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An Over Molding Process For A Plurality Of Current Conducting Elements

Abstract: ABSTRACT Embodiments herein disclose an over-molding process (101) of a connecting member assembly (100) is provided. The connecting member assembly (100) includes a first connecting member (102) and a second connecting member (104). The first connecting member (102) and the second connecting member (104) are mechanically connected to a first device and a second device. The second connecting member 104 is connected to a plurality of current conducting elements (110). A molded structure (202) is configured to cover the connecting member assembly (100) to resist fluid entry from environment and to absorb heat energy that is generated when electric energy passes from the first connecting member (102) to the second connecting member (104) and the second connecting member (104) to the plurality of current conducting elements (110) to avoid short-circuiting possibilities. FIG. 1

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Notices, Deadlines & Correspondence

Patent Information

Application #
Filing Date
12 June 2023
Publication Number
39/2024
Publication Type
INA
Invention Field
MECHANICAL ENGINEERING
Status
Email
Parent Application

Applicants

SIMPLEENERGY PRIVATE LIMITED
9th floor, Wing A, Survey No.2/2, North Gate Phase-2, Modern Asset, Venkatala Village, Yelahanka, Hobli, Bengaluru-560064, Karnataka

Inventors

1. Sravya Balla
9th floor, Wing A, Survey No.2/2, North Gate Phase-2, Modern Asset, Venkatala Village, Yelahanka, Hobli, Bengaluru-560064, Karnataka.
2. Harish Kumar V
9th floor, Wing A, Survey No.2/2, North Gate Phase-2, Modern Asset, Venkatala Village, Yelahanka, Hobli, Bengaluru-560064, Karnataka.
3. Sharathkrishna
9th floor, Wing A, Survey No.2/2, North Gate Phase-2, Modern Asset, Venkatala Village, Yelahanka, Hobli, Bengaluru-560064, Karnataka.
4. Vinay K E
9th floor, Wing A, Survey No.2/2, North Gate Phase-2, Modern Asset, Venkatala Village, Yelahanka, Hobli, Bengaluru-560064, Karnataka.
5. Robins
9th floor, Wing A, Survey No.2/2, North Gate Phase-2, Modern Asset, Venkatala Village, Yelahanka, Hobli, Bengaluru-560064, Karnataka.
6. Vedant Shripad Satpute
9th floor, Wing A, Survey No.2/2, North Gate Phase-2, Modern Asset, Venkatala Village, Yelahanka, Hobli, Bengaluru-560064, Karnataka.

