Abstract: The present subject matter relates to an electronic-assembly comprising a housing (1) for at-least one electrical-component. The housing comprises at-least one opening for receiving a PCB (5), and a plurality of protrusions for supporting the received PCB (5). Further, at-least one side-wall comprises a recessed-portion for defining a vertical-opening. At-least one grommet (2) is accommodated within said vertical-opening of the side-wall and comprises a set of inter-locking recesses for achieving an interlocking with the vertical-opening. At-least one hole extends longitudinally across the length of the grommet (2), and at-least one electrical-wire (3) is guided by said at-least one-hole within the grommet (2) to connect with the PCB (5).
Technical Field
The present subject matter at least pertains to electronic assemblies and in particular to structures supporting said assemblies.
Background of Invention
Electronic devices as electronic-signal generating means are usually packed in housing and provided with wire harnesses for communicating the captured signal from the housing to a control/ display unit or illumination-unit. Owing to housing of electronic-components, such assemblies need to be sealed to render them water-proof, dust-proof etc. In addition, wire harnesses protruding out of the electronic assemblies need to be well-sealed and packaged to prevent any damage to wires. Examples of said electronic assemblies include bank-angle sensors, tilt sensors, fire, water, acoustic-sensors etc.
Grommet is known to be used for providing a compression-based sealing for the wire-harness against the housing. For such purposes, a window is provided in housing for grommet-fitment and to accommodate the wire-harness with grommet, inside the housing. Said example representation has been shown in Fig. 1. As may be understood from Fig. 1, the grommet also renders a compression based sealing. The window-dimensions are usually less compared to grommet outer profile to provide compression. Accordingly, there are chances that grommet can come out with excessive force in abused-condition, e.g. when housing is subjected to excessive shock and wear and tear. Grommet as the rubber-seal usually proves incapable of entirely filling all the gaps. Moreover, assembly time of grommet within the housing remains substantially high.
More-further, the printer circuit board (PCB) in the conventional electronic assemblies (as shown in Fig. 1) are soldered after wire-insertion in the grommet. This sub-assembly of grommet is inserted in housing window slot. Such process of grommet sub assembly insertion into housing slot is difficult for mass production volume. Moreover, soldering of PCB & wiring is difficult since the same has to be done after the grommet has been introduced into the assembly. This in turn often leads to instability of the PCB within the housing of the electronic-assembly and issues like PCB-tilt.
Summary:
This summary is provided to introduce a selection of concepts in a simplified format that are further described in the detailed description of the invention. This summary is not intended to identify key or essential inventive concepts of the invention, nor is it intended for determining the scope of the invention.
The present subject matter relates to an electronic-assembly comprising a housing for housing at-least one electrical-component. The housing comprises at-least one opening for receiving a PCB, and a plurality of protrusions for supporting the received PCB. Further, at-least one side-wall comprises a recessed-portion for defining a vertical-opening. At-least one grommet is accommodated within said vertical-opening of the side-wall and comprises a set of inter-locking recesses for achieving an interlocking with the vertical-opening. At-least one hole extends longitudinally across the length of the grommet, and at-least one electrical-wire is guided by said at-least one-hole within the grommet to connect with the PCB.
The present subject matter at least provides an arrangement and mechanism for sealing the electronic assembly and an ease of assembly thereof. The present subject matter at least uses the combination of potting-material (e.g. epoxy - liquid sealant) and compressions of rubber-grommet for sealing the assembly. Further, at least due to structure of the rubber-grommet and housing coupled with aforesaid sealing mechanisms, the present subject matter renders a robust assembly with infallible seal as well as an ease of the assembly of the components.
Overall, the present electronic assembly may be defined by at-least following features:
• Sealing between housing and rubber grommet, with the help of potting material like epoxy.
• Sealing between rubber grommet and wire, with the help of rubber compression.
• Liquid Sealing between housing and cover.
• Unique design of rubber grommet. The grommet has the interlocking ribs to locate in grommet housing. Accordingly, the grommet does not come out from housing while assembly and remains stable therein.
• Cord clamp is put on rubber grommet which enhances the wire sealing.
At least by virtue of aforesaid features, the present subject matter at least leads to following advantages:
• Rubber grommet design is unique with space for epoxy filling and interlock recess for locating in housing.
• PCB soldering is simple.
