[1]This application claims the benefit of priority based on the April Republic of Korea Patent Application No. 10-2016-0040363 submit one dated 2016, and all information disclosed in the documents of the Republic of Korea patent application are included as part of the specification.
[2]This application is directed to a battery module.
BACKGROUND
[3]Secondary battery and a nickel cadmium battery, a nickel hydrogen battery, a nickel-zinc battery or a lithium secondary battery, it is a typical lithium rechargeable battery.
[4]
The lithium secondary battery mainly uses a lithium oxide and a carbon material as an anode active material and the negative active material. Lithium secondary batteries, the positive electrode active material and the negative electrode in the active material comprises a respective coating the positive electrode plate and negative electrode plate the exterior of the electrode assembly and the electrode assembly is disposed with a separator between the housing seal with the electrolyte solution, it can type secondary battery in accordance with the shape of the packaging material and it can be classified as a pouch-shaped secondary battery. In this specification may be called a single secondary battery to a battery cell.
[5]
When used for middle- or large-sized devices, such as automobiles and electric power storage device, a large number of battery cells in order to increase the capacity and output are electrically connected to each other can be a battery module or a battery pack configuration.
[6]
In order for the battery module or a such a battery module constituting the plurality connected battery packs, it is required such as various fasteners or cooling equipment, such a fastener, or the cooling equipment and the like and causes an increase in the manufacturing cost of the battery module or a battery pack, the volume and increases the weight, and falls with increased volume and weight compared to the output also.
Detailed Description of the Invention
SUMMARY
[7]
The present application, it is possible to provide a battery module.
Problem solving means
[8]
The battery module of the present application comprises a module case and a battery cell. Battery cell may be housed in the module case. Battery cells may be present at least one in the module case, there may be a plurality of battery cells are housed in the module case. The number of battery cells are housed in the module case is not especially limited to be controlled depending on the purpose. A battery cell housed in the module case may be electrically connected to each other.
[9]
The module case may include a bottom plate and side walls defining an interior space, the battery cells can be stored at least. The module case may further include an upper plate for sealing the inner space. The side walls, bottom plate and top plate are either formed integrally with one another, or assembled discrete side walls, bottom plate and / or the upper plate, each may be formed with the module case. The shape and size of the module case is not particularly limited and may be suitably selected in accordance with the use object, etc., type and number of battery cells housed in the interior space.
[10]
1 is a diagram illustrating an example module case 10, an illustration of a box shape of the housing 10 including a bottom plate (10a) and four side walls (10b). Module case 10 may further include a top plate (10c) for sealing the inner space.
[11]
2 is a pattern diagram observing a module case 10 of Figure 1 is the battery cell 20 accommodated in the upper portion.
[12]
(It may be referred to below, bottom plate, etc.) of the module case bottom plate, side walls and / or top plate can have a hole is formed. These holes may be formed in the bottom plate or the like in contact with the resin layer can be described later, it may be formed in the bottom plate or the like in contact with the resin layer and the area of ​​80% or more contacts, which will be described later. The holes can be injected holil injecting a forming material (resin composition) of the resin layer in the case of forming a resin layer by an injection process as described later. At this time, the form of the hole, the number and position may be adjusted in consideration of the injection efficiency of a material for forming the resin layer. The holes in one example may be formed on at least the lower plate.
[13]
In one example of the hole it may be formed on the side wall, or the bottom plate of about 1/4 to about 3/8 or 3/4 point to 7/8 point or substantially central portion of the entire length of the top plate. The resin composition through an injection hole formed at this point can be injected to the resin layer to have a large contact myeonjok by injection. 1/4, 3/4, 3/8 or 7/8 of the points are, for example, as shown in Fig. 3, the overall length is measured by any one of the end surface (E), such as lower plate ( L) is the ratio of the distance (a) in contrast to the hole forming position. Further, the terminal (E) is the length (L) and the distance (A) in the formation may be, by any of the terminal (E) for measuring from the length (L) and the distance (A) the same end (E) have. In Figure 3 the injection hole (50a) is in the form which is located in approximately the middle portion of the lower plate (10a).
[14]
Injection hole size and shape are not particularly limited, and can be formed in consideration of the efficiency of injection of the resin material to be described later. For example, the holes may be a polygonal or amorphous, such as circular, elliptical, triangular or rectangular. Not necessarily to be injected and the number of holes is also greatly limited space, there is a resin layer as described above can be adjusted to have a large contact area as the lower plate.
[15]
Ends of the lower plate such that the injection holes are formed, may be formed in the observation hole (e. G., A view of the 3 50b). This observation hole is, for example, when injecting a resin material through the injection holes, may be to observe whether the injected material is injected into a well to the ends of the side walls, bottom plate or the top plate. The observation hole location, shape, size and number are not limited to be formed to determine whether the material to be injected into the appropriate injection.
[16]
The module case may be a heat-conductive casing. The term thermally conductive casing, in the entire case or a thermal conductivity above 10 W / mk, or at least means a case that contains a region having a thermal conductivity as described above. For example, at least one of the aforementioned side walls, bottom plate and the top plate may have the above-described thermal conductivity. In another example it may include the side wall, the bottom plate portion and at least one of the top plate having the thermal conductivity. In the thermal conductivity is, 20 W / mk or more in another example, 30 W / mk or more, 40 W / mk or more, 50 W / mk or more, 60 W / mk or more, 70 W / mk or more, 80 W / mk or more , 90 W / mk or more, 100 W / mk or more, 110 W / mk or more, 120 W / mk or more, 130 W / mk or more, 140 W / mk or more, 150 W / mk or more, 160 W / mk or more, 170 W / mk or more, 180 W / mk or more, 190 W / mk or may be at least 195 W / mk. The thermal conductivity is higher the value, so that the glass in terms of heat dissipation characteristics of the module, and the upper limit thereof is not particularly limited. In one example, the thermal conductivity of about 1,000 W / mK or less, 900 W / mk or less, 800 W / mk or less, 700 W / mk or less, 600 W / mk or less, 500 W / mk or less, 400 W / mk or less, 300 W / mk or 250 W / mK can be less than, but not limited thereto. Type of material exhibiting thermal conductivity as described above is not particularly limited, for example, aluminum, gold, and metal materials such as sterling silver, tungsten, copper, nickel or platinum. The module case is made of or the whole of a thermally conductive material as described above, It may be at least some portion of the area made of the thermally conductive material. Accordingly, the module case may include a different thermal conductivity of the above-given ranges, or, or at least the portion having the above-mentioned thermal conductivity.
[17]
In the module case portion having a thermal conductivity within the above range may be a number of layers to be described later and / or isolated areas in contact with the floor. Site having the thermal conductivity may be a contact area with the cooling medium such as cooling water. With such a structure may be a structure capable of emitting to the outside heat generated from the battery cells effectively implemented.
[18]
On the other hand, when the measured temperature is out of physical properties referred to herein affecting its physical properties, unless specifically stated otherwise, the physical properties may be the properties measured at room temperature. The term ambient temperature in the present specification is, for any one of a temperature, for example in the range of about 10 ℃ to 30 ℃, it can refer to about 25 ℃, about 23 ℃ or temperature of about 20 ℃.
[19]
In addition, a measure of the state of a liquid or solid material at room temperature is also referred to in this specification. Thus, the material is a material referred to as a liquid phase when the liquid phase at room temperature, referred to the solid phase used herein is a case of a solid phase at room temperature.