Specification

DESC:CROSS-REFERENCE TO RELATED APPLICATIONS
[0001] The application claims priority from an Indian Provisional Application Number: 202341039971 filed on 12-06-2023, the complete disclosures of which, are herein incorporated by reference.
BACKGROUND
Technical Field
[0002] The present disclosure relates to an over-molding process, and more particularly to an over-molding process for a plurality of current conducting elements.
Description of the Related Art
[0003] Over-molding process for a plurality of current conducting elements is a process of manufacturing that combines and seals the plurality of current conducting elements with a connector resulting in a single unified part. In a conventional process, a grommet is placed at the entry and exit points of a first device (E.g., a control unit) to allow the plurality of current conducting elements to pass. The plurality of current conducting elements is configured to distribute power from the first device to a second device. The second device (E.g., a motor) is a device that receives power from the first device. A safe passage of the plurality of current conducting elements will be taken care of by the grommet. At the same time, while using the grommet, there is no course of action to stop fluids from entering the plurality of current conducting elements.
[0004] In the conventional process, the plurality of current conducting elements used by the first device is positioned on vehicles that run in different road conditions. The plurality of current conducting elements is exposed to shock and vibration due to the different road conditions. So that vibration and shock transferred to the plurality of current conducting elements from the body of the vehicles which damages the plurality of current conducting elements, one or more connecting parts, the first device, and the second device.
[0005] While installing the plurality of current conducting elements between the first device and the second device, human error may occur, and the conventional process has no course of action to reduce human error which leads to the installation process being expensive. The plurality of current conducting elements used in the conventional process has less durability, and there is a high chance of abrasion. So, the plurality of current conducting elements used in the conventional process will not withstand extreme environmental conditions (E.g., high temperature).
[0006] Furthermore, heat will be generated at one or more connecting parts of the plurality of current conducting elements when current passes from one conducting surface to another conducting surface. The generated heat leads to short-circuit issues and fire accidents. The conventional process has no course of action to solve the overheating issues.
[0007] In the conventional process, the minimum bending radius of the plurality of current conducting elements will be equal to 3 times the outer diameter (D) of the plurality of current conducting elements. So, if the bending radius of the plurality of current conducting elements is less than 3D which damages the plurality of current conducting elements. The conventional process is not efficient in solving the above-mentioned problems.
[0008] Hence, there remains a need for an improvised process for the plurality of current conducting elements, & electromechanical packaging and therefore address the aforementioned issues.
SUMMARY
[0009] Accordingly, the embodiments herein disclose an over-molding process of a connecting member assembly is provided. The connecting member assembly includes a first connecting member and a second connecting member. The first connecting member is mechanically connected to a first device using one or more joining techniques. The second connecting member is mechanically connected to the first connecting member using the one or more joining techniques. The second connecting member is mechanically connected to a plurality of current conducting elements using the one or more joining techniques. The plurality of current conducting elements mechanically connected to a second device using the one or more joining techniques. A molded structure is configured to cover the connecting member assembly to resist fluid entry from environment and to absorb heat energy that is generated when electric energy passes from the first connecting member to the second connecting member and the second connecting member to the plurality of current conducting elements to avoid short-circuiting possibilities.
[0010] In one embodiment, the one or more joining techniques includes crimping, welding, brazing, soldering, mechanical fastening, and adhesive bonding.
[0011] In another embodiment, the first connecting member includes one or more first connecting member ends. The one or more first connecting member ends include a first end and a second end.
[0012] In yet another embodiment, the second connecting member includes one or more second connecting member ends. The one or more second connecting member ends include a third end and a fourth end.
[0013] In yet another embodiment, the first end of the first connecting member is mechanically connected to the first device using one or more joining techniques. The second end of the first connecting member is mechanically connected to the fourth end of the second connecting member using the one or more joining techniques. The third end of the second connecting member is mechanically connected to the plurality of current conducting elements using the one or more joining techniques.
[0014] In yet another embodiment, the molded structure is configured to avoid short-circuiting possibilities by absorbing heat that is generated when current passes from the second end of the first connecting member to the fourth end of the second connecting member and the third end of the second connecting member to the plurality of current conducting elements.
[0015] In yet another embodiment, the molded structure is made up of an electrically insulative material.
[0016] In yet another embodiment, the first connecting member is connected to the plurality of current conducting elements using a brazing process.
[0017] Accordingly, the embodiments herein disclose a method of manufacturing a connecting member assembly. The method includes the following steps: (a) connecting, using one or more joining techniques, a first connecting member to a first device, (i) the first connecting member includes one or more first connecting member ends, (ii) the one or more first connecting member ends includes a first end and a second end; (b) connecting, using the one or more joining techniques, the first connecting member to a second connecting member, (i) the second connecting member includes one or more second connecting member ends, (ii) the one or more second connecting member ends includes a third end and a fourth end; (c) connecting, the one or more joining techniques, the second connecting member to a plurality of current conducting elements; (d) connecting, the one or more joining techniques, the plurality of current conducting elements to a second device; and (e) covering, using a molded structure, the connecting member assembly to resist fluid entry from environment, and to absorb heat that is generated when electric energy passes from the first connecting member to the second connecting member and the second connecting member to the plurality of current conducting elements to avoid short-circuiting possibilities.
[0018] In one embodiment, the method further includes the following steps: (i) connecting, using the one or more joining techniques, the first end of the first connecting member to the first device; (ii) connecting, using the one or more joining techniques, the second end of the first connecting member to the fourth end of the second connecting member; and (iii) connecting, using the one or more joining techniques, the third end of the second connecting member to the plurality of current conducting elements.
[0019] In another embodiment, the method further includes applying, using the one or more joining techniques, a sealant material after connecting the first connecting member to the first device using one or more joining techniques to avoid the entry of water and dust, wherein the sealant material comprises a heat-shrink sleeve.
[0020] In yet another embodiment, the method further includes applying, using the one or more joining techniques the sealant material, after connecting the second connecting member to the plurality of current conducting elements to avoid the entry of water and dust.
[0021] These and other aspects of the embodiments herein will be better appreciated and understood when considered in conjunction with the following description and the accompanying drawings. It should be understood, however, that the following descriptions, while indicating preferred embodiments and numerous specific details thereof, are given by way of illustration and not of limitation. Many changes and modifications may be made within the scope of the embodiments herein without departing from the invention thereof, and the embodiments herein include all such modifications.
BRIEF DESCRIPTION OF DRAWINGS
[0022] The embodiments herein will be better understood from the following detailed description with reference to the drawings, in which:
[0023] FIG. 1 illustrates a connecting member assembly according to an embodiment as disclosed herein;
[0024] FIG. 2A illustrates an exploded perspective view of the connecting member assembly with a first connecting member, a second connecting member, and a molded structure, according to an embodiment as disclosed herein;
[0025] FIG. 2B illustrates an exploded perspective view of the connecting member assembly with the first connecting member and the molded structure, according to an embodiment as disclosed herein;
[0026] FIG. 3 illustrates a front view of a first device connected to the connecting member assembly with the molded structure, according to an embodiment as disclosed herein; and
[0027] FIG. 4 is a flow diagram illustrating a method for manufacturing the connecting member assembly with the molded structure, according to the embodiment as disclosed herein.
[0028] It may be noted that to the extent possible, like reference numerals have been used to represent like elements in the drawing. Further, those of ordinary skill in the art will appreciate that elements in the drawing are illustrated for simplicity and may not have been necessarily drawn to scale. For example, the dimension of some of the elements in the drawing may be exaggerated relative to other elements to help to improve the understanding of aspects of the invention. Furthermore, the elements may have been represented in the drawing by conventional symbols, and the drawings may show only those specific details that are pertinent to the understanding the embodiments of the invention so as not to obscure the drawing with details that will be readily apparent to those of ordinary skill in the art having benefit of the description herein.

