1]
This application claims the benefit of priority based on June the Republic of Korea Patent Application No. 10-2015-0083425 submission dated the year 2015, and all information disclosed in the documents of the Republic of Korea patent application are included as part of the specification.
[2]
This application is directed to a battery module.
BACKGROUND
[3]
Secondary battery and a nickel cadmium battery, a nickel hydrogen battery, a nickel-zinc battery or a lithium secondary battery, it is a typical lithium rechargeable battery.
[4]
The lithium secondary battery mainly uses a lithium oxide and a carbon material as an anode active material and the negative active material. Lithium secondary batteries, the positive electrode active material and the negative electrode in the active material comprises a respective coating the positive electrode plate and negative electrode plate the exterior of the electrode assembly and the electrode assembly is disposed with a separator between the housing seal with the electrolyte solution, it can type secondary battery in accordance with the shape of the packaging material and it can be classified as a pouch-shaped secondary battery. In this specification may be called a single secondary battery to a battery cell.
[5]
When used for middle- or large-sized devices, such as automobiles and electric power storage device, a large number of battery cells in order to increase the capacity and output are electrically connected to each other can be a battery module or a battery pack configuration.
[6]
In order for the battery module or a such a battery module constituting the plurality connected battery packs, it is required such as various fasteners or cooling equipment, such a fastener, or the cooling equipment and the like and causes an increase in the manufacturing cost of the battery module or a battery pack, the volume and increases the weight, and falls with increased volume and weight compared to the output also.
Detailed Description of the Invention
SUMMARY
[7]
The present application, it is possible to provide a battery module.
Problem solving means
[8]
The battery module of the present application may include a battery cell which is accommodated in a housing (hereinafter, in this specification the housing may be referred to as the module case.) And the housing. In the housing in the present application may be at least two or more of the battery cell is accommodated. Set of at least two battery cells are accommodated in a housing in the present application may be referred to as a battery cell assembly. Figure 1, is for the exemplary battery module, showing the housing 200 and the battery cell assembly 100, by way of example.
[9]
The housing may include at least the lower plate. The bottom plate may have a convex portion is formed at least two for guiding the battery cell. The battery cells may be mounted between the convex portion of the lower plate.
[10]
2 is a side view of an exemplary battery module, showing a form that is, the battery cell 400 mounted between the above-described convex portion of the lower plate 210. The bottom plate forms a convex portion formed on the, particular number or size, or the like is not particularly limited and may be appropriately selected in consideration of the number and the size and the shape of the battery cell to attempt to mount.
[11]
The lower plate may be a thermally conductive bottom plate. Since the convex portion formed on the lower plate also are part of the lower plate, the thermal conductivity can be holy. The term heat-conductive bottom plate is a lower plate of the thermal conductivity, or more than 10 W / mk, or at least means that the lower plate includes a portion having a thermal conductivity as described above. For example, the entire bottom plate, or at least the convex portion may have the above-mentioned thermal conductivity. In another example it may include a region having a degree the at least one of the lower plate and / or heat conductive projections. In the thermal conductivity is, 20 W / mk or more in another example, 30 W / mk or more, 40 W / mk or more, 50 W / mk or more, 60 W / mk or more, 70 W / mk or more, 80 W / mk or more , 90 W / mk or more, 100 W / mk or more, 110 W / mk or more, 120 W / mk or more, 130 W / mk or more, 140 W / mk or more, 150 W / mk or more, 160 W / mk or more, 170 W / mk or more, 180 W / mk or more, 190 W / mk or may be at least 195 W / mk. The thermal conductivity is higher the value, so that the glass in terms of heat dissipation characteristics of the module, and the upper limit thereof is not particularly limited. In one example, the thermal conductivity of about 1,000 W / mK or less, 900 W / mk or less, 800 W / mk or less, 700 W / mk or less, 600 W / mk or less, 500 W / mk or less, 400 W / mk or less, 300 W / mk or 250 W / mK can be less than, but not limited thereto. Type of material exhibiting thermal conductivity as described above is not particularly limited, for example, aluminum, gold, and metal materials such as sterling silver, tungsten, copper, nickel or platinum. Or the lower plate is made entirely of a thermally conductive material as described above, may be at least some portion of the area made of the thermally conductive material. Accordingly, the lower plate may comprise of the thermal conductivity of the above-given ranges, or, or at least the portion having the above-mentioned thermal conductivity.
[12]
In the lower plate portion having a thermal conductivity within the above range may be a portion in contact with the resin layer to be described later. Further, the region having the heat conductivity may be a contact area with the cooling medium such as cooling water. With such a structure may be a structure capable of emitting to the outside heat generated from the battery cells effectively implemented.
[13]
The lower plate is, it may be in contact with the cooling system, such as a water-cooling system in one example. At this time contact is in thermal contact to be described later.
[14]
On the other hand, when the measured temperature is out of physical properties referred to herein affecting its physical properties, unless specifically stated otherwise, the physical properties may be the properties measured at room temperature. The term ambient temperature in the present specification is, for any one of a temperature, for example in the range of about 10 ℃ to 30 ℃, it can refer to about 25 ℃, about 23 ℃ or temperature of about 20 ℃.
[15]
The housing may further comprise a separate structure, including at least the lower plate. For example, the housing may further comprise a side wall such that with the lower plate form an internal space in which the assembly of the battery cell can be housed. The structure of the housing is not particularly limited, including at least the lower plate.
[16]
The battery module may further include the cooling fins and / or cooling plate. In the cooling fins, for example, it may be placed between the battery cells that are guiding by the projections. At least the cooling fin may be present on top of the convex portions. At this time, the cooling fins may be disposed between the battery cell in a state covering the top surface of the convex portions.
[17]
In Figure 2, it shows a cooling pin 302 which is located in a state covering the top surface of the convex portion of the lower plate 210 between the battery cell 400 by way of example.
[18]
On the other hand, in the cooling plate it may also be positioned between the surface of the lower plate and the battery cell is formed between the convex portions. Figure 2 illustrates such a cooling plate 301 by way of example.
[19]
The battery module may include any one or all of the included, or the both in the cooling fins and a cooling plate.
