Abstract: Disclosed is a bidirectional DC/DC converter comprising: a primary-side circuit that includes a first DC power source or a first load; a secondary-side circuit that includes a second load or a second DC power source; a power transmission section that is capable of power transmission in both directions between the primary-side circuit and the secondary-side circuit; and a control section that controls the primary-side circuit and the secondary-side circuit in such a way that current flows through the power transmission section from the first DC power source to the second load or from the second DC power source to the first load.
Field of the Invention
The present invention relates to a bidirectional DC/DC
converter configured such that when a DC power source and a
load are connected to two terminals, respectively, a desired
DC power can be supplied to one terminal to which the load
is connected from the other terminal to which the DC power
source is connected.
Background of the Invention
Recently, with the remarkable progress in power
electronics technology, a power conversion technology in
which a DC power or AC power supplied from a DC power source
or AC power source is converted into a desired power without
substantial power loss using a semiconductor switch or the
like has been attracting attention. In particular, in
recent years requiring environmental considerations in using
the power, it becomes important to efficiently use
electrical energy of a storage battery such as a fuel cell,
a solar cell, and a secondary cell (hereinafter, referred to
as "storage battery or the like") in addition to electrical
energy available from an existing commercial power source.
For this reason, power conversion technology in power
electronics field has become indispensable now. A
semiconductor switch used in the power conversion apparatus
as such converts freely and broadly the power, and performs
on-of f switching at a high frequency. Thus, in the power
conversion, it is required to suppress the switching loss or
noise caused by switching of the semiconductor switch.
As a switch for suppressing the switching loss or
noise in the power conversion, for example, there is one
disclosed in Patent Document 1. Patent Document 1 discloses
a bidirectional current switch regenerating snubber energy.
In the disclosed switch, four semiconductor switch elements
without reverse blocking capability, each having a reverse
conducting diode and P-MOSFET connected in parallel, are
connected in a full bridge, and a capacitor for absorbing
the snubber energy is connected between the upper and lower
sides of electric potential. The operation of the
bidirectional current switch as such will be described with
reference to FIG. 8. FIG. 8 is an explanatory diagram
showing a circuit configuration of a conventional
bidirectional current switch.
Referring to FIG. 8, a full-bridge circuit is
connected between a current terminal 7 and a current
terminal 8. The full-bridge circuit is configured by
parallel connection of a first series circuit including a
semiconductor switch 1A and a semiconductor switch 1B which
do not have a reverse blocking capability and are connected
in the reverse direction, and a second series circuit
including a semiconductor switch 1C and a semiconductor
switch 1D which do not have a reverse blocking capability
and are connected in the reverse direction.
Further, each of the semiconductor switches 1A to 1D
may be constituted by, e.g., a p-channel metal-oxide-
semiconductor field-effect transistor (P-MOSFET) and a
parasitic diode connected in parallel thereto. Furthermore,
a snubber capacitor 4 is provided between midpoints of the
first series circuit and second series circuit so as to
connect the midpoints thereof. In the first series circuit,
a drain electrode Da of the semiconductor switch 1A is
connected to a drain electrode Db of the semiconductor
switch 1B. In the second series circuit, a source electrode
Sc of the semiconductor switch 1C is connected to a source
electrode Sd of the semiconductor switch 1D.
Further, a source electrode Sa of the semiconductor
switch 1A and a drain electrode Dc of the semiconductor
switch 1C are connected to the current terminal 7. In
addition, a source electrode Sb of the semiconductor switch
1B and a drain electrode Dd of the semiconductor switch 1D
are connected to the current terminal 8. In this
bidirectional current switch, gate control signals are
respectively applied to gate electrodes Ga to GD of the
semiconductor switches 1A to 1D from a control circuit (not
shown, hereinafter the same), so that the semiconductor
switches 1A to 1D perform an on-of.f operation in response to
the gate control signals applied to the gate electrodes Ga
to GD.
First, in the case where the current flows in the
forward direction to the current terminal 8 from the current
terminal 7, the control circuit sends the gate control
signals to the gate electrode Gb of the semiconductor switch
1B and the gate electrode Gc of the semiconductor switch 1C
to turn on the semiconductor switch 1B and the semiconductor
switch 1C at the same time. At this time, the control
circuit does not send the gate control signals to the gate
electrode Ga of the semiconductor switch 1A and the gate
electrode Gd of the semiconductor switch 1D. However, since
the current flows in the forward direction of each parasitic
diode by the parasitic diode of each of the semiconductor
switch 1A and the semiconductor switch 1D, the current flows
through the semiconductor switch 1A and the semiconductor
switch 1D. Accordingly, the current flows in the direction
from the current terminal 7 to the current terminal 8.
On the other hand, in the case where the current flows
in the backward direction to the current terminal 7 from the
current terminal 8, the control circuit sends the gate
control signals to the gate electrode Ga of the
semiconductor switch 1A and the gate electrode Gd of the
semiconductor switch 1D to turn on the semiconductor switch
1A and the semiconductor switch 1D at the same time. At
this time, the control circuit does not send the gate
control signals to the gate electrode Gb of the
semiconductor switch 1B and the gate electrode Gc of the
semiconductor switch 1C. However, since the current flows
in the forward direction of each parasitic diode by the
parasitic diode of each of the semiconductor switch 1B and
the semiconductor switch 1C, the current flows through the
semiconductor switch 1B and the semiconductor switch 1C.
Accordingly, the current flows in the direction from the
current terminal 8 to the current terminal 7.
Thus, according to the bidirectional current switch,
by alternately driving a pair of the semiconductor switches
1A and 1D located on a diagonal line and a pair of the
semiconductor switches 1B and 1C located on a diagonal line,
the current may flow in both forward and backward directions
between the current terminal 7 and the current terminal 8.
Further, when blocking the current between the current
terminal 7 and the current terminal 8 in the bidirectional
current switch, the control circuit turns off the driven
semiconductor switches by stopping the application of the
gate control signal to each of the gate electrodes of the
semiconductor switches to which the gate control signals
have been applied among the semiconductor switches 1A to 1D.
Thus, the current that had been flowing during the ON time
is diverted to the snubber capacitor 4 and the snubber
capacitor 4 is charged until the current becomes zero.
A voltage across the snubber capacitor 4 increases
until the current flowing through the snubber capacitor 4
becomes zero, and the current of the bidirectional current
switch is blocked automatically by the parasitic diode of
the semiconductor switch such that no current flows. Next,
when the current is allowed to flow through the
bidirectional current switch, for example, when the gate
control signals are respectively applied to the gate
electrode Ga of the semiconductor switch 1A and the gate
electrode Gd of the semiconductor switch 1D by the control
circuit, charges that have been charged in the snubber
capacitor 4 are discharged through the semiconductor switch
1A and the semiconductor switch 1D, and the energy that has
been charged in the snubber capacitor 4 is supplied to the
load side.
As an example of the power conversion apparatus using
the bidirectional current switch disclosed in Patent
Document 1, there is an AC/DC power conversion apparatus
disclosed in Patent Document 2. In the AC/DC power
conversion apparatus, a capacitor is connected between the
DC terminals of four reverse conduction type semiconductor
switches (bidirectional current switches) having a single
phase full-bridge configuration, and a secondary battery is
connected between the DC terminals with a DC inductor
therebetween. Further, an AC power source is coupled
between AC terminals with an AC inductor therebetween.
Accordingly, a pair of semiconductor switches located
on a diagonal line are turned on or turned off synchronously
with the phase of a power voltage, so that an AC power
source with a frequency lower than the resonance frequency
determined by the AC inductor and the capacitor is connected
to it. According to the AC/DC power conversion apparatus of
Patent Document 2, a large AC inductor is necessary compared
to a conventional pulse width modulation (PWM) converter,
but the on-off of the reverse conduction type semiconductor
switches is performed one time during one cycle of the AC
power source in principle, thereby lessening harmonics in
the current waveform, and significantly reducing switching
loss by reducing the number of on-off operations of the
reverse conduction type semiconductor switches.
