, that is increase or decrease the buffer
impedence. Likewise, this control signal information is also applied to buffer
320. The feedback control circuit also produces control signals to adjust the
slew rate of buffer 320 based on the impedance control signals produced from
operation of the feedback loop including buffer 330. Likewise, register 410 is
employed so that buffer 320 may be updated "on-the-fly," as explained in
more detail hereinafter.
FIG. 4 illustrates a portion of the embodiment of FIG. 2. For the portion
of the embodiment illustrated in FIG. 4, a precision external resistor 340 is
coupled to an output port of non-data signal (dummy) output buffer 330. The
impedance value obtained for buffer 330 due to the operation of the feedback
circuit previously described is then used to adjust the impedance of output
buffer 320. For the feedback circuit of this embodiment, a reference voltage
signal level for amplifier 360 is generated. This reference voltage signal level is
implemented in this embodiment by resistors 350 and 370 in FIG. 4. This sets
the threshold for amplifier 360. This reference value effectively sets the point
on the MOS transistor I/V characteristic to which the impedance of buffer 330 is
matched. Resistor 340 is selected by approximating the nominal value of the
external coupling to buffer 320. Of course, alternatively, an externally derived
coupling may be employed in place of resistor 340 or another approach may be
employed.
The feedback control circuit in this embodiment operates as follows. A
sample impedance signal value is taken by input latch 305. A first
predetermined period of time elapses to allow any metastabilities in the latch to
settle. Based upon the signal sample value obtained and the impedance of buffer
330 in relation to resistor 340, a determination regarding which direction to
adjust the impedance of buffer 330 is made, that is to increase or decrease the
impedence. This may be implemented in 310, for example, by adjusting the
value of an up/down counter or a shift register to control the impedance of
buffer 330, as explained later. Therefore, impedance control logic 310
generates signals applied to buffer 330 to produce the next impedance value.
Another second predetermined amount of time elapses for the change in the
adjusted impedance value to settle at the output port of buffer 330 and
propagate through input amplifier 360. This process is repeated until the
impedance, resistor 340 in this particular embodiment, has been matched, as
desired. At this point, in this particular embodiment, control circuit 310 results in
the impedance of buffer 330 varying by plus or minus a least significant control
bit about the desired impedance value.
The time to allow for metastability settling and for settling of the
transition of output buffer 330 is provided in this embodiment by a clock
divider, as illustrated in FIG. 4. As illustrated, logic in the control loop is
clocked by this divided down clock signal. It is desirable to set the clock or
sampling rate to obtain a reasonably low sampling error rate due to metastable
states in input latch 305. These metastabilities may occur from noise on the
dummy pin at any time with respect to the clock, and may, therefore, violate the
setup and hold conditions of latch 305. Computation of the mean time between
failures of a latch involves parameters such as the process technology, latch
design, allowable settling time, and probability distribution of the latch data edge
timing with respect to the clock. Using acceptable bounds for these parameters,
and an allowable error rate, an acceptable settling time may be calculated. For
example, for a latch which samples uniformly distributed asynchronous data
signals (and making some simplifying assumptions) at a frequency of
approximately 433 Megahertz, it is desirable to divide the clock by at least two
generated sampling clock pulses, although the invention is not limited in scope
in this respect. Thus for this embodiment, divider 442 provides an acceptable
settling time for the target process, although the invention is not limited in scope
in this respect.
Another aspect of this embodiment involves filtering frequencies greater
than half the sampling rate to reduce the noise sources occurring at, or greater
than, the Nyquist rate. These frequencies might otherwise result in aliasing. FIG.
5 illustrates the filter employed in this embodiment, although, again, the
invention is not limited in scope to employing a filler or to this particular
embodiment. Likewise, in placing the pole of the filter, it is desirable to avoid
instabilities. Therefore, it is desirable to update the impedance at a lower rate
than the bandwidth of the loop to allow the loop time to settle after an update.
In this particular embodiment, the pole of the analog filter is placed at less than
half the sampling frequency, but at least two times the update rate, although the
invention is not limited in this respect. In the time domain response, therefore,
after the impedance is updated, the next sampling event occurs after two filter
time constants. Of course, a greater number of filter time constants before the
next sampling event may be employed, however, doing so would also increase
the control loop lock time.
