TECHNICAL FIELD
[001] The present disclosure relates to field of beam splitters. More particularly, the
present disclosure relates to compact and efficient beam splitters for infrared (IR) range applications.
BACKGROUND
[002] Background description includes information that can be useful in
understanding the present invention. It is not an admission that any of the information provided herein is prior art or relevant to the presently claimed invention, or that any publication specifically or implicitly referenced is prior art.
[003] Photonic integrated circuits (also called planar light wave circuits (PLC) or
integrated optoelectronic devices) are devices on which several optical (and often electronic)
components are integrated. The technology of such devices is called integrated optics.
Photonic integrated circuits are usually fabricated with a wafer-scale technology (involving
lithography) on substrates (often-called chips) of silicon, silica, or a nonlinear crystal material
such as lithium niobate (LiNb03).Photonic integrated circuits utilize photons, massless
fundamental particles representing a quantum of light, instead of electrons. Photons move at
the speed of light through the transmitting medium with almost no interference from other
photons. This greatly increases the bandwidth and speed of the circuit while drastically
reducing the amount of energy loss, making PICs more power efficient. Photonic integrated
circuits (PICs) are increasingly employed in a variety of applications, such as optical fiber
communication, wavelength division multiplexing, and optical signal processing. Monolithic
integration of optoelectronic devices, such as amplifiers, waveguides, and splitters, into PICs
render characterization of those devices difficult. Preferably, the device performance of
individual elements in PICs should be tested at the wafer level, prior to packaging and fiber
coupling. Although on-chip electrical measurements such as IV curves and photocurrent
measurements may be used to identify catastrophic failures in individual devices on a PIC at
the wafer level, such measurements fail to characterize material parameters of the devices
under operating conditions and mayalso fail to identify certain defects and failures.
[004] Further, Signal integrity is a concern for photonic integrated circuits (PICs)
that utilize data transmission and/or reception components, as multiple transmitting and/or receiving signals may be present on a PIC. Signals are susceptible to degradation due to

various combinations of optical, electrical, and thermal crosstalk. Crosstalk of a transmitter
signal onto a receiver signal is especially a problem since transmitted signals may include
much higher power than received signals, both in the electrical and in the optical domain.
[005] In the present era, due to miniaturization and integration of optoelectronic
devices, it has become important to design ultra-compact optical devices that may be suitable for photonic integrated circuits (PlCs).In recent years, photonic crystals, as an artificial material with a periodic dielectric structure, play an increasingly important role in integrated optics because of its small size and easy integration, which may control light propagation characteristics at the wavelength of light. Currently, photonic integrated circuits allow the integration of practically all active or passive optical devices, such as, for example, coupling structures, waveguides, modulators, photonic crystal beam splitters and photo detectors. A photonic crystal beam splitter is an indispensable component in optical integrated circuits. Beam splitters may be manufactured in a variety of configurations and typically include one or more reflective, refractive and/or diffractive elements. In a typical beam splitter configuration, a first portion of main beam produced by a laser passes through the beam splitter with very little if any of the light being reflected, refracted or diffracted. This portion of the main beam is then coupled into an end of at ransmit optical fiber for transmission over the transmit optical fiber. At the same time, a second portion of the main beam is reflected, refracted and/or diffracted by the beam splitter to cause the second portion to be directed onto a monitor photodiode.
[006] Efforts have made in the related art to design, fabricate and/or manufacture
various power splitters. Most of the existing power splitter designs presented in the art have considerably large area and have been designed only for telecommunication wavelengths but its applications particularly in the mid infrared range may require to be explored for night vision applications. However, the existing solutions may have a weak confinement of electromagnetic waves within small space to manufacture compact power splitters appropriate for PICs. Further, existing Y-junction splitters may have drawbacks such as presence of backward reflections and bending losses. Some of the existing power splitters may have dimensions of 7.1 x 5.1 x 1.8 inches, 15cm x 10cm x 5cm etc. Some of the splitters
9 9 9
in the art are of dimensions 10xl2um , 10x13 um ,21x10 um respectively but they may not suitable for applications in PICs due to larger area.
[007] Therefore, there is a need in the art to provide a compact power splitter for
enabling low loss, highly efficient transfer of data with minimum power requirements. Further, there is a need to for the power splitter to enhance overall efficiency in IR range, to

