DESC:TECHNICAL FIELD
[0001] The present invention relates generally to testing of an assembled printed circuit board. The invention, more particularly, relates to a system and method for automatic detection of a fault present in an assembled printed circuit.
BACKGROUND
[0002] Modern Electronic Systems are becoming very complex. Printed Circuit Boards are the heart of all electronic devices. Present PCBs are having high component densities and manage bigger electrical loads. It has become very difficult to discover manufacturing defects like solder joints reliability and dry solder or design imperfections using traditional inspection methods.
[0003] Thermal imaging is used to identify design imperfections and faults in an assembled printed circuit board. Thermal probes have been used to monitor the thermal profile of the circuit board in operation. Thermal cameras are used to capture thermal profiles or identify faults in PCB while the board in a testing phase. But these methods like using thermal cameras, analysis of thermal images is done manually. The manual method presents a risk of identifying hotspots which may cause issues later.
[0004] There are many conventional solutions exist to address the above-mentioned problems. For example, one of the conventional solutions is proposed in US5440566A discloses a method for fault detection and diagnosis for Printed Circuit boards using thermal imaging and using a neural network to identify fault location.
[0005] Another conventional solution is proposed in US20070038969 discloses a system for electric testing PCB/MCM before and after assembly. The system uses energy taken from a heating source, timely applied at certain ports of the PCB/MCM (entry ports). The energy is defused through the board inner layer tracks terminating at the end of the channel tracks of the PCB/MCM (exit ports). The rate of energy diffusion on the board is measured at the terminating ports in the time domain. The thermal emission is measured by a spectrometer that conducts infrared scans and analyzes the PCBs energy spectrum. Measurements can be taken as discrete measurements or as integrated measurements. The measurement results are compared with the pre-memorized values of a group of patterns that represent the respective golden board. Defect analysis is automatically achieved based on learned defect test patterns.
[0006] The conventional solutions are not generic because neural network is trained for specific board thermal profile and its associated faults. It needs sufficient data and cannot be directly used for fault detection without training of NN (Neural Network).
[0007] Another conventional solution discloses about PCB tracks and not for planes like GND and power planes.
[0008] One more limitation of the conventional solution is that the user should know the input and output port of the PCB track where heat diffusion to be measured. It is scan based and will cover tracks one by one thus it is time-consuming. The use of a Spectrometer for this kind of application is expensive.
[0009] Thus, there is a need for an invention that solves the above-defined problems and provides a system and method for automatic fault detection in an assembled printed circuit board.
SUMMARY OF THE INVENTION
[0010] This summary is provided to disclose a system and method for automatic fault detection in an operational assembled printed circuit board. This summary is neither intended to identify essential features of the present invention nor is it intended for use in determining or limiting the scope of the present invention.
[0011] For example, various embodiments herein may include one or more systems and methods for the detection of a fault in an operational PCB (printed circuit board) or assembled circuit boards.
[0012] In an embodiment, the present invention describes a method for automatic fault detection in an operational assembled PCB. The method includes capturing, by a thermal imaging unit, a thermal image of an operational assembled PCB, and sending the captured thermal image towards a scaling and mapping engine unit. The method further includes sending, by a computing platform, a user feed assembly data towards the scaling and mapping engine unit. The method further includes scaling, rotating, and mapping, by the scaling and mapping engine unit, the received captured thermal image with the received assembly data. The method further includes segmenting, by a hot spot identification engine unit, faulty area on the received scaled and mapped thermal image with the help of a without reference thermal image or with reference thermal image, or a preset threshold thermal profile. The method further includes fetching, by the faulty component identifier unit, faulty components fabricated on the assembled PCB, wherein the fetching of the faulty components analysis is based on the received hot spot identification engine unit data and the assembly data. The method further includes displaying the faulty components information to a user.
[0013] In another embodiment, the present invention describes a system for automatic fault detection in an operational assembled PCB. The system includes a thermal imaging unit configured to capture a thermal image of an operational assembly board. The captured thermal image is sent towards a scaling and mapping engine unit. The system further includes a computing platform configured to send an assembly data which is fed by a user on the said computing platform. The assembly data incorporates real dimensions of the operational assembled PCB that is to be detected.