[Patent Document 1] Japanese Patent Laid-open
Publication No. 2000-358359
[Patent Document 2] Japanese Patent Laid-open
Publication No. 2008-193817
However, in the AC/DC power conversion device such as
disclosed in Patent Document 2, the control circuit turns on
and off a pair of reverse conduction type semiconductor
switches located on a diagonal line among the reverse
conduction type semiconductor switches in synchronization
with the voltage phase of the AC power source. In this
case, the control circuit sends gate control signals to
prevent two pairs located on diagonal lines from being
turned on at the same time, and switches the conversion from
AC power to DC power and the conversion from DC power to AC
power in response to the phases of the gate control signals.
To this end, the control circuit needs to monitor the
voltage phase of the AC power source, which may lead to a
problem that the control operation of the control circuit
becomes complicated. Therefore, there is a demand for a
power conversion apparatus which can output a desired power
through a simpler control operation. As an example of the
power conversion apparatus, particularly, there is a
bidirectional DC/DC converter which can bidirectionally
convert the DC power to be supplied to the secondary side
when the DC power source is connected to the primary side
and the storage battery or the like is connected to the
secondary side, or the DC power to be supplied to the
primary side when the storage battery or the like is
connected to the primary side and the DC power source is
connected to the secondary side, and it is required to
bidirectionally output a desired DC power through a simpler
control operation in terms of stable power supply.
Summary of the Invention
In view of the above, the present invention provides a
bidirectional DC/DC converter capable of bidirectionally
outputting a desired DC power between the primary side and
the secondary side when one of a DC power source and a load
is connected to the primary side and the other is connected
to the secondary side, through a very simple control
operation of synchronously adjusting on-duty ratios that are
switching frequencies of bidirectional current switches
provided on the primary side and on the secondary side,
respectively.
In accordance with an aspect of the present invention,
there is provided a bidirectional DC/DC converter capable of
converting a direct current (DC) between a first DC power
source or a first load and a second load or a second DC
power source, including: a primary side circuit including a
first DC power source or a first load; a secondary side
circuit including a second load or a second DC power source;
and a transformer unit which can transfer a power outputted
from the primary side circuit to the secondary side circuit,
wherein the primary side circuit includes: a first
bidirectional current switch including a bridge circuit
constituted by four semiconductor switches, and a capacitor
connected between two terminals of the bridge circuit; a
first control circuit which performs on/off control of each
of the semiconductor switches by applying a control signal
to a gate electrode of each of the semiconductor switches;
and a first inductor, one end of which is connected to the
first DC power source or first load, and the other end of
which is connected to the capacitor of the bridge circuit,
and wherein the secondary side circuit includes: a second
bidirectional current switch including a bridge circuit
constituted by four semiconductor switches, and a capacitor
connected between two terminals of the bridge circuit; a
second control circuit which performs on/off control of each
of the semiconductor switches by assigning a control signal
to a gate electrode of each of the semiconductor switches;
and a second inductor, one end of which is connected to the
second DC power source or second load, and the other end of
which is connected to the capacitor of the bridge circuit.
Preferably, each of a resonance frequency determined
by an electrostatic capacitance of the capacitor of the
primary side circuit and an inductance of the first inductor
and a resonance frequency determined by an electrostatic
capacitance of the capacitor of the secondary side circuit
and an inductance of the second inductor is higher than a
switching frequency of the eight semiconductor switches.
Further, among the semiconductor switches provided on
each of the primary side circuit and the secondary side
circuit, pairs of semiconductor switches located on a
diagonal line operate in synchronization with each other in
response to the control signals which are respectively
outputted from the first and the second control circuit.
Further, it is preferred that power supply from the
primary side circuit to the secondary side circuit or vice
verse is switched in response to control signals which are
respectively outputted by the first control circuit and the
second control circuit.
Brief Description of the Drawings
The objects and features of the present invention will
become apparent from the following description of
embodiments, given in conjunction with the accompanying
drawings, in which:
FIG. 1A is a block diagram showing a bidirectional
DC/DC converter in accordance with a first embodiment of the
present invention;
FIG. 1B is a detailed circuit diagram of the
bidirectional DC/DC converter in accordance with the first
embodiment of the present invention;
FlGs. 2 A and 2B illustrate explanatory diagrams
showing temporal variations of gate control signals applied
tc gate electrodes of semiconductor switches, wherein FIG.
2A is an explanatory diagram showing temporal variations of
gate control signals respectively applied to gate electrodes
Gaf Gb, Gc and Gd, and FIG. 2B is an explanatory diagram
showing temporal variations of gate control signals
respectively applied to gate electrodes Ge, Gf, Gg and Gh;
FIG. 3 depicts explanatory diagrams showing examples
of simulation result 1 under operation condition 1, wherein
(a) is an explanatory diagram showing an example of temporal
variations of a drain current Ida and a drain voltage Vda of
the semiconductor switch Qa, a current la, and a current lb,
(b) is an explanatory diagram showing an example of temporal
variations of a drain current Ide and a drain voltage Vde of
the semiconductor switch Qe, the current la, and the current
lb, and (c) is an explanatory diagram showing an example of
temporal variations of the gate control signal applied to
the gate electrode Ga of the semiconductor switch Qa and the
gate control signal applied to the gate electrode Ge of the
semiconductor switch Qe;
FIG. 4 illustrates explanatory diagrams showing
examples of simulation result 2 under operation condition 2,
wherein (a) is an explanatory diagram showing an example of
temporal variations of the drain current Ida and the drain
voltage Vda of the semiconductor switch Qa, the current la,
and the current lb, (b) is an explanatory diagram showing an
example of temporal variations of the drain current Ide and
the drain voltage Vde of the semiconductor switch Qe, the
current la, and the current lb, and (c) is an explanatory
diagram showing an example of temporal variations of the
gate control signal applied to the gate electrode Ga of the
semiconductor switch Qa and the gate control signal applied
to the gate electrode Ge of the semiconductor switch Qe;
FIG. 5 illustrates explanatory diagrams showing
examples of simulation result 3 under operation condition 3,
wherein fa) is an explanatory diagram showing an example of
temporal variations of the drain current Ida and the drain
voltage Vda of the semiconductor switch Qa, the current la,
and the current lb, (b) is an explanatory diagram showing an
example of temporal variations of the drain current Ide and
the drain voltage Vde of the semiconductor switch Qe, the
current la, and the current lb, and (c) is an explanatory
diagram showing an example of temporal variations of the
gate control signal applied to the gate electrode Ga of the
semiconductor switch Qa and the gate control signal applied
to the gate electrode Ge of the semiconductor switch Qe;
FIG. 6 illustrates explanatory diagrams showing
examples of simulation result 4 under operation condition 4,
wherein (a) is an explanatory diagram showing an example of
temporal variations of the drain current Ida and the drain
voltage Vda of the semiconductor switch Qa, the current la,
and the current lb, (b) is an explanatory diagram showing an
example of temporal variations of the drain current Ide and
the drain voltage Vde of the semiconductor switch Qe, the
current la, and the current lb, and (c) is an explanatory
diagram showing an example of temporal variations of the
gate control signal applied to the gate electrode Ga of the
semiconductor switch Qa and the gate control signal applied
to the gate electrode Ge of the semiconductor switch Qe;
FIG. 7 illustrates explanatory diagrams showing
examples of simulation result 5 under operation condition 5,
wherein (a) is an explanatory diagram showing an example of
temporal variations of the drain current Ida and the drain
voltage Vda of the semiconductor switch Qa, the current la,
and the current lb, (b) is an explanatory diagram showing an
example of temporal variations of the drain current Ide and
the drain voltage Vde of the semiconductor switch Qe, the
current la, and the current lb, and (c) is an explanatory
diagram showing an example of temporal variations of the
gate control signal applied to the gate electrode Ga of the
semiconductor switch Qa and the gate control signal applied
to the gate electrode Ge of the semiconductor switch Qe; and
FIG. 8 is an explanatory diagram showing a circuit
configuration of a conventional bidirectional current
switch.