solve bandwidth related problems and to suppress occurrence of backward reflections and bending losses.
[008] All publications herein are incorporated by reference to the same extent as if
each individual publication or patent application were specifically and individually indicated to be incorporated by reference. Where a definition or use of a term in an incorporated reference is inconsistent or contrary to the definition of that term provided herein, the definition of that term provided herein applies and the definition of that term in the reference does not apply.
[009] In some embodiments, the numbers expressing quantities or dimensions of
items, and so forth, used to describe and claim certain embodiments of the invention are to be understood as being modified in some instances by the term "about." Accordingly, in some embodiments, the numerical parameters set forth in the written description and attached claims are approximations that may vary depending upon the desired properties sought to be obtained by a particular embodiment. In some embodiments, the numerical parameters should be construed in light of the number of reported significant digits and by applying ordinary rounding techniques. Notwithstanding that the numerical ranges and parameters setting forth the broad scope of some embodiments of the invention are approximations, the numerical values set forth in the specific examples are reported as precisely as practicable. The numerical values presented in some embodiments of the invention may contain certain errors necessarily resulting from the standard deviation found in their respective testing measurements.
[0010] As used in the description herein and throughout the claims that follow, the
meaning of "a," "an," and "the" includes plural reference unless the context clearly dictates otherwise. Also, as used in the description herein, the meaning of "in" includes "in" and "on" unless the context clearly dictates otherwise.
[0011] Groupings of alternative elements or embodiments of the invention disclosed
herein are not to be construed as limitations. Each group member can be referred to and claimed individually or in any combination with other members of the group or other elements found herein. One or more members of a group can be included in, or deleted from, a group for reasons of convenience and/or patentability. When any such inclusion or deletion occurs, the specification is herein deemed to contain the group as modified thus fulfilling the written description of all groups used in the appended claims.

OBJECTS OF THE PRESENT DISCLOSURE
[0012] Some of the objects of the present disclosure, which at least one embodiment
herein satisfies are as listed herein below.
[0013] It is an object of the present disclosure to provide an ultra-compact beam
splitter for mid IR range applications.
[0014] It is another object of the present disclosure to provide an opto-electronic
integrated circuit with an efficient beam splitter.
[0015] It is another object of the present disclosure to provide a beam splitter to
minimize backward reflections that occur at a junction of the splitter.
[0016] It is another object of the present disclosure to provide an effect of resonance
and to transfer maximum power to output ports of a beam splitter.
[0017] It is another object of the present disclosure to provide a power splitter with
electronic-to-optical coupling to provide low loss and efficient transfer of data with minimum
power constraints.
[0018] It is another object of the present disclosure to provide a power splitter that
reduces leakage of light at corners of the power splitter.
SUMMARY
[0019] The present disclosure relates to the field of beam splitters. More particularly,
the present disclosure relates to compact and efficient beam splitters for infrared (IR) range applications.
[0020] This summary is provided to introduce simplified concepts of a system for
time bound availability check of an entity, which are further described below in the detailed description. This summary is not intended to identify key or essential features of the claimed subject matter, nor is it intended for use in determining/limiting the scope of the claimed subject matter.
[0021] An aspect of the present disclosure pertains to an opto-electronic integrated
circuit. The opto-electronic integrated circuit can include: a power splitter that can include an input port and one or more output ports; an input source that can be configured to generate a first set of optical signals to the power splitter via the input port; a first set of defect rods introduced on bends, located on either sides of the power splitter, to reduce backward reflections; and a second set of defect rods placed at a junction of the power splitter, the second set of defect rods configured to suppress bending losses, to resonate the first set of

