DESCRIPTION ANTENNA SHEET, TRANSPONDER, AND BOOKLET [0001] The present invention relates to an antenna sheet, a transponder, and a booklet. Priority is claimed on Japanese Patent Application No. 2007-239982, filed September 14,2007, and Japanese Patent Application No. 2008-187007, filed July 18, 2008, the contents of which are incorporated herein by reference. BACKGROUND ART [0002] There are conventionally known technologies for arranging a wire-wound antenna coil on a substrate and connecting it to an IC module to form a non-contact type communication unit which performs data communications with an external reading/writing device (e.g. see Patent Document 1). [0003] In recent years, systems using non-contact IC card and non-contact IC tags are being used with the aim of enhancing security. To apply the excellent characteristics of such non-contact IC cards, IC tags, and the like in a booklet, such as a passport and a savings passbook, it is proposed to form a non-contact type information medium by pinching an IC inlet, with an antenna that is connected to a non-contact IC module, between outer-cover base materials, and mounting the medium on the booklet by bonding it to a front cover or the like thereof. Since such a booklet enables electronic data to be entered to the IC inlet and printed, enhanced security characteristics and the like can be achieved. [0004] Patent Document 2 describes one example of a booklet such as that described above. In this booklet, a non-contact type information medium is bonded to an inner face of a back cover of the booklet. The non-contact type information medium is configured such that, on a top-face side of a first base-material sheet, a second base-material sheet having an opening of a predetermined width is affixed to form a recess, an IC chip and an antenna coil attached thereto are provided in this recess, and an adhesive layer is provided on a bottom-face side of the first base-material sheet. Patent Document 1: Japanese Patent No. 3721520 Patent Document 2: Japanese Patent Application, First Publication No. 2002-42068. DISCLOSURE OF THE INVENTION Problems to be Solved by the Invention [0005] However, in the conventional technology described above, when the portion where the IC module and the wire-wound antenna coil are connected is subjected to repeated flexing, since the wire-wound antenna has an extremely narrow diameter of, for example, approximately 0.05 mm to 0.2 mm, there is a problem that the wire-wound antenna coil is liable to break after striking the edge of the terminal section of the IC module. Furthermore, when using ultrasound welding and the like to connect the wire-wound antenna coil to the terminal section of the IC module, there is a problem of constriction in the connection sections of the wire-wound antenna coil, making it liable to break. [0006] Furthermore, during a manufacturing process, it is necessary to wire each individual wire-wound antenna onto the substrate, making it difficult to increase productivity. [0007] Furthermore, many booklets such as that described above are conventionally formed using paper and the like. Since chloride ions, water, and the like can easily permeate through paper, permeation of such substances sometimes leads to deterioration of the antenna and the like of the bonded non-contact type information medium. As a result, there is an adverse affect on the durability of the non-contact type information medium, leading to problems such as a possibility of a decline in the performance of the non-contact type information medium while the booklet is being used. [0008] Furthermore, in conventional technology, since the IC module is fixed on the substrate, when a product in which the substrate and the IC module are covered with paper and the like is manufactured, there is a problem that the product becomes thicker. In this case, due to the flexibility of paper, there is a problem that the region where the IC module is installed expands and contacts other components, breaking the IC module and the like. [0009] The present invention has been realized in view of these circumstances, and aims to provide an antenna sheet, a transponder, and a booklet that, when a product is manufactured by using a flexible base material such as paper to pinch an IC module, enables the product to be made thin. Means for Solving the Problem [0010] To solve the problems described above, an antenna sheet of the present invention includes a flexible substrate, and an antenna coil that is connected to a terminal section of an external IC module including an IC chip and is arranged on the substrate; a storing section that stores at least a part of the IC module being formed on the substrate. When connecting the terminal section of the IC chip to a connection section of the antenna sheet, at least a part of the IC module can be stored in the storing section. Consequently, when securing the IC module to the substrate, the thickness of at least a part of the IC module is absorbed by the storing section, enabling the product (e.g. an inlet) to be made thin. [0011] The antenna coil of the antenna sheet of the present invention is formed in a film shape, the width of the connection section of the antenna coil to be connected to the terminal section is larger than the