[20]
Cooling fins and / or cooling plate, may have a thermal conductivity in the range as mentioned in the lower plate, and therefore can be a metal material such as aluminum, gold, Sterling silver, tungsten, copper, nickel or platinum as the lower plate.
[21]
The number of battery cells in a housing is not especially limited to be controlled by the output that is required, etc. Thus, the use of the battery module. The battery cells may be electrically connected to each other.
[22]
The type of the battery cell is not particularly limited, and can be applied to all of the various battery cells known in the art. The battery cells in one example may be a pouch-shaped battery. 3, the pouch-shaped battery 100 may typically include an electrode assembly, electrolyte, and a pouch exterior. 3 is a perspective view schematically showing the configuration of the separation exemplary pouch-shaped battery, Figure 4 is a perspective view of the coupling structure of Fig.
[23]
The electrode assembly 110 contained in the pouch-shaped battery 100, may be at least one positive and one negative electrode plate with a separator arranged between the forms. The electrode assembly 110 includes a single or a wound type winding with a positive electrode plate and a negative plate the separator, it can be divided into a plurality of positive electrode plates and a plurality of negative electrode plate is placed a separator between the laminated alternately stacked and the like.
[24]
The pouch exterior 120 is, for example, may be of a type having an external insulating layer, a metal layer and an inner adhesive layer. The packaging material 120, protection of the electrode assembly 110 and the internal components such as the electrolyte, and in view of the supplement and heat dissipation properties, such as for the electrochemical properties of the electrode assembly 110 and the electrolyte solution comprise a metal thin film of aluminum or the like can. This metal thin film is to ensure electrical insulation of the electrode assembly 110 and an electrolyte, such as the element or cell 100 of the other elements in the external, it may be interposed between the insulating layer formed of an insulating material.
[25]
In one example of the case 120, the upper pouch 121 and may include a lower pouch 122, the upper pouch 121 and a lower pouch 122 is at least one of an inner space of the concave form (I) this can be formed. The inner space (I) of this pouch has an electrode assembly 110 can be housed. The outer peripheral surface of the upper pouch 121 and the pouch bottom 122 is provided with a sealing part (S), is such a sealing part (S) are bonded to each other, the electrode assembly 110 is accommodated in the internal space can be closed.
[26]
And each electrode plate of the electrode assembly 110 includes the electrode tabs, the one or more electrode tabs may be connected to the electrode lead. Electrode leads may function as an electrode terminal of the upper pouch 121 and the pouch bottom 122 sealing portion being disposed exposed to the outside of the packaging material (120) between (S), the secondary battery 100 of the.
[27]
However, the form of the above-described pouch-shaped battery is an illustration, not a battery cell used in the present application be limited to the type as described above. In the present application has variety of pouch-type battery or other types of cells known to be applied both as a battery cell.
[28]
The battery module is a resin layer, for example, the thermal conductivity may also be included in the 2 W / mK or more additional resin layer. The resin layer, between the cooling pin and the convex portion, specifically between the region and the convex portion of the heat sink which covers the convex portion of the top surface, between the cooling plate and the lower plate, the cooling fin with the battery cell of between between the cooling plate or with the battery cell may be present in at least one area. This resin layer can have, and in contact with said cooling fin, the cooling plate, the convex portion, the lower plate and / or the battery cell. In the contact it is in thermal contact. The term thermal contact is a certain amount of space between the resin layer and the cooling fin, the cooling plate, the convex portion, the lower plate and / or the battery cell, even if there may mean a case which can be the heat transfer from one subject to another destination, can.
[29]
The resin layer of the said at least about 10% of the total area of ​​the lower plate, about 15%, at least about 20%, at least about 25%, about 30%, at least about 35% or more, at least about 40%, about 45% or more, it may be covered with about 50% or more, or an area of ​​at least about 55%. At least the resin layer may be covered with a convex portion of the above-mentioned lower plate. The area of ​​the upper limit of the resin layer is not particularly limited, for example, is approximately 100%.
[30]
The term resin layer in the present application, a layer containing a resin component, the resin layer in one example, the adhesive may be a layer. The battery module in one example is the lower plate, the battery cell, said number, which includes a cooling fin and a cooling plate, in contact with both between the cooling pins and a lower plate between and / or the lower plate and the cooling of the plate layers It includes. On the other hand, in the contact, to refer to the aforementioned thermal contact, it said contact is or are the resin layer directly contacts with the bottom plate, or, for other elements, for example, between, such as the resin layer and the lower plate, isolated there is a layer including but may represent a state that is not interfering with the heat transfer to the lower plate, such as that from the other elements to the resin layer. It does not interfere with the transfer of heat from the other elements in between, such as the resin layer and the lower plate (ex. An insulating layer) that is, even if present, the other elements and the total thermal conductivity of the resin layer is approximately 1.5 W / mK or more, about 2 W / mK or more, 2.5 W / mK or more, 3 W / mK or more, 3.5 W / mK or more, or 4 or more W / mK or, or all of, such as the bottom plate in contact with the resin layer and that even though the thermal conductivity of the other component means the case included in the range. The thermal conductivity of the thermal contact is 50 W / mK or less, 45 W / mk or less, 40 W / mk or less, 35 W / mk or less, 30 W / mk or less, 25 W / mk or less, 20 W / mk or less, 15 W / mk or less, and is equal to or less than 10W / mK or less, 5 W / mK or less, 4.5 W / mK or less, or about 4.0 W / mK. This thermal contact is, if the other element is present, can be achieved by controlling the thermal conductivity and / or thickness of the other element.
[31]
The resin layer, may be present in between, if necessary, the cooling fins and / or the cooling plate and the battery cell.
[32]
While still present application the reduction through the adoption of the structure as a general battery module, or a cooling equipment of a variety of fasteners or modules that were required for existing at the time of configuration of a battery pack assembly of such modules, such as a widespread, while ensuring the heat dissipation characteristics , it may implement a storage module that many more battery cells per unit volume. Accordingly, more compact in the present application, lightweight and can provide a high-output battery module.
[33]
As described above, the thermally conductive or thermally conductive region, such as the lower plate may be a contact area with the cooling medium such as cooling water.