[20]
The type of the battery cell accommodated in the module case is also not particularly limited, and can be applied to all of the various battery cells known in the art. The battery cells in one example can be of the pouch.
[21]
Referring to FIG. 4, the pouch-shaped battery cell 100 may typically include an electrode assembly, electrolyte, and a pouch exterior.
[22]
4 is an exploded perspective view schematically showing the configuration of an exemplary pouch hyeongsel, Figure 5 is a perspective view of the coupling structure of Fig.
[23]
Pouch electrode assembly 110 contained in hyeongsel 100, may be at least one positive and one negative electrode plate with a separator arranged between the forms. The electrode assembly 110 includes a single or a wound type winding with a positive electrode plate and a negative plate the separator, it can be divided into a plurality of positive electrode plates and a plurality of negative electrode plate is placed a separator between the laminated alternately stacked and the like.
[24]
The pouch exterior 120 is, for example, may be of a type having an external insulating layer, a metal layer and an inner adhesive layer. The packaging material 120, protection of the electrode assembly 110 and the internal components such as the electrolyte, and in view of the supplement and heat dissipation properties, such as for the electrochemical properties of the electrode assembly 110 and the electrolyte solution comprise a metal thin film of aluminum or the like can. This metal thin film is to ensure electrical insulation of the electrode assembly 110 and an electrolyte, such as the element or cell 100 of the other elements in the external, it may be interposed between the insulating layer formed of an insulating material.
[25]
In one example of the case 120, the upper pouch 121 and may include a lower pouch 122, the upper pouch 121 and a lower pouch 122 is at least one of an inner space of the concave form (I) this can be formed. The inner space (I) of this pouch has an electrode assembly 110 can be housed. The outer peripheral surface of the upper pouch 121 and the pouch bottom 122 is provided with a sealing part (S), is such a sealing part (S) are bonded to each other, the electrode assembly 110 is accommodated in the internal space can be closed.
[26]
And each electrode plate of the electrode assembly 110 includes the electrode tabs, the one or more electrode tabs may be connected to the electrode lead. Electrode leads may function as an electrode terminal of the upper pouch 121 and the pouch bottom 122 sealing portion being disposed exposed to the outside of the packaging material (120) between (S), the secondary battery 100 of the.
[27]
In the form of a pouch-shaped cell it is an illustration, not a battery cell used in the present application be limited to the type as described above. In the present application has variety of hyeongsel pouch or other types of cells known to be applied both as a battery cell.
[28]
The battery module of the present application, the number may further include a resin layer. The term resin layer in the present application, a layer containing a resin component, the resin layer in one example, the adhesive may be a layer. The battery module in one example, can be included in the case and the battery cell, in contact with one of the side walls of the case, the bottom plate or top plate. In this case the side wall in contact with the resin layer, the bottom plate or the top plate can be a side wall aforementioned heat conductive, the lower plate or the upper panil. On the other hand, isolated to that in the contact, means in thermal contact, said contact is or are the resin layer directly contacts with the bottom plate, or, for other elements, for example, between, such as the resin layer and the lower plate, below there is a layer including but may represent a state that is not interfering with the heat transfer to the lower plate, such as that from the other elements to the resin layer. It does not interfere with the transfer of heat from the above, even if the other element (ex. Isolated this Pending part that layer or below) exists between such as the resin layer and the lower plate, and the other elements and the total thermal conductivity of the resin layer Fig. It is approximately 1.5 W / mK or more, about 2 W / mK or more, 2.5 W / mK or more, 3 W / mK or more, 3.5 W / mK or more, or 4 W / mK or more, or, or in contact with the resin layer and that even though the overall thermal conductivity of the other component such as a bottom plate, which means a case that is included in the range. The thermal conductivity of the thermal contact is 50 W / mK or less, 45 W / mk or less, 40 W / mk or less, 35 W / mk or less, 30 W / mk or less, 25 W / mk or less, 20 W / mk or less, 15 W / mk or less, 10W / mK or less, 5 W / mK or less, can be not more than 4.5 W / mK or less, or about 4.0 W / mK. This thermal contact is, if the other element is present, can be achieved by controlling the thermal conductivity and / or thickness of the other element.
[29]
The resin layer, it is in contact as the lower plate, and may also be in contact also with the battery cell. Contact of the battery cell and a resin layer is also the above-described thermal contact. While still present application the reduction through the adoption of the structure as a general battery module, or a cooling equipment of a variety of fasteners or modules that were required for existing at the time of configuration of a battery pack assembly of such modules, such as a widespread, while ensuring the heat dissipation characteristics , it may implement a storage module that many more battery cells per unit volume. Accordingly, more compact in the present application, lightweight and can provide a high-output battery module.
[30]
6 and 7, an illustrative cross-sectional view of the battery module, for example, the module case 10 includes a side wall (10b) and the lower plate (10a), such as 6 and 7; May be in the form including a plurality of battery cells 20 and the battery cell 20 and the case 10 is in contact with both (in thermal contact), the resin layer 30, which is housed inside of the case.
[31]
The lower plate is in contact with the resin layer 30 in the structure or the like may be a heat conductive bottom plate as described above.
[32]
Contact area, such as the resin layer and the bottom plate is, the lower plate a total area compared to about 70% or more, such as at least about 75%, at least about 80%, about 85%, at least about 90% or at least about 95%. The upper limit of the contact area is not particularly limited, and for example, may be less than 100% or less or about 100%.
[33]
The contact area, can be a bottom plate, etc. In this case comprises a thermally conductive portion has a contact area, that is the ratio of the thermally conductive portion of the total area of ​​the thermally conductive portion.
[34]
As described above, the thermally conductive or thermally conductive region, such as the lower plate may be a contact area with the cooling medium such as cooling water. That is, as shown in Fig. 6, and the heat (H) by the structure as described above can be easily discharged to the like bottom plate, sikimeuroseo contact this lower plate, such as the cooling medium (CW), a simplified structure even more so that the heat can be released easily.
[35]
The resin layer 30, as shown in figure 6, may be filled and the inner space of the case 10 as shown or in the form of a relatively thin layer, or the figure 7. In the above case, the battery cell 20 can be in the state of being inserted into the resin layer. The thickness of the structure in the case of figure 6, such as a resin layer, for example, range from about 100 ㎛ to 5 mm within the range or about 200㎛ to 5 mm of the can tomorrow. When the resin layer in the thin structure of the present application, since the glass in the insulation characteristics of the glass, and the thick side in the heat dissipation characteristics will be described later, it can be set to an appropriate thickness in consideration of this point. The thickness, the number of the thinnest portion of the thickness of the resin layer, can be the thickest part thickness or an average thickness of.
[36]
As it is shown in Figure 6 or 7, wherein said module, for the at least one surface, for example, the inside of the case 10, the resin layer 30 to surface (10a) has the guide for the battery cells 20 to be received in contact with the there may be a guide Pending part (10d). Shape is not particularly limited, and may have an appropriate shape may be employed considering the shape, etc. of the battery cell is applied, the guide Pending part (10d) at this time this Pending part (10d) is that which is integrally formed as the lower plate or, or it may be a separately attached. The Pending part guide (10d) may be formed by considering the above-described thermal contact using a metallic material such as a thermally conductive material, e.g., aluminum, gold, Sterling silver, tungsten, copper, nickel or platinum. In addition, the figure but not shown, between the battery cells 20 to be received, it may be a kanji or the adhesive layer. In the separator sheets it may serve as a buffer at the time of charging and discharging of the battery cell.