[0014] The system further includes the scaling and mapping engine unit configured to scale, rotate, and map the received captured thermal image with the received assembly data. The said scaled and mapped data is sent further towards a hot spot identification engine unit. The hot spot identification engine unit is configured to segment the faulty area on the received scaled and mapped thermal image with the help of a without reference thermal image or with the help of a reference thermal image, or with the help of a preset threshold (temperature) thermal profile. The hot spot identification engine unit finds the location of the area having a fault. A faulty component identifier unit is configured to fetch faulty components assembled on the assembly board based on the received hot spot identification engine unit data and the assembly data. The system further includes a display unit to display the faulty components' information to a user.

BRIEF DESCRIPTION OF ACCOMPANYING DRAWINGS
[0015] The detailed description is described with reference to the accompanying figures. In the figures, the left-most digit(s) of a reference number identifies the figure in which the reference number first appears. The same numbers are used throughout the drawings to reference like features and modules.
[0016] Fig. 1 illustrates a block diagram depicting an automatic detection of a fault in an assembly board using thermal imaging, according to an embodiment of the present disclosure.
[0017] Fig. 2 illustrates a schematic diagram depicting a scaling and mapping of Thermal Image, according to an exemplary implementation of the present disclosure.
[0018] Fig. 3 illustrates a schematic diagram depicting a hot spot identification engine unit, according to an embodiment of the present disclosure.
[0019] Fig. 4 illustrates a schematic diagram depicting fetching of components at faults from assembly data, according to an embodiment of the present disclosure.
[0020] Fig. 5 illustrates a method for automatic fault detection in an assembly board, according to an exemplary implementation of the present invention.
[0021] It should be appreciated by those skilled in the art that any block diagrams herein represent conceptual views of illustrative methods embodying the principles of the present disclosure. Similarly, it will be appreciated that any flow charts, flow diagrams, and the like represent various processes which may be substantially represented in a computer-readable medium and so executed by a computer or processor, whether or not such computer or processor is explicitly shown.
DETAILED DESCRIPTION
[0022] The various embodiments of the present invention describe a system and method for automatic fault detection in an operational assembled PCB. The novel aspects about the present invention are a mapping of thermal profile with an assembly data and identification of hotspot or fault with or without reference image or by a preset threshold thermal profile. This is can be done with no prior knowledge of PCB design. Another aspect of the present invention is to provide quick and automatic debugging of electronic circuit boards that are suitable for production in an industrial environment.
[0023] In the following description, for purpose of explanation, specific details are outlined to provide an understanding of the present disclosure. It will be apparent, however, to one skilled in the art that the present disclosure may be practiced without these details. One skilled in the art will recognize that embodiments of the present disclosure, some of which are described below, may be incorporated into a number of systems.
[0024] However, the systems and methods are not limited to the specific embodiments described herein. Further, structures and devices shown in the figures are illustrative of exemplary embodiments of the presently disclosure and are meant to avoid obscuring the presently disclosure.
[0025] It should be noted that the description merely illustrates the principles of the present invention. It will thus be appreciated that those skilled in the art will be able to devise various arrangements that, although not explicitly described herein, embody the principles of the present invention. Furthermore, all examples recited herein are principally intended expressly to be only for explanatory purposes to help the reader in understanding the principles of the invention and the concepts contributed by the inventor to furthering the art and are to be construed as being without limitation to such specifically recited examples and conditions. Moreover, all statements herein reciting principles, aspects, and embodiments of the invention, as well as specific examples thereof, are intended to encompass equivalents thereof.
[0026] In one of the exemplary implementations, the present invention discloses a method for automatic fault detection in an operation assembled PCB. The method for automatic detection of a fault in an assembled PCB is done by mapping thermal image profiles with an assembly data. The method comprises capturing a thermal image of a circuit board in operation. Further, scaling and mapping of the thermal image to assembly dimensions, and finally identifying hot spots by segmenting the area at fault, finding its location, fetching component details from the assembly data, and providing the faulty component details to a user.
[0027] In another exemplary implementation, the method for automatic fault detection in an assembly board includes capturing, by a thermal imaging unit, a thermal image of an operational assembly board and sending the captured thermal image towards a scaling and mapping engine unit.
[0028] In another exemplary implementation of the present invention, sending, by a computing platform, a user feed assembly data towards the scaling and mapping engine unit is disclosed.
[0029] In another exemplary implementation of the present invention, scaling, rotating, and mapping, by the scaling and mapping engine unit, the received captured thermal image with the received assembly data is disclosed.