• Liquid-sealant fills in all the small areas of grommet, housing and cover.
• Assembly process of the electronic assembly with grommet and achievement of sealing in present invention is done with ease.
• The well-sealed electronic assembly of present invention has a long life and does not get affected by the various vibrational forces or temperature.
• Assembly cycle time is reduced as blind assembly of grommet is eliminated & soldering of wiring harness to PCB is done outside housing.
To further clarify advantages and features of the present invention, a more particular description of the invention will be rendered by reference to specific embodiments thereof, which is illustrated in the appended drawing. It is appreciated that these drawings depict only typical embodiments of the invention and are therefore not to be considered limiting its scope. The invention will be described and explained with additional specificity and detail with the accompanying drawings.
Brief description of drawings
These and other features, aspects, and advantages of the present invention will become better understood when the following detailed description is read with reference to the accompanying drawings in which like characters represent like parts throughout the drawings, wherein:
Fig. 1 illustrates a prior art sensor assembly and a sealing-arrangement therein, in accordance with an embodiment of the present subject matter.
Fig. 2 illustrates an electronic assembly as an electronic sensor-assembly, in accordance with an embodiment of the present subject matter.
Fig. 3 illustrates a rubber grommet for sensor assembly, in accordance with an embodiment of the present subject matter.
Fig. 4 illustrates a sectional-view of the sensor-assembly of Fig. 2, in accordance with an embodiment of the present subject matter.
Fig. 5 illustrates the sensor-assembly of Fig. 2 without the top-cover, in accordance with an embodiment of the present subject matter.
Fig. 6 illustrates an exploded view depicting the connection a) between a housing of the sensor-assembly and the grommet and, b) between the grommet and the wire harness, in accordance with an embodiment of the present subject matter.
Fig. 7 illustrates an exploded-view of the example sensor assembly, in accordance with an embodiment of the present subject matter.
Fig. 8 illustrates an example instantiation of the sensor assembly within a two-wheeled vehicle, in accordance with an embodiment of the present subject matter.
Further, skilled artisans will appreciate that elements in the drawings are illustrated for simplicity and may not have been necessarily been drawn to scale. For example, the flow charts illustrate the method in terms of the most prominent steps involved to help to improve understanding of aspects of the present invention. Furthermore, in terms of the construction of the device, one or more components of the device may have been represented in the drawings by conventional symbols, and the drawings may show only those specific details that are pertinent to understanding the embodiments of the present invention so as not to obscure the drawings with details that will be readily apparent to those of ordinary skill in the art having benefit of the description herein.
Detailed description of drawings
For the purpose of promoting an understanding of the principles of the invention, reference will now be made to the embodiment illustrated in the drawings and specific language will be used to describe the same. It will nevertheless be understood that no limitation of the scope of the invention is thereby intended, such alterations and further modifications in the illustrated system, and such further applications of the principles of the invention as illustrated therein being contemplated as would normally occur to one skilled in the art to which the invention relates.
It will be understood by those skilled in the art that the foregoing general description and the following detailed description are explanatory of the invention and are not intended to be restrictive thereof.
Reference throughout this specification to "an aspect", "another aspect" or similar language means that a particular feature, structure, or characteristic described in connection with the embodiment is included in at least one embodiment of the present invention. Thus, appearances of the phrase "in an embodiment", "in another embodiment" and similar language throughout this specification may, but do not necessarily, all refer to the same embodiment.
The terms "comprises", "comprising", or any other variations thereof, are intended to cover a nonexclusive inclusion, such that a process or method that comprises a list of steps does not include only those steps but may include other steps not expressly listed or inherent to such process or method. Similarly, one or more devices or subsystems or elements or structures or components proceeded by "comprises... a" does not, without more constraints, preclude the existence of other devices or other sub-systems or other elements or other structures or other components or additional devices or additional sub-systems or additional elements or additional structures or additional components.
Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The system, methods, and examples provided herein are illustrative only and not intended to be limiting.
Embodiments of the present invention will be described below in detail with reference to the accompanying drawings.
Fig. 2 illustrates an electronic-assembly, in accordance with an embodiment of the present subject matter. While forthcoming description depicts electronic assembly as a sensor assembly, the same shall be also construed to cover all electronic assemblies that require sealing and insertion of wire-harnesses through grommets.