[37]
The resin layer or the battery module is that the resin is applied, can have at least one property of the physical properties described below. The various properties described below is not intended to give priority to the different physical properties of any of the physical properties to be independent, the resin layer is to be satisfied of at least one or two or more of the technical properties.
[38]
For example, as the resin layer is a thermally conductive resin layer, the thermal conductivity is about 1.5 W / mK or more, about 2 W / mK or more, 2.5 W / mK or more, 3 W / mK or more, 3.5 W / mK or more, or 4 W / mK may be higher. The thermal conductivity is 50 W / mK or less, 45 W / mk or less, 40 W / mk or less, 35 W / mk or less, 30 W / mk or less, 25 W / mk or less, 20 W / mk or less, 15 W / mk may be less than or less, 10W / mK or less, 5 W / mK or less, 4.5 W / mK or less, or about 4.0 W / mK. The lower plate with a resin layer as described above is that the resin layer adhering to the thermally conductive resin layer such as when the number may be the above-mentioned thermal conductivity is 10 W / mK or more sites. At this time, portions of the module case indicative of the thermal conductivity may be a cooling medium, for example, a contact portion as the cooling water. The thermal conductivity of the resin layer is, for example, a numerical value measured according to ASTM D5470 standard, or ISO 22007-2 standard. A manner that the thermal conductivity of the resin layer within the range as described above is not particularly limited. For example, the number may be adjusted via the thermal conductivity is used in the type and / or of the filler resin used in the resin layer of the resin layer. For example, acrylic resin, urethane resin and silicone resin in known resin components that can typically be used as an adhesive agent have another similar heat transfer properties, and the epoxy resin is excellent in thermal conductivity as compared thereto, the olefin-based resin is an epoxy resin it is known to have high thermal conductivity compared to. Therefore, it is possible to select to have the excellent thermal conductivity of the resin is also necessary. However, it is difficult to generally the thermal conductivity is desired only as the resin component obtained,
[39]
The thermal resistance of the battery module is the resin layer or a resin layer applied on the battery modules 5 K / W or less, 4.5 K / W or less, 4 K / W or less, 3.5 K / W or less, 3 K / W or less, or about 2.8 K / W or less. The heat resistance of such a range, the resin layer or heat radiation efficiency naejineun excellent cooling efficiency when the number of battery modules to control the resin layer is applied can be secured so that it appears. The thermal resistance is how the measurement is not particularly limited. For example, it can be measured according to ASTM D5470 standard, or ISO 22007-2 standard.
[40]
The resin layer, in view of the impact resistance and vibration resistance of the use process of the effective stationary module of the battery cell may have a suitable adhesive force. Be the one illustrated in the resin layer adhesive strength of about 1,000 gf / 10mm or less, about 950 gf / 10mm or less, about 900 gf / 10mm or less, about 850 gf / 10mm or less, about 800 gf / 10mm or less, about 750 gf / 10mm or less, about 700 gf / 10mm or less, and up to about 650 gf / 10mm or less than about 600 gf / 10mm. Adhesion of the resin layer may be at least about 50, at least about 70 gf / 10mm or more, about 80 gf / 10mm or more, or about 90 gf / 10mm In other instances. The adhesive force is, may be a value measured to be about 300 mm / peel rate and 180 ° peel angle of min. Further, the adhesive force can be adhesion to the module case that the resin layer is in contact. For example, in the case where the insulating layer between the said number as the lower plate is in contact with the resin layer on the module case the resin layer formed as described later, the adhesive force with respect to the module case is a module case in which the insulating layer is formed adhesion to be one. If the adhesive force as described above can be secured, it may receive a variety of materials, for example, excellent adhesion to various materials, such as battery cells included in the battery module case naejineun. If this range of adhesive strength is secured, the volume change during charge and discharge of the battery cells in the battery module, the peeling due to curing shrinkage of a resin layer or a change of temperature of the battery modules or the like is prevented has excellent durability can be secured. This adhesive can be, for example, be obtained by forming the resin layer as an adhesive layer.
[41]
The resin layer is also a thermal shock test, for example, by raising the temperature again, the mixture was kept at a low temperature of about -40 ℃ 30 minute 80 ℃ battery the cycle by one cycle of that continued for 30 minutes after the thermal shock test which repeated 100 times away from the module housing or the battery cells of the module, and the peeling or crack or may be required to be formed so that this will not occur. For example, there is a level of performance as described above may be required in order to be durable if the battery module is applied to products that require a long warranty period (in the case of cars, more than 15 years), such as cars secured.
[42]
The resin layer may be a number of electrically insulating layers. Maintain the capacity of the battery module by the resin layer in the above structure represents the electrical insulation, and it is possible to ensure stability. Be an electrically insulating resin layer, a dielectric breakdown voltage of about 3 kV / mm or more measured in accordance with ASTM D149, of about 5 kV / mm or more, about 7 kV / mm or more, 10 kV / mm or more, more than 15 kV / mm or 20 kV / mm can be at least. The dielectric breakdown voltage but is not that figure particular limitation to exhibit more the resin layer excellent high insulating properties is, the number when considering the composition of the resin layer from about 50 kV / mm or less, 45 kV / mm or less, 40 kV / mm or less , it can be not more than 35 kV / mm or less, 30 kV / mm. Above and can be controlled by adjusting the insulation of the resin component of the resin layer is also the dielectric breakdown voltage of, for example, the number can be adjusted to the dielectric breakdown voltage by applying an insulating filler in the resin layer. In general, a ceramic filler that will be described later in the thermally conductive filler has been known as a component that can ensure an insulation property.
[43]
A resin layer, a flame-retardant resin layer can be applied in consideration of the reliability. The term flame-retardant resin layer can in this application can mean a resin layer showing a V-0 rating at least flame-retardant (Vertical Burning Test) UL 94 V Test. This can ensure the stability of the fire and other accidents that may occur in the battery module.
[44]
The resin can share 5 or less. The specific gravity may be 4.5 or less, 4 or less, 3.5 or less, or 3 or less in other examples. Could represent the proportion of this range, the resin layer is advantageous for the production of a more lightweight battery modules. Since the specific gravity of the figure is lower the glass to the weight of the module, the lower limit is not particularly limited. For example, the specific gravity is about 1.5 or more, or may be 2 or more. It may be the resin layer can be a component that is added to the resin layer to indicate the portion of the range, such as the control. For example, as much as possible thermal conductivity desired in the lower specific gravity at the time of addition of the thermally conductive filler is applied to the filler, that is, a low specific gravity itself filler that can be secured, or surface treatment include methods of applying consisting of fillers can be used have.
[45]
The resin layer is not possible, it is appropriate to include a volatile substance. For example, the resin layer may have a ratio of non-volatile components can be 90% or more, 95% or at least 98% by weight or more. Nonvolatile minutes and that ratio in the above may be defined in the following manner. That is, the portion which remains the non-volatile swelling resin layer after holding at 100 ℃ for about one hour can be defined as a non-volatile content, and thus the ratio is maintained for about one hour at the initial weight and the 100 ℃ of the resin layer after the rate can be measured by the standard.
[46]
Further, the resin layer would have excellent resistance to deterioration, if necessary, a module case or pyomyeonga stability which does not react chemically with potential of the battery cell may be required.
