FIELD OF INVENTION

[001] The embodiments herein relate to a retention mechanism, and more particularly but not exclusively to a Printed Circuit Board retention mechanism that secures the Printed Circuit Board to an electronic device.

BACKGROUND OF INVENTION

[002] A printed circuit board, is a self-contained module of interconnected electronic components found in devices ranging from common pagers and radios to sophisticated radar and computer systems. The circuits are formed by a thin layer of conducting material deposited, or "printed," on the surface of an insulating board known as the substrate. Individual electronic components are placed on the surface of the substrate and soldered to the interconnecting circuits. Contact fingers along one or more edges of the substrate act as connectors to other Printed Circuit Boards or to external electrical devices such as on-off switches. A Printed Circuit Board may have circuits that perform a single function, such as a signal amplifier, or multiple functions. The term "Printed Circuit Board," as used through out this specification, can also be referred as printed wiring board (PWB) or etched wiring board.

[003] The increased use of Printed Circuit Boards in both consumer and industrial applications has created a large demand for relatively inexpensive mounting or retaining devices that can retain printed circuit boards in an operative position. Various forms of retaining systems such as spring action metal card retainer, wedge lock mechanism, Lever wedge lock mechanism and so on have evolved for mounting printed circuit boards.

[004] In the conventional retaining systems, the Printed circuit boards (PCB) have been mounted to a chassis or heat sink with devices that are mounted to the Printed Circuit Board and which, when actuated, retain the edge of the Printed circuit board (PCB) in a slot in a chassis, housing or other circuit board-retaining frame. The Printed Circuit Board has also been mounted to a frame or chassis utilizing edge connectors. Edge connectors, while protecting electrical contact, generally do not provide vibration or shock resistance, nor do they support thermal transfer to a heat sink. Further, it is important not only to be able to properly connect the circuit board to other circuit boards or to wiring but also to be able to secure the circuit board against vibration. Further, heat generated by components on the board has to be dissipated so as to ensure efficient operation of the circuit board components and to prevent failure due to excess heat.

[005] Further, the trend in today's technology is to reduce the size of the circuit elements thereby minimizing the space occupied by the elements and to increase the number of circuit boards utilized in an installation. Since a prime advantage in the utilization of printed circuit boards is their capability of permitting a fast assembling and replacement of circuit elements, it has become necessary to provide various mounting arrangements which are capable of removing, replacing and retaining the printed circuit board easily when required. Accordingly, there is a need for a relatively inexpensive and easily manufactured printed circuit board retainer for removing, replacing and retaining the circuit boards of today's technology with relative ease. Further, there is a need to provide a retaining system that could overcome the aforementioned drawbacks of existing technologies.

OBJECT OF INVENTION

[006] The principal object of this invention is to provide a retaining system for retaining Printed Circuit Board (PCB) effectively on to electrical devices.

[007] Another object of the invention is to provide Printed Circuit Board retaining system that could provide efficient heat transfer from Printed Circuit Board to electrical devices.

[008] A further object of the invention is to provide Printed Circuit Board (PCB) retaining system that will improve resistance towards shock and vibrations.

[009] A further object of the invention is to provide a retention system that will facilitate fast assembling and replacement of circuit elements.

BRIEF DESCRIPTION OF FIGURES

[0010] This invention is illustrated in the accompanying drawings, throughout which like reference letters indicate corresponding parts in the various figures. The embodiments herein will be better understood from the following description with reference to the drawings, in which:;

[0011] FIG. 1 shows an isometric view of the retention system according to an embodiment of the present invention;

[0012] FIG. la shows a sectional view of the retention system according to an embodiment of the present invention;

[0013] FIG. 2 depicts a cross sectional view of the retention system according to an embodiment of the present invention;

[0014] FIG. 3 depicts an isometric side view of the retention system according to an embodiment of the present invention; and

[0015] FIG. 4 depicts a sectional view of the retention system holding a printed circuit board (PCB) according to an embodiment of the present invention.