DETAILED DESCRIPTION OF PREFERRED EMBODIMENTS
[0029] In the following description, for the purposes of explanation, various specific details are set forth in order to provide a thorough understanding of embodiments of the present disclosure. It will be apparent, however, that embodiments of the present disclosure may be practiced without these specific details. Several features described hereafter can each be used independently of one another or with any combination of other features. An individual feature may not address all of the problems discussed above or might address only some of the problems discussed above. Some of the problems discussed above might not be fully addressed by any of the features described herein.
[0030] The ensuing description provides exemplary embodiments only and is not intended to limit the scope, applicability, or configuration of the disclosure. Rather, the ensuing description of the exemplary embodiments will provide those skilled in the art with an enabling description for implementing an exemplary embodiment. It should be understood that various changes may be made in the function and arrangement of elements without departing from the spirit and scope of the disclosure as set forth.
[0031] The word “exemplary” and/or “demonstrative” is used herein to mean serving as an example, instance, or illustration. For the avoidance of doubt, the subject matter disclosed herein is not limited by such examples. In addition, any aspect or design described herein as “exemplary” and/or “demonstrative” is not necessarily to be construed as preferred or advantageous over other aspects or designs, nor is it meant to preclude equivalent exemplary structures and techniques known to those of ordinary skill in the art. Furthermore, to the extent that the terms “includes,” “has,” “contains,” and other similar words are used in either the detailed description or the claims, such terms are intended to be inclusive—in a manner similar to the term “comprising” as an open transition word—without precluding any additional or other elements.
[0032] Reference throughout this specification to “one embodiment” or “an embodiment” or “an instance” or “one instance” means that a particular feature, structure, or characteristic described in connection with the embodiment is included in at least one embodiment of the present disclosure. Thus, the appearances of the phrases “in one embodiment” or “in an embodiment” in various places throughout this specification are not necessarily all referring to the same embodiment. Furthermore, the particular features, structures, or characteristics may be combined in any suitable manner in one or more embodiments.
[0033] The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the disclosure. As used herein, the singular forms “a”, “an” and “the” are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will be further understood that the terms “comprises” and/or “comprising,” when used in this specification, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof. As used herein, the term “and/or” includes any and all combinations of one or more of the associated listed items.
[0034] The accompanying drawings are used to help easily understand various technical features and it should be understood that the embodiments presented herein are not limited by the accompanying drawings. As such, the present disclosure should be construed to extend to any alterations, equivalents and substitutes in addition to those which are particularly set out in the accompanying drawings. Although the terms first, second, etc. may be used herein to describe various elements, these elements should not be limited by these terms. These terms are generally only used to distinguish one element from another.
[0035] Accordingly, the embodiments herein disclose an over-molding process of a connecting member assembly is provided. The connecting member assembly includes a first connecting member and a second connecting member. The first connecting member is mechanically connected to a first device using one or more joining techniques. The second connecting member is mechanically connected to the first connecting member using the one or more joining techniques. The second connecting member is mechanically connected to a plurality of current conducting elements using the one or more joining techniques. The plurality of current conducting elements mechanically connected to a second device using the one or more joining techniques. A molded structure is configured to cover the connecting member assembly to resist fluid entry from environment and to absorb heat energy that is generated when electric energy passes from the first connecting member to the second connecting member and the second connecting member to the plurality of current conducting elements to avoid short-circuiting possibilities.
[0036] Referring now to the drawings and more particularly to FIGS. 1 to 4, where similar reference characters denote corresponding features consistently throughout the figure, these are shown as preferred embodiments.
[0037] FIG. 1 illustrates a connecting member assembly 100 according to an embodiment as disclosed herein. The connecting member assembly 100 includes a first connecting member 102, a second connecting member 104, and the like. The first connecting member 102 includes one or more first connecting member ends 106. The one or more first connecting member ends 106 include, but not limited to, a first end 106A, and a second end 106B. The second connecting member 104 includes one or more second connecting member ends 108. In an embodiment, the first connecting member 102 includes, but not limited to, an “U” shape. In another embodiment, the connecting member assembly 100 includes, but not limited to, an “U” shape. The one or more second connecting member ends 108 include, but not limited to, a third end 108A, and a fourth end 108B.
[0038] The first end 106A of the first connecting member 102 is mechanically coupled to a first device (shown in FIG. 3) using one or more joining techniques. In one embodiment, the one or more joining techniques include but not limited to, crimping, welding, brazing, soldering, mechanical fastening, and adhesive bonding. Once the first connecting member 102 is coupled to the first device using one or more joining techniques, sealant material will be applied to avoid the entry of water and dust. In one embodiment, the sealant material includes, but not limited to, heat shrink sleeves. In another embodiment, the first device includes one or more power terminals. The one or more power terminals are configured to send and/or receive the power. In yet another embodiment, the first device includes, but not limited to, a control unit, or an energy storage device. In yet another embodiment, the first device may be any device that can send power to other devices.
[0039] The first connecting member 102 is in a predetermined shape using a stamping process. In yet another embodiment, the first connecting member 102 may be a busbar or a wire. In yet another embodiment, the first connecting member 102 may be a strip, a bar, or a tube made of current conducting elements. In yet another embodiment, the first connecting member 102 includes, but not limited to, copper, brass, or aluminum.