optical signals across the one or more output ports and to transfer maximum power to the one
or more output ports.
[0022] In an aspect, the power splitter can be an ultra-compact transverse electric
(TE) polarized Y junction photonic crystal based Y junction power splitter.
[0023] In an aspect, the power splitter can be designed by using a silicon wafer of
dimensions 10*10 um .
[0024] In an aspect, a plurality of air holes can be inserted in a substrate of refractive
index 1 and radius 0.3 um.
[0025] In an aspect, the first set of defect rods can be provided with a radius of
O.lum.
[0026] In an aspect, the first set of optical signals can include a Gaussian modulated
continuous input waveform.
[0027] In an aspect, the Gaussian modulated continuous input waveform can be
generated towards the power splitter, via the input port, at a range of 1400nm to 1500nm.
[0028] In an embodiment, the system within the scope of this application it is
expressly envisaged that the various aspects, embodiments, examples and alternatives set out
in the preceding paragraphs, in the claims and/or in the following description and drawings,
and in particular the individual features thereof, can be taken independently or in any
combination. Features described in connection with one embodiment are applicable to all
embodiments, unless such features are incompatible.
[0029] Various objects, features, aspects and advantages of the inventive subject
matter will become more apparent from the following detailed description of preferred
embodiments, along with the accompanying drawing figures in which like numerals represent
like components.
BRIEF DESCRIPTION OF THE DRAWINGS
[0030] The diagrams are for illustration only, which thus is not a limitation of the
present disclosure, and wherein:
[0031] FIG. 1 illustrates an exemplary representation of an opto-electronic integrated
circuit in accordance with an embodiment of the present disclosure.
[0032] FIG. 2 illustrates a computer system in which or with which embodiments of
the present invention can be utilized in accordance with embodiments of the present
disclosure.

DETAILED DESCRIPTION
[0033] The following is a detailed description of embodiments of the disclosure
depicted in the accompanying drawings. The embodiments are in such detail as to clearly communicate the disclosure. However, the amount of detail offered is not intended to limit the anticipated variations of embodiments; on the contrary, the intention is to cover all modifications, equivalents, and alternatives falling within the spirit and scope of the present disclosure as defined by the appended claims.
[0034] In the following description, numerous specific details are set forth in order to
provide a thorough understanding of embodiments of the present invention. It will be apparent to one skilled in the art that embodiments of the present invention can be practiced without some of these specific details.
[0035] Embodiments of the present invention include various steps, which will be
described below. The steps can be performed by hardware components or can be embodied in machine-executable instructions, which can be used to cause a general-purpose or special-purpose processor programmed with the instructions to perform the steps. Alternatively, steps can be performed by a combination of hardware, software, and firmware and/or by human operators.
[0036] Various methods described herein can be practiced by combining one or more
machine-readable storage media containing the code according to the present invention with
appropriate standard computer hardware to execute the code contained therein. An apparatus
for practicing various embodiments of the present invention can involve one or more
computers (or one or more processors within a single computer) and storage systems
containing or having network access to computer program(s) coded in accordance with
various methods described herein, and the method steps of the invention could be
accomplished by modules, routines, subroutines, or subparts of a computer program product.
[0037] If the specification states a component or feature "may", "can", "could", or
"might" be included or have a characteristic, that particular component or feature is not required to be included or have the characteristic.
[0038] As used in the description herein and throughout the claims that follow, the
meaning of "a," "an," and "the" includes plural reference unless the context clearly dictates otherwise. Also, as used in the description herein, the meaning of "in" includes "in" and "on" unless the context clearly dictates otherwise.
[0039] Exemplary embodiments will now be described more fully hereinafter with
reference to the accompanying drawings, in which exemplary embodiments are shown. These