Detailed Description of the Embodiments
Hereinafter, embodiments of the present invention will
be described in detail with reference to the accompanying
drawings which form a part hereof.
(First Embodiment)
A circuit configuration of a bidirectional DC/DC
converter in accordance with a first embodiment of the
present invention will be described with reference to FIGs.
1A to 2B. FIG. 1A is a block diagram showing a
configuration of a bidirectional DC/DC converter 11 in
accordance with the first embodiment of the present
invention, and FIG. 1B is a detailed circuit diagram
thereof. FIGs. 2 A and 2B illustrate explanatory diagrams
showing temporal variations of gate control signals applied
to gate electrodes Ga to Gh of semiconductor switches Qa to
Qh in the bidirectional DC/DC converter 11 of the first
embodiment.
FIG. 2A is an explanatory diagram showing temporal
variations of gate control signals respectively applied to
gate electrodes Ga, Gb, Gc and Gd, and FIG. 2B is an
explanatory diagram showing temporal variations of gate
control signals respectively applied to gate electrodes Ge,
Gf, Gg and Gh. Further, an on-duty ratio of the gate
control signals in FIGs. 2A and 2B is assumed to be 4 9% of
one cycle by considering the dead time of each of the
semiconductor switches Qa to Qh.
Referring to FIG. IB, the bidirectional DC/DC
converter 11 includes a primary side circuit 12, a
transformer 13 (power transfer unit) and a secondary side
circuit 14. The units 12 to 14 constituting the
bidirectional DC/DC converter 11 will be described below. A
load or first DC power source Va is connected between a
terminal Ta and a terminal Tb of the primary side circuit
12, and a load or second DC power source Vb is connected
between a terminal Tc and a terminal Td of the secondary
side circuit 14.
In the bidirectional DC/DC converter according to the
present invention, power may be supplied from the primary
side to the secondary side by connecting the DC power source
to the primary side circuit 12 and the load to the secondary
side circuit 14, and power may be supplied from the
secondary side to the primary side by connecting the load to
the primary side circuit 12 and the DC power source to the
secondary side circuit 14. However, in order to simplify
the explanation, as shown in FIG. IB, a case where the DC
power sources are connected to both sides will be described.
In the primary side circuit 12, a bidirectional
current switch SW1 disclosed in Patent Document 2 as
described above is connected in series between a DC terminal
Tl and a DC terminal T2. In the bidirectional current
switch SW1, a series circuit of the semiconductor switch Qa
and the semiconductor switch Qb, a series circuit of the
semiconductor switch Qc and the semiconductor switch Qd, and
a capacitor CI are respectively connected in parallel
between the DC terminal Tl and the DC terminal T2. For
example, each of the semiconductor switches Qa to Qd may be
constituted by a p-channel metal-oxide-semiconductor field-
effect transistor (P-MOSFET) and a parasitic diode which is
connected in parallel to the P-MOSFET. Further, each of the
semiconductor switches Qa to Qd may be configured by an
insulated gate bipolar transistor (IGBT) other than the
configuration of the P-MOSFET and the parasitic diode.
In the series circuit of the semiconductor switch Qa
and the semiconductor switch Qb, a source electrode Sa of
the semiconductor switch Qa is connected to a drain
electrode Db of the semiconductor switch Qb. In the series
circuit of the semiconductor switch Qc and the semiconductor
switch Qd, a source electrode Sc of the semiconductor switch
Qc is connected to a drain electrode Dd of the semiconductor
switch Qd. Further, a drain electrode Da of the
semiconductor switch Qa and a drain electrode Dc of the
semiconductor switch Qc are respectively connected to the DC
terminal Tl. Furthermore, a source electrode Sb of the
semiconductor switch Qb and a source electrode Sd of the
semiconductor switch Qd are respectively connected to the DC
terminal T2. Thus, a so-called full bridge circuit is
configured.
In the bidirectional current switch SWl, as shown in
FIG. 2A, the gate control signals are applied to the gate
electrodes Ga to Gd of the semiconductor switches Qa to Qd
by a control circuit 15a. Accordingly, the semiconductor
switches Qa to Qd perform an on-off operation in response to
the gate control signals applied to the gate electrodes Ga
to Gd. FIGs. 2A and 2B show examples of the temporal
variations when the gate control signals are applied to the
gate electrodes Ga to Gh of the semiconductor switches Qa to
Qh every 10 usee.
In the bidirectional current switch SWl, the control
circuit 15a applies gate control signals whose phases are
synchronized with each other to the gate electrode Ga of the
semiconductor switch Qa and the gate electrode Gd of the
semiconductor switch Qd located on a diagonal line.
Further, the control circuit 15a applies gate control
signals whose phases are synchronized with each other to the
gate electrode Gb of the semiconductor switch Qb and the
gate electrode Gc of the semiconductor switch Qc located on
a diagonal line.
An on-duty ratio of the gate control signals applied
to the gate electrodes Ga to Gd of the semiconductor
switches Qa to Qd is set up to 50% (in practice, e.g.,
about 4 9% taking into account the dead time) of one cycle
in order to prevent a short circuit of the gate electrodes
Ga to Gd. Further, the control circuit 15a does not apply
gate control signals to the gate electrode Ga of the
semiconductor switch Qa and the gate electrode Gb of the
semiconductor switch Qb to be turned on at the same time in
any phase. Similarly, the control circuit 15a does not
apply gate control signals to the gate electrode Gc of the
semiconductor switch Qc and the gate electrode Gd of the
semiconductor switch Qd to be turned on at the same time in
any phase. This is because a short circuit occurs when a
voltage is applied to the capacitor CI.
Further, the capacitor CI functions as a snubber
capacitor in the bidirectional current switch of Patent
Document 1 described above, and also functions as a
smoothing capacitor for smoothing an AC voltage induced in
the primary side circuit 12 through the transformer 13 into
a DC voltage when the second DC power source Vb is connected
between the terminal Tc and the terminal Td of the secondary
side circuit 14.
Further, the first DC power source Va and the resistor
Rl are connected in series between the terminal Ta and the
terminal Tb. The resistor Rl is a low resistance element
provided as an internal resistor of the first DC power
source Va.
Further, a first inductor LI is connected in series
between the terminal Ta and the DC terminal Tl such that a
current la flows toward the first inductor Ll from the first
DC power source Va. Hereinafter, as shown in FIG. 1, the
direction of the current la flowing toward the first
inductor Ll from the first DC power source Va is described
as a positive direction of the current la.
Further, a primary side inductor 13a of the
transformer 13 is connected between a terminal T3 which is a
connection node of the source electrode Sa of the
semiconductor switch Qa and the drain electrode Db of the
semiconductor switch Qb, and a terminal T4 which is a
connection node of the source electrode Sc of the
semiconductor switch Qc and the drain electrode Dd of the
semiconductor switch Qd.
Further, in the primary side circuit 12, the
electrostatic capacitance of the capacitor CI and the
inductance of the primary side excitation inductor 13a of
the transformer 13 are set respectively such that the
resonance frequency determined by the capacitor C1 and the
primary side excitation inductor 13a of the transformer 13
is higher than the switching frequency of the semiconductor
switches Qa to Qd. Accordingly, every time after the
capacitor C1 is discharged, there occurs a period in which
the voltage across the capacitor C1 is substantially zero.