[0030] In another exemplary implementation of the present invention, segmenting, by a hot spot identification engine unit, faulty area on the received scaled and mapped thermal image with the help of without a reference thermal image or with the help of reference thermal image or with the help of a preset threshold thermal profile data, and finding a location of an area having fault is disclosed.
[0031] In another exemplary implementation of the present invention, fetching, by the faulty component identifier unit, faulty components fabricated on the assembled PCB, wherein the fetching of the faulty components analysis is based on the received hot spot identification engine unit data and the assembly data is disclosed. Displaying of the faulty component’s information to the user.
[0032] In another exemplary implementation of the present invention, segmenting of the faulty area using without the reference thermal image is disclosed. Segmenting comprising comparing, by the hot spot identification engine unit, a thermal image captured at initial transition time within a very few milliseconds when the assembled PCB is just powered ON with a thermal image captured later after the assembled PCB is powered ON.
[0033] The thermal image captured at the initial transition time within the very few milliseconds when the assembled PCB is just powered On, for a physical short present on the assembled PCB shows a very high rising thermal profile within few milliseconds from the board power ON. Whereas, the thermal image captured for the assembled PCB after some time when the assembled PCB is powered ON shows a thermal profile of high heat dissipating components. This difference in the thermal profiles helps to identify hotspots.
[0034] In another exemplary implementation of the present invention, the assembly data includes the real dimensions of the assembled PCB board fed by a user on the computing platform.
[0035] In another exemplary implementation of the present invention, segmenting of the faulty area on the received scaled and mapped thermal image is identified with the help of a reference thermal image. Segmenting of the faulty area with the help of the reference thermal image comprising steps of, comparing, by the hot spot identification engine unit, a thermal profile of the reference thermal image captured at the same instance of time after the assembled board is powered ON with a thermal profile of the thermal image captured later, after the assembly board is powered ON.
[0036] The method further includes steps of ruling out major heat dissipating components present in the thermal profile of the captured thermal image with the help of the reference thermal image and identifying hidden fault like shorts hotspot when the major heat dissipating components are ruled out.
[0037] In another exemplary implementation of the present invention, segmenting of the faulty area on the scaled and mapped thermal image is identified with the help of a preset threshold thermal data is disclosed. Segmenting of the faulty area on the received scaled and mapped thermal image is identified with the help of a preset threshold thermal profile data that includes, comparing the thermal image profile of the assembled PCB captured periodically with the preset threshold thermal profile data, and identifying of faulty components if the thermal image profile data crosses the preset threshold thermal profile data.
[0038] In another exemplary embodiment, the method can be used by continuously monitoring of the assembled PCB board in operation and can be used by detecting fault like shorts in the assembled PCB board.
[0039] In another exemplary embodiment, the method of detection of a fault or shot in the assembled PCB board can be used with a reference or without reference images, or the preset threshold thermal profile set by a user. For example, when the assembled PCB board is continuously monitored while in operation (load testing) it can take thermal profiles of the board periodically with time and do the thermal analysis as per the threshold set by the user.
[0040] In one of the embodiments, the present invention discloses a system for automatic fault detection in an operational assembled PCB board. Detection of a fault in the operational assembled PCB is achieved using thermal imaging. The automatic detection of a fault in the assembled PCB using the thermal imaging is done by mapping the thermal image to the board assembly data by the scaling and mapping engine unit. The scaling and mapping engine unit take input from the thermal imaging unit. Scaling and mapping engine scale, rotate and map the image to the actual dimensions of the operational assembled PCB from an assembly data.
[0041] In another embodiment, a hot spot identification engine unit is disclosed. The hot spot identification engine unit takes input from the scaling and mapping engine and segment the area which is at fault in the operational PCB identifies the location of the area having the fault.
[0042] In hot spot or fault like shorts, detection can be done with the reference image, or the without reference image or the preset threshold thermal (temperature) profile set by the user.
[0043] In another embodiment, the faulty component identifier module is discussed. The faulty component identifier module takes input from the hot spot identification engine unit and fetch the components in front and back of the assembled PCB board or both from the assembly data and display to the user.
[0044] In another embodiment, the automatic detection is used for continuous monitoring of assembled PCB in operation, detecting fault like shorts in the assembled PCB board for quick and automatic debugging of electronic circuit boards suitable for production.
[0045] Fig. 1 illustrates a block diagram (100) depicting an automatic detection of a fault in an operational assembled PCB using thermal imaging, according to an embodiment of the present invention.