[47]
The resin layer may also be advantageous to have a lower shrinkage after the curing or hardening. This can prevent the occurrence of peeling or voids that can occur in the use of the module manufacturing process naejineun. The shrinkage ratio can be properly adjusted in a range capable of exhibiting the above-described effects, for example, it may be less than 5%, less than 3% or about 1%. The shrinkage ratio, so that value is lower the glass, the lower limit is not particularly limited.
[48]
The resin layer also may be advantageous to have a low coefficient of thermal expansion (CTE). This can prevent the occurrence of peeling or voids that can occur in the use of the module manufacturing process naejineun. The thermal expansion coefficient can be appropriately adjusted in which may represent the above-mentioned effective range, e.g., 300 ppm / K is less than, 250 ppm / K is less than, 200 ppm / K is less than, 150 ppm / K or less than about 100 ppm / K can be less. The coefficient of thermal expansion, so the figure is lower the glass, the lower limit is not particularly limited.
[49]
The resin layer may be a tensile strength properly adjusted, it is excellent in impact resistance, etc. is obtained from may be a module that looks appropriate durability provided. The tensile strength (tensile strength), for example, may be adjusted in the range of at least about 1.0 MPa.
[50]
The resin can be elongation (elongation) is properly adjusted, it has excellent impact resistance can be secured through this module looks to provide adequate durability. Elongation, for example, may be adjusted in the range of about 10% or higher, or at least about 15%.
[51]
The resin layer may also be advantageous to display the appropriate hardness. For example, you can have the hardness of the resin is too high, the resin may become too brittle (brittle) it may adversely affect reliability. In addition, it can secure the impact resistance, vibration resistance by adjusting the hardness of the ground floor, and it is possible to ensure the durability of the product. The resin layer is, for example, Shore (shore) is less than the hardness of the A type 100, 99 or less, 98 or less, 95 or less or 93 or less, or, the hardness in Shore D type 80, less than about 70 or less or about 65 or less, or may be about 60 or less. The lower limit of the hardness is not particularly limited. For example, the Shore hardness (shore), or a hardness of less than 60 in the A type, the hardness in Shore (shore) OO type can be on the order of 5 or more or about 10 or more. The hardness of the resin layer is usually from being influenced by the kind of the filler to the ratio contained in the resin layer, if containing an excessive amount of the filler, the higher the normal hardness. However, resin ingredients contained in the resin layer, as a silicon-based resin generally showing a lower hardness than the other resin such as epoxy or urethane affect its hardness.
[52]
The resin layer, or may be at least 5% by weight loss or a (5% weight loss) temperature of 400 ℃, 70% by weight 800 ℃ remaining in thermogravimetric analysis (TGA). With such a characteristic can be improved in stability at high temperatures of the battery modules. 800 ℃ the residual amount is at least about 75% by weight or more, about 80% by weight or more, at least about 85% by weight or about 90% by weight in another example. 800 ℃ the residual amount can be up to about 99% by weight in another example. The thermogravimetric analysis (TGA) can be measured in the range of 25 ℃ to 800 ℃ to 20 ℃ / min under temperature rise rate of 60 cm3 / min in the atmosphere of nitrogen (N2). The thermogravimetric analysis (TGA) results can also be achieved through a number of adjustment of the composition of the resin layer. For example, 800 ℃ level is usually dependent on the type and to the ratio of the filler contained in the resin layer, if containing an excessive amount of the filler, the residual amount increases. However, the silicone-based resin wherein the residual amount is more general, since the high and a high heat resistance as compared with other resin such as epoxy or polyurethane, thus resin ingredients contained in the resin layers affects the hardness.
[53]
The type of the resin layer may be an effective fixing of the battery cell, so long as it can be given the above-mentioned physical properties as needed is not particularly limited, a curing resin material can be used all well-known.
[54]
The resin layer can be formed by curing a resin composition comprising a resin component by default, so that the resin layer or the resin composition may include a resin component. A resin component which can be used include an acrylic resin, an epoxy resin, there may be mentioned urethane-based resin, olefin resin, urethane resin, EVA (Ethylene vinyl acetate) resin or silicone resin or the like, so that the resin layer of the resin It can be included. The resin layer may include a resin as a main component among resin components. That is, the acrylic resin in the total resin components contained in the resin layer, epoxy resin, urethane resin, olefin resin, urethane resin, EVA (Ethylene vinyl acetate) resin or silicone resin or the like is about 70%, by weight or more, can be included about 75%, about 80%, at least about 85%, or at least about 90%. The ratio can be up to about 99% or less, or about 95%.
[55]
Be material for forming the resin layer, i.e., the resin composition, may be in the adhesive material as described above, and solvent-based, but may be of water-based or solvent-free, in consideration of the convenience of manufacturing process to be described later appropriate to the number of solvent-resin can.
[56]
Resin material and the like active energy ray curing type, moisture curing type, thermosetting type or room temperature curing, can also considering the convenience of the manufacturing process such as described below appropriate to the room temperature curing type.
[57]
The resin layer may include a filler in view of the above, thermal conductivity, insulating properties, heat resistance (TGA analysis), or specific gravity. Through the use of a suitable filler can be secured, such as the thermal conductivity of the above-mentioned range. In one example of the filler may be a thermally conductive filler. The term thermally conductive filler in the present application, the thermal conductivity is meant from about 1 W / mK or more, about 5 W / mK or more, about 10 W / mK or more, or about 15 W / mK or more materials. The thermal conductivity of the thermally conductive filler may be up to about 400 W / mK or less, about 350 W / mK or less, or about 300 W / mK. The type of thermally conductive filler that can be used is not particularly limited and may be applied to a ceramic filler in consideration of the insulating property and the like. For example, a ceramic particle such as alumina, AlN (aluminum nitride), BN (boron nitride), silicon nitride (silicon nitride), SiC, or BeO may be used. Also, if the insulating characteristic of the resin layer can be ensured, the application of carbon fillers such as graphite (graphite) may also be considered. Form or content of the filler contained in the resin layer is not particularly limited, and considering also sedimentation potential, it is an object thermal conductivity naejineun heat resistance in the viscosity number of the resin composition, the resin layer, insulating, filling effect or dispersibility including selection It can be. In general, the larger the size of the filler is more likely to settle in the filler increases the viscosity of the resin composition, the resin layer. In addition, the smaller size tends to have higher heat resistance. Therefore, in consideration of the point described above, and a filler of the appropriate kind may be selected, it is also possible to use two or more kinds of fillers as required. Also, Considering the amount to be filled is to use a spherical filler of glass, but in the form of filler such as by taking into consideration the formation and the conductivity of the acicular or plate-like network may be used. The number in one example of the resin layer may include a thermally conductive filler in the average particle diameter of from 0.001 to 80 ㎛ ㎛. The average particle size of the filler may be 0.01 ㎛, at least 0.1, at least 0.5㎛, more than 1 ㎛, over 2㎛, over 3㎛, 4㎛ over, or approximately over 5㎛ 6㎛ than in other examples. The average particle size of the filler is less than about 75㎛ In another example, about 70㎛ hereinafter 65㎛ hereinafter 60㎛ hereinafter 55㎛ hereinafter 50㎛ hereinafter 45㎛ hereinafter 40㎛ hereinafter 35㎛ hereinafter 30㎛ or less, up to about 25㎛, about 20㎛ hereinafter 15㎛ or less, and is about less than or about 10㎛ 5㎛ less.