It is possible to achieve soft switching at zero voltage and
zero current and reduce the switching losses in the
semiconductor switches Qa to Qd in the operation of the
bidirectional DC/DC converter 11.
In the secondary side circuit 14, a bidirectional
current switch SW2 disclosed in Patent Document 2 described
above is connected in series between a DC terminal T5 and a
DC terminal T6. In the bidirectional current switch SW2, a
series circuit of the semiconductor switch Qf and the
semiconductor switch Qe, a series circuit of the
semiconductor switch Qg and the semiconductor switch Qh, and
a capacitor C2 are respectively connected in parallel
between the DC terminal T5 and the DC terminal T6. For
example, each of the semiconductor switches Qe to Qh may be
constituted by a p-channel metal-oxide-semiconductor field-
effect transistor (P-MOSFET) and a parasitic diode which is
connected in parallel to the P-MOSFET. Further, each of the
semiconductor switches Qe to Qh may be configured by an
insulated gate bipolar transistor (IGBT) other than the
configuration of the P-MOSFET and the parasitic diode.
In the series circuit of the semiconductor switch Qe
and the semiconductor switch Qh, a source electrode Se of
the semiconductor switch Qe is connected to a drain
electrode Df of the semiconductor switch Qf. Further, in
the series circuit of the semiconductor switch Qg and the
semiconductor switch Qh, a source electrode Sg of the
semiconductor switch Qg is connected to a drain electrode Dh
of the semiconductor switch Qh. A drain electrode De of the
semiconductor switch Qe and a drain electrode Dg of the
semiconductor switch Qg are respectively connected to the DC
terminal T5. Further, a source electrode Sf of the
semiconductor switch Qf and a source electrode Sh of the
semiconductor switch Qh are respectively connected to the DC
terminal T6. Thus, a so-called full bridge circuit is
configured.
In the bidirectional current switch SW2, as shown in
FIG. 2B, the gate control signals are applied to the gate
electrodes Ge to Gh of the semiconductor switches Qe to Qh
from a control circuit 15b. Accordingly, the semiconductor
switches Qe to Qh perform an on-off operation in response to
the gate control signals applied to the gate electrodes Ge
to Gh.
In the bidirectional current switch SW2, the control
circuit 15b applies gate control signals whose phases are
synchronized with each other to the gate electrode Gf of the
semiconductor switch Qf and the gate electrode Gg of the
semiconductor switch Qg located on a diagonal line.
Further, the control circuit 15b applies gate control
signals whose phases are synchronized with each other to the
gate electrode Ge of the semiconductor switch Qe and the
gate electrode Gh of the semiconductor switch Qh located on
a diagonal line.
An on-duty ratio of the gate control signals applied
to the gate electrodes Ge to Gh of the semiconductor
switches Qe to Qh is set up to 50% (in practice, e.g.,
about 49% taking into account the dead time) of one cycle
in order to prevent a short circuit of the gate electrodes
Ge to Gh. Further, the control circuit 15b does not apply
gate control signals to the gate electrode Ge of the
semiconductor switch Qe and the gate electrode Gf of the
semiconductor switch Qf to be turned on at the same time in
any phase. Similarly, the control circuit 15b does not
apply gate control signals to the gate electrode Gg of the
semiconductor switch Qg and the gate electrode Gh of the
semiconductor switch Qh to be turned on at the same time in
any phase. This is why a short circuit occurs when there is
a voltage across the capacitor C1.
Further, the capacitor C1 functions as a snubber
capacitor in the bidirectional current switch disclosed in
Patent Document 1 described above, and also functions as a
smoothing capacitor for smoothing an AC voltage induced in
the secondary side circuit 14 through the transformer 13
into a DC voltage when the first DC power source Va is
connected between the terminal Ta and the terminal Tb of the
primary side circuit 12.
Furthermore, the second DC power source Vb and the
resistor R2 are connected in series between the terminal Tc
and the terminal Td. The resistor R2 is a low resistance
element provided as an internal resistor of the second DC
power source Vb.
A second inductor L2 is connected in series between
the terminal Tc and the DC terminal T5 such that a current
lb flows toward the second inductor L2 from the second DC
power source Vb. Hereinafter, as shown in FIG. 1, the
direction of the current la flowing toward the second
inductor L2 from the second DC power source Vb is described
as a positive direction of the current lb.
A secondary side inductor 13b of the transformer 13 is
connected between a terminal T7 which is a connection node
of the source electrode Se of the semiconductor switch Qe
and the drain electrode Df of the semiconductor switch Qf,
and a terminal T8 which is a connection node of the source
electrode Sg of the semiconductor switch Qg and the drain
electrode Dh of the semiconductor switch Qh.
In the secondary side circuit 14, the electrostatic
capacitance of the capacitor C2 and the inductance of the
secondary side excitation inductor 13b of the transformer 13
are set respectively such that the resonance frequency
determined by the capacitor C2 and the secondary side
excitation inductor 13b of the transformer 13 is higher than
the switching frequency of the semiconductor switches Qe to
Qh. Accordingly, every time after the capacitor C2 is
discharged, there occurs a period in which the voltage
across the capacitor C2 is substantially zero. It is
possible to achieve soft switching at zero voltage and zero
current and reduce the switching losses in the semiconductor
switches Qe to Qh in the operation of the bidirectional
DC/DC converter 11.
As shown in FIGs. 2A and 2B, the control circuit 15a
and the control circuit 15b respectively apply the gate
control signals whose phases are synchronized with each
other to the gate electrode Ga of the semiconductor switch
Qa, the gate electrode Gd of the semiconductor switch Qd,
the gate electrode Gf of the semiconductor switch Qf, and
the gate electrode Gg of the semiconductor switch Qg.
Further, the control circuit 15a and the control circuit 15b
respectively apply the gate control signals whose phases are
synchronized with each other to the gate electrode Gb of the
semiconductor switch Qb, the gate electrode Gc of the
semiconductor switch Qc, the gate electrode Ge of the
semiconductor switch Qe, and the gate electrode Gh of the
semiconductor switch Qh.
In the bidirectional DC/DC converter 11, the control
circuit 15a applies the gate control signals to the gate
electrodes Gb and Gc to turn on the semiconductor switches
Qb and Qc according to the on-duty ratio of the cycle
described above. In addition, in synchronization with the
application of the gate control signals to the gate
electrodes Gb and Gc by the control circuit 15a, the control
circuit 15b respectively applies the gate control signals to
the gate electrodes Ge and Gh to turn on the semiconductor
switches Qe and Gh according to the on-duty ratio of the
cycle described above.
Further, immediately after stopping the application of
the gate control signals to the gate electrodes Gb and Gc
according to the on-duty ratio of the cycle described above,
similarly, the control circuit 15a applies the gate control
signals to the gate electrodes Ga and Gd to turn on the
semiconductor switches Qa and Qd according to the on-duty
ratio of the cycle described above. In addition,
immediately after stopping the application of the gate
control signals to the gate electrodes Ge and Gh according
to the on-duty ratio of the cycle described above,
similarly, the control circuit 15b assigns the gate control
signals to the gate electrodes Gf and Gg to turn on the
semiconductor switches Qf and Qg according to the on-duty
ratio of the cycle described above in synchronization with
the application of the gate control signals to the gate
electrodes Ga and Gd by the control circuit 15a. As shown
in FIGs. 2 A and 2B, the control circuit 15a and the control
circuit 15b repeat these operations.
Thus, an alternating current flows through the primary
side inductor 13a of the transformer 13, and an induced
voltage transformed by the transformer 13 in accordance with
a transformation ratio determined by the primary side
inductor 13a and the secondary side inductor 13b is applied
to the secondary side circuit 14.
