Description:TECHNICAL FIELD
The present disclosure relates to segregating and mobilizing various entities from a substrate. Moreover, the present disclosure relates to an apparatus for segregating and mobilizing entities from a substrate.
BACKGROUND
In the domain of cleaning operations or segregating and mobilizing entities from a substrate, high-speed water jets have been extensively utilized across industries, especially in manufacturing, aiming to remove diverse coatings over solid substrates. Solid substrates includes solid walls, metal pieces, metallic components and the like. However, such jets are primarily designed for high-speed tasks (~100 m/s), proving challenging to generate and control at lower velocities, hindering mild cleaning requirements. Hence, the high-speed water jets are not applicable for a sensitive substrate such as circuit boards, thin clothes, oil beds and the like. Further, other traditional method such as vacuum suction devices have exhibited efficacy in some specific tasks. However, the limitations become apparent when addressing the need for controlled and precise treatment of sensitive substrates or the relocation of various entities. Specifically, existing high-speed water jet systems are primarily adept in aggressive treatment but face challenges in adapting to mild treatment requirements, especially those necessitating controlled fluid velocities. The vacuum suction devices, on the other hand, struggle to effectively mobilize heavier entities adhered to surfaces due to limited suction pressure. Conventional treatment methods often disturb the surrounding environment while attempting to treat or transport substances, biological entities, or fluidic matter.
Therefore, in light of the foregoing discussion, there exists a need to overcome the aforementioned drawbacks associated with the conventional method for mobilization of the entities from a sensitive substrate.
SUMMARY
The present disclosure provides an apparatus for segregating and mobilizing entities from a substrate. The present disclosure provides a solution to the technical problem of how to effectively relocate various entities from a surface of the substrate. An aim of the present disclosure is to provide a solution that overcomes at least partially the problems encountered in the prior art and provide an improved apparatus that facilitates an efficient movement and relocation of entities from the substrate while minimizing disruption to the surrounding environment and substrates.
One or more objectives of the present disclosure is achieved by the solutions provided in the enclosed independent claims. Advantageous implementations of the present disclosure are further defined in the dependent claims.
In one aspect, the present disclosure provides an apparatus for segregating and mobilizing entities from a substrate. The apparatus comprising: a first nozzle configured to generate a first vortex ring of a fluid in a first direction towards the substrate when the fluid enters the first nozzle to cause a scoop action by dislodging at least a portion of the entities from the substrate; and a second nozzle configured to generate a second vortex ring of the fluid in a second direction towards the substrate when the fluid enters the second nozzle to cause a sweep action on the dislodged entities to further mobilize the dislodged entities away from the substrate, wherein the second vortex ring of the fluid is generated after a predetermined time interval from the generation of the first vortex ring of the fluid.
The apparatus of the present disclosure introduces leveraging a two-step process for segregating and mobilizing entities from the substrate. The sequential generation of vortex rings through the first and second nozzles facilitates a nuanced approach. The scoop action initiated by the first nozzle's vortex ring efficiently dislodges entities from the substrate without damaging the surface. This controlled dislodgment ensures precise targeting, making it ideal for delicate or sensitive substrates like electronic components or biomedical devices. Subsequently, the second nozzle's vortex ring performs the sweep action on the dislodged entities. This sweeping motion further mobilizes the dislodged entities away from the substrate. By separating the dislodgment and mobilization processes, it minimizes the risk of reattachment or disruption of the substrate. This approach offers a nuanced, multi-step method that's adaptable to various entity types and substrates, ensuring efficient and controlled movement of dislodged entities. It enables targeted and gentle handling, particularly beneficial in scenarios where precision and substrate preservation are critical, setting it apart from conventional, more forceful methods.
It is to be appreciated that all the aforementioned implementation forms can be combined. All steps which are performed by the various entities described in the present application as well as the functionalities described to be performed by the various entities are intended to mean that the respective entity is adapted to or configured to perform the respective steps and functionalities. It will be appreciated that features of the present disclosure are susceptible to being combined in various combinations without departing from the scope of the present disclosure as defined by the appended claims.