[58]
The percentage of the filler contained in the resin layer, for the above-mentioned properties, e.g., thermal conductivity, can be selected in consideration of the characteristics of the resin layer so that the insulating property and the like can be secured. For example, the filler, the resin component of the resin 100 parts by weight of the preparation can be included in at least about 50 parts by weight. By weight of said filler portion to about 100 parts by weight In another example parts or more, about 150 parts by weight or more, about 200 parts by weight or more, and about 250 parts by weight or more, about 300 parts by weight or more, about 350 parts by weight or more, about 400 parts by weight or more, about 500 parts by weight or more, about 550 parts by weight or more, and about 600 parts by weight or more, may be greater than or equal to about 650 parts by weight parts or more or about 700 parts by weight. The upper limit of the content of the filler is not particularly limited, for example, be controlled within a range to satisfy the thermal conductivity of a number of the above-mentioned resin layer. The content of the filler in one example is about 2,000 parts by weight or less compared to 100 parts by weight of the resin component, 18 parts by weight or less, 16 parts by weight or less, 1,400 parts by weight, 12 parts by weight, 1000 parts by weight or less, less than 950 parts by weight or 900 can be not more than parts by weight.
[59]
Resin or resin composition may include a flame retardant for the satisfaction of the above-mentioned flame retardant grade. The present inventors, while exhibiting the properties that the resin or resin composition, and the object type of the flame retardant at the same time be selected so as to satisfy the above flame-retardant grades, it has been found that to be the rate control in one example. That is, in order to simply imparting flame retardancy, but when blended with a large amount of flame retardant in the resin composition or the resin layer, and in that case the physical properties of the resin may be damaged. In particular, the thermal conductivity requirements as shown in the present application the resin or resin composition, the thixotropy is required for the injection process, in the case of a resin composition that is fast curing at room temperature requirements, while still satisfying the above properties at the same time, high flame-retardant It is difficult to obtain a rating.
[60]
The inventors have confirmed through various proved that the phosphorus-based flame retardant have to be applied in order to achieve the above object. Thus the resin or resin composition of the present application is in accordance with, and a phosphorus-based flame retardant. As the phosphorus-based flame retardant is, it is at room temperature and liquid at room temperature, the phosphorus-based flame retardant may be a mixture of the solid phosphorus-based flame retardant. With this combination of the flame retardant of the specific two kinds of without damage to the thixotropic, thermally conductive curable and has a high flame retardant grade can be secured.
[61]
Liquid phosphorus-based flame retardant in the above, as the flame retardant showing a liquid at normal temperatures, for example, a melting point of less than room temperature, e.g., less than about 30 ℃, less than 25 ℃, less than 20 ℃, less than 23 ℃, less than 15 ℃, 10 ℃ may be less than or the flame retardant is less than 8 ℃. In addition, phosphorus-based flame retardant solid phase in the above, as a flame retardant shown in solid state at room temperature, for example, the melting point temperature exceeds, for example, greater than about 20 ℃, greater than about 25 ℃, greater than about 30 ℃, greater than about 40 ℃ or greater than about 50 ℃ may be a phosphorus flame retardant.
[62]
A phosphorus-based flame retardant as described above can be used are various types, for example, a phosphorus-based flame retardant of the liquid is resorcinol bis (diphenyl phosphate), a phosphite, such as (resorcinol bis (diphenyl phosphate)) (phosphate ) based flame retardant can be applied. Further, in the solid-phosphorus-based flame retardant is a phosphinate (phosphinate) based flame retardant such as aluminum phosphinate (Aluminium phophinate) may be used.
[63]
A solid phosphorus-based flame retardant in the are may be used a flame retardant in the form of a powder, the particle size distribution in such a case (Particle Size Distribution) 50% particle diameter (D50) is to use the powder form of the flame retardant is in the range of about 1μm to about 10μm. The particle diameter (D50) is at least about 2 μm In other instances, or about 3 μm or more, at least about 4 μm, or at least about 4.5 μm, about 9 μm or less, 8 μm or less, 7 μm or less, 6 μm or less, or 5.5 μm or less.
[64]
Maintain the desired physical properties via a combination of a specific phosphorus-based flame retardant while being manufactured with a high number of flame retardant grade resin or resin composition as described above is possible.
[65]
The ratio of the flame retardant can be controlled in one example. For example, the resin or resin composition may include a resin component, and the phosphorus-based flame retardant in a proportion of 20 to 40 parts by weight based on 100 parts by weight of the resin component. In the resin component, it comprises a material that is a resin state by a resin material and the conditions of curing. The ratio of the phosphorus-based flame retardant is from about 22 parts by weight or more in another example, 24 parts by weight or more and 26 parts by weight or 28 parts by weight, or be greater than or equal to, 38 parts by weight or less, 36 parts by weight or less, 34 parts by weight or less, 32 parts by weight It can be on the order of or less.
[66]
In such a state that the ratio (A / B) of the weight (B) of the weight (A) and the solid phase of the liquid phosphorus-based flame retardant phosphorus-based flame retardant can be adjusted in the range of 0.5 to 1.5. The ratio (A / B) is about 0.6 or more, 0.7 or more, 0.8 or more, 0.9 or more, or 0.95 or more in another example, 1.4 or less, 1.3 or less, 1.2 or less, 1.1 or less, or 1.05 or less.
[67]
It is possible to form a resin layer or a resin composition in which physical properties for the purpose of more effectively under the ratio as described above. In order to achieve the proper effect, the resin or resin composition, the flame retardant As the phosphorus-based flame retardant, for, for example, may include only a combination of the above-mentioned phosphorus-based flame retardant.
[68]
The resin layer, adjusting the needed viscosity, such viscosity control agents, for viscosity control in accordance with the increase or or or shear force to lower the viscosity of example, for example, thixotropy imparting agent, a diluent, dispersing agent, surface treating agent or a coupling agent there may be and including further.
[69]
Thixotropy imparting agents may be by adjusting the viscosity according to the shear force of the resin composition to occur to the production process of battery module effectively. Thixotropy imparting agents that can be used are, there is a fumed silica and the like can be illustrated.
[70]
Diluent or dispersant as long as they can exhibit the action described above to be used for a lower viscosity of the resin composition generally may be used without limiting the kind of the various known in the industry.
[71]
Surface-treating agent is for the surface treatment of filler which is incorporated in the resin layer, so long as it can exhibit the effect as described above can be used without limitation to the various known types on the market.
[72]
If the coupling agent is, for example, it can be used to improve the dispersibility of the heat conductive filler such as alumina, so long as it can exhibit the effect as described above can be used without limitation to the various known types on the market.
[73]
The resin layer may further include a flame retardant or flame retardant such aid. This resin layer may be formed of the flame-retardant resin layer. A flame retardant are a variety of known flame retardant can be applied without particular limitations, for example, may be applied, such as a filler in the form of solid flame retardant and a flame retardant liquid. Flame retardants include, for example, cyano melamine, but the inorganic flame retardant such as an organic flame retardant such as a click rate, or magnesium hydroxide, such as the (melamine cyanurate), but is not limited thereto.
[74]
When the amount of the filler filled in the resin layer may be used for many flame-retardant material of the liquid type (TEP, Triethyl phosphate or TCPP, tris (1,3-chloro-2-propyl) phosphate, and so on). Further, the silane coupling to the action of the flame retardant synergist ring I may be added.
[75]
The resin layer may include any of the components of one or two or more kinds.