[0040] The second end 106B of the first connecting member 102 is coupled to the fourth end 108B of the second connecting member 104 using one or more joining techniques. In one embodiment, the first connecting member 102, and the second connecting member 104 are coupled together via the using one or more joining techniques. In one embodiment, the one or more joining techniques include but not limited to, crimping, welding, brazing, soldering, mechanical fastening, and adhesive bonding.
[0041] The second connecting member 104 is mechanically connected to the first connecting member 102 using one or more joining techniques. The second connecting member 104 is mechanically coupled to the plurality of current conducting elements 110 using the one or more joining techniques. Once the second connecting member 104 is coupled to the plurality of current conducting elements 110 using one or more joining techniques, the sealant material will be applied to avoid the entry of water and dust. In one embodiment, the sealant material includes, but not limited to, heat shrink sleeves. In one embodiment, the plurality of current conducting elements 110 may be a wire, a cable, and the like. In one embodiment, the third end 108A of the second connecting member 104 is coupled to the plurality of current conducting elements 110 using the one or more joining techniques. In another embodiment, the one or more joining techniques may be a crimping process and the like. In yet another embodiment, the one or more joining techniques include, but not limited to, crimping, welding, brazing, soldering, mechanical fastening, and adhesive bonding.
[0042] The second connecting member 104 is a current conducting element. In one embodiment, the second connecting member 104 includes, but not limited to, a lug or a wire.
[0043] Furthermore, the plurality of current conducting elements 110 connected to a second device. Once the plurality of current conducting elements 110 is connected to the second device, the sealant material will be applied to avoid the entry of water and dust. In one embodiment, the sealant material includes, but not limited to, heat shrink sleeves. In one embodiment, the sealant material will be changed based on the type of the second device. In one embodiment, the second device includes one or more devices. In another embodiment, the second device includes one or more power terminals. The one or more power terminals are configured to receive the power. In yet another embodiment, the second device includes, but not limited to, a control unit, or an energy storage device. In yet another embodiment, the second device may be another controller unit (a battery monitoring system, a body control module). In yet another embodiment, the second device may be any device that can send power to other devices.
[0044] FIG. 2A illustrates a perspective view of the connecting member assembly 100 with a first connecting member 102, a second connecting member 104, and a molded structure 202 according to an embodiment as disclosed herein. The second end 106B of the first connecting member 102 is coupled to the second 108B of the second connecting member 104 using one or more joining techniques. In one embodiment, the first connecting member 102, and the second connecting member 104 are connected together via the one or more joining techniques. In another embodiment, the one or more joining techniques include, but not limited to, crimping, welding, brazing, soldering, mechanical fastening, and adhesive bonding.
[0045] The second connecting member 104 is the current conducting element. In one embodiment, the second connecting member 104 includes, but not limited to, a lug or a wire.
[0046] The second connecting member 104 is coupled to the plurality of current conducting elements 110 using one or more joining techniques. In one embodiment, the third end 108A of the second connecting member 104 is coupled to the plurality of current conducting elements 110 using the one or more joining techniques. In another embodiment, the one or more joining techniques may be the crimping process and the like. In yet another embodiment, the one or more joining techniques include, but not limited to, crimping, welding, brazing, soldering, mechanical fastening, and adhesive bonding.
[0047] Heat energy is generated when the electric energy passes from the second end 106B of the first connecting member 102 to the fourth end 108B of the second connecting member 104. Further, the heat energy is generated when the electric energy passes from the third end 108A of the second connecting member 104 to the plurality of current conducting elements 110.
[0048] The connecting member assembly 100 is covered with the molded structure 202. The molded structure 202 is configured to cover the connecting member assembly 100 to resist fluid entry from the environment. In addition to that, the molded structure 202 is configured to absorb heat energy that is generated when the electric energy passes (i) from the second end 106B of the first connecting member 102 to the fourth end 108B of the second connecting member 104 and (ii) from the third end 108A of the second connecting member 104 to the plurality of current conducting elements 110. Absorbing the generated heat helps to avoid short-circuiting possibilities.
[0049] The molded structure 202 includes an electrically insulative material and the like. In one embodiment, the electrically insulative material may be a material with zero carbon content. In another embodiment, the electrically insulative material includes, but not limited to, silicon.
[0050] FIG. 2B illustrates a perspective view of the connecting member assembly 100 with the first connecting member 102 and the molded structure 202 according to another embodiment herein. The connecting member assembly 100 includes the first connecting member 102 and the plurality of current conducting elements 110. The first connecting member 102 is connected to the plurality of current conducting elements 110 using a brazing process. As used herein, the brazing is defined as a joining process that joins two or more metal surfaces by letting molten metal flow into the joint. The first connecting member 102 includes one or more first connecting member ends 106. The one or more first connecting member ends 106 include, but not limited to, the first end 106A, and the second end 106B. The first end 106A of the first connecting member 102 is connected to the first device using one or more joining techniques. In one embodiment, the one or more joining techniques include but not limited to, crimping, welding, brazing, soldering, mechanical fastening, and adhesive bonding. In another embodiment, the first device includes one or more power terminals. The one or more power terminals are configured to send and/or receive the power. In yet another embodiment, the first device includes, but not limited to, a control unit, or an energy storage device. In yet another embodiment, the first device may be any device that can send power to other devices. The first connecting member 102 is in a predetermined shape using a stamping process. In yet another embodiment, the first connecting member 102 may be a busbar or a wire. In yet another embodiment, the first connecting member 102 may be a strip, a bar, or a tube made of current conducting elements. In yet another embodiment, the first connecting member 102 includes, but not limited to, copper, brass, or aluminum.