Additional aspects, advantages, features and objects of the present disclosure would be made apparent from the drawings and the detailed description of the illustrative implementations construed in conjunction with the appended claims that follow.
BRIEF DESCRIPTION OF THE DRAWINGS
FIG. 1 is a block diagram of an apparatus for segregating and mobilizing entities from a substrate, in accordance with an embodiment of the present disclosure;
FIG. 2 is a schematic block diagram of the apparatus for segregating and mobilizing the entities from the substrate, in accordance with an embodiment of the present disclosure;
FIG. 3 is another schematic block diagram of another apparatus for segregating and mobilizing the entities from the substrate, in accordance with another embodiment of the present disclosure; and
FIGs. 4A-4F collectively depict a schematic flow diagram for segregating and mobilizing the entities from the substrate, in accordance with an embodiment of the present disclosure.
The summary above, as well as the following detailed description of illustrative embodiments, is better understood when read in conjunction with the appended drawings. For the purpose of illustrating the present disclosure, exemplary constructions of the disclosure are shown in the drawings. However, the present disclosure is not limited to specific methods and instrumentalities disclosed herein. Moreover, those skilled in the art will understand that the drawings are not to scale. Wherever possible, like elements have been indicated by identical numbers.
Embodiments of the present disclosure will now be described, by way of example only, with reference to the following diagrams wherein:
In the accompanying drawings, an underlined number is employed to represent an item over which the underlined number is positioned or an item to which the underlined number is adjacent. A non-underlined number relates to an item identified by a line linking the non-underlined number to the item. When a number is non-underlined and accompanied by an associated arrow, the non-underlined number is used to identify a general item at which the arrow is pointing.
DETAILED DESCRIPTION OF EMBODIMENTS
The following detailed description illustrates embodiments of the present disclosure and ways in which they can be implemented. Although some modes of carrying out the present disclosure have been disclosed, those skilled in the art would recognize that other embodiments for carrying out or practicing the present disclosure are also possible.
FIG. 1 is a block diagram of an apparatus for segregating and mobilizing entities from a substrate, in accordance with an embodiment of the present disclosure. With reference to FIG. 1, there is shown a block diagram of an apparatus 100 for segregating and mobilizing entities from a substrate. The apparatus 100 includes a first nozzle 102 and a second nozzle 104. The apparatus 100 includes at least one pressurized fluid source 106 fluidly coupled with the first nozzle 102 and the second nozzle 104. In other words, the at least one pressurized fluid source 106 is linked to both the first nozzle 102 and the second nozzle 104, establishing a connection that facilitates transfer and flow of fluids (liquids or gases) between the at least one pressurized fluid source 106, first nozzle 102, and second nozzle 104. In some embodiments, the at least one pressurized fluid source 106 includes a first pressurized fluid source fluidly coupled with the first nozzle 102 and a second pressurized fluid source fluidly coupled with the second nozzle 104. The at least one pressurized fluid source 106 is connected to a fluid regulator 108 that regulates an amount of pressure of the fluid entering an inlet of each the first nozzle 102 and the second nozzle 104.
In some implementations, the apparatus 100 further includes a first solenoid valve 110 that is coupled to the first nozzle 102. The first solenoid valve 110 controls opening and closing of the first nozzle 102. The apparatus 100 further includes a second solenoid valve 110 that is coupled to the second nozzle 104. The second solenoid valve 112 controls opening and closing of the second nozzle 104. Further, the apparatus 100 includes a controller 114 that regulates a timing sequence of the first solenoid valve 110 and the second solenoid valve 112. In some other implementations, other mechanisms like pneumatic valves, electrically actuated valves, or even manually controlled valves may be employed to regulate fluid flow and pressure in the apparatus 100.