[34]
The resin layer, there can be, and filling the space between such or in the form of a thin layer, or the lower plate and the cooling fins and / or cooling plate. The thickness of the resin layer is, for example, range from about 100 ㎛ to 5 mm within the range or about 200㎛ to 5 mm of the can tomorrow. The thinner the resin layer in the structure of the present application, since the glass in the glass, the thick insulating property in the heat dissipation surface, it is possible to set an appropriate thickness in consideration of this point. The thickness, the number of the thinnest portion of the thickness of the resin layer, can be the thickest part thickness or an average thickness of.
[35]
The battery module wherein the resin layer or the resin layer is applied, can have at least one property of the physical properties described below. The various properties described below is not intended to give priority to the different physical properties of any of the physical properties to be independent, the resin layer is to be satisfied of at least one or two or more of the technical properties.
[36]
For example, can the resin layer is a resin layer is thermally conductive, the thermal conductivity may have at least about 2 W / mK or more, 2.5 W / mK or more, 3 W / mK or more, 3.5 W / mK or more, or 4 W / mK. The thermal conductivity is 50 W / mK or less, 45 W / mk or less, 40 W / mk or less, 35 W / mk or less, 30 W / mk or less, 25 W / mk or less, 20 W / mk or less, 15 W / mk may be less than or less, 10W / mK or less, 5 W / mK or less, 4.5 W / mK or less, or about 4.0 W / mK. The lower plate with a resin layer as described above is that the resin layer adhering to the thermally conductive resin layer such as when the number may be the above-mentioned thermal conductivity is 10 W / mK or more sites. At this time, portions of the module case indicative of the thermal conductivity may be a cooling medium, for example, a contact portion as the cooling water. The thermal conductivity of the resin layer is, for example, a numerical value measured according to ASTM D5470 standard, or ISO 22007-2 standard. A manner that the thermal conductivity of the resin layer within the range as described above is not particularly limited. For example, the number may be adjusted via the thermal conductivity is used in the type and / or of the filler resin used in the resin layer of the resin layer. For example, acrylic resin, urethane resin and silicone resin in known resin components that can typically be used as an adhesive agent have another similar heat transfer properties, and the epoxy resin is excellent in thermal conductivity as compared thereto, the olefin-based resin is an epoxy resin it is known to have high thermal conductivity compared to. Therefore, it is possible to select to have the excellent thermal conductivity of the resin is also necessary. However, it is difficult to generally the thermal conductivity of a desired resin component alone is secured, the way that the heat-conductive resin layer includes a filler component excellent in an appropriate ratio as described later can be applied.
[37]
The thermal resistance of the battery module is the resin layer or a resin layer applied on the battery modules 5 K / W or less, 4.5 K / W or less, 4 K / W or less, 3.5 K / W or less, 3 K / W or less, or about 2.8 K / W or less. The heat resistance of such a range, the resin layer or heat radiation efficiency naejineun excellent cooling efficiency when the number of battery modules to control the resin layer is applied can be secured so that it appears. The thermal resistance is how the measurement is not particularly limited. For example, it can be measured according to ASTM D5470 standard, or ISO 22007-2 standard.
[38]
The resin layer, in view of the impact resistance and vibration resistance of the use process of the effective stationary module of the battery cell may have a suitable adhesive force. Be the one illustrated in the resin layer adhesive strength of about 1,000 gf / 10mm or less, about 950 gf / 10mm or less, about 900 gf / 10mm or less, about 850 gf / 10mm or less, about 800 gf / 10mm or less, about 750 gf / 10mm or less, about 700 gf / 10mm or less, and up to about 650 gf / 10mm or less than about 600 gf / 10mm. Adhesion of the resin layer may be at least about 50, at least about 70 gf / 10mm or more, about 80 gf / 10mm or more, or about 90 gf / 10mm In other instances. The adhesive force is, may be a value measured to be about 300 mm / peel rate and 180 ° peel angle of min. Further, the adhesive force can be adhesion to the module case that the resin layer is in contact. For example, in the case where the insulating layer between the said number as the lower plate is in contact with the resin layer on the module case the resin layer formed as described later, the adhesive force with respect to the module case is a module case in which the insulating layer is formed adhesion to be one. If the adhesive force as described above can be secured, it may receive a variety of materials, for example, excellent adhesion to various materials, such as battery cells included in the battery module case naejineun. If this range of adhesive strength is secured, the volume change during charge and discharge of the battery cells in the battery module, the peeling due to curing shrinkage of a resin layer or a change of temperature of the battery modules or the like is prevented has excellent durability can be secured. This adhesive can be, for example, be obtained by forming the resin layer as an adhesive layer. That is, with a known adhesive material can exhibit adhesive strength is well known, in consideration of the adhesive force may be selected such a material.
[39]
The resin layer is also a thermal shock test, for example, by raising the temperature again, the mixture was kept at a low temperature of about -40 ℃ 30 minute 80 ℃ battery the cycle by one cycle of that continued for 30 minutes after the thermal shock test which repeated 100 times away from the module housing or the battery cells of the module, and the peeling or crack or may be required to be formed so that this will not occur. For example, there is a level of performance as described above may be required in order to be durable if the battery module is applied to products that require a long warranty period (in the case of cars, more than 15 years), such as cars secured.
[40]
The resin layer may be a number of electrically insulating layers. Maintain the capacity of the battery module by the resin layer in the above structure represents the electrical insulation, and it is possible to ensure stability. Be an electrically insulating resin layer, a dielectric breakdown voltage of about 3 kV / mm or more measured in accordance with ASTM D149, of about 5 kV / mm or more, about 7 kV / mm or more, 10 kV / mm or more, more than 15 kV / mm or 20 kV / mm can be at least. The dielectric breakdown voltage but is not that figure particular limitation to exhibit more the resin layer excellent high insulating properties is, the number when considering the composition of the resin layer from about 50 kV / mm or less, 45 kV / mm or less, 40 kV / mm or less , it can be not more than 35 kV / mm or less, 30 kV / mm. Above and can be controlled by adjusting the insulation of the resin component of the resin layer is also the dielectric breakdown voltage of, for example, the number can be adjusted to the dielectric breakdown voltage by applying an insulating filler in the resin layer. In general, a ceramic filler that will be described later in the thermally conductive filler has been known as a component that can ensure an insulation property.
