FIELD OF THE INVENTION
The present invention relates to an apparatus and a method for automatic segregation of recyclable and reusable parts from electronic wastes. More particularly, it relates to an apparatus and a method for automatic separation of the working and non-working parts of a waste printed circuit boards.

BACKGROUND OF THE INVENTION
E-waste management is an important requirement for ecologically sustainable development in many countries. Efficient sorting of waste is a major issue in today's society and is becoming a burgeoning problem for the waste management industries to ensure effective and sustainable management of waste. The economic value of waste is best realized when it is segregated.
The trend of making the manually controlled things automatic has become a common practice these days. Making things automatic reduces burden on the humans. Also, the cost and effort used in manually operated products is much higher than that of the automated systems.
The main problem of manually operated waste management systems is checking and segregating components based upon their recovery, reuse potential. The usual method either involves a manual approach wherein either a person has to wander through the different spots, checking the places for waste collection or a team is required for identification and segregation of the components. This is somewhat complex and time consuming process. Hence, the present day waste management system is not as efficient as it should have been taking into consideration the advancements in the technologies that arose in the recent years. Hence, there is no safeguard regarding effective utilization of the e-waste by the proper identification, segregation and applying waste management approaches for the underlying components of the e-wastes.
Moreover, there’s another problem wherein recyclers need to identify values or reuse capability of underlying components of the e-wastes to determine or plan the appropriate waste management strategy. PCB’s are the important components of electrical equipments that owns a precious composition of metals, non-metals, the parts like capacitors, semiconductors, inductors, removable board ports etc. Hence, recycling becomes a more complex task. The complexity of recovery process is not merely due to the disparity of precious composition; rather it is due to the existence of such removable parts that have tendency of reuse, recycle, or recovery depending on the functional state of the components.
Re-using functional components like capacitors, inductors, semiconductors etc. could be a better option and cost effective approach in an effective waste management procedure.
CN101444784A discloses a method and a device for high-efficiency recovery of waste circuit boards in vacuum. As per the disclosed methodology, the waste circuit board is arranged in a vacuum vessel and heated for pyrolysis, wherein, most of pyrolysis volatile matter is cooled and liquefied into liquid oil, and the rest is taken into a gas collector; a centrifuge device separates soldering tin from the circuit board during the pyrolysis; substrates and electronic components of the pyrolyzed circuit board are assorted and collected to be further separated and recovered. The main disadvantage of this method is that the heating involved in the pyrolysis process might affect the functionality of working components even pyrolysis take place under vacuum condition.
US6234317 discloses device for sorting raw, pretreated or recycled bulk material. The device is of lesser utility in recycling purpose as the main function of component removal from PCB has to be performed separately.
In order to overcome limitations of the state of the art, one way is to come up with an approach that can ensure an effective waste management procedure irrespective of the nature, functional status, and abundance of valuable materials like metals, non-metals etc. Such approach should focus on the ease of operation, low dependence on man power and tendency to implement one or more waste management techniques at the same time without interrupting the parallel ongoing process (s).
Therefore, an approach is needed that can automatically segregate the components and determine the functional state of the components which may help the recyclers to set the flow and objectives of waste management process which either may be the re-use, recycling, and recovery of the components.

OBJECT OF THE INVENTION
The main object of the present invention is to provide an apparatus and a method for automatic segregation of working and non-working components of waste printed circuit boards or electronic waste with no or minimal manual intervention.
Yet another object of the present invention is to provide a Programmable Logic Controller (PLC) controlled apparatus that through a series of input/output modules, sensor modules and communication processors operates the segregation process in an automatic mode.
Yet another object of the present invention is to provide an approach for reusing the functional components present in the waste printed circuit boards or e-waste.
Yet another object of the present invention is to provide a component segregator comprising of a primary component segregation section and a chip separation section, contiguously connected to segregate components in various stages depending upon their functionality, nature and reusability.
Yet another object of the present invention is to provide a sensor enabled apparatus to sense presence of waste on the conveyer belt and initiating the belt movement.
Yet another object of the present invention is to provide an automatic segregation apparatus enabled with an infrared (IR) proximity sensors or camera module for automatic sorting of chips present in the waste printed circuit boards or e-wastes.
Yet another object of the present invention is to provide an apparatus wherein specific parameters like temperature, speed, and time can be customized as per the requirement of the segregation process.
Yet another object of the present invention is to provide a method of segregation with automatic unit operations like size sorting, metal sorting and segregation of reusable components like chip/capacitors/inductors/diodes from the printed circuit boards or e-waste.
Yet another aspect of the present invention is to provide an apparatus with a safety mechanism to protect embedded parts present in the e-waste from being damaged.