[0046] The system of the present invention includes a thermal imaging unit (104), a scaling and mapping engine unit (106), a hot spot identification engine unit (108), assembly data (110), and a faulty component identifier (112) for automatically detecting a fault in an operational assembled PCB (102) or an operational assembled circuit board. The system may be used in other PCB circuits as well. For a person skilled in the art can easily identify other circuit boards.
[0047] A thermal imaging unit (104) captures a thermal image of the assembled PCB board (102) that is operational. The thermal imaging unit (104) may be a thermal camera. The thermal imaging unit (104) further sends the captured thermal image of the operational assembled PCB board (102) towards a scaling and mapping engine unit (106).
[0048] A user fed assembly data (110) is stored on a computing platform (not shown in Fig.). The assembly data (110) includes the actual dimensions of the assembled PCB board (102). The assembly data also includes all the details of components fabricated on the assembled PCB board (102).
[0049] The scaling and mapping engine unit (106) of the present invention scale, rotate and map the thermal dimensions of the captured thermal image to the actual dimensions of the assembly data (110) stored in the computing platform. The scaled and mapped data is sent further towards a hot spot identification engine unit (108).
[0050] The hot spot identification engine unit (108) takes input from the scaling and mapping engine unit (106) and segments the area which is at fault in the assembly PCB board (102). The hot spot identification engine unit (108) also finds a location of the area having a fault in the assembly PCB board (102). Segmenting of the faulty area on the received scaled and mapped thermal image is done by a without reference thermal image or with reference thermal image, or a preset threshold thermal profile data.
Segmenting of the faulty area using without the reference thermal image:
[0051] Without reference image means that the Golden image of the working assembled PCB board (102) is not required.
[0052] A problem identified in a case when a short is present in the operational assembled PCB board (102). The thermal image is captured at the time when the assembled PCB board (102) is completely ON. Then, in that case, the thermal profile of the faulty area with short may be hidden by actual high heat dissipating components over a period of time.
[0053] To overcome this problem, the present invention provides a solution.
[0054] The captured thermal image of the operational assembled PCB board (102) at very initial transition time within very few milliseconds, when the assembled PCB board (102) is just powered ON is compared with the thermal image captured later, after the assembled PCB board (102) is powered ON.
[0055] For physical short present on the assembled PCB board (102) shows a very high rising thermal profile within a few milliseconds from the power ON. The thermal image captured for the assembled PCB board (102) after some time when the assembled PCB board (102) is powered ON contains a thermal profile of high heat dissipating components. This difference in thermal profile helps to identify hotspots. This method does not require any reference image to identify a faulty hotspot.
[0056] Further, this data is sent to the faulty component identifier unit (112). The faulty component identifier unit (112) takes input from the hot spot identification engine unit (108) and fetches the component in front and back of the assembled PCB board (102) or both from the assembly data. The faulty components information is displayed to the user.
Segmenting of the faulty area with the reference thermal image:
[0057] In this method, identifying the faulty area is achieved with the help of the reference thermal image. The method includes comparing, by the hot spot identification engine unit (108), a thermal profile of the reference thermal image captured at the same instance of time after the assembled PCB board (102) is powered ON with a thermal profile of the thermal image captured later, after the assembled PCB board (102) is powered ON.
[0058] In this case, fault like shorts hotspot will be hidden by major heat-dissipating components (example processor). The reference image helps to rule out the major heat dissipating components and identify fault like shorts.
[0059] The hot spot identification engine unit (108) compares the thermal profiles of the captured reference thermal image captured at the same instance of time after the assembled PCB board (102) is powered ON with the thermal profile of the thermal images captured later, after the assembled PCB board (102) is powered ON. The hot spot identification engine unit (108) further rule out the major heat dissipating components present in the thermal profile of the captured thermal image with the help of the reference thermal image, and identifying hidden fault like shorts hotspot when the major heat dissipating components are ruled out.
[0060] Further, this data is sent to the faulty component identifier unit (112). The faulty component identifier unit (112) takes input from the hot spot identification engine unit (108) and fetches component in front and back of the assembled PCB board (102) or both from the assembly data. The faulty components information is displayed to the user.