[41]
A resin layer, a flame-retardant resin layer can be applied in consideration of the reliability. The term flame-retardant resin layer can in this application can mean a resin layer showing a V-0 rating in the (Vertical Burning Test) UL 94 V Test. This can ensure the stability of the fire and other accidents that may occur in the battery module.
[42]
The resin can share 5 or less. The specific gravity may be 4.5 or less, 4 or less, 3.5 or less, or 3 or less in other examples. Could represent the proportion of this range, the resin layer is advantageous for the production of a more lightweight battery modules. Since the specific gravity of the figure is lower the glass to the weight of the module, the lower limit is not particularly limited. For example, the specific gravity is about 1.5 or more, or may be 2 or more. It may be the resin layer can be a component that is added to the resin layer to indicate the portion of the range, such as the control. For example, as much as possible thermal conductivity desired in the lower specific gravity at the time of addition of the thermally conductive filler is applied to the filler, that is, a low specific gravity itself filler that can be secured, or surface treatment include methods of applying consisting of fillers can be used have.
[43]
The resin layer is not possible, it is appropriate to include a volatile substance. For example, the resin layer may have a ratio of non-volatile components can be 90% or more, 95% or at least 98% by weight or more. Nonvolatile minutes and that ratio in the above may be defined in the following manner. That is, the portion which remains the non-volatile swelling resin layer after holding at 100 ℃ for about one hour can be defined as a non-volatile content, and thus the ratio is maintained for about one hour at the initial weight and the 100 ℃ of the resin layer after the rate can be measured by the standard.
[44]
Further, the resin layer would have excellent resistance to deterioration, if necessary, a module case or pyomyeonga stability which does not react chemically with potential of the battery cell may be required.
[45]
The resin layer may also be advantageous to have a lower shrinkage after the curing or hardening. This can prevent the occurrence of peeling or voids that can occur in the use of the module manufacturing process naejineun. The shrinkage ratio can be properly adjusted in a range capable of exhibiting the above-described effects, for example, it may be less than 5%, less than 3% or about 1%. The shrinkage ratio, so that value is lower the glass, the lower limit is not particularly limited.
[46]
The resin layer also may be advantageous to have a low coefficient of thermal expansion (CTE). This can prevent the occurrence of peeling or voids that can occur in the use of the module manufacturing process naejineun. The thermal expansion coefficient can be appropriately adjusted in which may represent the above-mentioned effective range, e.g., 300 ppm / K is less than, 250 ppm / K is less than, 200 ppm / K is less than, 150 ppm / K or less than about 100 ppm / K can be less. The coefficient of thermal expansion, so the figure is lower the glass, the lower limit is not particularly limited.
[47]
The resin layer may be a tensile strength properly adjusted, it is excellent in impact resistance, etc. is obtained from may be a module that looks appropriate durability provided. The tensile strength (tensile strength), for example, may be adjusted in the range of at least about 1.0 MPa.
[48]
The resin can be elongation (elongation) is properly adjusted, it has excellent impact resistance can be secured through this module looks to provide adequate durability. Elongation, for example, may be adjusted in the range of about 10% or higher, or at least about 15%.
[49]
The resin layer may also be advantageous to display the appropriate hardness. For example, you can have the hardness of the resin is too high, the resin may become too brittle (brittle) it may adversely affect reliability. In addition, it can secure the impact resistance, vibration resistance by adjusting the hardness of the ground floor, and it is possible to ensure the durability of the product. The resin layer is, for example, Shore (shore) is less than the hardness of the A type 100, 99 or less, 98 or less, 95 or less or 93 or less, or, the hardness in Shore D type 80, less than about 70 or less or about 65 or less, or may be about 60 or less. The lower limit of the hardness is not particularly limited. For example, the Shore hardness (shore), or a hardness of less than 60 in the A type, the hardness in Shore (shore) OO type can be on the order of 5 or more or about 10 or more. The hardness of the resin layer is usually from being influenced by the kind of the filler to the ratio contained in the resin layer, if containing an excessive amount of the filler, the higher the normal hardness. However, resin ingredients contained in the resin layer, as a silicon-based resin generally showing a lower hardness than the other resin such as epoxy or urethane affect its hardness.
[50]
The resin layer, or may be at least 5% by weight loss or a (5% weight loss) temperature of 400 ℃, 70% by weight 800 ℃ remaining in thermogravimetric analysis (TGA). With such a characteristic can be improved in stability at high temperatures of the battery modules. 800 ℃ the residual amount is at least about 75% by weight or more, about 80% by weight or more, at least about 85% by weight or about 90% by weight in another example. 800 ℃ the residual amount can be up to about 99% by weight in another example. The thermogravimetric analysis (TGA) can be measured in the range of 25 ℃ to 800 ℃ to 20 ℃ / min under temperature rise rate of 60 cm3 / min in the atmosphere of nitrogen (N2). The thermogravimetric analysis (TGA) results can also be achieved through a number of adjustment of the composition of the resin layer. For example, 800 ℃ level is usually dependent on the type and to the ratio of the filler contained in the resin layer, if containing an excessive amount of the filler, the residual amount increases. However, the silicone-based resin wherein the residual amount is more general, since the high and high heat resistance as compared with other resin such as epoxy or polyurethane, thus resin ingredients contained in the resin layers affects the hardness.
[51]
The type of the resin layer may be an effective fixing of the battery cell, so long as it can be given the above-mentioned physical properties as needed is not particularly limited, a curing resin material can be used all well-known. A material that can be used include an acrylic resin, an epoxy resin, there may be mentioned urethane-based resin, olefin resin, urethane resin, EVA (Ethylene vinyl acetate) resin or silicone resin or the like, and there is the resin layer comprising the resin can do. The resin layer may include a resin as a main component among resin components. That is, the acrylic resin in the total resin components contained in the resin layer, epoxy resin, urethane resin, olefin resin, urethane resin, EVA (Ethylene vinyl acetate) resin or silicone resin or the like is about 70%, by weight or more, can be included about 75%, about 80%, at least about 85%, or at least about 90%. The ratio can be up to about 99% or less, or about 95%.