The segregating and mobilizing the entities from the substrate involves separating and moving various elements or materials (referred to as entities) away from a base or surface, such as a substrate. This action may include the displacement or relocation of particles, objects, contaminants, or components from the surface or material they are adhered to or present on. Some examples of entities include, but not limited to, particles such as dust, dirt, debris, and contaminants; biological matter such as microorganisms, bacteria, and cells; liquid droplets such as oil droplets, and water particles; solid objects such as chips, fragments, and granules; chemicals such as residues, solutes, and powders; and air bubbles. Some examples of substrate include, but not limited to, solid Surfaces such as metal plates, glass, ceramics, or electronic components; biological substrates such as living tissues, cells, or organic matter; liquid interfaces such as a surface of liquids like water, oils, or chemicals; industrial components such as machinery parts, mechanical structures, or manufactured objects; and soil and sediments such as earth surfaces, sand, or sedimentary layers.
The first nozzle 102 and the second nozzle 104 refer to a device designed to control a direction or characteristics of a flow of a fluid. Further, the first nozzle 102 and the second nozzle 104 generates a specific action, like creating a vortex ring of the fluid toward the substrate. The first nozzle 102 and the second nozzle 104 are made up of an acrylic material. However, in some examples, alternative materials like stainless steel, polymers, or specialized alloys may be used for manufacturing of the first nozzle 102 and the second nozzle 104.
The at least one pressurized fluid source 106 refers to a device capable of providing and maintaining fluid (liquid or gas) under pressure. The at least one pressurized source 106 ensures a continuous or regulated supply of pressurized fluid to the first nozzle 102 and the second nozzle 104 for their intended functions in the apparatus 100. In some examples, the at least one pressurized fluid source 106 is a compressor, a compressed air tank or a pump system that generates and maintains pressure in a fluid reservoir.
The fluid regulator 108 refers to a device or component used to control, manage, or adjust the flow, pressure, or direction of a fluid within a system. The fluid regulator 108 ensures that the fluid moves in a specified manner, rate, or condition as required for the intended operation. The fluid regulator 108 may include, but not limited to, valves, pumps, or other mechanisms designed to modulate and maintain the desired parameters of the fluid within the apparatus 100.
The first solenoid valve 110 and the second solenoid valve 112 refer to components within the apparatus 100 that function as switch-like devices. The first solenoid valve 110 and the second solenoid valve 112 regulate the flow of fluid through the first nozzle 102 and the second nozzle 104, respectively, by opening or closing in response to signals from the controller 114. The first solenoid valve 110 and the second solenoid valve 112 control the initiation and cessation of the first and second vortex rings by allowing or halting the pressurized fluid flow through the corresponding nozzles.
The controller 114 refers to a central unit responsible for regulating a timing and sequence of operations for the first nozzle 102 and the second nozzle 104. In certain implementations, the controller 114 refers to a microcontroller unit (MCU) like an Arduino or Raspberry Pi, a dedicated timing circuit, or even a programmable logic controller (PLC) that controls the activation and timing of the first solenoid valve 110 and the second solenoid valve 112 controlling the first nozzle 102 and the second nozzle 104, respectively.
It should be noted that the operation of the apparatus 100 is explained with reference to a schematic diagram of the apparatus 100 as illustrated in FIG. 2.
FIG. 2 is a schematic block diagram of the apparatus for segregating and mobilizing the entities from the substrate, in accordance with an embodiment of the present disclosure. FIG. 2 is described in conjunction with the elements of FIG. 1. With reference to FIG. 2, there is a schematic block diagram of the apparatus 100 of FIG. 1 that segregates and mobilizes entities 202 from a substrate 204. As illustrated in the embodiment of FIG. 2, the at least one pressurized fluid source 106 is fluidly coupled to the first nozzle 102 and the second nozzle 104 via an Arduino controlled three way valve 206. The Arduino controlled three way valve refers to a valve system that integrates an Arduino microcontroller to regulate the flow direction or distribution of fluids among three different pathways. The Arduino, acting as a control unit, manages the valve's operation, enabling it to switch fluid flow between multiple routes based on programmed instructions or sensor inputs. In some examples, the Arduino controlled three way valve may act as the fluid regulator 108 of FIG. 1. In some examples, the at least one pressurized fluid source 106 is fluidly coupled to the first nozzle 102 and the second nozzle 104 via any other valve or mechanism that may distribute the fluids among different ways. Further, a set of pipelines is connecting each component of the apparatus 100 i.e., the at least one pressurized fluid source 106, the Arduino controlled three way valve 206, the first nozzle 102, and the second nozzle 104 as shown in FIG. 2. In some examples, the set of pipelines are pneumatic tubes that may perform under high pressures.