[0016] FIG. 5 depicts a front view of the enclosure holding Printed Circuit Board (PCB) using plurality of retention systems according to an embodiment of the present invention.

DETAILED DESCRIPTION OF INVENTION

[0017] The embodiments herein and the various features and advantageous details thereof are explained more fully with reference to the non-limiting embodiments that are illustrated in the accompanying drawings and detailed in the following description. Descriptions of well-known components and processing techniques are omitted so as to not unnecessarily obscure the embodiments herein. The examples used herein are intended merely to facilitate an understanding of ways in which the embodiments herein may be practiced and to further enable those of skill in the art to practice the embodiments herein. Accordingly, the examples should not be construed as limiting the scope of the embodiments herein.

[0018] The embodiments herein provide a Printed Circuit Board retention system that could improve vibration and shock resistance to the Printed Circuit Board when the Printed Circuit Board is retained in the enclosure. Further, the embodiments herein provide a Printed Circuit Board (PCB) retention system that could improve heat transfer from Printed Circuit Board to the heat sink or enclosure. Referring now to the drawings, and more particularly to FIGS. 1 through 4, where similar reference characters denote corresponding features consistently throughout the figures, there are shown embodiments.

[0019] Fig. 1 shows an isometric and sectional view of a retention system 100 according to an embodiment of the present invention. The retention system 100 is configured to secure a Printed Circuit Board (402 as shown in fig. 4) on to a housing or enclosure (not shown) of electronic or electrical devices. In one embodiment, the housing is made of a plastic material. In another embodiment, the housing is made of aluminium or sheet iron. However, it is also within the scope of invention, that the housing may be made of any other material depending on the specifications or requirements of the electronic or electrical devices. Further, the retention system 100 is connected to the housing of electronic or electrical device by at least one of a fastener, screw, clamp and similar means. In one embodiment, the retention system 100 is provided as an integral element of the housing of electronic or electrical device.
[0020] Fig. la shows a sectional view of a retention system 100 according to an embodiment of the present invention. The retention system 100 includes an elongated body 102 and a plurality of clamping assemblies 104. The elongated body 102 includes a horizontal member 102a and a vertical member 102b. The horizontal member 102a and the vertical member 102b are connected to each other such that the elongated body 102 provides "L" shaped configuration. However, it is also within the scope of the invention that the elongated body 102 may be of different configuration, without otherwise deterring the intended function of the elongated body 102 as can be deduced from this description. In one embodiment, the horizontal member 102a and the vertical member 102b are integral. In another embodiment, the horizontal member 102a and the vertical member 102b may be provided as separate elements and connected to each other by at least one of screw, clamp or similar means. Further, at least one of horizontal member 102a and vertical member 102b of the elongated body 102 is made of aluminium. However, it is also within the scope of the invention that at least the member of elongated body 102 may be of different material without otherwise deterring the intended function of the elongated body 102.

[0021] FIG. 2 depicts a cross sectional view of the retention system 100 according to an embodiment of the present invention. Each of the clamping assembly 104 includes a ball 108, spring 110 and an adjustment screw 112. Further, the clamping assembly 104 is provided on the horizontal member 102a of the elongated body 102 such that there is a predetermined gap between the clamping assembly 104 and the vertical member 102b. In one embodiment, the clamping assembly 104 and the horizontal member 102a are integral. In another embodiment, the clamping assembly 104 is attached to the horizontal member 102a through clamp, screw or similar means. Further, first end 104a of the clamping assembly 104 is provided with the adjustment screw 112. The adjustment screw 112 extends inside a through-hole 114 along a horizontal axis and towards the vertical member 102b. Further, a second end 112b of the adjustment screw 112 is engaged to the ball 108 through the spring 110. In one embodiment, the ball 108, spring 110 and the adjustment screw 112 are engaged to each other so as to define a predetermined gap between the ball 108 and the vertical member 102b. Further, the connection between the ball 108, spring 110 and the adjustment screw 112 enables a movement of the ball 108 towards the vertical member 102b when the adjustment screw 112 is tightened. Similarly, the connection between the ball 108, spring 110 and the adjustment screw 112 enables the movement of ball 108 away from the vertical member 102b when the adjustment screw 112 is loosened. In one embodiment, at least one of spring 110 and the ball 108 is made of steel. However, it is also with in the scope of invention that at least one of spring 110 and the ball 108 may be made of different material without otherwise deterring the intended function of the spring 110 and the ball 108 as can be deduced from this description. Further, in another embodiment, plurality of clamping assembly 104 is provided at a defined spacing. FIG. 3 depicts an isometric side view of the retention system according to an embodiment of the present invention. Further, it is also with in the scope of invention that the clamping assembly 104 may be attached to the vertical member 102b such that there is a predetermined gap between the ball 108 and the horizontal member 102a.