[52]
Be material for forming the resin layer, i.e., the resin composition, may be in the adhesive material as described above, and solvent-based, but may be of water-based or solvent-free, in consideration of the convenience of manufacturing process to be described later appropriate to the number of solvent-resin can.
[53]
Resin material and the like active energy ray curing type, moisture curing type, thermosetting type or room temperature curing, can also considering the convenience of the manufacturing process such as described below appropriate to the room temperature curing type.
[54]
The resin layer may include a filler in view of the above, thermal conductivity, insulating properties, heat resistance (TGA analysis), or specific gravity. Through the use of a suitable filler can be secured, such as the thermal conductivity of the above-mentioned range. In one example of the filler may be a thermally conductive filler. The term thermally conductive filler in the present application, the thermal conductivity is meant from about 1 W / mK or more, about 5 W / mK or more, about 10 W / mK or more, or about 15 W / mK or more materials. The thermal conductivity of the thermally conductive filler may be up to about 400 W / mK or less, about 350 W / mK or less, or about 300 W / mK. The type of thermally conductive filler that can be used is not particularly limited and may be applied to a ceramic filler in consideration of the insulating property and the like. For example, a ceramic particle such as alumina, AlN (aluminum nitride), BN (boron nitride), silicon nitride (silicon nitride), SiC, or BeO may be used. Also, if the insulating characteristic of the resin layer can be ensured, the application of carbon fillers such as graphite (graphite) may also be considered. Form or content of the filler contained in the resin layer is not particularly limited, and considering also sedimentation potential, it is an object thermal conductivity naejineun heat resistance in the viscosity number of the resin composition, the resin layer, insulating, filling effect or dispersibility including selection It can be. In general, the larger the size of the filler is more likely to settle in the filler increases the viscosity of the resin composition, the resin layer. In addition, the smaller size tends to have higher heat resistance. Therefore, in consideration of the point described above, and a filler of the appropriate kind may be selected, it is also possible to use two or more kinds of fillers as required. Further, in consideration of the amount to be filled it is to use a spherical filler of glass, but may also be used in consideration of the form or the form of a network of conductive fillers, such as needle-shaped or plate-shaped. The number in one example of the resin layer may include a thermally conductive filler in the average particle diameter of from 0.001 to 80 ㎛ ㎛. The average particle size of the filler may be 0.01 ㎛, at least 0.1, at least 0.5㎛, more than 1 ㎛, over 2㎛, over 3㎛, 4㎛ over, or approximately over 5㎛ 6㎛ than in other examples. The average particle size of the filler is less than about 75㎛ In another example, about 70㎛ hereinafter 65㎛ hereinafter 60㎛ hereinafter 55㎛ hereinafter 50㎛ hereinafter 45㎛ hereinafter 40㎛ hereinafter 35㎛ hereinafter 30㎛ or less, up to about 25㎛, about 20㎛ hereinafter 15㎛ or less, and is about less than or about 10㎛ 5㎛ less.
[55]
The percentage of the filler contained in the resin layer, for the above-mentioned properties, e.g., thermal conductivity, can be selected in consideration of the characteristics of the resin layer so that the insulating property and the like can be secured. For example, the filler, the resin component of the resin 100 parts by weight of the preparation can be included in the range from about 50 to 2,000 parts by weight. By weight of said filler portion to about 100 parts by weight In another example parts or more, about 150 parts by weight or more, about 200 parts by weight or more, and about 250 parts by weight or more, about 300 parts by weight or more, about 350 parts by weight or more, about 400 parts by weight or more, about 500 parts by weight or more, about 550 parts by weight or more, at least about 600 parts by weight or more or about 650 parts by weight.
[56]
The resin layer, adjusting the needed viscosity, such viscosity control agents, for viscosity control in accordance with the increase or or or shear force to lower the viscosity of example, for example, thixotropy imparting agent, a diluent, dispersing agent, surface treating agent or a coupling agent there may be and including further.
[57]
Thixotropy imparting agents may be by adjusting the viscosity according to the shear force of the resin composition to occur to the production process of battery module effectively. Thixotropy imparting agents that can be used are, there is a fumed silica and the like can be illustrated.
[58]
Diluent or dispersant as long as they can exhibit the action described above to be used for a lower viscosity of the resin composition generally may be used without limiting the kind of the various known in the industry.
[59]
Surface-treating agent is for the surface treatment of filler which is incorporated in the resin layer, so long as it can exhibit the effect as described above can be used without limitation to the various known types on the market.
[60]
If the coupling agent is, for example, it can be used to improve the dispersibility of the heat conductive filler such as alumina, so long as it can exhibit the effect as described above can be used without limitation to the various known types on the market.
[61]
The resin layer may further include a flame retardant or flame retardant such aid. This resin layer may be formed of the flame-retardant resin layer. A flame retardant are a variety of known flame retardant can be applied without particular limitations, for example, may be applied, such as a filler in the form of solid flame retardant and a flame retardant liquid. Flame retardants include, for example, cyano melamine, but the inorganic flame retardant such as an organic flame retardant such as a click rate, or magnesium hydroxide, such as the (melamine cyanurate), but is not limited thereto.
[62]
When the amount of the filler filled in the resin layer may be used for many flame-retardant material of the liquid type (TEP, Triethyl phosphate or TCPP, tris (1,3-chloro-2-propyl) phosphate, and so on). Further, the silane coupling to the action of the flame retardant synergist ring I may be added.
[63]
The resin layer may include any of the components of one or two or more kinds.