[76]
In the one example of the battery module may further include an insulating layer between the module housing and the module housing, or between the resin layer and of the battery cell. 8 is an illustration of a number of resin layers 30 and the case that the bottom plate (10c), this insulating layer 40 between the Pending part (10d) formed on the casing is formed. The addition of the insulating layer it is possible to prevent problems such as electrical short-circuiting phenomenon or fire according to the contact of the cell and the case by the impact that can occur during use. The insulating layer can be formed by coating naejineun of material having a high insulating property and thermal conductivity of the insulating insulation formed from a sheet, or with injection. For example, a process of forming an insulating layer before the injection of the resin composition in the production method of the battery module, which will be described later can be performed. Forming the insulating layer may be applied include so-called (Thermal Interface Material) TIM. In another method the insulating layer is bonded may be made of a material, for example, it may be the content of the filler such as the thermally conductive filler with little or no use of the resin layer to form an insulating layer. A resin component which can be used in the formation of the insulating layer, an acrylic resin, PVC (poly (vinyl chloride)), olefin resin, epoxy resin, silicone, or such as PE (polyethylene), EPDM rubbers ((ethylene propylene diene monomer rubber) Although such rubber component, such as may be illustrated, but is not limited to the insulating layer, a dielectric breakdown voltage of about 5 kV / mm or more measured in accordance with ASTM D149, of about 10 kV / mm, at least about 15 kV / mm or more, 20 kV / mm or more, 25 kV / mm or more, or may be at least 30 kV / mm. The dielectric breakdown voltage is not the figure is high, more particularly restricted to exhibit excellent insulating property. For example, the dielectric breakdown voltage of the insulating layer may be up to about 100 kV / mm or less, 90 kV / mm or less, 80 kV / mm or less, 70 kV / mm or less, or 60 kV / mm. The thickness of the insulating layer can be set in an appropriate range in consideration of the insulating property and thermal conductivity of the insulating layer, e.g., about 5㎛ least about 10㎛ disorders, 20㎛, over 30㎛, over 40㎛ , can be on the order of at least 50㎛, over 60㎛, or more than, more than, or more than 80㎛ 90㎛ 70㎛. In addition, it is not also particularly limited, the upper limit of thickness, for example, be up to about 1 mm or less, about 200㎛ hereinafter 190㎛ hereinafter 180㎛ hereinafter 170㎛ or less, or 160㎛ 150㎛.
[77]
This application is also, for the battery module, for example, relates to a method of producing the above-mentioned battery modules.
[78]
Production method of the present application includes the steps of injecting a resin composition in the above-mentioned module case; Curing step, and the resin composition for accommodating the battery cells in the module case may include the step of forming the resin layer.
[79]
The sequence of steps for receiving a battery cell in the step and module case of injecting the resin composition in the interior of the module case is not particularly limited. For example, injecting a resin composition into the module case first, and houses the battery cell in that state, or has the battery cells can be injected into the first resin composition after stored inside the module case.
[80]
The term resin composition in the present application, can sense the state of a number of pre-cured resin layer, and the term resin may refer to the state of the resin layer after curing.
[81]
Method of injecting a resin composition into the module case is not particularly limited and may be subject to a well-known manner. For example, injecting a resin composition is poured into a resin composition to the opening of the module housing, or the way that injection (injection) of the resin composition by the above-mentioned injection hole is formed in the module case, the resin composition to both the battery cell and a battery module, this method may be applied such that the coating. For proper fixing the implantation process may be performed while constantly vibrate the battery module or the battery cell.
[82]
The type of the resin composition to be injected is not particularly limited in the above, it is possible to select the desired type of suitable resin compositions which may exhibit the physical properties of.
[83]
For example, the resin composition is injected from above, may be a resin composition capable of forming a resin layer containing a component meet or physical properties, therefor, such as the above-described heat-conductive.
[84]
This resin composition may be the above-mentioned solvent-based, water-based or solventless type resin composition can be suitably solventless resin composition.
[85]
In addition, the resin composition and the like active energy ray curing type, moisture curing type, thermosetting type or room temperature-curable resin composition, may be suitably from room temperature-curable resin composition.
[86]
The resin composition may be a resin composition containing one or more of various additives such as the aforementioned thermally conductive filler.
[87]
Such resin composition is one-component, it may be composed of two-part or three-part and so on.
[88]
The resin composition of the implanted module case or a method for storing the battery cell to the module case before the composition is injected is not particularly limited.
[89]
Storage of the battery cell may be performed by disposing the battery cells in view of such a purpose arranged in a suitable position in the module case. In the case of the cartridge structure exists, place the battery cell in the proper position of the cartridge or the structure, it is possible to insert the cartridge structure of a battery cell located in the module case performing the steps:
[90]
After storing the battery cell adhesion or contact between the battery cell and the module case between the battery cells it can be formed by curing the injected resin composition. Method of curing the resin composition is not particularly limited.
[91]
For example, the resin composition is an active energy ray curing type of case, for applying the appropriate column in the case of method, thermosetting maintaining under suitable humidity in the case of method, the moisture-curing to irradiation with an active energy beam such as ultraviolet rays to the resin composition If the room temperature curing method or the like method may be to keep the resin composition at room temperature to perform the steps:
[92]
In addition, prior to curing or hardening process or in the time and fairness chosen etc. stored before or storage process of the battery cell, for example in conditions that affect the stability of the battery cell to apply the short-time heat so that about 40 ℃ to 50 ℃ may.
[93]
The present application also relates to a resin which can be used to forming the above-mentioned production method or battery module of the above-mentioned structure of the composition.
[94]
In the resin composition as described above, so long as it may be possible to effectively fixed to the battery cell module case, and the above-mentioned physical properties given as needed is not particularly limited and can be used all of the known resin composition .
[95]
This resin composition, the acrylic resin composition, an epoxy resin composition, the urethane resin composition, the olefin-based resin composition, the urethane resin composition, EVA (Ethylene vinyl acetate) based, but can include a resin composition or the silicone resin composition or the like, but are not limited to, .
[96]
The resin composition, solvent type resin composition, the resin composition may be a water-based or solventless type resin composition can be suitably solventless resin composition.
[97]
The resin composition, and the like active energy ray-curable resin composition, the moisture-curing resin composition, thermosetting resin composition or a room temperature curing resin compositions, may be suitably from room temperature-curable resin composition.
[98]
For example, consider a known acrylic adhesive, an epoxy adhesive, a urethane adhesive, an olefinic adhesive, an additive such as the above-mentioned filler into the resin composition capable of forming an adhesive or a silicone adhesive-based EVA (Ethylene vinyl acetate) object properties the resin composition prepared by adding an appropriate amount can be applied to the above-described method.
[99]
The resin composition as described above, in view of the room temperature-curing, etc., may include a radical initiator thereto, and for the catalyst. For example, the resin composition may include a catalyst for the initiator such as a peroxide initiator, and acyl-toluidine (toluidine) compounds such as benzoyl peroxide, may be implemented by an appropriate curing system thereto.
[100]
The resin composition may comprise a variety of components, if necessary, in addition to the above components.
[101]
The present application also relates to a battery pack including the battery pack, for example, two or more of the foregoing battery module. The battery modules in the battery pack can be electrically connected to each other. 2 how to configure the battery pack to electrically connect the one or more battery modules are not particularly limited and may be applied to both a known manner.