exemplary embodiments are provided only for illustrative purposes and so that this disclosure will be thorough and complete and will fully convey the scope of the invention to those of ordinary skill in the art. The invention disclosed may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Various modifications will be readily apparent to persons skilled in the art. The general principles defined herein can be applied to other embodiments and applications without departing from the spirit and scope of the invention. Moreover, all statements herein reciting embodiments of the invention, as well as specific examples thereof, are intended to encompass both structural and functional equivalents thereof. Additionally, it is intended that such equivalents include both currently known equivalents as well as equivalents developed in the future (i.e., any elements developed that perform the same function, regardless of structure). Also, the terminology and phraseology used is for the purpose of describing exemplary embodiments and should not be considered limiting. Thus, the present invention is to be accorded the widest scope encompassing numerous alternatives, modifications and equivalents consistent with the principles and features disclosed. For purpose of clarity, details relating to technical material that is known in the technical fields related to the invention have not been described in detail so as not to unnecessarily obscure the present invention.
[0040] Thus, for example, it will be appreciated by those of ordinary skill in the art
that the diagrams, schematics, illustrations, and the like represent conceptual views or processes illustrating systems and methods embodying this invention. The functions of the various elements shown in the figures can be provided through the use of dedicated hardware as well as hardware capable of executing associated software. Similarly, any switches shown in the figures are conceptual only. Their function can be carried out through the operation of program logic, through dedicated logic, through the interaction of program control and dedicated logic, or even manually, the particular technique being selectable by the entity implementing this invention. Those of ordinary skill in the art further understand that the exemplary hardware, software, processes, methods, and/or operating systems described herein are for illustrative purposes and, thus, are not intended to be limited to any particular named element.
[0041] Embodiments of the present invention can be provided as a computer program
product, which can include a machine-readable storage medium tangibly embodying thereon instructions, which can be used to program a computer (or other electronic devices) to perform a process. The term "machine-readable storage medium" or "computer-readable

storage medium" includes, but is not limited to, fixed (hard) drives, magnetic tape, floppy diskettes, optical disks, compact disc read-only memories (CD-ROMs), and magneto-optical disks, semiconductor memories, such as ROMs, PROMs, random access memories (RAMs), programmable read-only memories (PROMs), erasable PROMs (EPROMs), electrically erasable PROMs (EEPROMs), flash memory, magnetic or optical cards, or other type of media/machine-readable medium suitable for storing electronic instructions (e.g., computer programming code, such as software or firmware). A machine-readable medium can include a non-transitory medium in which data can be stored and that does not include carrier waves and/or transitory electronic signals propagating wirelessly or over wired connections. Examples of a non-transitory medium can include, but are not limited to, a magnetic disk or tape, optical storage media such as compact disk (CD) or digital versatile disk (DVD), flash memory, memory or memory devices. A computer-program product can include code and/or machine-executable instructions that can represent a procedure, a function, a subprogram, a program, a routine, a subroutine, a module, a software package, a class, or any combination of instructions, data structures, or program statements. A code segment can be coupled to another code segment or a hardware circuit by passing and/or receiving information, data, arguments, parameters, or memory contents. Information, arguments, parameters, data, etc. can be passed, forwarded, or transmitted via any suitable means including memory sharing, message passing, token passing, network transmission, etc.
[0042] Furthermore, embodiments can be implemented by hardware, software,
firmware, middleware, microcode, hardware description languages, or any combination
thereof. When implemented in software, firmware, middleware or microcode, the program
code or code segments to perform the necessary tasks (e.g., a computer-program product) can
be stored in a machine-readable medium. A processor(s) can perform the necessary tasks.
[0043] Systems depicted in some of the figures can be provided in various
configurations. In some embodiments, the systems can be configured as a distributed system where one or more components of the system are distributed across one or more networks in a cloud computing system.
[0044] Each of the appended claims defines a separate invention, which for
infringement purposes is recognized as including equivalents to the various elements or limitations specified in the claims. Depending on the context, all references below to the "invention" can in some cases refer to certain specific embodiments only. In other cases, it will be recognized that references to the "invention" will refer to subject matter recited in one or more, but not necessarily all, of the claims.