[64]
In one example of the battery module may further include an insulating layer between the lower plate and the, or between the resin layer of the battery cell and the bottom plate, cooling fins and / or cooling plate. The addition of the insulating layer it is possible to prevent problems such as electrical short-circuiting phenomenon or fire according to the contact of the cell and the case by the impact that can occur during use. The insulating layer can be formed by coating naejineun of material having a high insulating property and thermal conductivity of the insulating insulation formed from a sheet, or with injection. For example, a process of forming an insulating layer before the injection of the resin composition in the production method of the battery module, which will be described later can be performed. Forming the insulating layer may be applied include so-called (Thermal Interface Material) TIM. In another method the insulating layer is bonded may be made of a material, for example, it may be the content of the filler such as the thermally conductive filler with little or no use of the resin layer to form an insulating layer. A resin component which can be used in the formation of the insulating layer, an acrylic resin, PVC (poly (vinyl chloride)), olefin resin, epoxy resin, silicone, or such as PE (polyethylene), EPDM rubbers ((ethylene propylene diene monomer rubber) Although such rubber component, such as may be illustrated, but is not limited to the insulating layer, a dielectric breakdown voltage of about 5 kV / mm or more measured in accordance with ASTM D149, of about 10 kV / mm, at least about 15 kV / mm may be at least, 20 kV / mm or more, 25 kV / mm or higher, or 30 kV / mm. the dielectric breakdown voltage is not the figure is high, more particularly restricted to exhibit excellent insulating property, for example, the breakdown voltage of the insulating layer may be up to about 100 kV / mm or less, 90 kV / mm or less, 80 kV / mm or less, 70 kV / mm or less, or 60 kV / mm. the thickness of the insulating layer of the insulating layer in consideration of the insulating property and thermal conductivity it can be set in an appropriate range, for Surface, can be on the order of at least about 5㎛ least about 10㎛ disorders, 20㎛, 30㎛ disorders, 40㎛, 50㎛ disorders, 60㎛, or more, at least 80㎛ or 90㎛ 70㎛. In addition, the upper limit of thickness is not particularly limited, and for example, may be up to about 1 mm or less, about 200㎛ hereinafter 190㎛ hereinafter 180㎛ hereinafter 170㎛ or less, or 160㎛ 150㎛.
[65]
This application is also, for the battery module, for example, relates to a method of producing the above-mentioned battery modules.
[66]
Method for producing a module as described above is not particularly limited, and the surface of the bottom plate, the cooling fins and / or the cooling plate and the fold library cell after the formation of the resin composition layer using the resin composition described above to at least the convex portion It may comprise the step of receiving. At the appropriate time during the process, the step of curing the resin composition may be to do anything more.
[67]
The term resin composition in the present application, can sense the state of a number of pre-cured resin layer, and the term resin may refer to the state of the resin layer after curing.
[68]
Method of forming a resin composition layer of the lower plate may be not particularly limited and performed according to a known method.
[69]
In the resin composition of the kinds is not particularly limited, it is possible to select the desired type of suitable resin compositions which may exhibit the physical properties of.
[70]
For example, the resin composition is injected from above, may be a resin composition capable of forming a resin layer containing a component meet or physical properties, therefor, such as the above-described heat-conductive.
[71]
This resin composition may be the above-mentioned solvent-based, water-based or solventless type resin composition can be suitably solventless resin composition.
[72]
In addition, the resin composition and the like active energy ray curing type, moisture curing type, thermosetting type or room temperature-curable resin composition, may be suitably from room temperature-curable resin composition.
[73]
The resin composition may be a resin composition containing one or more of various additives such as the aforementioned thermally conductive filler.
[74]
Such resin composition is one-component, it may be composed of two-part or three-part and so on.
[75]
There is such a resin composition can be cured, if necessary, when the method of curing the resin composition is not particularly limited.
[76]
For example, the resin composition is an active energy ray curing type of case, for applying the appropriate column in the case of method, thermosetting maintaining under suitable humidity in the case of method, the moisture-curing to irradiation with an active energy beam such as ultraviolet rays to the resin composition If the room temperature curing method or the like method may be to keep the resin composition at room temperature to perform the steps:
[77]
In addition, prior to curing or hardening process or in the time and fairness chosen etc. stored before or storage process of the battery cell, for example in conditions that affect the stability of the battery cell to apply the short-time heat so that about 40 ℃ to 50 ℃ may.
[78]
The present application also relates to a resin which can be used to forming the above-mentioned production method or battery module of the above-mentioned structure of the composition.
[79]
In the resin composition as described above, so long as it may be possible to effectively fixing the battery cell and the above-mentioned physical properties given as needed is not particularly limited and can be used all of the known resin composition.
[80]
This resin composition, the acrylic resin composition, an epoxy resin composition, the urethane resin composition, the olefin-based resin composition, the urethane resin composition, EVA (Ethylene vinyl acetate) based, but can include a resin composition or the silicone resin composition or the like, but are not limited to, .
[81]
The resin composition, solvent type resin composition, the resin composition may be a water-based or solventless type resin composition can be suitably solventless resin composition.
[82]
The resin composition, and the like active energy ray-curable resin composition, the moisture-curing resin composition, thermosetting resin composition or a room temperature curing resin compositions, may be suitably from room temperature-curable resin composition.
[83]
For example, consider a known acrylic adhesive, an epoxy adhesive, a urethane adhesive, an olefinic adhesive, an additive such as the above-mentioned filler into the resin composition capable of forming an adhesive or a silicone adhesive-based EVA (Ethylene vinyl acetate) object properties the resin composition prepared by adding an appropriate amount can be applied to the above-described method.
[84]
The resin composition as described above, in view of the room temperature-curing, etc., may include a radical initiator thereto, and for the catalyst. For example, the resin composition may include a catalyst for the initiator such as a peroxide initiator, and acyl-toluidine (toluidine) compounds such as benzoyl peroxide, may be implemented by an appropriate curing system thereto.
[85]
The resin composition may comprise a variety of components, if necessary, in addition to the above components.
[86]
The present application also relates to a battery pack including the battery pack, for example, two or more of the foregoing battery module. The battery modules in the battery pack can be electrically connected to each other. 2 how to configure the battery pack to electrically connect the one or more battery modules are not particularly limited and may be applied to both a known manner.
[87]
The present application also relates to a device including the battery module or the battery pack. Examples of the apparatus but include an automobile such as an electric car, but not limited to, may be included in all applications that require the output to the secondary battery. For example, the method of using the battery module or a battery pack configured for the motor vehicle is not particularly limited, and a general method may be used.
Effects of the Invention
[88]
In this application there is a volume output compared while being manufactured in a simple process and low cost can be excellent, and provides excellent battery module, a method of manufacturing such heat dissipation properties and the resin composition for use in the method of manufacturing the same.
Brief Description of the Drawings
[89]
1 and 2 is a diagram showing the structure of an exemplary battery module.