Segmenting of the faulty area with the preset threshold thermal profile data:
[0061] Segmenting of the faulty area on the received scaled and mapped thermal image is identified with the help of a preset threshold thermal profile data. The hot spot identification engine unit (108) compares the thermal image profile of the assembled PCB board (102) that is captured periodically with the preset threshold thermal profile data set by the user. Further, the hot spot identification engine unit (108) identifies the faulty components if the thermal image profile data crosses the preset threshold thermal profile data.
[0062] Further, this data is sent to the faulty component identifier unit (112). The faulty component identifier unit (112) takes input from the hot spot identification unit (108) and fetches component in front and back of the assembled PCB board (102) or both from the assembly data. The faulty components information is displayed to the user.
[0063] Fig. 2 illustrates a schematic diagram depicting a scaling and mapping of the thermal image, according to an exemplary embodiment of the present invention.
[0064] In Fig. 2, the thermal imaging unit (104) gives input to the scaling and mapping engine (106) which will scale, rotate and map the image to actual dimensions from the assembly data section (110). Scaling, mapping, and rotating of the captured thermal image is performed to match with the actual dimensions of the assembled PCB board (102). The actual dimensions are fed by the user on the computing platform.
[0065] Fig. 3 illustrates a schematic diagram depicting a hot spot identification engine unit, according to an exemplary embodiment of the present invention.
[0066] In Fig. 3, the hot spot identification engine unit (108) takes input from the scaling and mapping engine unit (106), and segment the area which is at fault in the assembled PCB board (102) with the help of the reference image, or with the help of the without reference image or with the help of the preset threshold thermal profile set by the user. It also finds the location of the area having a fault.
[0067] Fig. 4 illustrates a schematic diagram depicting fetching of components at faults from the assembly data, according to an exemplary embodiment of the present invention.
[0068] In Fig. 4, the location of the faulty area is given as input to the faulty component identifier unit (112) which will then fetch the components in front and back of the assembled PCB board (102) or both from the assembly data section (110) and display to the user. Fetching of the components at fault is done from the assembly data (110) and the segmented location and the area at fault.
[0069] Fig. 5 illustrates a method for automatic fault detection in an assembled PCB board, according to an exemplary implementation of the present invention.
[0070] Referring now to Fig. 5 which illustrates a flowchart (500) of automatic fault detection in the assembled PCB board, according to an exemplary implementation of the present invention. The flow chart (500) of Fig. 5 is explained below with reference to Fig.1 as described above.
[0071] At step 502, capturing, by a thermal imaging unit (104), a thermal image of the operational assembled PCB board (102) and sending the captured thermal image towards a scaling and the mapping engine unit (106).
[0072] At step 504, sending, by a computing platform, the user feed assembly data (110) towards the scaling and mapping engine unit (106).
[0073] At step 506, scaling, rotating, and mapping, by the scaling and mapping engine unit (106), the received captured thermal image with the received assembly data (110);
[0074] At step 508, segmenting, by a hot spot identification engine unit (108), the faulty area on the received scaled and mapped thermal image with the help of a without reference thermal image, and
[0075] At step 510, finding the location of the area having fault;
[0076] At step 512, fetching, by a faulty component identifier unit (112), faulty components fabricated on the assembled PCB board (102), wherein the fetching of the faulty components analysis is based on the received hot spot identification engine unit data (108) and the assembly data (110); and
[0077] At step 514, displaying of the faulty components information to the user.
[0078] The foregoing description of the invention has been set merely to illustrate the invention and is not intended to be limiting. Since modifications of the disclosed embodiments incorporating the substance of the invention may occur to a person skilled in the art, the invention should be construed to include everything within the scope of the invention.

,CLAIMS:
1. A method for automatic fault detection in a printed circuit board, the method comprising:
capturing, by a thermal imaging unit (104), a thermal image of an operational assembled (PCB) printed circuit board (102) and sending the captured thermal image towards a scaling and mapping engine unit (106);
sending, by a computing platform, a user feed assembly data (110) towards the scaling and mapping engine unit (106);
scaling, rotating, and mapping, by the scaling and mapping engine unit (106), the received captured thermal image with the received assembly data (110);
segmenting, by a hot spot identification engine unit (108), faulty area on the received scaled and mapped thermal image with the help of without reference thermal image, and
finding a location of an area having fault;
fetching, by the faulty component identifier unit (112), faulty components fabricated on the assembled PCB (102), wherein the fetching of the faulty components analysis is based on the received hot spot identification engine unit data (108) and the assembly data (110); and
displaying of the faulty components information to the user.