[102]
The present application also relates to a device including the battery module or the battery pack. Examples of the apparatus but include an automobile such as an electric car, but not limited to, may be included in all applications that require the output to the secondary battery. For example, the method of using the battery module or a battery pack configured for the motor vehicle is not particularly limited, and a general method may be used.
Effects of the Invention
[103]
In this application there is a volume output compared while being manufactured in a simple process and low cost can be excellent, and provides excellent battery module, a method of manufacturing such heat dissipation properties and the resin composition for use in the method of manufacturing the same.
Brief Description of the Drawings
[104]
1 is a diagram illustrating an example module case which can be applied in this application.
[105]
2 is a view showing a form of the battery cell is accommodated in the module case.
[106]
3 is a view of an exemplary bottom plate and the injection holes observation hole.
[107]
4 and 5 are diagrams showing an exemplary a battery pouch which can be used as a battery cell.
[108]
Figures 6 to 8 is a diagram showing the structure of an exemplary battery module.
[109]
Reference Numerals
[110]
10: a module case
[111]
10a: lower plate
[112]
10b: side walls
[113]
10c: top plate
[114]
10d: Guy Pending part
[115]
20: Battery cells
[116]
30: resin
[117]
50a: injection hole
[118]
50b: Observation Hall
[119]
40: insulating layer
[120]
100: pouch hyeongsel
[121]
110: electrode assembly
[122]
120: exterior
[123]
121: upper par Butch
[124]
122: lower pouch
[125]
S: sealed portion
Mode for the Invention
[126]
Through the following examples and comparative examples describe the battery module of the present application but is not limited by the scope set forth the scope of the present application.
[127]
[128]
The thermal conductivity of the resin Assessment Method
[129]
Be the thermal conductivity of the resin layer is measured according to ASTM D5470 standard. That is, after placing the resin layer between the two copper bars (copper bar) according to the specifications of ASTM D 5470 one of the two copper bars are brought into contact with the heater, and the other is the later in contact with the cooler (cooler) made (state showing a temperature variation of no more than about 0.1 ℃ for 5 minutes) and the heater so as to maintain a constant temperature, thermal equilibrium by adjusting the capacity of the cooler. Column to measure the temperature of each copper bar in a state of equilibrium, and therefore the thermal conductivity of the formula (K, unit: W / mK) were evaluated. Pressure applied to the thermal conductivity of the resin layer at the time of assessment was adjusted to about 11 Kg / 25 cm2, the thermal conductivity was calculated based on the final thickness when the thickness of the resin layer is changed during the measurement process.
[130]

[131]
K = (Q×dx)/(A×dT)
[132]
In the above formula, K is the thermal conductivity (W / mK), Q is an hour moved column by column (in W) is, dx is the resin layer thickness (unit: m) of a, A is the cross-sectional area of ​​the resin layer (unit: and m2), dT is the temperature difference (in units of copper rod: a K).
[133]
[134]
2. The flame retardancy evaluation method
[135]
Flame retardant grades of resin was determined in accordance with UL 94V test method UL plastic test method. To cure the resin composition is prepared in the following examples so that the first thickness of from about 2 to about 3 mm, and the width and 125 mm and 13 mm respectively, the length of the vertical bar to prepare a specimen of the form.
[136]
Then check for 10 seconds jeopyeom to the specimen, and the combustion time (t1) of the specimen and burn aspect the flame length of 20mm (primary jeopyeom). Then, when the primary jeopyeom after combustion is completed, and after 10 seconds jeopyeom the combustion time (t2) and the sparks of the specimen measured Rimed time (glowing time) (t3), and records the combustion aspect. By determining the time (t1, t2, t3) and the combustion pattern (whether the cotton ignition by the addition, if the combustion to the clamp, and so on), and calculates the rating according to the following criteria.
[137]

[138]
V0 rating: Individual burn time (t1 or t2) this is 10 seconds or less, pre-treatment conditions by the total combustion time (t1 + t2 in total for the 5 specimens) is a less than 50 seconds, the time Rimed combustion and spark after secondary jeopyeom There is no combustion and until the 30 seconds or less, the clamp (125mm shown), ignition of cotton by dripping even if no
[139]
V1 rating: an individual burn time (t1 or t2) is greater than 10 seconds or less 30 seconds, the total combustion time by pre-treatment conditions (t1 + t2 in total for the 5 specimens) is a greater than 50 seconds or less 250 seconds, after the secondary jeopyeom There is no combustion to the combustion and a spark Rimed this time exceeds 30 seconds or less 60 seconds, the clamp (125mm shown), ignition of cotton by dripping even if no
[140]
V2 rating: an individual burn time (t1 or t2) is greater than 10 seconds or less 30 seconds, the total combustion time by pre-treatment conditions (t1 + t2 in total for the 5 specimens) is a greater than 50 seconds or less 250 seconds, after the secondary jeopyeom and burning and spark is less than 60 seconds is more than 30 seconds Rimed time, it is not burned to a clamp (125mm shown), if the ignition of cotton by dripping
[141]
[142]
3. flowability (thixotropic) Evaluation
[143]
Whether thixotropy is, the resin composition of PET (Poly (ethylene terephthalate)) and then loaded into a thickness of about 30 mm in the film (loading), left stand for 1 hour and the loaded film perpendicularly, wherein the resin composition flows It was evaluated by measuring the distance down. No thixotropic to not less than the distance of the resin composition flows down 50mm, were evaluated to determine the flow, was determined in the case of less than 50 mm to the thixotropic confirmation.
[144]
[145]
Example 1.
[146]
Preparation of resin composition
[147]
2-part urethane adhesive composition is a: (1㎛ to 60㎛ particle size distribution) of the two-part urethane adhesive composition is not flame retardant is compounded (subject:: HP-3753 (KPX Chemical Company), a curing agent TLA-100 (Asai helicase)) on alumina in that state after curing amounts which may represent a thermal conductivity of approximately 3 W / mK were mixed in a (two-liquid resin component totals 100 parts by weight compared to about 600 to 900 parts by weight range). Then, about 15 parts by weight of resorcinol bis (diphenyl phosphate) (resorcinol bis (diphenylphosphate)), and also aluminum phosphinate 15 parts by weight of (Aluminium phosphinate) compared to the total 100 parts by weight of the second liquid resin component of the adhesive composition in addition to the formulation to prepare a resin composition. When resonance in the play-bis (diphenyl phosphate) is, in a (P) the liquid phosphorus-based flame retardant content is from about 10 to 12% of aluminum phosphinate is phosphorus (P) the content of approximately 23 to 24% as solid flame retardant, the particle size distribution and 50% particle size (D50) of about 5 μm, the degradation temperature of the solid phosphorus-based flame retardant of about 350 ℃.
[148]
[149]
Manufacture of battery modules
[150]
A module case of the shape, such as 1, was used as the bottom plate, the module case having a side wall and a top plate made of aluminum. Wherein, the inner surface of the bottom plate of the module case, and additional guiding for guiding the mounting of the battery cell is formed in the center of the bottom plate of the module housing has an injection hole for injection of the resin composition is formed at a predetermined interval, of the lower plate the terminal is formed the observation hole. In the module case it was housed a bundle of a plurality of stacked battery pouch pouch. Then the top plate was covered with an upper surface of the module case. After that, by curing after the injection until the composition is injected into the injection holes of the prepared resin composition it is observed to reach the observation hole to prepare a battery module.
[151]
[152]
Comparative Example 1.