A structure of the sensor-assembly comprises a housing which is made up of plastic material. It consists of two pillars each LH and RH side for a mounting magnet sub assembly (as later elaborated in Fig. 5). Also provided are two circular-slots (RH and LH) within the housing for mounting the sensor assembly to any external support.
Fig. 3 depicts a grommet that is made up of rubber-material with a unique-design. It consists of three circular-holes which are provided for wire-insertion from outside to reach
the inside electronic- circuit. The internal diameter (ID) of hole is less compared to wire outside diameter (OD) to provide the compression-sealing between the grommet and wire. However, in another example, the number of holes may be less or more than 3. Further, interlocking-recesses may be provided to fit the grommet within the designated area of the housing.
Fig. 4 illustrates a sectional-view of the sensor-assembly of Fig. 2, in accordance with an embodiment of the present subject matter. The electronic assembly comprises a housing
(1) for at-least one electrical-component. The housing (1) comprises at-least one opening for
receiving a PCB (5), and a plurality of protrusions for supporting the received PCB (5). The
plurality of protrusions correspond to a plurality of pips provided with crushing-ribs to create
interference-fit connection between the PCB (5) and the pips to in-turn restrict movement of
the PCB (5) within the housing (1).
At-least one side-wall is provided, such that the side-wall has a recessed-portion for defining a vertical-opening. At-least one grommet (2) is accommodated within said vertical-opening of the side-wall. More specifically, at least one side-wall defines a lateral-extension of the housing (1) comprising said vertical opening, wherein such lateral-extension stands molded to accommodate the grommet. The grommet (2) comprises a set of inter-locking recesses for achieving an interlocking with the vertical-opening, and at-least one hole within the grommet (2) extends longitudinally across the length of the grommet (2) as a conduit. The grommet (2) is snug-fitted within the vertical opening of the side-wall upon having been downwardly-inserted into the vertical-opening for allowing locking between the interlocking recesses and the vertical-opening of the side-wall.
At least one electrical-wire (3) is guided by said at-least one-hole within the grommet
(2) to connect with the PCB (5). Specifically, a plurality of holes extend longitudinally within
the grommet (2) as conduits. Moreover, the conduits are arranged vertically with respect to
each other (e.g. as a triangle) for routing wires (3).
As discussed before, the housing (1) comprise three pips to assemble the PCB sub assembly. The PCB sub assembly itself comprises PCB soldered to wires emanating from the wire-harness (3). The PCB assembly is assembled to the housing (1), such that PCB sub-assembly includes the bare PCB (5), a hall IC (e.g. in case sensor assembly is hall-sensor based bank angle assembly), the grommet (2) and the wiring harness (3). The hall IC may be
attached to the PCB circuit board, which is used to sense the specified-angle when it detects the magnet and provide signal to ECU (Engine Control Unit).The PCB (5) is supported upon the pips within the housing (1). These three pips are provided with crushing ribs to create interference between PCB (5) hole and pips to restrict the x and y direction movement of the PCB (5) within the housing (1).
Overall, at least an ease of installation of the PCB sub-assembly (5), grommet (2) and wire-harness (3) is rendered due to structure of the housing (1) that contributes to a rigid holding of the PCB (i.e. pip and crushing ribs) and grommet (2) (i.e. portion of housing that mates with grommet recesses). The structure of grommet (2) has the interlocking recesses and the provision of wire-insertion within grommet (2). A sealing provision (epoxy liquid sealant) is provided between the grommet (2) and the housing (1). Another sealing-provision (epoxy liquid sealant) between a top cover (8) and grommet (2).
Further, as may be understood, the combination of liquid, epoxy and compression based sealing-arrangement provides a sealed sensor assembly. Such sealing arrangement is achieved due to
a) A structure/geometry of the housing (1) that contributes to liquid sealing between
the housing (1) and top cover (8).
b) Sealing provision (epoxy liquid sealant) between the grommet (2) and the
housing (1)
c) Sealing provision (epoxy liquid sealant) between the top cover (8) and grommet
(2)
d) Interlocking recesses of the grommet (2) leading to compressive sealing with
respect to wires (3).
Fig. 5 illustrates the sensor-assembly of Fig. 2 without the top-cover, in accordance with an embodiment of the present subject matter. In an example, Fig. 5 depicts the sensor assembly as based on the Hall-effect and accordingly includes a magnet sub-assembly.