[90]
Figures 3 and 4 is a diagram showing an exemplary pouch-shaped battery.
[91]

[92]
100: battery cell assembly
[93]
200: Housing
[94]
210: lower plate
[95]
301: cooling plate
[96]
302: cooling fin
[97]
400: Battery cells
[98]
100: pouch-shaped battery
[99]
110: electrode assembly
[100]
120: exterior
[101]
121: upper par Butch
[102]
122: lower pouch
[103]
S: 실링부
Mode for the Invention
[104]
Through the following examples and comparative examples describe the battery module of the present application but is not limited by the scope set forth the scope of the present application.
[105]
[106]
1. The thermal conductivity of the resin Assessment Method
[107]
Be the thermal conductivity of the resin layer is measured according to ASTM D5470 standard. That is, after placing the resin layer between the two copper bars (copper bar) according to the specifications of ASTM D 5470 one of the two copper bars are brought into contact with the heater, and the other is the later in contact with the cooler (cooler) made (state showing a temperature variation of no more than about 0.1 ℃ for 5 minutes) and the heater so as to maintain a constant temperature, thermal equilibrium by adjusting the capacity of the cooler. Column to measure the temperature of each copper bar in a state of equilibrium, and therefore the thermal conductivity of the formula (K, unit: W / mK) were evaluated. Heat transfer pressure is also applied to the resin layer during the evaluation is about Kg 11/25 cm 2 was controlled such that the degree of the thermal conductivity was calculated based on the final thickness when the thickness of the resin layer is changed during the measurement process.
[108]

[109]
K = (Q×dx)/(A×dT)
[110]
In the above formula, K is the thermal conductivity (W / mK), Q is an hour moved column by column (in W) is, dx is the resin layer thickness (unit: m) of a, A is the cross-sectional area of ​​the resin layer (unit: and m2), dT is the temperature difference (in units of copper rod: a K).
[111]
[112]
2. The share valuation method
[113]
The proportion of the resin was measured according to ASTM D792 standard. For example, after it weighed again in the water after weighed the resin layer in accordance with the standard calculation of the density and specific gravity from the difference of the measured weight, or powder and pellet (pellet) a predetermined amount (ex. About 5 g ) were dissolved in a measured volume already in the pyrometer, one can calculate the ratio from the difference in weight and volume in 73.4F °.
[114]
[115]
3. Method of thermogravimetric analysis (TGA, Thermogravimetric Analysis)
[116]
Use the TA400 TA Instrument's equipment was carried out thermal gravimetric analysis. The resin was performed using analysis of about 10 mg, assay 25 ℃ to a temperature range of 800 ℃, heating rate 20 ℃ / min and 60 cm 3 / min of nitrogen (N 2 was performed under analysis) atmosphere.
[117]
[118]
4. The breakdown voltage measurement
[119]
The breakdown voltage of the resin was evaluated according to the ASTM D149 standard. Breakdown voltage is the material means that the voltage applied to the point of losing the insulating and conductive rapidly increases from a certain level of high voltage to lose insulating properties. As the breakdown of the minimum voltage required to cause a breakdown voltage, and insulation it is causing arcing completely through through the specimen. The voltage change ratio (voltage gradient) can be obtained by dividing the voltage of the destroyed moment in insulation thickness. Backman Industrial PA70-1005 / 202 apparatus using the dielectric breakdown voltage was measured, and such that when the thickness of the specimen (resin layer) is to be about 2mm, a diameter of approximately 100mm.
[120]
[121]
5. The adhesion measurements
[122]
An insulating film (epoxy and / or polyester-based insulating layer) was attached by using the bottom plate and the PET be a film resin (poly (ethylene terephthalate)) of the aluminum-made module case is formed, the width to be attached at this time is about 10 mm It was adjusted to be about. The thickness of the resin when was approximately 1 mm. The attachment is carried out to cure them after loading (loading) of the uncured resin composition is provided between the insulating film and the PET film. Then, the adhesion and peeling off the PET film from the insulation side at a rate of 180 degrees and a peel angle of about 300 mm / min is measured.
[123]
[124]
6. Determination of hardness
[125]
The hardness of the resin layer was measured according to ASTM D 2240, JIS K 6253 standard. Shore A, durometer was performed using a hardness instrument, and samples of the flat state under the load (about 1.5 Kg) to the surface than 1 Kg of (resin layer) measuring the initial hardness, by checking the measured values ​​stabilized after 15 seconds evaluate the hardness.
[126]
[127]
7. Reliability of the Battery Module
[128]
The reliability of the battery module was evaluated by measuring the heat resistance and the temperature of the module. Thermal resistance of the battery module, type and position the module between the upper and lower blocks of a measuring instrument, by running DynTIM Tester software of a computer (controlling computer), and determines the heating (heating) current and the measured time and the like on Software and it was complete the setting of the parameters, such as measuring the pressure, thermal resistance measurement conditions, evaluating the heat resistance to measure the heat resistance by the T3Ster and DynTIM tester with software that is controlled measuring conditions. The module temperature was measured by attaching a contact-type thermometer by the position of the module. The heat resistance and the module temperature was measured in the state in which the lower plate of the battery module in contact with the liquid cooling system. Reliability in accordance with the respective evaluation results were classified according to the following criteria.
[129]

[130]
Awards: thermal resistance 2.5 K / W or less
[131]
Of: the thermal resistance 2.5 K / W to exceed 3 K / W or less
[132]
Bottom: heat resistance 3 K / W exceeds
[133]

[134]
A: the temperature is below 50 ℃
[135]
H: the temperature is greater than 50 ℃
[136]
[137]
Example 1.
[138]
Preparation of resin composition
[139]
2-part urethane adhesive composition is: (1㎛ to 60㎛ particle size distribution) for the two-part urethane adhesive composition of about 3 after curing (subject:: HP-3753 (KPX Chemical Company), a curing agent TLA-100 (Asai helicase)) on alumina W / amount which may represent the thermal conductivity of mK is mixed with (2 solution total solid content 100 parts by weight compared to about 600 to 900 parts by weight within the range of decrease), and room temperature viscosity of preparing a medicine 250,000 cP degree of the resin composition, to this battery It was applied to the manufacture of the module.
