An integrated circuit (IC) package comprising:a substrate including an IC;a ground line; andan encoded region to provide information based upon selectivedeposition of solder balls electrically coupled to the ground line,
| # | Name | Date |
|---|---|---|
| 1 | in-pct-2002-00845-mum-power of authority(03-08-2001).pdf | 2001-08-03 |
| 2 | in-pct-2002-00845-mum-form 5(21-06-2002).pdf | 2002-06-21 |
| 3 | in-pct-2002-00845-mum-form 3(21-06-2002).pdf | 2002-06-21 |
| 4 | in-pct-2002-00845-mum-form 1a(21-06-2002).pdf | 2002-06-21 |
| 5 | in-pct-2002-00845-mum-form-pct-isa-210(26-06-2002).pdf | 2002-06-26 |
| 6 | in-pct-2002-00845-mum-form-pct-ipea-409(26-06-2002).pdf | 2002-06-26 |
| 7 | in-pct-2002-00845-mum-form 19(29-03-2004).pdf | 2004-03-29 |
| 8 | in-pct-2002-00845-mum-correspondence(ipo)-(29-04-2004).pdf | 2004-04-29 |
| 9 | in-pct-2002-00845-mum-power of authority(28-04-2005).pdf | 2005-04-28 |
| 10 | in-pct-2002-00845-mum-petition under rule 137(28-04-2005).pdf | 2005-04-28 |
| 11 | in-pct-2002-00845-mum-form 3(28-04-2005).pdf | 2005-04-28 |
| 12 | in-pct-2002-00845-mum-form 2(granted)-(28-04-2005).pdf | 2005-04-28 |
| 14 | in-pct-2002-00845-mum-form 1a(28-04-2005).pdf | 2005-04-28 |
| 15 | in-pct-2002-00845-mum-drawing(28-04-2005).pdf | 2005-04-28 |
| 16 | in-pct-2002-00845-mum-claims(granted)-(28-04-2005).pdf | 2005-04-28 |
| 18 | in-pct-2002-00845-mum-cancelled pages(28-04-2005).pdf | 2005-04-28 |
| 19 | in-pct-2002-00845-mum-form 1a(29-04-2005).pdf | 2005-04-29 |
| 20 | in-pct-2002-00845-mum-correspondence(29-04-2005).pdf | 2005-04-29 |
| 21 | abstract1.jpg | 2018-08-08 |