The magnet sub assembly is assembled within the housing (1) which includes magnet (6), two washers (7) and a pin (9). In an example, the magnet (6) is made up of plasto ferrite, which is free to rotate about the pin (9) supported in housing. A pair of washers (7) is made up of POM (Polyoxymethylene) material, which is assembled on both side of pin (9) to restrict the longitudinal movement of magnet (6) in Y-directions. The pin (9) is made up of
brass-material, which is snap-locked on housing pillars hole, said housing pillars being the first RH and LH pillars. The magnet (6) movement is free to rotate like a pendulum about the pin (9) with no restriction from the housing (1) on the pin (9).
After liquid-sealant is filled in a recess provided in the housing (1) around the magnet sub assembly, the top-cover (8) is assembled to the housing (1) for example by a snap-lock arrangement. As mentioned before, the cover (8) in turn is made up of plastic-material having two snaps, each LH and RH side to connect to the housing (1). These two snaps lock with housing (1) to render a snap-fit connection. After the cover (8) has been assembled over the housing (1), a cord-clamp (10) is tied on rubber grommet (2) and housing (1), which imparts compression between wire (3) and grommet sealing (2).
Fig. 6 illustrates an exploded view depicting the connection a) between a housing of the sensor-assembly and the grommet and, b) between the grommet and the wire harness, in accordance with an embodiment of the present subject matter. As indicated in Fig. 6, a direction of insertion of grommet into the housing of the sensor assembly has been shown. The grommet may be inserted vertically downwards into the housing, thereby leading to a visible as well as an ease of assembly of grommet within the housing. This at least differs from the direction of insertion of the state of the art grommet as otherwise depicted in the Fig. 1.
Fig. 7 illustrates an exploded-view depicting the connection between the sensor assembly and wire harness, in accordance with an embodiment of the present subject matter.
Without limiting the scope of the present subject matter, in an example, the housing may be formed of plastic or resin or any other similar type materials. The Pin may be metallic and formed of metals such as brass, etc. The magnetic material may be selected from amongst different materials having magnetic properties, preferably Anisotropic Plasto Ferrite, not limited to the Anisotropic Plasto Ferrite. The grommet may be formed of EPDM (ethylene propylene diene-terpolymer), or any other similar rubber material.
Fig. 8 illustrates an example application of sensor assembly in preceding figures as a bank-angle sensor in two wheelers. The Bank angle sensor (BAS) is used to detect a Tilt, Roll-over, Bank angle of a vehicle when vehicle is falling down. BAS provides tilt indication signal to ECU to shut-off the engine.
1. Operating voltage range = 5 V ± 0.1V
2. Operating temperature range= -20° C to +85° C
3. Rated Load Current = 10mA at rated voltage
4. Tilt detection angle (RH & LH) as per application/s
5. Ingress Protection ( IP) 67
Other applications where the sensor assembly as depicted in Fig. 1 to 6 hold applicable include bank-angle sensors, tilt sensors, fire, water, acoustic sensors, optical sensors etc.
In a nutshell, the present subject matter provides a unique concept of sealing between wire & grommet by compression method, and a sealing between housing and rubber grommet by epoxy- liquid sealant. Further, the wiring harness sleeve is clamped with rubber grommet by cord clamp to avoid any chances of water entry through sleeve.
The drawings and the forgoing description give examples of embodiments. Those skilled in the art will appreciate that one or more of the described elements may well be combined into a single functional element. Alternatively, certain elements may be split into multiple functional elements. Elements from one embodiment may be added to another embodiment. For example, orders of processes described herein may be changed and are not limited to the manner described herein.
Moreover, the actions of any flow diagram need not be implemented in the order shown; nor do all of the acts necessarily need to be performed. Also, those acts that are not dependent on other acts may be performed in parallel with the other acts. The scope of embodiments is by no means limited by these specific examples. Numerous variations, whether explicitly given in the specification or not, such as differences in structure, dimension, and use of material, are possible. The scope of embodiments is at least as broad as given by the following claims.