SUMMARY OF THE INVENTION
Accordingly, the present invention relates to an apparatus and a method for automatic segregation of working and non-working parts from waste printed circuit boards or electronic waste with minimal or no manual efforts. The apparatus comprises a component segregation section and a chip separation section, contiguous to segregation section to segregate the components in various stages depending upon their functionality, nature and reusability.
The apparatus takes in the bulk waste product as feed; the entry of the same is sensed by the sensors provided on the conveyor belt and that initiates the segregation process. The components from the waste product then undergo a number of stages wherein all necessary steps are taken like, size sorting, metallic parts sorting, reusable parts sorting viz. chips, capacitors, inductors, and diodes etc, and shredding.
The automatic segregation according to the present invention is based upon following principles:
1. Size sorting,
2. Metals sorting; and
3. Chip sorting
In another embodiment, the apparatus is enabled with a safety means wherein the functional components are avoided from crushing, damage, or any type of destruction during the segregation process.

BRIEF DESCRIPTION OF DRAWINGS
The various features, advantages and other uses of the present e-waste recycling method and apparatus will become more apparent by referring to the following detailed description and drawings in which:
FIG. 1 is an isometric view of the component segregator apparatus explaining various separation stages during segregation process.
FIG. 2a is a basic process flow diagram elucidating the general segregation procedure according to the present invention.
FIG. 2b is a schematic flow diagram elucidating the processing of remaining components obtained after component removal process.
FIG. 3 is a process diagram depicting the various stages involved in the segregation process.
FIG. 4 is a perspective view of the main component segregator according to an embodiment of the present invention.
FIG. 5 is a side view of main component segregator according to an embodiment of the present invention.
FIG. 6 shows the chip segregation unit according to an embodiment of the present invention.
FIG. 7 & 8 are the top and side views of the chip segregation unit according to an embodiment of the present invention.
FIG. 9 is a layout of a PLC controlled system.
FIG. 10 is a block diagram elucidating the chip sorting or detection process according to an embodiment of the present invention.