Due to the operation of the control loop and a situation in which the
impedance of output buffer 320 may not precisely match, the control loop
should lock with a one-bit variation from the matching point and, therefore,
oscillate. It is desirable to remove this oscillation from the actual output signal
produced by buffer 320. Although this may be accomplished a number of
different ways, a simple digital notch filter may be employed. For example, a
simple, exclusive or circuit may be employed. If successive digital sample values
are the same then an update of buffer 320 is performed, however, if successive
samples are not the same, then the last update is retained by buffer 320. This
particular embodiment is illustrated in FIG. 6. As illustrated, impedance control
block 310 provides signals to output buffer 330. Likewise, the output signals of
low pass filter 610 are provided to notch filter 620. Notch filter 620 provides a
signal to block 407. Depending on the successive samples provided to notch
filter 620, the impedance control signals produced by 310 are also provided by
block 407 to register 640 and, therefore, to register 410 and ultimately to buffer
320.
The implementation of impedance control block 307 is dependent, at
least in part, on the weighting of the output buffer legs. For example, if the
devices are linearly weighted, a shift register may be employed. However, if they
are binary weighted, this block may be implemented as an up/down counter. For
a linearly weighted buffer, one bit of a shift register would change on each
impedance update, changing the impedance of the buffer by a substantially
uniform amount. For a binary weighted buffer, a counter is updated, producing
another binary digital signal value controlling the buffer impedance. In such an
embodiment, therefore, all bits of the counter may change on a single impedance
update. As illustrated in FIG. 6, adder 650 is used to offset the nominal slew rate
value from the nominal impedance value. This offset value may be set either
internally or externally by a variety of techniques. For example, the offset value
may be loaded into a register from an external source, or alternatively, it may be
implemented with fuses. For example, if it were intended to use the same output
buffer to match several alternative impedances, and it were desirable to maintain
a substantially constant slew rate, it would be desirable to be able to modify this
offset value.
As previously described, this embodiment includes the capability to
adjust the impedance of the output buffer while the output buffer is transmitting
data signals. One problem with this "on-fhe-fly" updating is that if the update
occurs temporally near an outgoing data signal edge, for example, it may alter
the timing of the edge. This may produce undesirable timing jitter. For
example, for the case of a binary weighted output buffer with five legs, a
significant change in the impedance of the output buffer may occur in a single
clock cycle. With linear encoding, because only one bit at a time changes, the
impact of this effect is reduced. However, linear encoding provides a smaller
range of impedance values. Likewise, where slew rate control is employed, an
additional problem may result because after a large change in impedance, some
output buffer legs may turn on relatively slowly due to slew rate control. This
may occur in this embodiment since, for .source terminated buffers, "turn off"
of a leg is done quickly, while "turn on" of a leg is done slowly to implement
slew rate control. For example, the impedance control signal values from 310
may change from 1000 to 0111 on a single impedance update. If the most
significant bit changes first, the buffer may tristate momentarily. Tf non-zero
current was in the signal transmission coupling when the buffer tiistated, the line
will switch. The remaining impedance control bits will then switch, turning the
buffer back on and returning the coupling approximately to it's original state,
but slowly. The line, therefore, glitches. This may degrade performance if the
output buffer is transmitting data signals while this occurs.
For the embodiment illustrated in FIG. 8, on-the-fly updating is
performed by updating while the output buffer is in tri-state or by updating the
"off" or non-transmitting side of the CMOS output buffer (for example, in this
embodiment, the NMOS devices while the output signal is high, and the PMOS
devices while the output signal is low). To implement this approach, latches are
employed at each individual leg of the output buffer using register 410 of FIG.
2, in this embodiment, for example. The latches used in register 410 are
replicated at each signal output port; however, these latches may be relatively
small. For the embodiment illustrated in FIG. 2, signals RHSET and OEn are
employed so that "on-the-fly" updating occurs during tri-state or reset.
Although the invention is not limited in scope in this respect, in this particular
embodiment on-lhc-fly updating is employed only for the impedance of the
output buffer. For an application in which resolution of the slew rate control is
relatively coarse, the slew rate control may be operated for a few clock cycles
after reset to remove process variations, for example, and then the slew rate value
may be locked. Alternatively, on-the-fly updating of the slew rate may likewise
be employed, although this may also create timing jitter.
An embodiment of a method of adjusting an impedance of an
interface circuit output buffer, such as output buffer 320 illustrated in FIG. 2,
may be accomplished as follows. As previously described, the impedance of a
non-data signal output buffer, such as output buffer 330 in FIG. 2, coupled to an
external impedance, such as resistor 340 in FIG. 2, may be digitally adjusted.