[0051] The second end 106B of the first connecting member 102 is connected to the plurality of current conducting elements 110 using the one or more joining processes. In one embodiment, the first connecting member 102 is connected to the plurality of current conducting elements 110 using the one or more joining processes. In one embodiment, the one or more joining process includes, but not limited to, the brazing process. As used herein, the brazing is defined as a joining process that joins two or more metal surfaces by letting molten metal flow into the joint.
[0052] Then the molded structure 202 covers the connecting member assembly 100. The molded structure 202 is configured to cover the connecting member assembly 100 to resist fluid entry from the environment. In addition to that, the molded structure 202 is configured to absorb heat energy that is generated when the electric energy passes from the first connecting member 102 to the plurality of current conducting elements 110. Absorbing the generated heat helps to avoid short-circuiting possibilities. The molded structure 202 includes the electrically insulative material and the like. In one embodiment, the electrically insulative material may be the material with zero carbon content. In another embodiment, the electrically insulative material includes, but not limited to, silicon.
[0053] Furthermore, the plurality of current conducting elements 110 connected to the second device. In one embodiment, the second device include one or more devices. In another embodiment, the second device may include one or more power terminals. The one or more power terminals are configured to receive the power. In yet another embodiment, the second device may include, but not limited to, a control unit, or an energy storage device. In yet another embodiment, the second device may be another controller unit (a battery monitoring system, a body control module). In yet another embodiment, the second device may be any device that can send power to other devices.
[0054] FIG. 3 illustrates a front view of the first device 300 connected to the connecting member assembly 100 with the molded structure 202 according to an embodiment as disclosed herein. The connecting member assembly 100 is coupled to the first device 300 using one or more joining techniques. In one embodiment, the one or more joining techniques include but not limited to, crimping, welding, brazing, soldering, mechanical fastening, and adhesive bonding. In one embodiment, the first device 300 includes one or more power terminals. The one or more power terminals are configured to send and/or receive the power. In one embodiment, the first device 300 is a control box, an energy storage device, and the like. In yet another embodiment, the second device may be another controller unit (a battery monitoring system, a body control module). In yet another embodiment, the first device 300 may be any device that can send power to other devices.
[0055] The connecting member assembly 100 connected to the first device 300. The plurality of current conducting elements 110 are connected to the second device (not shown in the figure). In one embodiment, the second device may include one or more devices. Further, the second device may include, but not limited to, a motor.
[0056] FIG. 4 is a flow diagram illustrating a method 400 of manufacturing the connecting member assembly 100 with the molded structure 202 according to an embodiment as disclosed herein. At step 402, connecting a first end 106A of a first connecting member 102 to a first device 300 using one or more joining techniques. In one embodiment, the first connecting member 102 includes one or more first connecting member ends 106. The one or more first connecting member ends 106 includes a first end 106A and a second end 106B. In one embodiment, the one or more joining techniques include but not limited to, crimping, welding, brazing, soldering, mechanical fastening, and adhesive bonding. In another embodiment, the first device 300 includes one or more power terminals. The one or more power terminals are configured to send and/or receive the power. In yet another embodiment, the first device 300 includes, but not limited to, a control unit, or an energy storage device. In yet another embodiment, the first device 300 may be any device that can send power to other devices.
[0057] In yet another embodiment, the first connecting member 102 may be a strip, a bar, or a tube made of current conducting elements 204. In yet another embodiment, the first connecting member 102 includes, but not limited to, copper, brass, or aluminum.
[0058] At step 404, connecting the second end 106B of the first connecting member 102 to a fourth end 108B of a second connecting member 104 using one or more joining techniques. The second connecting member 104 includes one or more second connecting member ends 108. The one or more second connecting member ends 108 includes a third end 108A and a fourth end 108B. The first connecting member 102, and the second connecting member 104 are coupled together using one or more joining techniques. In one embodiment, the one or more joining techniques include but not limited to, crimping, welding, brazing, soldering, mechanical fastening, and adhesive bonding. The second connecting member 104 is a current conducting element. In one embodiment, the second connecting member 104 includes, but not limited to, a lug or a wire.
[0059] In one embodiment, the second end 106A of the first connecting member 102 is directly connected to the plurality of current conducting elements 110.
[0060] At step 406, connecting the third end 108A of the second connecting member 104 to the plurality of current conducting elements 110 using the one or more joining techniques to make a connecting member assembly 100. In another embodiment, the one or more joining techniques may be the crimping process and the like. In yet another embodiment, the one or more joining techniques include but not limited to, crimping, welding, brazing, soldering, mechanical fastening, and adhesive bonding.
[0061] At step 408, connecting the plurality of current conducting elements 110 connected to a second device. The second device may be a device that receives power from the first device 300 via the connecting member assembly 100. In one embodiment, the second device includes one or more devices. In another embodiment, the second device includes one or more power terminals. The one or more power terminals are configured to receive the power. In yet another embodiment, the second device includes, but not limited to, a control unit, or an energy storage device. In yet another embodiment, the second device may be another controller unit (a battery monitoring system, a body control module, or a motor). In yet another embodiment, the second device may be any device that can send power to other devices.