As illustrated in the embodiment of FIG. 2, the first solenoid valve 110 is connected to the first nozzle 102 and the second solenoid valve 112 is connected to the second nozzle 104. Further, a first axis A1 is defined normal to the substrate 204. The first nozzle 102 is positioned at a first distance L1 from the substrate 204. Specifically, an outlet of the first nozzle 102 is positioned at the first distance L1 from an upper surface of the substrate 204 along the first axis A1. The second nozzle 104 is positioned at a second distance L2 from the substrate 204. Specifically, an outlet of the second nozzle 104 is positioned at the second distance L2 from a nearest edge of the substrate 204 along a normal of the first axis A1. The first distance L1 of the first nozzle 102 and the second distance L2 from the second nozzle 104 from the substrate 204 are adjustable for the segregation and the mobilization of the at least a portion of the entities 202 from the substrate 204. Moreover, in the illustrated embodiment of FIG. 2, the first nozzle 102 and the second nozzle 104 are positioned orthogonal to each other in the apparatus 100. However, in some other embodiments, the first nozzle 102 and the second nozzle 104 may be inclined at 45 degrees to 135 degrees to each other in the apparatus 100.
In operation, the first nozzle 102 is configured to generate a first vortex ring of the fluid in a first direction D1 towards the substrate 204 when the fluid enters the first nozzle 102 to cause a scoop action by dislodging at least a portion of the entities 202 from the substrate 204. In addition, a second axis A2 is defined that corresponds to the first direction D1 in which the first vortex ring of the fluid is propelled. In other words, the second axis A2 is substantially parallel to the first direction D1. Further, the second nozzle 104 is configured to generate a second vortex ring of the fluid in a second direction D2 towards the substrate 204 when the fluid enters the second nozzle 104 to cause a sweep action on the dislodged entities to further mobilize the dislodged entities away from the substrate 204. In some implementations, the second direction D2 is substantially parallel to the substrate 204. The second vortex ring of the fluid is generated after a predetermined time interval from the generation of the first vortex ring of the fluid. The term “dislodged entities” refers to particles, substances, or matter that have been detached or removed from the substrate 204 due to the action of the generated vortex rings.
In some implementations, the predetermined time interval is determined based on a duration of operation for the first solenoid valve 110, a duration of operation for the second solenoid valve 112, an amount of time taken for the first vortex ring of the fluid to travel from the outlet of the first nozzle 102 to the substrate 204, an amount of time taken for the second vortex ring of the fluid to travel from an outlet of the second nozzle 104 to the substrate 204, and a duration for which the entities 202 to be cleaned/mobilized is suspended in the fluid after the scoop action from the impingement of the first vortex ring of the fluid generated by the first nozzle 102. In other words, the predetermined time interval between the generation of first and second vortex rings is a result of the interplay between the operational periods of the first solenoid valve 110, the second solenoid valve 112, the amount of time taken for the first and second vortex rings to travel, and the suspension time of the entities 202 in the fluid. Moreover, the travel times may be influenced by a convection speed of the first and second vortex rings and the first distance L1 and the second distance L2 that the first and second vortex rings need to cover. This facilitates a synchronized and well-balanced temporal sequence of events to ensure an effective and efficient cleaning cycle, where each time component plays a crucial role in achieving the cleaning or mobilizing outcome.