Further, in the bidirectional DC/DC converter 11, it
is possible to appropriately switch between the power supply
from the primary side circuit 12 to the secondary side
circuit 14 and the power supply from the secondary side
circuit 14 to the primary side circuit 12 according to the
on-duty ratio of the gate control signals outputted by the
control circuit 15a and the control circuit 15b
respectively. For example, if the on-duty ratio of the gate
control signals applied to the gate electrodes Ga to Gd of
the semiconductor switches Qa to Qd from the control circuit
15a in the primary side circuit 12 is greater than the on-
duty ratio of the gate control signals applied to the gate
electrodes Ge to Gh of the semiconductor switches Qe to Qh
from the control circuit 15b in the secondary side circuit
14, the bidirectional DC/DC converter 11 performs the power
supply from the primary side circuit 12 to the secondary
side circuit 14.
On the other hand, if the on-duty ratio of the gate
control signals applied to the gate electrodes Ga to Gd of
the semiconductor switches Qa to Qd from the control circuit
15a in the primary side circuit 12 is smaller than the on-
duty ratio of the gate control signals applied to the gate
electrodes Ge to Gh of the semiconductor switches Qe to Qh
from the control circuit 15b in the secondary side circuit
14, the bidirectional DC/DC converter 11 performs the power
supply from the secondary side circuit 14 to the primary
side circuit 12.
In the next, operation simulation of the bidirectional
DC/DC converter 11 will be described in a case where step-
down ratio of the transformer 13 is 1:1.
FIGS. 3 to 5 are explanatory diagrams illustrating
simulation results 1 to 3 under operation conditions 1 to 3
of the bidirectional DC/DC converter 11 in accordance with
the first embodiment.
First, a description will be given of the simulation
result 1 under the operation condition 1. The operation
condition 1 shown in FIG. 3 is described below. FIG. 3
illustrates explanatory diagrams showing examples of the
simulation result 1 under the operation condition 1. In
FIG. 3, (a) is an explanatory diagram showing an example of
temporal variations of a drain current Ida and a drain
voltage Vda of the semiconductor switch Qa, the current la
flowing through the first inductor LI, and the current lb
flowing through the second inductor L2. In FIG. 3, (b) is
an explanatory diagram showing an example of temporal
variations of a drain current Ide and a drain voltage Vde of
the semiconductor switch Qe, the current la flowing through
the first inductor LI, and the current lb flowing through
the second inductor L2. In FIG. 3, (c) is an explanatory
diagram showing an example of temporal variations of the
gate control signal applied to the gate electrode Ga of the
semiconductor switch Qa and the gate control signal applied
to the gate electrode Ge of the semiconductor switch Qe.
(1) The first DC power source Va is connected to the
primary side circuit 12, and the second DC power source Vb
is connected to the secondary side circuit 14.
(2) Voltage of the first DC power source Va: 380 [VJ
(3) Voltage of the second DC power source Vb: 380 [V]
(4) On-duty ratio of the semiconductor switches Qa to
Qd: 49% of one cycle (Off-duty ratio is 51% of one cycle)
(5) On-duty ratio of the semiconductor switches Qe to
Qh: 49% of one cycle (Off-duty ratio is 51% of one cycle)
(6) Step-down ratio of the transformer 13: the primary
side circuit 12 and the secondary side circuit 14 have a
relationship of 1:1.
In (a) , (b) and (c) of FIG. 3, a horizontal axis
represents time (2.5 usec/1 div). A dotted line waveform of
(a) of FIG. 3 represents the drain current Ida [A] of the
semiconductor switch Qa for the gate control signal applied
to the gate electrode Ga of the semiconductor switch Qa. A
dashed dotted line waveform of (a) of FIG. 3 represents the
drain voltage Vda [V] of the semiconductor switch Qa for the
gate control signal applied to the gate electrode Ga of the
semiconductor switch Qa. A dotted line waveform of (b) of
FIG. 3 represents the drain current Ide [A] of the
semiconductor switch Qe for the gate control signal applied
to the gate electrode Ge of the semiconductor switch Qe. A
dashed dotted line waveform of (b) of FIG. 3 represents the
drain voltage Vde [V] of the semiconductor switch Qe for the
gate control signal applied to the gate electrode Ge of the
semiconductor switch Qe.
As shown in (c) of FIG. 3, since the gate control
signal applied to the gate electrode Ga of the semiconductor
switch Qa and the gate control signal applied to the gate
electrode Ge of the semiconductor switch Qe have the same
on-duty ratio, the gate control signals are respectively
outputted by the control circuit 15a and the control circuit
15b such that the phase of each gate control signal is
simply inverted. That is, the semiconductor switch Qe is
turned off while the semiconductor switch Qa is turned on,
and the semiconductor switch Qa is turned off while the
semiconductor switch Qe is turned on. In (c) of FIG. 3,
among the eight semiconductor switches Qa to Qh, the cases
of the semiconductor switch Qa and the semiconductor switch
Qe are illustrated representatively in the bidirectional
current switch SWl and the bidirectional current switch SW2.
However, the gate control signals of the other semiconductor
switches Qb to Qd and Qf to Qh are shown in FIG. 2 when the
on-duty ratio is 4 9%.
As shown in (a) and (b) of FIG. 3, the current la and
the current lb are substantially zero. Accordingly, under
the operation condition 1, i.e., in the case where the on-
duty ratio of the semiconductor switches Qa to Qd is 4 9%
substantially identical to the on-duty ratio of the
semiconductor switches Qe to Qh, it is shown that the
current la and the current lb do not flow in the
bidirectional DC/DC converter 11.
Further, as shown in (a) and (b) of FIG. 3, the
waveforms of the drain current Ida and the drain voltage Vda
of the semiconductor switch Qa, and the waveforms of the
drain current Ide and the drain voltage Vde of the
semiconductor switch Qe do not overlap each other.
Accordingly, it is shown that the switching losses of the
semiconductor switch Qa and the semiconductor switch Qe can
be reduced in the bidirectional DC/DC converter 11.
Similarly, the switching losses of the other semiconductor
switches Qb to Qd and Qf to Qh can be reduced.
Next, a description will be given of the simulation
result 2 under the operation condition 2. The operation
condition 2 shown in FIG. 4 is described below. FIG. 4
illustrates explanatory diagrams showing examples of the
simulation result 2 under the operation condition 2. In
FIG. 4, (a) is an explanatory diagram showing an example of
temporal variations of the drain current Ida and the drain
voltage Vda of the semiconductor switch Qa, the current la
flowing through the first inductor Ll, and the current lb
flowing through the second inductor L2.
In FIG. 4, (b) is an explanatory diagram showing an
example of temporal variations of the drain current Ide and
the drain voltage Vde of the semiconductor switch Qe, the
current Ia flowing through the first inductor Ll, and the
current Ib flowing through the second inductor L2. In FIG.
4, (c) is an explanatory diagram showing an example of
temporal variations of the gate control signal applied to
the gate electrode Ga of the semiconductor switch Qa and the
gate control signal applied to the gate electrode Ge of the
semiconductor switch Qe.
fl) The first DC power source Va is connected to the
primary side circuit 12, and the second DC power source Vb
is connected to the secondary side circuit 14.
(2) Voltage of the first DC power source Va: 380 [V]
(3) Voltage of the second DC power source Vb: 380 [V]
(4) On-duty ratio of the semiconductor switches Qa to
Qd: 40% of one cycle (Off-duty ratio is 60% of one cycle)
(5) On-duty ratio of the semiconductor switches Qe to
Qh: 49% of one cycle (Off-duty ratio is 51% of one cycle)
(6) Step-down ratio of the transformer 13: the primary
side circuit 12 and the secondary side circuit 14 have a
relationship of 1:1.