Benefits, other advantages, and solutions to problems have been described above with regard to specific embodiments. However, the benefits, advantages, solutions to problems, and any component(s) that may cause any benefit, advantage, or solution to occur or become more pronounced are not to be construed as a critical, required, or essential feature or component of any or all the claims.
we claim:-
1. An electronic-assembly comprising:
a housing (1) for at-least one electrical-component, said housing (1) comprising:
at-least one opening for receiving a PCB (5);
a plurality of protrusions for supporting the received PCB (5); and
at-least one side-wall having a recessed-portion for defining a vertical-opening;
at-least one grommet (2) accommodated within said vertical-opening of the side-wall, said grommet (2) comprising:
a set of inter-locking recesses for achieving an interlocking with the vertical-opening; and
at least one hole extending longitudinally across the length of the grommet (2); and
at least one electrical-wire (3) guided by said at-least one-hole within the grommet (2) to connect with the PCB (5).
2. The electronic-assembly as claimed in claim 1, wherein said at least one side-all defines a lateral-extension of the housing (1) having said vertical opening, said lateral-extension having been molded to accommodate the grommet.
3. The electronic-assembly as claimed in claim 2, wherein the plurality of protrusions correspond to a plurality of pips provided with crushing-ribs to create interference-fit connection between the PCB (5) and pips to in turn restrict movement of the PCB (5) within the housing (1).
4. The electronic-assembly as claimed in claim 1, wherein the grommet (2) is snug-fitted within the vertical opening of the side-wall upon having been downwardly-inserted into the vertical opening for allowing locking between the interlocking recesses and the vertical-opening.
5. The electronic-assembly as claimed in claim 1, wherein a plurality of holes extend longitudinally within the grommet (2) as conduits and arranged vertically with respect to each other for routing wires.
6. The electronic-assembly as claimed in claim 1, wherein the housing (1) comprises:
at- least two housing pillars (LH & RH) for mounting a magnet sub assembly; and
at-least two circular-slots for mounting the housing (1) to an external-support.
7. The electronic-assembly as claimed in claim 6, wherein the magnet sub assembly
comprises:
a pin (9) positioned within the housing (1) by snap-locking to the pair of
housing pillars;
a magnet (6) rotatable about the pin (9) supported in the housing; and
a pair of washers (7) assembled on both sides of pin (9) to restrict the
longitudinal movement of magnet (6).
8. The electronic-assembly as claimed in claim 6, further comprising:
a cover (8) snap fitted to the housing (1) through a snap-lock arrangement for covering the housing (1) from the top and in turn covering the magnetic sub assembly and PCB (5) present within the housing (1).
9. The electronic-assembly as claimed in claim 1, wherein the grommet (2) seals the
electrical-wire (3) through compression.
10. The electronic-assembly as claimed in claim 1, further comprising:
a first liquid-sealing arrangement between the grommet (2) and the housing
(i);
a second liquid sealing arrangement between the housing (1) and the cover (8), said second liquid sealant provided in a recess provided in the housing (1);
a third liquid sealing arrangement between the housing (1) and the grommet
(2).
| # | Name | Date |
|---|---|---|
| 1 | 201811038289-IntimationOfGrant28-02-2024.pdf | 2024-02-28 |