[0022] FIG. 4 depicts a sectional view of the retention system holding a printed circuit board (PCB) according to an embodiment of the present invention. The PCB 402 that is to be inserted to the housing or enclosure (not shown) is provided in the defined gap between the ball 108 and the vertical member 102b. Further, the adjustment screw 112 is tightened such that the ball 108 moves towards the vertical member 102b and retains the PCB 402 towards a flat wall of vertical member 102b. Further, providing plurality of clamping assembly 104, each having a ball 108, spring 110 and adjustment screw 112 at predetermined or defined spacing provides additional clamping force to retain PCB 402 towards the vertical member 102b. Further, spring 110 between the adjustment screw 112 and the ball 108 enables high resistance to vibration and shock. Furthermore, as the PCB 402 is retained towards the vertical member 102b of the elongated body, more portions of the PCB 402 is provided in contact with the retention system 100 hence it provides improved heat transfer from the PCB 402 to the electrical or electronic devices. Further, the spring 108 that is configured to retain PCB 402 on to the system 100 improves flexibility of the retention system 100.

[0023] In one embodiment, the Printed Circuit Board 402 is inserted to the enclosure by using plurality of retention systems 100. FIG. 5 depicts a front view of the enclosure holding Printed Circuit Board (PCB) using plurality of retention system according to an embodiment of the present invention. The enclosure 116 includes one or more retention system 100. In one embodiment, the enclosure 116 includes two retention system namely first retention system l00f that is provided at the top of the enclosure 116 and the second retention system 100s that is provided at the bottom of the enclosure 116. In one embodiment, the first retention system l00f and the second retention system 100s is secured to the top and bottom portion of the enclosure 116 using a screw 118. However, it is also with in the scope of the invention that the retention system could be secured/ connected to the enclosure 116 by any other available technique without otherwise deterring the intended function of the retention system 116. Similarly, it is also with in the scope of the invention that any number of retention system could be used any where inside the enclosure in order to accept the Printed Circuit Board inside the enclosure 116 without otherwise deterring the intended function of the retention system as could be deduced from this description. Further, Printed Circuit Board 402 is gently pushed from front side, through the gap between the ball 108 and the vertical member 102b of first clamping assembly 104f of the first retention system 100f (as shown in FIG. 5) that is provided at the top of the enclosure 116 and the gap between the ball 108 and vertical member 102b of second clamping assembly 104s of the second retention system 100s that is provided at the bottom of the enclosure 116 (as shown in FIG. 5). Further, the Printed Circuit Board 402 is pushed till the Printed Circuit Board 402 reaches the last clamping assembly (not shown) in the first retention system l00f and second retention system 100s respectively. In one embodiment, the ball 108 of the all the clamping assemblies in the first retention system l00f and the second retention system 100s revolves around the self axis thereby providing a smooth slide to the Printed Circuit Board (PCB) 402, when the Printed Circuit Board (PCB) 402 is pushed from front side.