In the illustrated embodiment of FIG. 2, the first nozzle 102 and the second nozzle 104 are positioned orthogonal to each other in the apparatus 100 such that the first direction D1 in which the first vortex ring of the fluid is generated and the second direction D2 in which the second vortex ring of the fluid is generated are orthogonal to each other. Further, the first axis A1 that is normal to the substrate 204 and the second axis A2 that corresponds to the first direction D1 in which the first vortex ring of the fluid is propelled has an angle ? therebetween. In the illustrated embodiment of FIG. 2, the angle ? is zero degrees. In other words, the first axis A1 and the second axis A2 are substantially parallel to each other. In some other implementations, the angle ? between the first axis A1 that is normal to the substrate 204 and the second axis A2 that corresponds to the first direction D1 in which the first vortex ring of the fluid is propelled ranges from -45 degrees to 45 degrees. However, in some implementations, the angle ? between the first axis A1 and the second axis A2 may be variably adjusted to accommodate specific application requirements.
The at least one pressurized fluid source 106 is configured to supply the fluid to generate the first vortex ring of the fluid and the second vortex ring of the fluid through the first nozzle 102 and the second nozzle 104, respectively. The at least one pressurized fluid source 106 is configured to supply the fluid in a predetermined pressure to propel the fluid through the second nozzle 104 after the predetermined time interval of supplying the fluid in the predetermined pressure to the first nozzle 102. In some examples, the predetermined pressure may be determined based on the specific characteristics of the entities 202 present on the substrate 204. Additionally, the predetermined pressure may be influenced by the type of material of the substrate 204 to ensure an optimal dislodgment process without causing harm or damage. Therefore, the determination of the predetermined pressure may be contingent upon an evaluation of the entity size, adherence, and density, coupled with an assessment of the fragility or robustness of the substrate 204. Further, the fluid regulator 108 is configured to regulate the predetermined pressure of the fluid entering the inlet of each the first nozzle 102 and the second nozzle 104. The regulation of the predetermined pressure controls a strength and a velocity of the generated first vortex ring of the fluid and the generated second vortex ring of the fluid.
In some implementations, the first solenoid valve 110 is configured to control opening and closing of the first nozzle 102 for generating the first vortex ring of the fluid. In other words, the first solenoid valve 110 operates as a control mechanism for the opening and closing of the first nozzle 102. When triggered or activated, the first solenoid valve 110 regulates the flow of the pressurized fluid, enabling it to pass through or restrict the passage to the first nozzle 102. This controlled release of pressurized fluid into the first nozzle 102 initiates the generation of the first vortex ring of the fluid. The first solenoid valve 110 essentially acts as a switch that governs the flow of fluid to the first nozzle 102, determining when the first vortex ring generation process begins and ends. Similarly, the second solenoid valve 112 is configured to control opening and closing of the second nozzle 104 for generating the second vortex ring of the fluid. Specifically, the second solenoid valve 112 acts as a switch, controlling when the pressurized fluid flows through the second nozzle 104 to create the second vortex ring of the fluid. When activated, the second solenoid valve 112 opens the pathway for fluid release, enabling the initiation of the second vortex ring of the fluid. When deactivated, the second solenoid valve 112 closes off the flow, thereby concluding the generation of the second vortex ring of the fluid.
In some implementations, a single pressurised supply source line bifurcated into two lines for supply into the first nozzles 102 and the second nozzle 104 through the first solenoid valves 110 and the second solenoid 112 respectively to control the first nozzle 102 and the second nozzle 104 independently at a first time point and a second time point respectively, as shown in FIG. 2. In some other implementations, the single pressurised supply source line is fed into a single solenoid valve, the outlet of which is bifurcated into two lines for supply into the first nozzle 102 and the second nozzle 104. In this implementation, the first and second vortex rings from the first nozzle 102 and the second nozzle 104 are generated simultaneously at a same time point. To obtain the suspension time of the entities 202 after the scoop action from the impingement of the first vortex ring of the fluid, the amount of time taken for the first vortex ring of the fluid to travel from the outlet of the first nozzle 102 to the substrate 204 and the amount of time taken for the second vortex ring of the fluid to travel from the outlet of the second nozzle 104 to the substrate 204 is controlled by adjusting distance L1 and L2 while designing the apparatus 100. In another implementation, the single pressurised supply source line is fed into a single three-way solenoid valve, the two outlets of which is fed into two lines for supply into the first nozzle 102 and the second nozzle 104 to control them independently at the first time point and the second time point.