[0062] At step 410, covering the connecting member assembly 100 with a molded structure 202. The connecting member assembly 100 is covered with the molded structure 202 to resist fluid entry from environment and absorb the heat energy that is generated. Absorbing the generated heat energy when current passes (i) from the second 106B of the first connecting member 102 to the fourth end 108B of the second connecting member 104 and (ii) from the third end 108A of the second connecting member 104 to the plurality of current conducting elements 110 helps to avoid short-circuiting possibilities.
[0063] In an embodiment, the first end 106A of the first connecting member 102 is connected to the first device 300 using one or more joining techniques. In one embodiment, the one or more joining techniques include but not limited to, crimping, welding, brazing, soldering, mechanical fastening, and adhesive bonding. In another embodiment, the first device 300 includes one or more power terminals. The one or more power terminals are configured to send and/or receive the power. In yet another embodiment, the first device 300 includes, but not limited to, a control unit, or an energy storage device. In yet another embodiment, the first device 300 may be any device that can send power to other devices.
[0064] In an embodiment, the second end of the first connecting member 102 is connected to a fourth end 108B of a second connecting member 104 using one or more joining techniques. The first connecting member 102, and the second connecting member 104 are coupled together using one or more joining techniques. In one embodiment, the one or more joining techniques include but not limited to, crimping, welding, brazing, soldering, mechanical fastening, and adhesive bonding. The second connecting member 104 is a current conducting element. In one embodiment, the second connecting member 104 includes, but not limited to, a lug or a wire.
[0065] In an embodiment, the third end 108A of the second connecting member 104 is connected to the plurality of current conducting elements 110 by using the one or more joining techniques.
[0066] In an embodiment, the method 400 further includes applying, using the one or more joining techniques, a sealant material after connecting the first connecting member 102 to the first device 300 using one or more joining techniques to avoid the entry of water and dust, (i) the sealant material includes a heat-shrink sleeve. In one embodiment, the sealant material will be changed based on the type of the first device 300.
[0067] In an embodiment, the method 400 includes applying, using the one or more joining techniques the sealant material, after connecting the second connecting member 104 to the plurality of current conducting elements 110 to avoid the entry of water and dust. In one embodiment, the sealant material will be changed based on the type of the second device.
[0068] The molded structure 202 enables the plurality of current conducting elements 110 to have better functionality by opposing the entry of fluids. The molded structure 202 improves the ability to withstand the vibration and shock continual flexing without damage to the termination point of the plurality of current conducting elements 110. The plurality of current conducting elements 110 is highly durable and long-lasting without any chance of abrasion.
[0069] The plurality of current conducting elements 110 is capable to withstand extreme environmental conditions. The molded structure 202 makes the plurality of current conducting elements 110 tamper-proof by covering the connecting member assembly 100. The molded structure 202 changed the appearance and attaching methods of the plurality of current conducting elements 110. The molded structure 202 makes the plurality of current conducting elements 110 easier to work and handle.
[0070] Furthermore, the shape of the plurality of current conducting elements 110 can be modified as per our requirements. The molded structure 202 provides aesthetic standards and the highest quality in the plurality of current conducting elements 110. The over-mold process enables vehicle manufacturers to design and manufacture products as per requirements/preferences. The over-mold process reduces human error significantly during installation will make the installation process simple and cheaper.
[0071] In addition to that, the plurality of current conducting elements 110 with the molded structure 202 provides better quality and is fluid and shock resistant. The plurality of current conducting elements 110 with the molded structure 202 withstands a high temperature when compared to existing current conducting elements 204. The molded structure 202 includes an electrically insulative material and the like. In one embodiment, the electrically insulative material may be a material with zero carbon content. In another embodiment, the electrically insulative material includes, but not limited to, silicon.
[0072] In one embodiment, the insulation material of the plurality of current conducting elements 110 and the material of the molded structure 202 will have similar properties. In one embodiment, the bonding between the first connecting member 102, and the molded structure 202 requires a rough surface with an adhesive agent. In another embodiment, the bonding between the first connecting member 102, and the molded structure 202 requires the first connecting member 102 with a coating (E.g., Nickel/Tin) that adheres to the material of the molded structure 202.
[0073] The proposed over-mold process protects the molded structure 202 from water and dust. The proposed over-mold process provides the plurality of current conducting elements 110 that withstand higher operating temperatures and durability.
[0074] The proposed over-mold process may be used in a compact area of one or more components of the first device 300 and the second device. Furthermore, the proposed invention will reduce the harness length in the first device 300 and the second device.
[0075] Improvements and modifications may be incorporated herein without deviating from the scope of the invention. The foregoing description of the specific embodiments will so fully reveal the general nature of the embodiments herein that others can, by applying current knowledge, readily modify and/or adapt for various applications such specific embodiments without departing from the generic concept, and, therefore, such adaptations and modifications should and are intended to be comprehended within the meaning and range of equivalents of the disclosed embodiments. It is to be understood that the phraseology or terminology employed herein is for the purpose of description and not of limitation. Therefore, while the embodiments herein have been described in terms of preferred embodiments, those skilled in the art will recognize that the embodiments herein can be practiced with modification within the spirit and scope of the appended claims.