In (a) , (b) and (c) of FIG. 4, a horizontal axis
represents time (2.5 usec/1 div). A dotted line waveform of
(a) of FIG. 4 represents the drain current Ida [A] of the
semiconductor switch Qa for the gate control signal applied
to the gate electrode Ga of the semiconductor switch Qa. A
dashed dotted line waveform of (a) of FIG. 4 represents the
drain voltage Vda [V] of the semiconductor switch Qa for the
gate control signal applied to the gate electrode Ga of the
semiconductor switch Qa. A dotted line waveform of (b) of
FIG. 4 represents the drain current Ide [A] of the
semiconductor switch Qe for the gate control signal applied
to the gate electrode Ge of the semiconductor switch Qe. A
dashed dotted line waveform of (b) of FIG. 4 represents the
drain voltage Vde [V] of the semiconductor switch Qe for the
gate control signal applied to the gate electrode Ge of the
semiconductor switch Qe.
As shown in (c) of FIG. 4, the gate control signal
applied to the gate electrode Ga of the semiconductor switch
Qa and the gate control signal applied to the gate electrode
Ge of the semiconductor switch Qe have different on-duty
ratios. Specifically, as described in (4) of the operation
condition 2, the on-duty ratio of the semiconductor switches
Qa to Qd is 40% of one cycle, and as described in (5) of
r.he operation condition 2, the on-duty ratio of the
semiconductor switches Qe to Qh is 49% of one cycle.
Further, similarly to the operation condition 1, in (c) of
FIG. 4, among the eight semiconductor switches Qa to Qh, the
cases of the semiconductor switch Qa and the semiconductor
switch Qe are illustrated representatively in the
bidirectional current switch SW1 and the bidirectional
current switch SW2.
As shown in (a) and (b) of FIG. 4, as the simulation
result 2 under the operation condition 2, the current Ia
changes in negative values, and the current Ib changes in
positive values. Thus, as seen from the simulation result 2
under the operation condition 2, the bidirectional DC/DC
converter 11 of the first embodiment supplies the converted
power from the secondary side circuit 14 (second DC power
source Vb) in which the on-duty ratio of the gate control
signal is large to the primary side circuit 12 (first DC
power source Va) in which the on-duty ratio is small.
Further, as shown in (a) and (b) of FIG. 4, the
waveforms of the drain current Ida and the drain voltage Vda
of the semiconductor switch Qa, and the waveforms of the
drain current Ide and the drain voltage Vde of the
semiconductor switch Qe do not overlap each other.
Accordingly, it is shown that the switching losses of the
semiconductor switch Qa and the semiconductor switch Qe can
be reduced in the bidirectional DC/DC converter 11.
Similarly, the switching losses of the other semiconductor
switches Qb to Qd and Qf to Qh can be reduced.
Next, a description will be given of the simulation
result 3 under the operation condition 3. The operation
condition 3 shown in FIG. 5 is described below. FIG. 5
illustrates explanatory diagrams showing examples of the
simulation result 3 under the operation condition 3. In
FIG. 5, (a) is an explanatory diagram showing an example of
temporal variations of the drain current Ida and the drain
voltage Vda of the semiconductor switch Qa, the current Ia
flowing through the first inductor L1, and the current Ib
flowing through the second inductor L2.
In FIG. 5, (b) is an explanatory diagram showing an
example of temporal variations of the drain current Ide and
the drain voltage Vde of the semiconductor switch Qe, the
current Ia flowing through the first inductor L1, and the
current Ib flowing through the second inductor L2. In FIG.
5, (c) is an explanatory diagram showing an example of
temporal variations of the gate control signal applied to
the gate electrode Ga of the semiconductor switch Qa and the
gate control signal applied to the gate electrode Ge of the
semiconductor switch Qe.
(1) The first DC power source Va is connected to the
primary side circuit 12, and the second DC power source Vb
is connected to the secondary side circuit 14.
(2) Voltage of the first DC power source Va: 380 [V]
(3) Voltage of the second DC power source Vb: 380 [V]
(4) On-duty ratio of the semiconductor switches Qa to
Qd: 49% of one cycle (Off-duty ratio is 51% of one cycle)
(5) On-duty ratio of the semiconductor switches Qe to
Qh: 40% of one cycle (Off-duty ratio is 60% of one cycle)
(6) Step-down ratio of the transformer 13: the primary
side circuit 12 and the secondary side circuit 14 have a
relationship of 1:1.
In (a) , (b) and (c) of FIG. 5, a horizontal axis
represents time (2.5 usec/1 div). A dotted line waveform of
(a) of FIG. 5 represents the drain current Ida [A] of the
semiconductor switch Qa for the gate control signal applied
to the gate electrode Ga of the semiconductor switch Qa. A
dashed dotted line waveform of (a) of FIG. 5 represents the
drain voltage Vda [V] of the semiconductor switch Qa for the
gate control signal applied to the gate electrode Ga of the
semiconductor switch Qa. A dotted line waveform of (b) of
FIG. 5 represents the drain current Ide [A] of the
semiconductor switch Qe for the gate control signal applied
to the gate electrode Ge of the semiconductor switch Qe. A
dashed dotted line waveform of (b) of FIG. 5 represents the
drain voltage Vde [V] of the semiconductor switch Qe for the
gate control signal applied to the gate electrode Ge of the
semiconductor switch Qe.
As shown in (c) of FIG. 5, the gate control signal
applied to the gate electrode Ga of the semiconductor switch
Qa and the gate control signal applied to the gate electrode
Ge of the semiconductor switch Qe have different on-duty
ratios. Specifically, as described in (4) of the operation
condition 3, the on-duty ratio of the semiconductor switches
Qa to Qd is 4 9% of one cycle, and as described in (5) of
the operation condition 3, the on-duty ratio of the
semiconductor switches Qe to Qh is 40% of one cycle.
Further, similarly to the operation condition 1, in (c) of
FIG. 5, the cases of the semiconductor switch Qa and the
semiconductor switch Qe among the eight semiconductor
switches Qa to Qh are illustrated representatively in the
bidirectional current switch SW1 and the bidirectional
current switch SW2.
As shown in (a) and (c) of FIG. 5, the current Ib
changes in negative values, and the current Ia changes in
positive values. Thus, as seen from the simulation result 3
under the operation simulation condition 3, the
bidirectional DC/DC converter 11 of the first embodiment
supplies the converted power from the primary side circuit
12 (first DC power source Va) in which the on-duty ratio of
the gate control signal is large to the secondary side
circuit 14 (second DC power source Vb) in which the on-duty
ratio is small.
Further, as shown in (a) and (b) of FIG. 5, the
waveforms of the drain current Ida and the drain voltage Vda
of the semiconductor switch Qa, and the waveforms of the
drain current Ide and the drain voltage Vde of the
semiconductor switch Qe do not overlap each other.
Accordingly, it is shown that the switching losses of the
semiconductor switch Qa and the semiconductor switch Qe can
be reduced in the bidirectional DC/DC converter 11.
Similarly, the switching losses of the other semiconductor
switches Qb to Qd and Qf to Qh can be reduced.
Next, operation simulation of the bidirectional DC/DC
converter 11 will be described in a case where step-down
ratio of the transformer 13 is 1:0.2.
FIGS. 6 and 7 are explanatory diagrams illustrating
simulation results 4 and 5 under operation conditions 4 and
5 of the bidirectional DC/DC converter 11 of the first
embodiment.
First, a description will be given of the simulation
result 4 under the operation condition 4. The operation
condition 4 shown in FIG. 6 is described below. FIG. 6
illustrates explanatory diagrams showing examples of the
simulation result 4 under the operation condition 4. In
FIG. 6, (a) is an explanatory diagram showing an example of
temporal variations of a drain current Ida and a drain
voltage Vda of the semiconductor switch Qa, the current Ia
flowing through the first inductor L1, and the current Ib
flowing through the second inductor L2.