[140]
[141]
Manufacture of battery modules
[142]
The shape of the battery module as shown in Fig. 2 by using the produced resin composition was prepared. Figure 2 in the form of lower plate 101, the cooling fin 201 and cooling plate 202 were all made of aluminum. And mounting the battery cell between the cost for manufacturing the resin composition after the coating so as to cover the entire bottom plate equipped with a cooling fin and a cooling plate in its upper portion, respectively, and mounted so as to cover the convex portions of the surface of the cooling fins on the surface of the lower plate , to cure the resin composition to prepare a battery module.
[143]
[144]
Example 2.
[145]
Preparation of resin composition
[146]
Two-component silicone adhesive composition of about 3 W / mK is the: (1㎛ to 60㎛ particle size distribution) of the two-component silicone adhesive composition after curing (subject:: SL5100A (KCC agent), curing agent SL5100B (KCC agent)) on alumina for the production of a mixture in an amount that can represent the thermal conductivity (second solution total solid content of 100 parts by weight of about 800 to 1200 parts by weight within the range of negative contrast), the room temperature viscosity of preparing a resin composition by about 130,000 cP, and to this battery module, It was applied.
[147]
[148]
Manufacture of battery modules
[149]
And is the battery module in the same manner as in Example 1 except for using the above prepared resin composition was prepared.
[150]
[151]
Example 3.
[152]
2-part urethane adhesive composition is: (1㎛ to 60㎛ particle size distribution) for the two-part urethane adhesive composition of about 3.5 after curing on alumina (subject:: PP-2000 (KPX Chemical Company), a curing agent TLA-100 (Asai helicase)) a mixture in an amount that can represent the thermal conductivity of W / mK (2 solution total solid content 100 parts by weight compared to about 600 to 900 range by weight of I), except that the room temperature viscosity with a resin composition prepared so that about 350,000 cP and the battery module was prepared in the same manner as in example 1.
[153]
[154]
Example 4.
[155]
Alumina in the epoxy adhesive composition of the room temperature curing type available from Kukdo Chemical (particle size distribution: 1㎛ to 60㎛) the adhesive composition is an amount that can exhibit a thermal conductivity of approximately 3 W / mK even after hardening (two-liquid total solid content 100 by mixing in parts by weight compared to about 600 to 900 inclusive) portion, it was prepared, and the battery modules in the same manner as in example 1 except that the viscosity at room temperature with a resin composition prepared so that about 500,000 cP.
[156]
[157]
Example 5.
[158]
2-part urethane adhesive composition after about two: (1㎛ to 60㎛ particle size distribution) for the two-part urethane adhesive composition cured (subject:: PP-2000 (KPX Chemical Company), a curing agent TLA-100 (Asai helicase)) on alumina a mixture in an amount that can represent the thermal conductivity of W / mK (2 solution total solid content 100 parts by weight compared to about 400 to 900 range by weight of I), except that the room temperature viscosity with a resin composition prepared so that about 150,000 cP and the battery module was prepared in the same manner as in example 1.
[159]
[160]
Example 6.
[161]
Embodiment, but the same manufacturing the battery module as in Example 5, to prepare a module, so that the resin composition to cover about 50% of the area of ​​the lower plate.
[162]
[163]
Comparative Example 1.
[164]
Two-component silicone adhesive composition (subject: SL5100A (KCC agent), curing agent: SL5100B (KCC agent)) is the two-component silicone adhesive composition of the graphite (graphite), the amount that can represent a thermal conductivity of about 1.5 W / mK even after curing in and is the same as the battery module as in example 2 except that a mixture (2 solution total solid content 100 parts by weight of about 100 to 300 parts by weight within the range of negative contrast), the room temperature viscosity with a resin composition prepared so that about 2,000,000 cP It was prepared.

Claims
[Claim 1]
A module case for a battery cell having a lower plate which is formed of two or more convex portions for guiding; A plurality of battery cells is mounted between the convex portion; Cooling plate existing between the surface of the bottom plate between the convex portion and the battery cell; And and in contact with said cooling fin and a convex portion between the convex portion of the upper surface with a covering state including a cooling fin disposed between the plurality of battery cells, wherein the cooling fin and the convex portion of the lower plate, the thermal conductivity is 2 W / mK battery module also includes a resin or higher.
[Claim 2]
The method of claim 1, wherein the lower plate has a thermal conductivity of 10 W / mK or more battery modules.
[Claim 3]
The method of claim 1, wherein the lower plate includes a battery module in contact with the water-cooling system and thermal.
[Claim 4]
The method of claim 1, wherein the cooling fin and a cooling plate is a thermal conductivity of 10 W / mK or more battery modules.
[Claim 5]
The method of claim 1, wherein the resin layer, the battery modules covering more than 10% of the area of ​​the total area of ​​the lower plate.
[Claim 6]
The method of claim 1, wherein the resin layer has a thermal conductivity of 3 W / mK or more battery modules.
[Claim 7]
The method of claim 1, wherein the resin layer is the dielectric breakdown voltage is 10 kV / mm or more battery modules.
[Claim 8]
The method of claim 1, wherein the resin layer has a specific gravity of 5 or less battery module.
[Claim 9]
The method of claim 1, wherein the resin layer is a thermogravimetric analysis (TGA) 800 ℃ remaining amount is 70 wt% or more battery module.
[Claim 10]
The method of claim 1, wherein the resin layer, an acrylic resin, epoxy resin, urethane resin, olefin resin, a battery module including the EVA resin or silicon resin.
[Claim 11]
The method of claim 1, wherein the resin layer is a battery module including a filler.
[Claim 12]
12. The method of claim 11, the filler, the ceramic particles or carbon-based filler of the battery module.
[Claim 13]
The method of claim 1, wherein the resin layer is, thixotropic imparting agents, diluents, dispersing agents, surface treating agents, a flame retardant or a coupling agent, a battery module including a.
[Claim 14]
Of claim 1 including two or more battery modules, wherein the two or more battery modules are electrically connected to each other in the battery pack.
[Claim 15]
The car comprising a battery module or a battery pack of claim 14 to claim 1.