In some implementations, the controller 114 is configured to regulate a timing sequence of the first solenoid valve 110 coupled to the first nozzle 102 and the second solenoid valve 112 coupled to the second nozzle 104. The controller 114 is further configured to control a timing of the opening and closing of each of the first solenoid valve 110 and second solenoid valve 112 to coordinate the generation of the first vortex ring and the second vortex ring of the fluid for performing the scoop and sweep actions for one or more iterations. By controlling the opening and closing of the first solenoid valve 110 and the second solenoid valve 112, the controller controls intervals between the activation of each of the first solenoid valve 110 and the second solenoid valve 112. In an example, when a time gap of 10 milliseconds (ms) separates the actuation of the first solenoid valve 110 and the second solenoid valve 112, this ensures a specific delay between the generation of the first and second vortex rings. The specific delay may enable the dislodgement of the entities 202 by the first vortex ring and then, following a brief pause, the mobilization of the dislodged entities by the second vortex ring. Role of the controller 114 in timing coordination offers flexibility in tailoring the intervals between these actions. This adaptability allows for varied applications and scenarios where different time gaps may be optimal for efficient entity dislodgment and mobilization.
The apparatus 100 introduces leveraging a two-step process for segregating and mobilizing the entities 202 from the substrate 204. The sequential generation of the first and second vortex rings through the first nozzle 102 and the second nozzle 104 facilitates a nuanced approach. The scoop action initiated by the first vortex ring of the first nozzle 102 efficiently dislodges the entities 202 from the substrate 204 without damaging the surface. This controlled dislodgment ensures precise targeting, making it ideal for delicate or sensitive substrates like electronic components or biomedical devices. Subsequently, the second vortex ring of the second nozzle 104 performs the sweep action on the dislodged entities. This sweeping motion further mobilizes the dislodged entities away from the substrate 204. By separating the dislodgment and mobilization processes, it minimizes the risk of reattachment or disruption of the substrate 204. This approach offers a nuanced, multi-step method that's adaptable to various entity types and substrates, ensuring efficient and controlled movement of dislodged entities. It enables targeted and gentle handling, particularly beneficial in scenarios where precision and substrate preservation are critical, setting it apart from conventional, more forceful methods.
FIG. 3 is another schematic diagram of another apparatus for segregating and mobilizing the entities from the substrate, in accordance with another embodiment of the present disclosure. FIG. 3 is described in conjunction with the elements of FIGs. 1 and 2. With reference to FIG. 3, there is a schematic block diagram of an apparatus 300 that segregates and mobilizes the entities 202 from the substrate 204. As illustrated in the embodiment of FIG. 3, the apparatus 300 is similar to the apparatus 100 of FIG. 1, in terms of fundamental operational principle and functional outcome. However, the apparatus 300 has a different configuration of some components of the apparatus 300. The apparatus 300 includes a first pressurized fluid source 302 that is only connected to the first nozzle 102, and a second pressurized fluid source 304 that is only connected to the second nozzle 104. In some examples, the first pressurized fluid source 302 and the second pressurized fluid source 304 may be substantially similar to the at least one pressurized fluid source 106 of FIG. 1.