[0045] All methods described herein can be performed in any suitable order unless
otherwise indicated herein or otherwise clearly contradicted by context. The use of any and
all examples, or exemplary language (e.g., "such as") provided with respect to certain
embodiments herein is intended merely to better illuminate the invention and does not pose a
limitation on the scope of the invention otherwise claimed. No language in the specification
should be construed as indicating any non-claimed element essential to the practice of the
invention.
[0046] Various terms as used herein are shown below. To the extent a term used in a
claim is not defined below, it should be given the broadest definition persons in the pertinent
art have given that term as reflected in printed publications and issued patents at the time of
filing.
[0047] The present disclosure relates to the field of beam splitters. More particularly,
the present disclosure relates to compact and efficient beam splitters for infrared (TR) range
applications.
[0048] An aspect of the present disclosure pertains to an opto-electronic integrated
circuit. The opto-electronic integrated circuit can include: a power splitter that can include an
input port and one or more output ports; an input source that can be configured to generate a
first set of optical signals to the power splitter via the input port; a first set of defect rods
introduced on bends, located on either sides of the power splitter, to reduce backward
reflections; and a second set of defect rods placed at a junction of the power splitter, the
second set of defect rods configured to suppress bending losses, to resonate the first set of
optical signals across the one or more output ports and to transfer maximum power to the one
or more output ports.
[0049] In an aspect, the power splitter can be an ultra-compact transverse electric
(TE) polarized Y junction photonic crystal based Y junction power splitter.
[0050] In an aspect, the power splitter can be designed by using a silicon wafer of
dimensions 10*10 um .
[0051] In an aspect, a plurality of air holes can be inserted in a substrate of refractive
index 1 and radius 0.3 um.
[0052] In an aspect, the first set of defect rods can be provided with a radius of
0.1 um.
[0053] In an aspect, the first set of optical signals can include a Gaussian modulated
continuous input waveform.

[0054] In an aspect, the Gaussian modulated continuous input waveform can be
generated towards the power splitter, via the input port, at a range of 1400nm to 1500nm.
[0055] FIG. 1 illustrates an exemplary representation of an opto-electronic integrated
circuit in accordance with an embodiment of the present disclosure.
[0056] According to an embodiment, the system 100 can include one or more
processor(s). The one or more processor(s)can be implemented as one or more
microprocessors, microcomputers, microcontrollers, digital signal processors, central
processing units, logic circuitries, and/or any devices that manipulate data based on
operational instructions. Among other capabilities, the one or more processor(s)are
configured to fetch and execute computer-readable instructions stored in a memory of the
system 100. The memory can store one or more computer-readable instructions or routines,
which can be fetched and executed to create or share the data units over a network service.
The memory can include any non-transitory storage device including, for example, volatile
memory such as RAM, or non-volatile memory such as EPROM, flash memory, and the like.
[0057] Various components /units of the proposed system 100 can be implemented as
a combination of hardware and programming (for example, programmable instructions) to implement their one or more functionalities as elaborated further themselves or using processors. In examples described herein, such combinations of hardware and programming can be implemented in several different ways. For example, the programming for the units can be processor executable instructions stored on a non-transitory machine-readable storage medium and the hardware for units can include a processing resource (for example, one or more processors), to execute such instructions. In the present examples, the machine-readable storage medium can store instructions that, when executed by the processing resource, implements the various units. In such examples, the system 100 can include the machine-readable storage medium storing the instructions and the processing resource to execute the instructions, or the machine-readable storage medium can be separate but accessible to the system 100 and the processing resource. In other examples, the units can be implemented by electronic circuitry. A database can include data that is either stored or generated as a result of functionalities implemented by any of the other components /units of the proposed system 100.
[0058] In an embodiment, the opto-electronic integrated circuit 100 can be fabricated.
The opto-electronic integrated circuit 100 can include a power splitter 102; an input source 104; a first set of defect rods (106-1, 106-2, 106-3 & 106-4); and a second set of defect rods (108-1 & 108-2).