DETAILED DESCRIPTION OF THE INVENTION
The present invention will now be described hereinafter with reference to the accompanying drawings, in which some, but not all embodiments of the invention are shown. Indeed, the invention may be embodied in many different forms and should not be construed as limited to the embodiments set forth herein; rather, these embodiments are provided so that this disclosure will satisfy applicable legal requirements.
Many modifications and other embodiments of the invention set forth herein will readily occur to one skilled in the art to which the invention pertain having the benefit of the teachings presented in the foregoing descriptions and the associated drawings. Therefore, it is to be understood that the invention is not to be limited to the specific embodiments disclosed and that modifications and other embodiments are intended to be included within the scope of the appended drawings. Although specific terms are employed herein, they are used in a generic and descriptive sense only and not for purposes of limitation.
FIG. 1 is an isometric view of component segregator depicting complete system for executing the segregation process. In the first step, the e-waste components from component removal machine(s) 400 are received by the primary sieving unit 110 for sorting. Component removal machines provide two types of fractions, i.e. fine and coarse, other than the blank boards. Primary sieving unit 110 conducts screening of fraction containing solder balls, dust, multilayer ceramic capacitor (Platinum Group Metals), high value small capacitors, pins and fine particles, which further goes for separate sorting system 300. Thereafter, the components are selectively sent towards the component segregator 100 and chip segregation section 200 for the automatic segregation of components and chips. The component segregator 100 and chip segregator 200 are contiguously connected to provide a continuous process of segregation.
In yet another embodiment, the embedded components of the printed circuit boards are separated in three different stages wherein, all connector and ports are first removed in stage one. The removed connector and ports are then sent for mechanical recycling. Remaining material is moved forward for further segregation steps.
FIG. 2a is a process flow diagram elucidating the component removal procedure wherein the waste material is fed into the component removal machine/apparatus. The component removal machine (CRM) performs preparatory steps like primary sorting of electronic waste, and removal of the components of the e-waste, particularly waste printed circuit boards. After component removal, the blank boards are sent for shredding and further recycling procedures. Whereas, the removed components are sent for segregation process of present invention. Precisely, the component removal machine connected prior to the segregator apparatus removes all of the working and non working components from the printed circuit boards and convey said components for various checks to ensure proper waste management approach depending on the type and status of each component. For example, if printed circuit board is entered as feed then the apparatus would remove all the embedded components of the printed circuit boards convey all such parts for functionality check with the help of various sensing modules and smart testing kits equipped in the apparatus. If components are found in good working condition, then they are sent for reuse purpose. Similarly, if components are found defective, then other approaches of waste management could be opted based on recovery, recycle potential of such defective part(s). The blank boards after component removal are sent for metal recovery process.
Referring to FIG. 2b, a schematic flow diagram for the processing of remaining material obtained is explained. The removed components are sent for size sorting, sieving, metals sorting, and chips sorting. Size sorting of the removed components is done by the rolling separation method. Whereas, metals present in the removed components are sorted through magnetic sorter. The chips are sorted with the help of infrared proximity sensors.
Referring to FIG. 3, a process diagram depicting the various stages like size sorting, metal sorting and chips sorting according to an embodiment of the present invention. Size sorting is done in stages further by passing the components through rollers and segregating connectors/ports, processor jack/Iron, Capacitors/Transistors where capacitors/transistors are send to testing bench where again checking if they need to be introduced to mechanical recycling or reuse.
Referring to FIG. 4, a perspective view of the component segregator is provided. In this embodiment, the segregator comprises a frame 145 to support the conveyor system 120 and other sub-assemblies. There are two types of PCB material fractions received from CRM processing other than blank board namely fine and coarse. Primary sieving unit 110 does the screening of Fine fraction which contains Solder balls, dust, multilayer ceramic capacitor (Platinum Group Metals), high value small capacitors, pins and fine particles, which further goes for separate sorting system. The primary sieving unit 110 forms with screen, cam mechanism for back and forth vibration. It is same as vibratory feeder.The primary sieving unit 110 receives the components from the component removal machine (CRM) wherein, the coarse and fine components are separated. The coarse components include components like heat sink, sockets, connectors, copper coils, electrolyte capacitors, coils, connecter bases, transistors, inductors, chips, etc. The coarse components are then transferred to feeder 115 which receives all sized / coarse fraction of mixed components. It works on cam mechanism for back and forth vibration. It is same as vibratory feeder. The feeder 115 is contiguously connected to the conveyor system 120. The conveyor system 120 comprises a motor driven conveyer belt that longitudinally runs along the main frame 145 and conveys the coarse fraction of mixed components which passes through various separation stages. The conveyor system further comprises cameras and proximity sensors to sense the components on the conveyor belt and triggering the motor thus moving the conveyor belt in desired direction. A plurality of roller separators 125, 130, & 140 is provided at a suitable location at an adjustable height above the conveyor belt, such that the belt runs just beneath the separators. Each roller separator unit is provided with at least one hopper 155 to receive and collect the components from the roller separator unit. Each roller separator unit segregates the components depending upon their size and transfers the remaining components towards another roller separator unit where, the components are segregated based on the same principle i.e. size. As discussed above, the segregated components are collected in the respective hoppers 155. Hoppers acts as guide to segregated materials to collection bins. For segregation of magnetic components, a magnetic separator/sorter 160 is provided. The magnetic separator/sorter is attached subsequently next to the roller separators to initiate the magnetic separation process with the components left after roller separation process and guides segregated iron material to collection bins.