width of the antenna coil, and a pair of the connection sections are arranged opposing each other at portions pinching the storing section in the substrate. With this configuration, when the IC module terminal section and the antenna coil connection section is subjected to repeated flexing, and a stress acts on the antenna coil, since the antenna coil is formed in a film shape, in comparison with a conventional wire-wound antenna coil, flexibility is enhanced, and concentration of stress can be prevented. Moreover, since the width of the connection section to be connected to the terminal section of the IC module is increased, stress can be dispersed in the width direction and prevented from concentrating. In addition, since the antenna coil is formed on the substrate, the substrate functions as a reinforcing member for the antenna coil. This can prevent the antenna coil from striking the edge of the terminal section of the IC module. Therefore, breakage of the antenna coil can be prevented. When connecting the connection sections to the terminal section, since the connection section of the antenna coil, which is film-shaped and has an increased width, is connected to the terminal section of the IC module, constriction is unlikely to occur during connecting as it does when using a conventional wire-wound antenna coil. Therefore, breakage of the connection sections can be prevented. Furthermore, when the substrate is plasticized and flows due to heat, since the antenna coil is formed in a film shape, in comparison with a conventional wire-wound antenna, the contact area of the antenna coil with the substrate increases, and the flow resistance of the antenna coil can be increased. Therefore, it is possible to prevent the antenna coil from moving according to the flow of the substrate, and to improve the reliability of data communication. Furthermore, since the film-shaped antenna coil can be manufactured collectively by, for example, etching and the like, in comparison with a manufacturing process in which wire-wound antenna coils are individually wired, productivity can be noticeably increased. [0012] The antenna sheet of the present invention includes a chloride ion-resistant layer formed such as to cover the antenna coil. With this configuration, since the chloride ion-resistant layer is formed such as to cover the antenna coil, even if incorporated in a booklet made of paper and such like, the antenna coil is not damaged by chloride ions that permeate the paper. [0013] The antenna sheet of the present invention includes a water-resistant layer formed such as to cover the antenna coil. With this configuration, since the water-resistant layer is formed such as to cover the antenna coil, even if incorporated in a booklet made from paper and such like, the antenna coil is not damaged by chloride ions that permeate the paper. [0014] Furthermore, in the antenna sheet of the present invention, the widths of the connection sections are smaller or similar to the width of the terminal section. With this configuration, the connection sections can be connected to the terminal section along the entire width in the width direction. This enables the connection sections to be more reliably connected to the terminal section, and increases the reliability of the antenna coil. [0015] Furthermore, in the antenna sheet of the present invention, the terminal section and the connection sections are connected such as to overlap in a direction linking the opposing connection sections, and the length of the connection sections is larger than the length of a region where they overlap with the terminal section. With this configuration, in connecting the connection sections and the terminal section, when they are connected such as to overlap in the direction linking the opposing connection sections, the edge of the terminal section is further to the inside than the edge sides of the length direction of the connection sections. Consequently, the edge of the terminal section contacts the connection sections, whose width is larger than the antenna coil. Therefore, when the portion where the terminal section of the IC module connects to the connection sections of the antenna coil is subjected to repeated flexing, the edge of the terminal section can be received by the connection sections with increased widths. This can prevent concentration of stress, and can prevent breakage of the antenna coil. [0016] Furthermore, in the antenna sheet of the present invention, slit holes are provided in the substrate and in the connection sections. With this configuration, if flexing and the like is applied and cracks occur in the width direction of the connection sections, when the cracks reach the slit holes, there is communication between the cracks traveling in the width direction and the slit holes extending in the length direction, stopping the progression of the cracks in the width direction. Therefore, the cracks can be prevented from crossing the slit holes and progressing in the width direction, and breakage of the antenna coil can be prevented. [0017] Furthermore, in the antenna sheet of the present invention, a through hole that penetrates the substrate is formed in a region of the substrate where the antenna coil is not formed. With this configuration, when