[0059] In an embodiment, the power splitter 102 can include an input port 110 and
one or more output ports 112-1 & 112-2.
[0060] In an embodiment, the input source 104 can be configured to generate a first
set of signals to the power splitter 102 via the input port 110.
[0061] In an embodiment, the first set of defect rods (hereinafter, collectively referred
as 106) can be introduced on bends that can be located on both sides of the power splitter.
The first set of defect rods can be used to reduce backward reflections.
[0062] In an embodiment, the second set of defect rods (hereinafter, collectively
referred as 108) can be placed at a junction of the power splitter 102. The second set of defect
rods 108 can be configured to suppress bending losses, resonate the first set of optical signals
across the one or more output ports (hereinafter, collectively referred as 112) and transfer
maximum power to the one or more output ports 112.
[0063] In an embodiment, the power splitter 102 can be an ultra-compact transverse
electric (TE) polarized Y junction photonic crystal based Y junction power splitter.
[0064] In an embodiment, the power splitter 102 can bede signed by using a silicon
wafer of dimensions 10*10 um .
[0065] In an embodiment, a plurality of air holes can be inserted in a substrate of
refractive index 1 and of radius 0.3 um.
[0066] In an embodiment, the first set of defect rods 106can be provided with a radius
of 0.1 um.
[0067] In an embodiment, the first set of optical signals can include a Gaussian
modulated continuous input waveform.
[0068] In an embodiment, the Gaussian modulated continuous input waveform can be
generated towards the power splitter 102, via the input port 110, at a range of 1400nm to
1500nm.
[0069] In an embodiment, the Gaussian modulated continuous input waveform is
generated towards the power splitter 102, via the input port, at 1430nm. Thus, ultra-compact
and efficient beam splitter 102 can be implemented for mid IR range applications especially
in night vision cameras and in security devices.
[0070] In an exemplary embodiment, the power splitter 102 can be designed with
dimensions less than 10 um and can result in an overall efficiency of more than 95 percent in
mid IR range applications.
[0071] In an exemplary embodiment, the power splitter 102 can include two or more
waveguides to perform as the power splitter 102.

[0072] In an exemplary embodiment, the backward reflections can be present due to
mode mismatch problems at the junction of the splitter 102.
[0073] In an exemplary embodiment, the power splitter 102 can be configured to
minimize backward reflections and bending losses that can occur in the power splitter 102 by
introducing the first set of defect rods 106 at the bends of the power splitter 102 (i.e. at
waveguides).
[0074] In an exemplary embodiment, the second set of defect rods 108 can be placed
at the junction of the splitter 102 to provide resonance effect and to transfer maximum power
to the output ports 112 of the splitter 102.
[0075] In an exemplary embodiment, due to ultra-compact size (i.e. less than 10 um),
the power splitter 102 can be easily integrated into small size photonic chips. Further, due to
electronic to optical coupling, bandwidth bottleneck problem can be solved, low loss can be
provided, and efficient transfer of data with minimum power requirement can be established.
[0076] In layout design, the splitter 102 can be designed with a hexagonal lattice
structure. A plurality of air holes can be inserted in the substrate of refractive index ' 1' and of
radius 0.3*a, where 'a' is a lattice constant and it is a distance between holes. In an
exemplary embodiment, the lattice constant can be taken as 1 um for the sake of brevity.
[0077] In an exemplary embodiment, a set of rows of holes can be removed to create
Y junction waveguide bends. The first set of defect rods 106 can act as reflectors for reducing
backward reflections and leakage of light at corners of the waveguides of the splitter 102.
[0078] In an exemplary embodiment, the output power distribution from the output
ports 112 can be observed.
[0079] In an exemplary embodiment, for fabrication of power splitter 102, electron
beam lithography and dry etching techniques can be implemented.
[0080] FIG. 2 illustrates a computer system in which or with which embodiments of
the present invention can be utilized in accordance with embodiments of the present
disclosure.
[0081] As shown in FIG. 2, computer system includes an external storage device 210,
a bus 220, a main memory 230, a read only memory 240, a mass storage device 250,
communication port 260, and a processor 270. A person skilled in the art will appreciate that
computer system can include more than one processor and communication ports. Examples
of processor 270 include, but are not limited to, an Intel® Itanium® or Itanium 2
processor(s), or AMD® Opteron® or Athlon MP® processor(s), Motorola® lines of
processors, FortiSOC™ system on a chip processors or other future processors. Processor