LIST OF REFERENCE NUMERALS

100: Connecting member assembly
102: First connecting member
104: Second connecting member
106: One or more first connecting member ends
106A: First end
106B: Second end
108: One or more second connecting member ends
108A: Third end
108B: Fourth end
110: Plurality of current conducting elements
202: Molded structure
300: First device






,CLAIMS:CLAIMS
I/We Claim:
1. An over-molding process (101) of a connecting member assembly (100) comprising:
the connecting member assembly (100) comprises:
a first connecting member (102) is mechanically connected to a first device (300) using one or more joining techniques; and
a second connecting member (104) is mechanically connected to the first connecting member (102) using the one or more joining techniques, wherein the second connecting member (104) is mechanically connected to a plurality of current conducting elements (110) using the one or more joining techniques, wherein the plurality of current conducting elements (110) mechanically connected to a second device using the one or more joining techniques; and
a molded structure (202) is configured to cover the connecting member assembly (100) to resist fluid entry from environment and to absorb heat energy that is generated when electric energy passes from the first connecting member (102) to the second connecting member (104) and the second connecting member (104) to the plurality of current conducting elements (110) to avoid short-circuiting possibilities.

2. The over-molding process (101) as claimed in claim 1, wherein the one or more joining techniques comprises crimping, welding, brazing, soldering, mechanical fastening, and adhesive bonding.