In implementing separate pressurized fluid sources for each of the first nozzle 102 and the second nozzle 104, the apparatus 100 achieves a significant stride in control and precision, crucial for the dislodgment and mobilization of the entities 202 from diverse substrates (for example, the substrate 204). This configuration grants the apparatus 300 unparalleled control over the behaviour and characteristics of the generated first and second vortex rings. By regulating the pressure, flow rates, and timing independently for each of the first nozzle 102 and the second nozzle 104, the apparatus 300 attains a level of customization that caters precisely to conditions of the substrate 204 and the nature of the entities 202 to be mobilized. This individualized control not only optimizes the cleaning operations or dislodging and mobilizing operations but also minimizes potential interference between the two actions. The segregated sources reduce the risk of one vortex ring impeding the efficiency of the other, ensuring maximum effectiveness in the scoop and sweep actions. Moreover, the flexibility to adjust pressures or fluid types per nozzle allows for adaptability in managing a wide array of entities (for example, the entities 202) and substrates (for example, the substrate 204), making the apparatus 300 versatile and efficient in diverse cleaning or mobilization scenarios. Ultimately, the configuration offers an advanced level of adaptability, precision, and performance, elevating the efficiency of dislodgment and mobilization processes across various applications.
In some implementations, two independent pressurised supply source line fed into the first nozzles 102 and the second nozzle 104 through the first solenoid valves 110 and the second solenoid 112 respectively to control the first nozzle 102 and the second nozzle 104 independently at the first time point and the second time point respectively, as shown in FIG. 3.
FIGs. 4A-4F collectively depict a schematic flow diagram for segregating and mobilizing the entities from the substrate, in accordance with an embodiment of the present disclosure. FIGs. 4A-4F are described in conjunction with the elements of FIGs. 1, 2, and 3. With reference to FIGs. 4A-4F, there is a schematic flow diagram 400 for segregating and mobilizing the entities 202 from the substrate 204. Initially, in FIG. 4A, the first nozzle 102 generates a first vortex ring 402 of the fluid in the first direction D1 towards the substrate 204 having the entities 202. Moving to FIG. 4B, the first vortex ring 402 impacts the substrate 204, leading to the dislodgment of entities 202 from its surface. Subsequently, as seen in FIG. 4C, the energy of the first vortex ring 402 dissipates, but the dislodged entities 404 remain suspended over the substrate 204 for a specific time period, completing the scooping action. Further, in FIG. 4D, after a predetermined time interval from the generation of the first vortex ring 402 of the fluid, a second vortex ring 406 is generated. The second vortex ring 406 propels parallel to the substrate 204. Then, in FIG. 4E, the second vortex ring 406 reaches the dislodged entities 404, mobilizing the dislodged entities 404 in the process. Finally, in FIG. 4F, the second vortex ring 406 relocate mobilized entities 408 from one location to another in the second direction D2 away from the substrate 204, completing the sweep action. By employing the scoop action (using the first nozzle 102 to generate the first vortex ring 402 for dislodging the entities 202) followed by the sweep action (using the second nozzle 104 to further mobilize the dislodged entities away from the substrate 204), the apparatus 100, 300 may ensure a comprehensive and effective cleaning or mobilization process. Repeating this sequence multiple times or iterating the scoop and sweep actions may lead to a more exhaustive removal or mobilization of the entities 202, ensuring that even challenging or residual particles or materials are efficiently dislodged and relocated away from the substrate 204. This iterative approach enhances the apparatus's ability to achieve thorough and precise entity segregation and mobilization.
Modifications to embodiments of the present disclosure described in the foregoing are possible without departing from the scope of the present disclosure as defined by the accompanying claims. Expressions such as "including", "comprising", "incorporating", "have", "is" used to describe and claim the present disclosure are intended to be construed in a non-exclusive manner, namely allowing for items, components or elements not explicitly described also to be present. Reference to the singular is also to be construed to relate to the plural. The word "exemplary" is used herein to mean "serving as an example, instance or illustration". Any embodiment described as “exemplary” is not necessarily to be construed as preferred or advantageous over other embodiments and/or to exclude the incorporation of features from other embodiments. The word "optionally" is used herein to mean "is provided in some embodiments and not provided in other embodiments". It is appreciated that certain features of the present disclosure, which are, for clarity, described in the context of separate embodiments, may also be provided in combination in a single embodiment. Conversely, various features of the present disclosure, which are, for brevity, described in the context of a single embodiment, may also be provided separately or in any suitable combination or as suitable in any other described embodiment of the disclosure. , Claims:1. An apparatus (100. 300) for segregating and mobilizing entities (202) from a substrate (204), the apparatus (100, 300) comprising:
a first nozzle (102) configured to generate a first vortex ring (402) of a fluid in a first direction (D1) towards the substrate (204) when the fluid enters the first nozzle (102) to cause a scoop action by dislodging at least a portion of the entities (202) from the substrate (204); and
a second nozzle (104) configured to generate a second vortex ring (406) of the fluid in a second direction (D2) towards the substrate (204) when the fluid enters the second nozzle (104) to cause a sweep action on the dislodged entities to further mobilize the dislodged entities away from the substrate (204), wherein the second vortex ring (406) of the fluid is generated after a predetermined time interval from the generation of the first vortex ring (402) of the fluid.