270 can include various modules associated with embodiments of the present invention. Communication port 260 can be any of an RS-232 port for use with a modem-based dialup connection, a 10/100 Ethernet port, a Gigabit or 10 Gigabit port using copper or fibre, a serial port, a parallel port, or other existing or future ports. Communication port 260 can be chosen depending on a network, such a Local Area Network (LAN), Wide Area Network (WAN), or any network to which computer system connects.
[0082] Memory 230 can be Random Access Memory (RAM), or any other dynamic
storage device commonly known in the art. Read only memory 240 can be any static storage
device(s) e.g., but not limited to, a Programmable Read Only Memory (PROM) chips for
storing static information e.g., start-up or BIOS instructions for processor 270. Mass storage
250 can be any current or future mass storage solution, which can be used to store
information and/or instructions. Exemplary mass storage solutions include, but are not
limited to, Parallel Advanced Technology Attachment (PATA) or Serial Advanced
Technology Attachment (SATA) hard disk drives or solid-state drives (internal or external,
e.g., having Universal Serial Bus (USB) and/or Firewire interfaces), e.g. those available from
Seagate (e.g., the Seagate Barracuda 7200 family) or Hitachi (e.g., the Hitachi Deskstar
7K1000), one or more optical discs, Redundant Array of Independent Disks (RAID) storage,
e.g. an array of disks (e.g., SATA arrays), available from various vendors including Dot Hill
Systems Corp., LaCie, Nexsan Technologies, Inc. and Enhance Technology, Inc.
[0083] Bus 220 communicatively couples processor(s) 270 with the other memory,
storage and communication blocks. Bus 220 can be, e.g. a Peripheral Component
Interconnect (PCI) / PCI Extended (PCI-X) bus, Small Computer System Interface (SCSI),
USB or the like, for connecting expansion cards, drives and other subsystems as well as other
buses, such a front side bus (FSB), which connects processor 270 to software system.
[0084] Optionally, operator and administrative interfaces, e.g. a display, keyboard,
and a cursor control device, can also be coupled to bus 220 to support direct operator interaction with computer system. Other operator and administrative interfaces can be provided through network connections connected through communication port 260. External storage device 210 can be any kind of external hard-drives, floppy drives, IOMEGA® Zip Drives, Compact Disc - Read Only Memory (CD-ROM), Compact Disc - Re-Writable (CD-RW), Digital Video Disk - Read Only Memory (DVD-ROM). Components described above are meant only to exemplify various possibilities. In no way should the aforementioned exemplary computer system limit the scope of the present disclosure.