The impedance of an interface circuit output buffer, such as output buffer 320
in FIG. 2, may be digitally adjusted based, at least in pail, on digitally adjusted
impedance of the non-data signal output buffer. Likewise, the impedance of the
interface circuit output buffer may also be digitally adjusted based, at least in
part, on the digital adjustment of the impedance of the non-data signal output
buffer. Again, this has been previously described in connection with output
buffer 320, as illustrated in FIG. 2. Likewise, the impedance of the interface
circuit output buffer may be digitally adjusted on-the-fly. For example, in the
embodiment illustrated in FIG. 2 the impedance of the non-transmitting side of
the interface circuit output buffer may be digitally adjusted on-the-fly.As
previously described, digitally adjusting the impedance of the non-data signal
output buffer comprises approximately matching the impedance of the non-data
signal output buffer, such as buffer 330 in FIG. 2, with the impedance of the
external coupling, such as resistor 340 in FIG. 2. Likewise, in this particular
embodiment, although the invention is not limited in scope in this respect, the
impedance of the non-data signal output buffer is digitally adjusted so that the
external impedance is source terminated. Likewise, digitally adjusting the
impedance of a non-data signal output buffer coupled to an external impedance
comprises digitally adjusting the impedance in binary weighted increments,
although, again, the invention is not limited in scope in this respect.
While certain features of the invention have been illustrated as described
herein, many modifications, substitutions, changes and equivalents will now
occur to those skilled in the art. It is, therefore, to be understood that the
appended claims are intended to cover all such modifications and changes as fall
within the true spirit of the invention.
WE CLAIM :
1. An integrated circuit comprising :
a digital feedback control circuit to adjust the impedance of an interface
circuit output buffer based, at least in part, on having adjusted the impedance of
a non-data signal output buffer coupled to an external impedance.
2. The integrated circuit as claimed in claim 1, wherein said digital feedback
control circuit also adjusts the slew rate of said interface circuit output buffer.
3. The integrated circuit as claimed in claim 2, wherein said digital feedback
control circuit comprises the capability to adjust the impedance of said interface
circuit output buffer on-the-fly.
4. The integrated circuit as claimed in claim 3, wherein the capability to
adjust the impedance of said interface circuit output buffer on-the-fly comprises
the capability to adjust the impedance of the non-transmitting side of said
interface circuit output buffer on-the-fly.
5. The integrated circuit as claimed in claim 3, wherein said digital feedback
control circuit to adjust the impedance of said interface circuit output buffer
comprises a digital feedback control circuit to approximately match the
impedance of said non-data signal output buffer with the impedance of the
external coupling.
6. The integrated circuit as claimed in claim 1, wherein said external coupling
comprises at least one resistor.
7. The integrated circuit as claimed in claim 1, wherein said digital feedback
control circuit comprises a source termination digital feedback control circuit.
8. The integrated circuit as claimed in claim 1, wherein said interface circuit
output buffer comprises an output buffer in which at least some of the transistors
are series gated.
9. The integrated circuit as claimed in claim 1, wherein said interface circuit
output buffer comprises an amplifier configuration with a plurality of legs, said
legs being sized so that their weighting to adjust the effective impedance of the
output buffer is substantially binary.
10. A method of adjusting the impedance of an interface circuit output buffer
comprising the steps of:
digitally adjusting the impedance of a non-data signal output buffer
coupled to an external impedance ; and
digitally adjusting the impedance of the interface circuit output buffer
based, at least in part, on the digitally adjusted impedance of the non-data signal
output buffer.
11. The method as claimed in claim 10, wherein digitally adjusting the
impedance of the interface circuit output buffer comprises also digitally adjusting
the slew rate of said interface circuit output buffer.
12. The method as claimed in claim 10, wherein digitally adjusting the
impedance of the interface circuit output buffer comprises digitally adjusting the
impedance on-the-fly.
13. The method as claimed in claim 12, wherein digitally adjusting the
impedance of the interface circuit output buffer on-the-fly comprises digitally
adjusting the impedance of the non-transmitting side of the interface circuit
output buffer on-the-fly.
14. The method as claimed in claim 10, wherein adjusting the impedance of
the non-data signal output buffer comprises approximately matching the
impedance of the non-data signal output buffer with the impedance of the
external coupling.
15. The method as claimed in claim 14, wherein the external coupling
comprises at least one resistor.