2. The apparatus (100, 300) as claimed in claim 1, wherein the first nozzle (102) and the second nozzle (104) are positioned orthogonal to each other in the apparatus (100, 300) such that the first direction (D1) in which the first vortex ring (402) of the fluid is generated and the second direction (D2) in which the second vortex ring (406) of the fluid is generated are orthogonal to each other.

3. The apparatus (100, 300) as claimed in claim 1, wherein an angle (?) between a first axis (A1) that is normal to the substrate (204) and a second axis (A2) that corresponds to the first direction (D1) in which the first vortex ring (402) of the fluid is propelled ranges from -45 degrees to 45 degrees.

4. The apparatus (100, 300) as claimed in claim 1, wherein the second direction (D2) is substantially parallel to the substrate (204).

5. The apparatus (100, 300) as claimed in claim 1, wherein the first nozzle (102) is positioned at a first distance (L1) from the substrate (204), and the second nozzle (104) is positioned at a second distance (L2) from the substrate (204), and wherein the first distance (L1) of the first nozzle (102) and the second distance (L2) from the second nozzle (104) from the substrate (204) are adjustable for segregation and mobilization of the at least a portion of the entities (202) from the substrate (204).

6. The apparatus (100, 300) as claimed in claim 1, wherein the apparatus (100, 300) comprises at least one pressurized fluid source (106) configured to supply the fluid to generate the first vortex ring (402) of the fluid and the second vortex ring (406) of the fluid through the first nozzle (102) and the second nozzle (104), respectively, wherein the at least one pressurized fluid source (106) is configured to supply the fluid in a predetermined pressure to propel the fluid through the second nozzle (104) after the predetermined time interval of supplying the fluid in the predetermined pressure to the first nozzle (102).

7. The apparatus (100, 300) as claimed in claim 6, wherein the apparatus (100, 300) comprises a fluid regulator (108) to regulate the predetermined pressure of the fluid entering an inlet of each the first nozzle (102) and the second nozzle (104), wherein the regulation of the predetermined pressure controls a strength and a velocity of the generated first vortex ring (402) of the fluid and the generated second vortex ring (406) of the fluid.

8. The apparatus (100, 300) as claimed in claim 1, wherein the apparatus (100, 300) comprises:
a first solenoid valve (110) that is coupled to the first nozzle (102) and is configured to control opening and closing of the first nozzle (102) for generating the first vortex ring (402) of the fluid; and
a second solenoid valve (112) that is coupled to the second nozzle (104) and is configured to control opening and closing of the second nozzle (104) for generating the second vortex ring (406) of the fluid.

9. The apparatus (100, 300) as claimed in claim 8, wherein the apparatus (100, 300) comprises a controller (114) configured to regulate a timing sequence of the first solenoid valve (110) coupled to the first nozzle (102) and the second solenoid valve (112) coupled to the second nozzle (104).

10. The apparatus (100, 300) as claimed in claim 9, wherein the controller (114) is configured to control a timing of the opening and closing of each of the first solenoid valve (110) and second solenoid valve (112) to coordinate the generation of the first vortex ring (402) and the second vortex ring (406) of the fluid for performing the scoop and sweep actions for one or more iterations.