[0085] Thus, it will be appreciated by those of ordinary skill in the art that the
diagrams, schematics, illustrations, and the like represent conceptual views or processes illustrating systems and methods embodying this invention. The functions of the various elements shown in the figures can be provided through the use of dedicated hardware as well as hardware capable of executing associated software. Similarly, any switches shown in the figures are conceptual only. Their function can be carried out through the operation of program logic, through dedicated logic, through the interaction of program control and dedicated logic, or even manually, the particular technique being selectable by the entity implementing this invention. Those of ordinary skill in the art further understand that the exemplary hardware, software, processes, methods, and/or operating systems described herein are for illustrative purposes and, thus, are not intended to be limited to any particular named.
[0086] While embodiments of the present invention have been illustrated and
described, it will be clear that the invention is not limited to these embodiments only. Numerous modifications, changes, variations, substitutions, and equivalents will be apparent to those skilled in the art, without departing from the spirit and scope of the invention, as described in the claim.
[0087] In the foregoing description, numerous details are set forth. It will be apparent,
however, to one of ordinary skill in the art having the benefit of this disclosure, that the present invention can be practiced without these specific details. In some instances, well-known structures and devices are shown in block diagram form, rather than in detail, to avoid obscuring the present invention.
[0088] As used herein, and unless the context dictates otherwise, the term "coupled
to" is intended to include both direct coupling (in which two elements that are coupled to each other contact each other)and indirect coupling (in which at least one additional element is located between the two elements). Therefore, the terms "coupled to" and "coupled with" are used synonymously. Within the context of this document terms "coupled to" and "coupled with" are also used euphemistically to mean "communicatively coupled with" over a network, where two or more devices are able to exchange data with each other over the network, possibly via one or more intermediary device.
[0089] It should be apparent to those skilled in the art that many more modifications
besides those already described are possible without departing from the inventive concepts herein. The inventive subject matter, therefore, is not to be restricted except in the spirit of the appended claims. Moreover, in interpreting both the specification and the claims, all

terms should be interpreted in the broadest possible manner consistent with the context. In particular, the terms "comprises" and "comprising" should be interpreted as referring to elements, components, or steps in a non-exclusive manner, indicating that the referenced elements, components, or steps can be present, or utilized, or combined with other elements, components, or steps that are not expressly referenced. Where the specification claims refers to at least one of something selected from the group consisting of A, B, C .... and N, the text should be interpreted as requiring only one element from the group, not A plus N, or B plus N, etc.
[0090] While the foregoing describes various embodiments of the invention, other and
further embodiments of the invention can be devised without departing from the basic scope thereof. The scope of the invention is determined by the claims that follow. The invention is not limited to the described embodiments, versions or examples, which are included to enable a person having ordinary skill in the art to make and use the invention when combined with information and knowledge available to the person having ordinary skillin the art.
ADVANTAGES OF THE PRESENT DISCLOSURE
[0091] The present disclosure provides an ultra-compact beam splitter for mid IR
range applications.
[0092] The present disclosure provides an opto-electronic integrated circuit with an
efficient beam splitter.
[0093] The present disclosure provides a beam splitter to minimize backward
reflections that occur at a junction of the splitter.
[0094] The present disclosure provides an effect of resonance and to transfer
maximum power to output ports of a beam splitter.
[0095] The present disclosure provides a power splitter with electronic-to-optical
coupling to provide low loss and efficient transfer of data with minimum power constraints.
[0096] The present disclosure provides a power splitter that reduces leakage of light at
corners of the power splitter.

We Claim

1.An opto-electronic integrated circuit comprising:
a power splitter comprising an input port and one or more output ports;
an input source configured to generate a first set of optical signals to the power splitter via the input port;
a first set of defect rods introduced on bends, located on both sides of the power splitter, to reduce backward reflections; and
a second set of defect rods placed at a junction of the power splitter, the second set of defect rods configured to suppress bending losses, resonate the first set of optical signals across the one or more output ports and transfer maximum power to the one or more output ports.
2. The opto-electronic integrated circuit as claimed in claim 1, wherein the power splitter is an ultra-compact TE polarized Y junction photonic crystal based Y junction power splitter.
3. The opto-electronic integrated circuit as claimed in claim 1, wherein the power splitter is designed using a silicon wafer of dimensions 10*10 um .
4. The opto-electronic integrated circuit as claimed in claim 1, wherein a plurality of air holes are inserted in a substrate of refractive index 1 and of radius 0.3 um.
5. The opto-electronic integrated circuit as claimed in claim 1, wherein the first set of defect rods are provided with a radius of 0.1 um.
6. The opto-electronic integrated circuit as claimed in claim 1, wherein the first set of optical signals comprises a Gaussian modulated continuous input waveform.
7. The opto-electronic integrated circuit as claimed in claim 6, wherein the Gaussian modulated continuous input waveform is generated towards the power splitter, via the input port, at a range of 1400nm to 1500nm.