bonding base materials to both sides of the antenna sheet, the base materials can be joined together via the through hole. The through hole can also increase the flexibility of the antenna sheet, make the antenna sheet lighter, and reduce the quantity of base material used. [0018] Furthermore, in the antenna sheet of the present invention, the connection sections of the antenna sheet are welded to the terminal section of the IC module at a plurality of points. With this configuration, when connecting the terminal section of the IC module to the connection section of the antenna sheet, a plurality of points can be alloyed or thermally fused, and thereby fixed. In comparison with when they are fixed at only one point, the connection strength of the terminal section of the IC module and the connection section of the antenna sheet with respect to flexing can be increased. [0019] A transponder of the present invention includes an antenna sheet including a flexible substrate and an antenna coil that is connected to a terminal section of an external IC module including an IC chip and is arranged on the substrate, a storing section that stores at least a part of the IC module being formed on the substrate, and an IC module including an IC chip and a terminal section; the IC module is fixed to the antenna sheet, and the antenna sheet is connected to the terminal section of the IC module. With this configuration, the antenna sheet including the transponder can prevent breakage of the antenna coil, increasing the reliability of data communication, and further increasing productivity. Therefore, according to the transponder of the present invention, it is possible to provide an inlet that enables breakage of the antenna coil to be prevented, has high data communications reliability, and high productivity. [0020] Furthermore, the transponder of the present invention includes a pair of base materials that pinch the antenna sheet and the IC module. With this configuration, the antenna sheet including the transponder can prevent breakage of the antenna coil, increase the reliability of data communication, and further increase productivity. The base materials can also reinforce the connection points between the connection sections of the antenna sheet and the terminal section of the IC module. Therefore, according to the present invention, it is possible to provide a transponder that can prevent breakage of the antenna coil, and that has high reliability of data communication and high productivity. [0021] Furthermore, in the transponder of the present invention, a base material opening for storing at least a part of the IC module is provided in at least one of the pair of base materials. With this configuration, the thickness of the section of the IC module that is stored in the base material opening is absorbed by the base material, enabling the transponder to be made thin. [0022] Furthermore, in the transponder of the present invention, a through hole is formed in the antenna sheet, and the pair of base materials are joined via the through hole. With this configuration, the base materials can be joined together via the through hole of the antenna sheet. This increases the strength of the joint between the transponder and the base materials, and can prevent peeling of the base materials from the antenna sheet. [0023] Furthermore, in the transponder of the present invention, a cover material is joined to a face of at least one of the pair of base materials. With this configuration, the external appearance and texture of the transponder can be altered to suit its purpose, enabling it to be applied in various fields. Also, since the transponder includes the antenna sheet, it becomes possible to provide a transponder which can prevent breakage of the antenna coil, and which achieves highly reliable data communication and high productivity. [0024] Furthermore, in the transponder of the present invention, the pair of base materials are porous or have a fibrous structure. With this configuration, since the thickness of the antenna sheet can be absorbed by the base materials which are porous or have a fibrous structure, a flatter transponder can be manufactured. [0025] When the transponder of the present invention is applied in a data carrier with non-contact type IC such as, for example, a card-shaped commuter pass with IC or an electronic money card, the antenna sheet including the inlet can prevent breakage of the antenna coil of the data carrier with non-contact type IC, thereby increasing the reliability of data communication and increasing productivity. [0026] When the transponder of the present invention is applied in an inlay for a booklet or a book cover, such as, for example, a booklet-shaped identification certificate such as a passport or a pass book, the antenna sheet including the inlay can prevent breakage of the antenna coil of the data carrier with non-contact type IC, thereby increasing the reliability of data communication and increasing productivity. [0027] A problem of using a conventional substrate made from a thermoplastic material with a low softening point such as PET-G is that, when manufacturing a product by thermal lamination of the substrate, the wire-wound antenna fixed on the substrate moves in accordance