| 1 | 201811038289-STATEMENT OF UNDERTAKING (FORM 3) [09-10-2018(online)].pdf | 2018-10-09 |
| 2 | 201811038289-PatentCertificate28-02-2024.pdf | 2024-02-28 |
| 2 | 201811038289-PROVISIONAL SPECIFICATION [09-10-2018(online)].pdf | 2018-10-09 |
| 3 | 201811038289-PROOF OF RIGHT [09-10-2018(online)].pdf | 2018-10-09 |
| 3 | 201811038289-AMENDED DOCUMENTS [06-09-2022(online)].pdf | 2022-09-06 |
| 4 | 201811038289-FORM 13 [06-09-2022(online)].pdf | 2022-09-06 |
| 4 | 201811038289-FORM 1 [09-10-2018(online)].pdf | 2018-10-09 |
| 5 | 201811038289-POA [06-09-2022(online)].pdf | 2022-09-06 |
| 5 | 201811038289-DRAWINGS [09-10-2018(online)].pdf | 2018-10-09 |
| 6 | 201811038289-RELEVANT DOCUMENTS [06-09-2022(online)].pdf | 2022-09-06 |
| 6 | 201811038289-DECLARATION OF INVENTORSHIP (FORM 5) [09-10-2018(online)].pdf | 2018-10-09 |
| 7 | 201811038289-FORM-26 [15-10-2018(online)].pdf | 2018-10-15 |
| 7 | 201811038289-ABSTRACT [23-02-2022(online)].pdf | 2022-02-23 |
| 8 | 201811038289-Proof of Right (MANDATORY) [18-10-2018(online)].pdf | 2018-10-18 |
| 8 | 201811038289-CLAIMS [23-02-2022(online)].pdf | 2022-02-23 |
| 9 | 201811038289-COMPLETE SPECIFICATION [23-02-2022(online)].pdf | 2022-02-23 |
| 9 | 201811038289-OTHERS-181018.pdf | 2018-10-24 |
| 10 | 201811038289-Correspondence-181018.pdf | 2018-10-24 |
| 10 | 201811038289-FER_SER_REPLY [23-02-2022(online)].pdf | 2022-02-23 |
| 11 | 201811038289-OTHERS [23-02-2022(online)].pdf | 2022-02-23 |
| 11 | abstract.jpg | 2018-11-22 |
| 12 | 201811038289-DRAWING [05-10-2019(online)].pdf | 2019-10-05 |
| 12 | 201811038289-FER.pdf | 2021-10-18 |
| 13 | 201811038289-CORRESPONDENCE-OTHERS [05-10-2019(online)].pdf | 2019-10-05 |
| 13 | 201811038289-FORM 18 [23-10-2019(online)].pdf | 2019-10-23 |
| 14 | 201811038289-COMPLETE SPECIFICATION [05-10-2019(online)].pdf | 2019-10-05 |
| 15 | 201811038289-CORRESPONDENCE-OTHERS [05-10-2019(online)].pdf | 2019-10-05 |
| 15 | 201811038289-FORM 18 [23-10-2019(online)].pdf | 2019-10-23 |
| 16 | 201811038289-DRAWING [05-10-2019(online)].pdf | 2019-10-05 |
| 16 | 201811038289-FER.pdf | 2021-10-18 |
| 17 | abstract.jpg | 2018-11-22 |
| 17 | 201811038289-OTHERS [23-02-2022(online)].pdf | 2022-02-23 |
| 18 | 201811038289-FER_SER_REPLY [23-02-2022(online)].pdf | 2022-02-23 |
| 18 | 201811038289-Correspondence-181018.pdf | 2018-10-24 |
| 19 | 201811038289-COMPLETE SPECIFICATION [23-02-2022(online)].pdf | 2022-02-23 |
| 19 | 201811038289-OTHERS-181018.pdf | 2018-10-24 |
| 20 | 201811038289-CLAIMS [23-02-2022(online)].pdf | 2022-02-23 |
| 20 | 201811038289-Proof of Right (MANDATORY) [18-10-2018(online)].pdf | 2018-10-18 |
| 21 | 201811038289-ABSTRACT [23-02-2022(online)].pdf | 2022-02-23 |
| 21 | 201811038289-FORM-26 [15-10-2018(online)].pdf | 2018-10-15 |
| 22 | 201811038289-DECLARATION OF INVENTORSHIP (FORM 5) [09-10-2018(online)].pdf | 2018-10-09 |
| 22 | 201811038289-RELEVANT DOCUMENTS [06-09-2022(online)].pdf | 2022-09-06 |
| 23 | 201811038289-DRAWINGS [09-10-2018(online)].pdf | 2018-10-09 |
| 23 | 201811038289-POA [06-09-2022(online)].pdf | 2022-09-06 |
| 24 | 201811038289-FORM 1 [09-10-2018(online)].pdf | 2018-10-09 |
| 24 | 201811038289-FORM 13 [06-09-2022(online)].pdf | 2022-09-06 |
| 25 | 201811038289-PROOF OF RIGHT [09-10-2018(online)].pdf | 2018-10-09 |
| 25 | 201811038289-AMENDED DOCUMENTS [06-09-2022(online)].pdf | 2022-09-06 |
| 26 | 201811038289-PROVISIONAL SPECIFICATION [09-10-2018(online)].pdf | 2018-10-09 |
| 26 | 201811038289-PatentCertificate28-02-2024.pdf | 2024-02-28 |
| 27 | 201811038289-STATEMENT OF UNDERTAKING (FORM 3) [09-10-2018(online)].pdf | 2018-10-09 |
| 27 | 201811038289-IntimationOfGrant28-02-2024.pdf | 2024-02-28 |
| 1 | SearchHistoryE_24-09-2021.pdf |