2. The method as claimed in claim 1, wherein the segmenting of the faulty area using the without reference thermal image comprising:
comparing, by the hot spot identification engine unit (108), the thermal image captured at initial transition time within a very few milliseconds when the assembled PCB (102) is just powered ON with the thermal image captured later, after the assembled PCB (102) is powered ON.
3. The method as claimed in claim 2, wherein the captured thermal image at initial transition time for a physical short contains a high rising thermal profile.
4. The method as claimed in claim 2, wherein the thermal image captured later, after the assembled PCB board (102) is powered ON contains a thermal profile of a high heat dissipating components.
5. The method as claimed in claim 3, wherein the high heat dissipating components thermal profile shows normal working conditions of the high heat dissipating components, and the high rising thermal profile shows the physical short components, wherein the high heat dissipating components and the physical short components are fabricated on the assembled PCB (102).
6. The method as claimed in claim 1, wherein the assembly data (110) includes the real dimensions of the assembled PCB (102) fed by the user on the computing platform.
7. The method as claimed in claim 1, wherein segmenting of the faulty area on the received scaled and mapped thermal image is identified with the help of a reference thermal image.
8. The method as claimed in claim 6, wherein segmenting of the faulty area with the help of the reference thermal image comprising:
comparing, by the hot spot identification engine unit (108), a thermal profile of the reference thermal image captured at the same instance of time after the assembled PCB board (102) is powered ON with a thermal profile of the thermal image captured later, after the assembled PCB board (102) is powered ON;
ruling out major heat dissipating components present in thermal profile of the captured thermal image with the help of the reference thermal image, and
identifying hidden fault like shorts hot spot when the major heat dissipating components are ruled out.
9. The method as claimed in claim 1, wherein segmenting of the faulty area on the received scaled and mapped thermal image is identified with the help of a preset threshold thermal profile data comprising:
comparing, by the hot spot identification engine unit (108) the thermal image profile of the assembled PCB (102) captured periodically with the preset threshold thermal profile data; and
identifying of faulty components if the thermal image profile data crosses the preset threshold thermal profile data.
10. A system for automatic fault detection in a printed circuit board comprising:
a thermal imaging unit (104) configured to capture a thermal image of an operational assembled PCB (102);
a computing platform configured to send a user feed assembly data (110), wherein the assembly data (110) incorporates real dimensions of the assembled PCB (102);
scaling and mapping engine unit (106) configured to scale, rotate, and map the received captured thermal image with the received assembly data (110);
a hot spot identification engine unit (108) configured to segment the faulty area on the received scaled and mapped thermal image with the help of without reference thermal image, and
to find a location of an area having fault;
a faulty component identifier unit (112) configured to fetch faulty components fabricated on the assembled PCB (102) based on the received hot spot identification engine unit (108) data and the assembly data (110); and
display unit to display the faulty components information to the user.
11. The system as claimed in claim 10, wherein the segmenting of the faulty area using the without reference thermal image comprising:
comparing the captured thermal image for a physical shorts captured at initial transition time within a very few milliseconds when the assembled PCB (102) is just powered ON with the thermal image captured later, after the assembled PCB (102) is powered ON.
12. The system as claimed in claim 11, wherein the physical shorts thermal image contains a high rising thermal profile, and the thermal image captured later, after the assembled PCB (102) is powered ON contains a high heat dissipating components thermal profile.
13. The system as claimed in claim 10, wherein segmentation of the faulty area on the received scaled and mapped thermal image is identified with the help of a reference thermal image.
14. The system as claimed in claim 13, wherein the hot spot identification engine unit (108) is configured to
compare a thermal profile of the reference thermal image captured at the same instance of time after the assembled PCB board (102) is powered ON with a thermal profile of the thermal image captured later, after the assembled PCB (102) is powered ON;
rule out major heat dissipating components present in thermal profile of the captured thermal image with the help of the reference image, and
identify hidden fault like shorts hot spot when the major heat dissipating components are ruled out.
15. The system as claimed in claim 10, wherein the hot spot identification engine unit (108) segments the faulty area on the received scaled and mapped thermal image profile data with the help of a preset threshold thermal profile data comprising:
comparing the thermal image profile data of the assembled PCB (102) captured periodically with the preset threshold thermal profile data, and
identifying of the faulty components, if the thermal image profile data crosses the preset threshold thermal profile data.