Referring to FIG. 5, the side view of the segregator unit is provided.
Referring to FIG. 6, a perspective view of the chip segregation unit is provided. In this embodiment, the secondary sieve assembly 245 receives the components from the magnetic sorter (not provided in the figure). The contents are transferred to the conveyor system for automatic separation of chips. The conveyor system comprises a motor driven conveyor belt that runs longitudinally to receive and move a processed batch from the main component segregator. Imaging module 210 is provided on the conveyor system for capturing images to detect the shape, size, and color of the components (chips). An arrangement of proximity sensors 220 detects the load on the conveyor belt and determines the distance between the components for an uninterrupted and accurate separation process. At least one reflection plate 240 is positioned on the conveyor system to reflect and manage the rays emitted from the proximity sensors. A plurality of air nozzles 225 at a suitable position on the conveyor belt collect the separated chips, the air nozzles are activated to separate components upon receiving a response from the imaging module and sensors depending upon the size, shape, color and distance of the components. The array of hoppers 230 collects the components from the respective air nozzle.
FIG. 7 & 8 are the top and side views of the chip segregator unit according to an embodiment of the present invention.
Referring to FIG.9, a layout of a PLC controlled system controlling various component removal machines equipped in the apparatus. The PLC system operates all the machines, rollers and sieving motors in an automatic mode. The status of the operation is displayed on the LCD/TFT screen provided to monitor proper functioning of the apparatus. In a preferred embodiment of the invention, the system operation stalls in case any of components to be segregated gets jammed at any point of segregation process, for instance, beneath the rollers. Unless, the jammed component is removed, the segregator will not re-operate. The apparatus is enabled with a safety means wherein the functional components are avoided from crushing, damage, or any type of destruction during the segregation process.
FIG. 10 is a block diagram elucidating the chip sorting or detection process. The chip sorting assembly comprises a conveyer belt; a plurality of infrared (IR) proximity sensors or camera module; an air pressure pump; and a collecting hopper. The IR proximity sensors or camera module are located on both sides of the conveyer belt wherein they sense the entry and detect type of the chips. The chip detection is controlled by the PLC system wherein the detection is based upon the colour of the chips. The air pressure pump further comprises plurality of air valves or vents. The presence of a specific coloured chip on the belt is detected by camera module that allows the specific air valve or vent to open and said detected chip is pushing out of the belt into the collected hopper by means of air flow. The different types of chips, that are segregated, are in 3 categories at 3 hoppers, namely high precious metal content chips; medium precious metal content chips; and low precious metal content chips. Function wise, the chips include electronic chips like microchips, processors, integrated circuit chips and microprocessors.
Accordingly, the most preferred embodiment provides an automatic component segregator for segregating electronic waste components comprising:
a) a frame;
b) at least one feeder to receive the components to be segregated;
c) at least one conveyor system to move the components away from the feeder, the system comprising at least one motor driven conveyor belt, and at least one proximity sensor;
d) plurality of roller separator units to segregate components according to their respective sizes, each of the unit comprising at least one roller separator and at least one hopper;
e) at least one magnetic sorter contiguous to the roller separator units to segregate magnetic components; and
f) at least one chip segregator contiguous to the magnetic sorter;
wherein the conveyor system is triggered on as soon as the conveyor belt receives the components from said feeder; the roller separator units are placed at an adjustable height above the conveyor belt such that the conveyor belt runs just beneath the separator; and the segregator is controlled by programmable logic controller.
In yet another preferred embodiment of the present invention is proposed an automatic component segregator for segregating electronic waste components comprising:
a) a frame;
b) at least one feeder to receive the components to be segregated;
c) at least one primary conveyor system to move the components away from the feeder, the system comprising motor driven conveyor belt, and at least one proximity sensor;
d) at least one roller separator unit to segregate components according to their respective sizes, the unit comprising at least one roller separator and at least one hopper;
e) at least one magnetic sorter contiguous to the roller separator units to segregate magnetic components;
f) at least one size separator unit to receive non-magnetic components from the magnetic sorter;
g) at least one secondary conveyor system contiguous to the size separator to move the components away from the size separator unit, the secondary conveyor system comprising motor driven conveyor belt and having two ends;
h) an imaging module provided at an at least one end of the secondary conveyor system to capture images of non-magnetic components to detect the shape, size, and color thereof;
i) an arrangement of proximity sensors at an at least one end of the secondary conveyer system to sense load on the secondary conveyor system and determine distance between the components; and
j) a plurality of air nozzles arranged on said secondary conveyor system, each provided with at least one hopper to collect the segregated components;
wherein the imaging module and the proximity sensors are positioned at a suitable location to capture images and to sense the presence of the components on the secondary conveyor system;
the plurality of air nozzles are provided at a suitable position on the conveyor system, the air nozzles are activated to separate components upon receiving a response from the imaging module and sensors depending upon the size, shape, colour and distance of the components; and the components are collected in their respective hoppers; and
the segregator is controlled by programmable logic controller.