16 The method as claimed in claim 10, wherein digitally adjusting the
impedance of a non-data signal output buffer coupled to an external impedance
comprises digitally adjusting the impedance of the non-data signal output buffer
so that the external impedance is source terminated.
17. The method as claimed in claim 10, wherein digitally adjusting the
impedance of a non-data signal output buffer coupled to an external impedance
comprises digitally adjusting the impedance in binary weighted increments.
18. An integrated circuit, substantially as herein described, particularly with
reference to and as illustrated in the accompanying drawings.
19. A method of adjusting the impedance of an interface circuit output buffer,
substantially as herein described, particularly with reference to the
accompanying drawings.
An integrated circuit (300) comprises : a digital feedback control circuit to adjust the impedance of an interface circuit output buffer based, at least in part, on having adjusted the impedance of a non-data signal output buffer (330) coupled to an external impedance.
A method of adjusting the impedance of an interface circuit output buffer comprises the steps of : digitally adjusting the impedance of a non-data signal output buffer coupled to an external impedance ; and digitally adjusting the impedance of the interface circuit output buffer based, at least in part, on the digitally adjusted impedance of the non-data signal output buffer.
| # | Name | Date |
|---|---|---|
| 1 | 1243-cal-1998-granted-specification.pdf | 2011-10-07 |
| 2 | 1243-cal-1998-granted-reply to examination report.pdf | 2011-10-07 |
| 3 | 1243-cal-1998-granted-priority document.pdf | 2011-10-07 |
| 4 | 1243-cal-1998-granted-letter patent.pdf | 2011-10-07 |
| 5 | 1243-cal-1998-granted-gpa.pdf | 2011-10-07 |
| 6 | 1243-cal-1998-granted-form 5.pdf | 2011-10-07 |
| 7 | 1243-cal-1998-granted-form 3.pdf | 2011-10-07 |
| 8 | 1243-cal-1998-granted-form 2.pdf | 2011-10-07 |
| 9 | 1243-cal-1998-granted-form 1.pdf | 2011-10-07 |
| 10 | 1243-cal-1998-granted-examination report.pdf | 2011-10-07 |
| 11 | 1243-cal-1998-granted-drawings.pdf | 2011-10-07 |
| 12 | 1243-cal-1998-granted-description (complete).pdf | 2011-10-07 |
| 13 | 1243-cal-1998-granted-correspondence.pdf | 2011-10-07 |
| 14 | 1243-cal-1998-granted-claims.pdf | 2011-10-07 |
| 15 | 1243-cal-1998-granted-assignment.pdf | 2011-10-07 |
| 16 | 1243-cal-1998-granted-abstract.pdf | 2011-10-07 |
| 17 | 01243-cal-1998-priority document.pdf | 2011-10-07 |
| 18 | 01243-cal-1998-gpa.pdf | 2011-10-07 |
| 19 | 01243-cal-1998-form-5.pdf | 2011-10-07 |
| 20 | 01243-cal-1998-form-3.pdf | 2011-10-07 |
| 21 | 01243-cal-1998-form-2.pdf | 2011-10-07 |
| 22 | 01243-cal-1998-form-1.pdf | 2011-10-07 |
| 23 | 01243-cal-1998-drawings.pdf | 2011-10-07 |
| 24 | 01243-cal-1998-description(complete).pdf | 2011-10-07 |
| 25 | 01243-cal-1998-correspondence.pdf | 2011-10-07 |
| 26 | 01243-cal-1998-claims.pdf | 2011-10-07 |
| 27 | 01243-cal-1998-assignment.pdf | 2011-10-07 |
| 28 | 01243-cal-1998-abstract.pdf | 2011-10-07 |
| 29 | 1243-CAL-1998-FORM-27.pdf | 2012-07-11 |
| 30 | 1243-CAL-1998-FORM-27-1.pdf | 2012-07-25 |
| 31 | 1243-CAL-1998-(25-03-2013)-FORM-27.pdf | 2013-03-25 |
| 32 | 1243-CAL-1998-(24-03-2015)-CORRESPONDENCE.pdf | 2015-03-24 |
| 33 | 197718-FORM 27-210316.pdf | 2016-06-22 |
| 34 | Form 27 [15-03-2017(online)].pdf | 2017-03-15 |
| 35 | Form 27 [30-03-2017(online)].pdf | 2017-03-30 |
| 36 | 1243-CAL-1998-RELEVANT DOCUMENTS [30-03-2018(online)].pdf | 2018-03-30 |