3. The over-molding process (101) as claimed in claim 1, wherein the first connecting member (102) comprises one or more first connecting member ends (106), wherein the one or more first connecting member ends (106) comprises a first end (106A) and a second end (106B).
4. The over-molding process (101) as claimed in claim 1, wherein the second connecting member (104) comprises one or more second connecting member ends (108), wherein the one or more second connecting member ends (108) comprises a third end (108A) and a fourth end (108B).
5. The over-molding process (101) as claimed in claim 1, wherein the first end (106A) of the first connecting member (102) is mechanically connected to the first device using the one or more joining techniques, wherein the second end (106B) of the first connecting member (102) is mechanically connected to the fourth end (108B) of the second connecting member (104) using the one or more joining techniques, wherein the third end (108A) of the second connecting member (104) is mechanically connected to the plurality of current conducting elements (110) using the one or more joining techniques.
6. The over-molding process (101) as claimed in claim 1, wherein the molded structure (202) is configured to avoid short-circuiting possibilities by absorbing heat energy that is generated when current passes from the second end (106B) of the first connecting member (102) to the fourth end (108B) of the second connecting member (104) and the third end (108A) of the second connecting member (104) to the plurality of current conducting elements (110).
7. The over-molding process (101) as claimed in claim 1, wherein the molded structure (202) is made up of an electrically insulative material.
8. The over-molding process (101) as claimed in claim 1, wherein the first connecting member (102) is connecting to the plurality of current conducting elements (110) using a brazing process.
9. A method (400) of manufacturing a connecting member assembly (100) comprising:
connecting, using one or more joining techniques, a first connecting member (102) to a first device (300), wherein the first connecting member (102) comprises one or more first connecting member ends (106), wherein the one or more first connecting member ends (106) comprises a first end (106A), and a second end (106B);
connecting, the one or more joining techniques, the first connecting member (102) to a second connecting member (104), wherein the second connecting member (104) comprises one or more second connecting member ends (108), wherein the one or more second connecting member ends (108) comprises a third end (108A) and a fourth end (108B);
connecting, the one or more joining techniques, the second connecting member (104) to a plurality of current conducting elements (110);
connecting, the one or more joining techniques, the plurality of current conducting elements (110) to a second device; and
covering, using a molded structure (202), the connecting member assembly (100) to resist fluid entry from the environment, and to absorb heat energy that is generated when electric energy passes from the first connecting member (102) to the second connecting member (104) and the second connecting member (104) to the plurality of current conducting elements (110) to avoid short-circuiting possibilities.
10. The method (400) as claimed in claim 9, wherein the method further comprises:
connecting, using the one or more joining techniques, the first end (106A) of the first connecting member (102) to the first device (300);
connecting, using the one or more joining techniques, the second end (106B) of the first connecting member (102) to the fourth end (108B) of the second connecting member (104); and
connecting, using the one or more joining techniques, the third end (108A) of the second connecting member (104) to the plurality of current conducting elements (110).
11. The method (400) as claimed in claim 9, wherein the method further comprises: applying, using the one or more joining techniques, a sealant material after connecting the first connecting member (102) to the first device (300) using one or more joining techniques to avoid the entry of water and dust, wherein the sealant material comprises a heat-shrink sleeve.

12. The method (400) as claimed in claim 9, wherein the method further comprises: applying, using the one or more joining techniques the sealant material, after connecting the second connecting member (104) to the plurality of current conducting elements (110) to avoid the entry of water and dust.

Documents

Application Documents

# Name Date
1 202341039971-STATEMENT OF UNDERTAKING (FORM 3) [12-06-2023(online)].pdf 2023-06-12
2 202341039971-PROVISIONAL SPECIFICATION [12-06-2023(online)].pdf 2023-06-12
3 202341039971-POWER OF AUTHORITY [12-06-2023(online)].pdf 2023-06-12
4 202341039971-FORM FOR STARTUP [12-06-2023(online)].pdf 2023-06-12
5 202341039971-FORM FOR SMALL ENTITY(FORM-28) [12-06-2023(online)].pdf 2023-06-12
6 202341039971-FORM 1 [12-06-2023(online)].pdf 2023-06-12
7 202341039971-FIGURE OF ABSTRACT [12-06-2023(online)].pdf 2023-06-12
8 202341039971-EVIDENCE FOR REGISTRATION UNDER SSI(FORM-28) [12-06-2023(online)].pdf 2023-06-12
9 202341039971-EVIDENCE FOR REGISTRATION UNDER SSI [12-06-2023(online)].pdf 2023-06-12
10 202341039971-DRAWINGS [12-06-2023(online)].pdf 2023-06-12
11 202341039971-DECLARATION OF INVENTORSHIP (FORM 5) [12-06-2023(online)].pdf 2023-06-12
12 202341039971-DRAWING [10-06-2024(online)].pdf 2024-06-10
13 202341039971-CORRESPONDENCE-OTHERS [10-06-2024(online)].pdf 2024-06-10
14 202341039971-COMPLETE SPECIFICATION [10-06-2024(online)].pdf 2024-06-10
15 202341039971-FORM-9 [19-09-2024(online)].pdf 2024-09-19
16 202341039971-FORM 18 [19-09-2024(online)].pdf 2024-09-19