In FIG. 6, (b) is an explanatory diagram showing an
example of temporal variations of the drain current Ide and
the drain voltage Vde of the semiconductor switch Qe, the
current Ia flowing through the first inductor L1, and the
current Ib flowing through the second inductor L2. In FIG.
6, (c) is an explanatory diagram showing an example of
temporal variations of the gate control signal applied to
the gate electrode Ga of the semiconductor switch Qa and the
gate control signal applied to the gate electrode Ge of the
semiconductor switch Qe.
(1) The first DC power source Va is connected to the
primary side circuit 12, and the second DC power source Vb
is connected to the secondary side circuit 14.
(2) Voltage of the first DC power source Va: 380 [V]
(3) Voltage of the second DC power source Vb: 76 [V]
(4) On-duty ratio of the semiconductor switches Qa to
Qd: 49% of one cycle (Off-duty ratio is 51% of one cycle)
(5) On-duty ratio of the semiconductor switches Qe to
Qh: 49% of one cycle (Off-duty ratio is 51% of one cycle)
(6) Step-down ratio of the transformer 13: the primary
side circuit 12 and the secondary side circuit 14 have a
relationship of 1:0.2.
In (a), (b) and (c) of FIG. 6, a horizontal axis
represents time (2.5 usec/1 div). A dotted line waveform of
(a) of FIG. 6 represents the drain current Ida [A] of the
semiconductor switch Qa for the gate control signal applied
to the gate electrode Ga of the semiconductor switch Qa. A
dashed dotted line waveform of (a) of FIG. 6 represents the
drain voltage Vda [V] of the semiconductor switch Qa for the
gate control signal applied to the gate electrode Ga of the
semiconductor switch Qa. A dotted line waveform of (b) of
FIG. 6 represents the drain current Ide [A] of the
semiconductor switch Qe for the gate control signal applied
to the gate electrode Ge of the semiconductor switch Qe. A
dashed dotted line waveform of (b) of FIG. 6 represents the
drain voltage Vde [V] of the semiconductor switch Qe for the
gate control signal applied to the gate electrode Ge of the
semiconductor switch Qe.
As shown in (c) of FIG. 6, since the gate control
signal applied to the gate electrode Ga of the semiconductor
switch Qa and the gate control signal applied to the gate
electrode Ge of the semiconductor switch Qe have the same
on-duty ratio, the gate control signals are respectively
outputted by the control circuit 15a and the control circuit
15b such that the phase of each gate control signal is
simply inverted. That is, the semiconductor switch Qe is
turned off while the semiconductor switch Qa is turned on,
and the semiconductor switch Qa is turned off while the
semiconductor switch Qe is turned on. In (c) of FIG. 6, the
cases of the semiconductor switch Qa and the semiconductor
switch Qe among the eight semiconductor switches Qa to Qh
are illustrated representatively in the bidirectional
current switch SW1 and the bidirectional current switch SW2.
However, the gate control signals of the other semiconductor
switches Qb to Qd and Qf to Qh are shown in FIG. 2 when the
on-duty ratio is 49%.
As shown in (a) and (b) of FIG. 6, there is a slight
difference in the magnitude of the current Ia and the
current lb, and it is considered that this difference
appears due to the effect of the step-down ratio of the
transformer 13. Accordingly, similarly to the simulation
result 1 under the operation condition 1, in the operation
simulation condition 4, i.e., in the case where the on-duty
ratio of the semiconductor switches Qa to Qd is 4 9%
substantially identical to the on-duty ratio of the
semiconductor switches Qe to Qh, it is shown that the
current Ia and the current Ib do not flow in the
bidirectional DC/DC converter 11.
Further, as shown in (a) and (b) of FIG. 6, the
waveforms of the drain current Ida and the drain voltage Vda
of the semiconductor switch Qa, and the waveforms of the
drain current Ide and the drain voltage Vde of the
semiconductor switch Qe do not overlap each other.
Accordingly, it is shown that the switching losses of the
semiconductor switch Qa and the semiconductor switch Qe can
be reduced in the bidirectional DC/DC converter 11.
Similarly, the switching losses of the other semiconductor
switches Qb to Qd and Qf to Qh can be reduced.
Finally, a description will be given of the simulation
result 5 under the operation condition 5. The operation
condition 5 shown in FIG. 7 is described below. FIG. 7
illustrates explanatory diagrams showing examples of the
simulation result 5 under the operation condition 5. In
FIG. 7, (a) is an explanatory diagram showing an example of
temporal variations of the drain current Ida and the drain
voltage Vda of the semiconductor switch Qa, the current Ia
flowing through the first inductor LI, and the current Ib
flowing through the second inductor L2 .
In FIG. 7, (b) is an explanatory diagram showing an
example of temporal variations of the drain current Ide and
the drain voltage Vde of the semiconductor switch Qe, the
current Ia flowing through the first inductor Ll, and the
current Ib flowing through the second inductor L2. In FIG.
7, (c) is an explanatory diagram showing an example of
temporal variations of the gate control signal applied to
the gate electrode Ga of the semiconductor switch Qa and the
gate control signal applied to the gate electrode Ge of the
semiconductor switch Qe.
(1) The first DC power source Va is connected to the
primary side circuit 12, and the second DC power source Vb
is connected to the secondary side circuit 14.
(2) Voltage of the first DC power source Va: 380 [V]
(3) Voltage of the second DC power source Vb: 76 [V]
(4) On-duty ratio of the semiconductor switches Qa to
Qd: 40% of one cycle (Off-duty ratio is 60% of one cycle)
(5) On-duty ratio of the semiconductor switches Qe to
Qh: 49% of one cycle (Off-duty ratio is 51% of one cycle)
(6) Step-down ratio of the transformer 13: 1:0.2
(which is a relationship of the primary side circuit 12 and
the secondary side circuit 14)
In (a) , (b) and (c) of FIG. 7, a horizontal axis
represents time (2.5 usec/1 div). A dotted line waveform of
(a) of FIG. 7 represents the drain current Ida [A] of the
semiconductor switch Qa for the gate control signal applied
to the gate electrode Ga of the semiconductor switch Qa. A
dashed dotted line waveform of (a) of FIG. 7 represents the
drain voltage Vda [V] of the semiconductor switch Qa for the
gate control signal applied to the gate electrode Ga of the
semiconductor switch Qa. A dotted line waveform of (b) of
FIG. 7 represents the drain current Ide [A] of the
semiconductor switch Qe for the gate control signal applied
to the gate electrode Ge of the semiconductor switch Qe. A
dashed dotted line waveform of (e) of FIG. 7 represents the
drain voltage Vde [V] of the semiconductor switch Qe for the
gate control signal applied to the gate electrode Ge of the
semiconductor switch Qe.
As shown in (c) of FIG. 7, the gate control signal
applied to the gate electrode Ga of the semiconductor switch
Qa and the gate control signal applied to the gate electrode
Ge of the semiconductor switch Qe have different on-duty
ratios. Specifically, as described in (4) of the operation
condition 5, the on-duty ratio of the semiconductor switches
Qa to Qd is 4 0% of one cycle, and as described in (5) of
the operation condition 5, the on-duty ratio of the
semiconductor switches Qe to Qh is 4 9% of one cycle.
Further, as in the operation condition 1, in (c) of FIG. 7,
the cases of the semiconductor switch Qa and the
semiconductor switch Qe among the eight semiconductor
switches Qa to Qh are illustrated representatively in the
bidirectional current switch SW1 and the bidirectional
current switch SW2 .