[0024] Further, the adjustment screw 112 of the all the clamping assemblies in the first retention system l00f and the second retention system 100s are tightened such that the adjustment screw 112 pushes the spring loaded ball 108 towards the vertical member 102b and retains the Printed Circuit Board 402 towards a flat wall of vertical member 102b. Further, providing plurality of clamping assemblies in the first retention system 104f and the second retention system 104s, each having a ball 108, spring 110 and adjustment screw 112 at predetermined or defined spacing provides additional clamping force to retain Printed Circuit Board 402 towards the vertical member 102b. Further, spring 110 between the adjustment screw 112 and the ball 108 enables high resistance to vibration and shock. Furthermore, as the Printed Circuit Board 402 is retained towards the vertical member 102b of the elongated body, more portions of the Printed Circuit Board 402 is provided in contact with the retention system 100 hence it provides improved heat transfer from the Printed Circuit Board 402 to the electrical or electronic devices. In one embodiment, the surface 402b of Printed Circuit Board 402 that is in contact with the vertical member 102b of the elongated body is coated with ESD strip. In one embodiment, the ESD strip is coated for a standard size of 35" wide, 7.45" long and 0.0028" thickness. Further, the ESD strip that is coated along the entire length of Printed Circuit Board 402 is provided in contact with the aluminium coated vertical surface 102b, such that the contact enables high and effective heat transfer. In one embodiment, the ESD strip is a copper pouring. However, it is also with in the scope of the invention that the ESD strip may be by means of any other material known in the art that could enable efficient heat transfer without otherwise deterring intended function of the retention system 100. Further, the spring 110 by means of the adjustment screw 112 enables the user of the retention system 100 to vary the gap between the ball 108 and the vertical member 102b such that it improves flexibility of the retention system 100 and enables the retention system 100 to retain Printed Circuit Board 402 of varying thickness.

[0025] Further, it is also within the scope of the invention that the retention system 100 may be mounted on any orientation or location according to the requirement. Furthermore, the Printed Circuit Board 402 may be fitted vertically as shown in the Fig.4 or otherwise any suitable orientation by having retention system mounted accordingly. Further, the retention system 100 can also be used for mounting, retaining or storing variety of items such as, but not limited to, CD's and PC card's aligned to different application.

[0026] The foregoing description of the specific embodiments will so fully reveal the general nature of the embodiments herein that others can, by applying current knowledge, readily modify and/or adapt for various applications such specific embodiments without departing from the generic concept, and, therefore, such adaptations and modifications should and are intended to be comprehended within the meaning and range of equivalents of the disclosed embodiments. It is to be understood that the phraseology or terminology employed herein is for the purpose of description and not of limitation. Therefore, while the embodiments herein have been described in terms of preferred embodiments, those skilled in the art will recognize that the embodiments herein can be practiced with modification within the spirit and scope of the embodiments as described herein.

CLAIMS

We claim,

1. A retention system for retaining Printed Circuit Board, said retention system comprising:

an elongated body having a horizontal member and a vertical member; and

at least one clamping assembly having a ball, a spring and an adjustment screw,

wherein

said clamping assembly is configured to define a gap between said ball and at least one of said horizontal member and said vertical member; and

said adjustment screw is configured to move said ball towards and away from at least one of said horizontal member and said vertical member.

2. The retention system as claimed in claim 1, wherein said clamping assembly is spaced away from an adjacent clamping assembly on at least one of said horizontal member and said vertical member.

3. The retention system as claimed in claim 1, wherein at least one of said ball and said spring is made of steel.

4. The retention system as claimed in claim 1, wherein said ball is configured to rotate along its own axis.

5. The retention system as claimed in claim 1, wherein at least one of horizontal member and vertical member is made of aluminium.

6. The retention system as claimed in claim I, wherein at least one of said horizontal member and said vertical member is configured to be in direct contact with a surface of Printed Circuit Board.

7. The retention system as claimed in claim 1, wherein at least said surface of Printed Circuit Board that is in direct contact with said vertical member is coated with copper.

8. The retention system as claimed in claim 1, wherein at least one of said clamping assembly is attached to at least one of said vertical member and said horizontal member by at least one of a screw, a clamp and a fastener.

9. The retention system as claimed in claim 1, wherein at least one of said clamping assembly is unitary to one of said vertical member and said horizontal member.