[153]
Except that no flame retardant blend in the preparation of the resin composition was prepared in the same manner as in Example 1, the battery module.
[154]
[155]
Comparative Example 2.
[156]
Was prepared as a flame retardant in the production of the resin composition, resorcinol bis (diphenyl phosphate), only the second liquid resin component totals 100 parts by weight of the preparation, except that a mixture of parts of about 30 parts by weight, the same battery modules as in Example 1, .
[157]
[158]
Comparative Example 3.
[159]
As a flame retardant in the production of the resin composition, chlorobenzene to prepare an alkyl diphosphonate ester (C13H24Cl6O8P2) only the second liquid resin component totals 100 parts by weight of the preparation, except that a mixture of parts of about 30 parts by weight, exemplary battery module in the same manner as in Example 1. The chloro alkyl diphosphonate ester (C13H24CL6O8P2) has a particle size distribution and 50% particle size (D50) of about 10 μm, the solid flame retardant to a decomposition temperature greater than about 280 ℃.
[160]
[161]
Comparative Example 4.
[162]
As a flame retardant in the production of the resin composition, an aluminum phosphinate only the second liquid resin component totals 100 parts by weight of the preparation, except that a mixture of parts of about 30 weight, performed identically battery module as in Example 1 was prepared.
[163]
[164]
Comparative Example 5.
[165]
As a flame retardant in the production of the resin composition, the poly aluminum phosphate-based flame retardant only the second liquid resin component totals 100 parts by weight of the preparation, except that a mixture of parts of about 30 weight, the same battery modules as in Example 1 was prepared. The poly-aluminum phosphate-based flame retardant, the particle size distribution and 50% particle size (D50) of about 18 μm, the decomposition temperature of the solid flame retardant in excess of about 275 ℃.
[166]
[167]
Comparative Example 6.
[168]
Was prepared in the type of the flame retardant only the second liquid resin component totals 100 parts by weight of the preparation, except that a mixture of parts of about 30 parts by weight, exemplary battery module in the same manner as in Example 1 as a flame retardant in the production of the resin composition, the thermoplastic elastomer (ester ether) . The flame retardant, the particle size distribution and 50% particle size (D50) of about 10 μm, the decomposition temperature of the solid flame retardant in excess of about 280 ℃.
[169]
[170]
Comparative Example 7.
[171]
Same as in Example 1, except that, and the resonance when the blending ratio of the play-bis (diphenyl phosphate) flame retardant in the production of the resin composition parts 10 parts, changing the compounding ratio of the aluminum phosphinate flame retardant parts 10 parts to prepare a battery module.
[172]
[173]
Comparative Example 8.
[174]
Was prepared 15 parts by weight of resorcinol bis (diphenyl phosphate) flame retardant and 15 parts by weight of aluminum poly-phosphite based flame retardant the flame retardant except that the blending, the battery modules in the same manner as in Example 1, in the manufacture of a resin composition .
[175]
[176]
Comparative Example 9.
[177]
The battery module was prepared in the same manner as in Example 1 except that the formulation of 15 parts by weight of resorcinol bis (diphenyl phosphate) flame retardant of the flame retardant and 15 parts by weight Comparative Example 6, in the manufacture of parts of the resin composition.
[178]
[179]
To summarized the properties of the resin composition applied in the above Examples and Comparative Examples are shown in Table 1.
[180]
TABLE 1
Thermal conductivity (unit: W / mK) Thixotropic Flame retardant grades
Example 1 3.03 Check thixotropic V0
Comparative Example 1 3.05 flow V1
Comparative Example 2 2.91 flow V1
Comparative Example 3 3.04 Check thixotropic V1
Comparative Example 4 2.57 Check thixotropic V1
Comparative Example 5 3.25 flow V2
Comparative Example 6 3.14 flow V1
Comparative Example 7 3.01 Check thixotropic V2
Comparative Example 8 3.01 flow V2
Comparative Example 9 2.96 flow V1

[181]
While having a modified yaw only in Example 1 from the above results, it can be seen that at the same time representing the resin composition satisfying the flame retardant rating V0 producing a high thermal conductivity. In Comparative Example 1, a flame-retardant rating dropped flame retardant is not to be added, the resin composition did not show thixotropy. Comparative Example 2, was thixotropic has not been confirmed, though the filler content of the formulation of the same thermal conductivity is poor, Comparative Example 3 and 4, but is thixotropic OK, not too satisfied with the high thermal conductivity and flame retardant grade at the same time. Comparative Examples 5, 6, 8 and 9, also was a thixotropic two mihwakbo, did not have a high thermal conductivity and flame retardant grades are not satisfied at the same time, but also in Comparative Example 7 For thixotropic check, a high thermal conductivity and flame retardant grades were not satisfied at the same time.

Claims

[Claim 1]A module case having a bottom plate and side walls defining an interior space; A plurality of battery cells present in the inner space of the module case; And said module includes a resin layer present in the inner space of the case, the number of the resin layer and having at least V-0 flame resistance rating in the UL 94 V test, the battery module comprising a phosphorus-based flame retardant and a resin component.
[Claim 2]
The method of claim 1, wherein the resin layer, and in contact with the plurality of battery cells, and the battery module in contact with the bottom plate or the side wall of the module case.
[Claim 3]
The method of claim 1, wherein the side walls in contact with the resin layer or the lower plate is a battery module including a thermally conductive region.
[Claim 4]
The method of claim 3, wherein the number ratio of the resin layer in contact with the heat conducting region, and 80% or more battery modules as compared to the total area of ​​the thermally conductive regions.
[Claim 5]
The method of claim 1, wherein the resin layer is greater than thermal conductivity of the battery module is 1.5 W / mK.
[Claim 6]
The method of claim 1, wherein the phosphorus-based flame retardant, the battery module comprising a liquid phosphorus-based flame retardant and a phosphorus-based flame retardant solid.
[Claim 7]
The method of claim 6 wherein the liquid phosphorus-based flame retardant is a phosphate-based flame retardant of the battery module.
[Claim 8]
The method of claim 6, wherein the solid phosphorus-based flame retardant is a phosphinate-based flame retardant of the battery module.
[Claim 9]
The method of claim 6, wherein the solid phosphorus flame retarder is a powder form of the battery modules in the particle size distribution 50% particle diameter (D50) in the range of 1μm to 10μm.
[Claim 10]
The method of claim 1, wherein the resin layer comprises a resin component, phosphorus-based flame retardant is a battery module that is included in a proportion of 20 to 40 parts by weight based on 100 parts by weight of the resin component.
[Claim 11]
11. The method of claim 10 wherein the liquid phosphorus-weight of (A) and the ratio of the weight (B) of the solid phosphorus-based flame retardant of the flame retardant (A / B) of the battery module in the range of 0.5 to 1.5.
[Claim 12]
The method of claim 1, wherein the resin layer is a battery module including only the phosphorus-based flame retardant as the flame retardant.
[Claim 13]
The method of claim 1, wherein the resin layer, an acrylic resin, epoxy resin, urethane resin, olefin resin, a battery module including the EVA resin or silicon resin.
[Claim 14]
The method of claim 1, wherein the resin layer is a battery module including a filler.
[Claim 15]
The method of claim 14 wherein the filler is, the ceramic particles or carbon-based filler of the battery module.
[Claim 16]
Which are electrically connected to each other, a battery pack including two or more of claim 1 to the battery module.