We claim:
1. An automatic component segregator for segregating electronic waste components comprising:
a) a frame;
b) at least one feeder to receive the components to be segregated;
c) at least one conveyor system to move the components away from the feeder, the system comprising at least one motor driven conveyor belt, and at least one proximity sensor;
d) plurality of roller separator units to segregate components according to their respective sizes, each of the unit comprising at least one roller separator and at least one hopper;
e) at least one magnetic sorter contiguous to the plurality of roller separator units to segregate magnetic components; and
f) at least one chip segregator contiguous to the magnetic sorter;
wherein,
the conveyor system is triggered on as soon as the conveyor belt receives the components from said feeder thus conveying the components towards the roller separator units;
the roller separator units are placed at an adjustable height above the conveyor belt such that the conveyor belt runs just beneath the separator; and
the segregator is controlled by programmable logic controller.

2. The automatic component segregator as claimed in claim 1, wherein the conveyor system further comprises an imaging module to detect presence of components on the conveyor belt.
3. The automatic component segregator as claimed in claim 1, wherein the plurality of roller separator units comprises rollers of varying sizes.

4. The automatic component segregator as claimed in claim 1, wherein the components to be segregated include connectors, ports, processor jacks, magnetic and non-magnetic components, capacitors, transistors, microchips, processors, integrated circuit chips, and microprocessors.

5. An automatic component segregator for segregating electronic waste components comprising:
a) a frame;
b) at least one feeder to receive the components to be segregated;
c) at least one conveyor system to move the components away from the feeder, the system comprising motor driven conveyor belt, and at least one proximity sensor;
d) at least one roller separator unit to segregate components according to their respective sizes, the unit comprising at least one roller separator and at least one hopper;
e) at least one magnetic sorter contiguous to the roller separator unit to segregate magnetic components; and
f) at least one chip segregator contiguous to the magnetic sorter;
wherein,
the conveyor system is triggered on as soon as the conveyor belt receives the components from said feeder thus conveying the components towards the roller separator unit;
the roller separator unit is placed at an adjustable height above the conveyor belt such that the conveyor belt runs just beneath the separator; and
the segregator is controlled by programmable logic controller.
6. The automatic component segregator as claimed in claim 5, wherein the conveyor system further comprises imaging module to detect presence of components on the conveyor belt.

7. The automatic component segregator as claimed in claim 5, wherein the components to be segregated include connectors, ports, processor jacks, magnetic and non-magnetic components, capacitors, transistors, microchips, processors, integrated circuit chips and microprocessors.

8. An automatic component segregator for segregating electronic waste components comprising:
a) a frame;
b) at least one feeder to receive the components to be segregated;
c) at least one primary conveyor system to move the components away from the feeder, the system comprising motor driven conveyor belt, and at least one proximity sensor;
d) at least one roller separator unit to segregate components according to their respective sizes, the unit comprising at least one roller separator and at least one hopper;
e) at least one magnetic sorter contiguous to the roller separator unit to segregate magnetic components;
f) at least one size separator unit to receive non-magnetic components from the magnetic sorter;
g) at least one secondary conveyor system contiguous to the size separator to move the components away from the size separator unit, the secondary conveyor system comprising motor driven conveyor belt and having two ends;
h) an imaging module provided at an at least one of the two ends of the secondary conveyor system to capture images of non-magnetic components to detect the shape, size, and color thereof;
i) an arrangement of proximity sensors at an at least one end of the secondary conveyor system to sense load on the secondary conveyor system and determine distance between the components; and
j) a plurality of air nozzles arranged on said secondary conveyor system, each provided with at least one hopper to collect the segregated components;
wherein
the conveyor system is triggered on as soon as the conveyor belt receives the components from said feeder thus conveying the components towards the roller separator units;
the roller separator unit is placed at an adjustable height above the conveyor belt such that the conveyor belt runs just beneath the separator;
the imaging module and the proximity sensors are positioned at a suitable location to capture images and to sense the presence of the components on the secondary conveyor system;
the plurality of air nozzles are provided at a suitable position on the conveyor system, the air nozzles are activated to separate components upon receiving a response from the imaging module and sensors depending upon the size, shape, color and distance of the components; and the components are collected in their respective hoppers; and
the segregator is controlled by programmable logic controller.

9. The automatic component segregator as claimed in claim 8, wherein the primary conveyor system further comprises imaging module to detect presence of components on the conveyor belt.

10. The automatic component segregator as claimed in claim 8, wherein the segregated non magnetic components are electronic chips including microchips, processors, integrated circuit chips and microprocessors.