with softening and flow of the substrate due to heat, affecting the data communication characteristics and reducing the reliability. In contrast, since the substrate of the antenna sheet described above is formed from polyethylene naphthalate or polyethylene terephthalate, whereby the heat-resistance temperature of the substrate can be increased in comparison with that of conventionally used thermoplastic materials with a low softening point such as PET-G. Consequently, when, for example, manufacturing a product by thermal lamination of a substrate, even if the substrate is subjected to heat, it can be prevented from plasticizing and flowing. Therefore, the antenna coil can be prevented from moving in accordance with the flow of the substrate, and reliability of data communication can be increased. [0028] A booklet of the present invention includes an antenna sheet including a flexible substrate, and an antenna coil that is connected to a terminal section of an external IC module including an IC chip and is arranged on the substrate, a storing section that stores at least a part of the IC module being formed on the substrate, an IC module including an IC chip and a terminal section, and a pair of base materials that pinch the antenna sheet and the IC module; the IC module being fixed to the antenna sheet, and the antenna sheet being connected to the terminal section of the IC module. Effect of the Invention [0029] According to the present invention, when using a flexible base material such as paper to pinch an IC module and manufacture a product, it is possible to provide an antenna sheet, a transponder, and a booklet that can make the product thin. 12 BRIEF DESCRIPTION OF THE DRAWINGS [0030] FIG. 1A is a plan view of an antenna sheet according to a first embodiment of the present invention. FIG. IB is a bottom view of an antenna sheet according to a first embodiment of the present invention. FIG. 2 A is a cross-sectional view of a connection section of a jumper wire and an antenna circuit of the antenna sheet according to the first embodiment of the present invention. FIG. 2B is a cross-sectional view of a connection section of a jumper wire and an antenna circuit of the antenna sheet according to the first embodiment of the present invention. FIG. 3 A is a plan view of an IC module according to the first embodiment of the present invention. FIG. 3B is a cross-sectional view taken along the line A-A' in a plan view of an IC module according to the first embodiment of the present invention. FIG. 4A is an enlarged plan view of an inlet according to the first embodiment of the present invention. FIG. 4B is a cross-sectional view taken along the line B-B' in an enlarged plan view of an inlet according to the first embodiment of the present invention. FIG 5 A is an explanatory cross-sectional view of a manufacturing method of an inlet according to the first embodiment of the present invention. FIG. 5B is an explanatory cross-sectional view of a manufacturing method of an inlet according to the first embodiment of the present invention. FIG. 6 is an enlarged plan view of an antenna sheet and an inlet according to a second embodiment of the present invention. FIG. 7 A is a plan view of an antenna sheet and an inlet according to a third embodiment of the present invention. FIG. 7B is a plan view of an antenna sheet and an inlet according to the third embodiment of the present invention. FIG. 7C is a plan view of an antenna sheet and an inlet according to the third embodiment of the present invention. FIG. 8 A is a plan view of an inlay according to an embodiment of the present invention. FIG. 8B is a front view of an inlay according to the embodiment of the present invention. FIG. 9 A is an explanatory plan view of a manufacturing method of an antenna sheet according to the embodiment of the present invention. FIG. 9B is an explanatory plan view of a manufacturing method of an IC module according to the embodiment of the present invention. FIG 10 is an explanatory plan view of a manufacturing method of an inlay according to the embodiment of the present invention. FIG 11 is a perspective view of a schematic configuration of an electronic passport according to the embodiment of the present invention. FIG 12 is apian view of a deformation example of an antenna sheet according to the embodiment of the present invention. FIG. 13 is a view showing a booklet which a non-contact type information medium according to a fourth embodiment of the present invention is attached to. FIG 14 is a view showing a mold of an IC inlet of the same non-contact type information medium. FIG. 15 is a cross-sectional view of the same non-contact type information medium attached to the same booklet 101. FIG. 16 is a view showing a cut state of the same IC inlet when manufacturing the same non-contact type information medium. FIG. 17 is a view showing dimensions of each part of the same non-contact type information medium in an example. FIG. 18A is a view showing an IC inlet a modification of a non-contact type information medium of the present invention. FIG. 18B is a view showing an IC inlet a modification of a non-contact type information medium of the present invention. Reference Symbols (Table Removed) BEST MODE FOR CARRYING OUT THE INVENTION [0032]