As shown in (a) and (b) of FIG. 7, the current Ia
changes in negative values, and the current Ib changes in
positive values. Thus, as seen from the simulation result 5
under the operation condition 5, the bidirectional DC/DC
converter 11 of the first embodiment supplies the converted
power from the secondary side circuit 14 (second DC power
source Vb) in which the on-duty ratio of the gate control
signal is large to the primary side circuit 12 (first DC
power source Va) in which the on-duty ratio is small.
Further, as shown in (a) and (b) of FIG. 7, the
waveforms of the drain current Ida and the drain voltage Vda
of the semiconductor switch Qa, and the waveforms of the
drain current Ide and the drain voltage Vde of the
semiconductor switch Qe do not overlap each other.
Accordingly, it is shown that the switching losses of the
semiconductor switch Qa and the semiconductor switch Qe can
be reduced in the bidirectional DC/DC converter 11.
Similarly, the switching losses of the other semiconductor
switches Qb to Qd and Qf to Qh can be reduced.
As described above, according to the bidirectional
DC/DC converter 11 of the first embodiment, pairs of
semiconductor switches located on the diagonal lines among
the semiconductor switches Qa to Qh of the bidirectional
current switch provided on the primary side and the
secondary side are alternately turned on and off. Further,
the on-duty ratios that are switching frequencies of the
pairs of the semiconductor switches are adjusted
synchronously. Accordingly, by a very simple control
operation, a desired DC power can be outputted
bidirectionally between the primary side and the secondary
side when one of a DC power source and a load is connected
to the primary side and the other is connected to the
secondary side.
Although various embodiments have been described with
reference to the accompanying drawings, it is needless to
say that the bidirectional DC/DC converter 11 of the present
invention is not limited to the above example. While the
invention has been shown and described with respect to the
embodiments, it will be understood by those skilled in the
art that various changes and modification may be made
without departing from the scope of the invention as defined
in the following claims.
WE CLAIM:
1. A bidirectional DC/DC converter comprising:
a primary side circuit including a first DC power
source or a first load;
a secondary side circuit including a second load or a
second DC power source;
a power transfer unit which can transfer a power
bidirectionally between the primary side circuit and the
secondary side circuit; and
a control unit which controls the primary side circuit
and the secondary side circuit such that a current flows
from the first DC power source to the second load or from
the second DC power source to the first load through the
power transfer unit.
2. The bidirectional DC/DC converter of claim 1,
wherein the power transfer unit includes a transformer which
transforms a voltage outputted from the primary side circuit
and supplies the transformed voltage to the secondary side
circuit, or transforms a voltage outputted from the
secondary side circuit and supplies the transformed voltage
to the primary side circuit,
wherein the primary side circuit comprises:
a first bidirectional current switch including a
bridge circuit constituted by four semiconductor switches,
and a capacitor connected between two terminals connected to
the first load or the first DC power source among four
connection points between the four semiconductor switches of
the bridge circuit;
a first control circuit which performs on/off control
of each of the semiconductor switches by applying a control
signal to a gate electrode of each of the semiconductor
switches; and
a first inductor, one end of which is connected to the
first DC power source or first load, and the other end of
which is connected to the capacitor of the bridge circuit,
wherein the secondary side circuit comprises:
a second bidirectional current switch including a
bridge circuit constituted by four semiconductor switches,
and a capacitor connected between two terminals connected to
the second load or the second DC power source among four
connection points between the four semiconductor switches of
the bridge circuit;
a second control circuit which performs on/off control
of each of the semiconductor switches by assigning a control
signal to a gate electrode of each of the semiconductor
switches; and
a second inductor, one end of which is connected to
the second DC power source or second load, and the other end
of which is connected to the capacitor of the bridge
circuit, and
wherein the control unit includes the first control
circuit and the second control circuit.
3. The bidirectional DC/DC converter of claim 2, wherein
each of a resonance frequency determined by an electrostatic
capacitance of the capacitor of the primary side circuit and
an inductance of the first inductor and a resonance
frequency determined by an electrostatic capacitance of the
capacitor of the secondary side circuit and an inductance of
the second inductor is higher than a switching frequency of
the eight semiconductor switches.
4. The bidirectional DC/DC converter of claim 3, wherein
the four semiconductor switches of each of the first
bidirectional current switch and the second bidirectional
current switch are arranged such that two semiconductor
switches are located on a first diagonal line and two
semiconductor switches are located on a second diagonal
line,
wherein in the primary side circuit, the first control
circuit simultaneously outputs control signals to the two
semiconductor switches located on the first diagonal line or
the second diagonal line,
wherein in the secondary side circuit, the second
control circuit simultaneously outputs control signals to
the two semiconductor switches located on the first diagonal
line or the second diagonal line, and
wherein the two semiconductor switches located on the
first diagonal line in the first bidirectional current
switch operate in synchronization with the two semiconductor
switches located on the second diagonal line in the second
bidirectional current switch, and the two semiconductor
switches located on the second diagonal line in the first
bidirectional current switch operate in synchronization with
the two semiconductor switches located on the first diagonal
line in the second bidirectional current switch.
5. The bidirectional DC/DC converter of claim 4, wherein
power supply from the primary side circuit to the secondary
side circuit or vice verse is switched in response to
control signals which are respectively outputted by the
first control circuit and the second control circuit.
| # | Name | Date |
|---|---|---|
| 1 | 3243-Kolnp-2012-(25-10-2012)SPECIFICATION.pdf | 2012-10-25 |
| 1 | 3243-KOLNP-2012-AbandonedLetter.pdf | 2019-04-01 |
| 2 | 3243-Kolnp-2012-(25-10-2012)FORM-5.pdf | 2012-10-25 |
| 2 | 3243-KOLNP-2012-FER.pdf | 2018-09-18 |
| 3 | 3243-KOLNP-2012-(26-04-2013)-CORRESPONDENCE.pdf | 2013-04-26 |
| 3 | 3243-Kolnp-2012-(25-10-2012)FORM-3.pdf | 2012-10-25 |
| 4 | 3243-KOLNP-2012-(26-04-2013)-ENGLISH TRANSLATION.pdf | 2013-04-26 |
| 4 | 3243-Kolnp-2012-(25-10-2012)FORM-2.pdf | 2012-10-25 |
| 5 | 3243-KOLNP-2012-(26-04-2013)-FORM 3.pdf | 2013-04-26 |
| 5 | 3243-Kolnp-2012-(25-10-2012)FORM-1.pdf | 2012-10-25 |
| 6 | 3243-KOLNP-2012-FORM18.pdf | 2013-03-29 |
| 6 | 3243-Kolnp-2012-(25-10-2012)DRAWINGS.pdf | 2012-10-25 |
| 7 | 3243-Kolnp-2012-(25-10-2012)DESCRIPTION (COMPLETE).pdf | 2012-10-25 |
| 7 | 3243-KOLNP-2012-(15-11-2012)-CORRESPONDENCE.pdf | 2012-11-15 |
| 8 | 3243-Kolnp-2012-(25-10-2012)CORRESPONDENCE.pdf | 2012-10-25 |
| 8 | 3243-KOLNP-2012-(15-11-2012)-FORM-1.pdf | 2012-11-15 |
| 9 | 3243-KOLNP-2012-(15-11-2012)-PA.pdf | 2012-11-15 |
| 9 | 3243-Kolnp-2012-(25-10-2012)CLAIMS.pdf | 2012-10-25 |
| 10 | 3243-Kolnp-2012-(25-10-2012)ABSTRACT.pdf | 2012-10-25 |
| 10 | 3243-KOLNP-2012.pdf | 2012-11-09 |
| 11 | 3243-Kolnp-2012-(25-10-2012)ABSTRACT.pdf | 2012-10-25 |
| 11 | 3243-KOLNP-2012.pdf | 2012-11-09 |
| 12 | 3243-KOLNP-2012-(15-11-2012)-PA.pdf | 2012-11-15 |
| 12 | 3243-Kolnp-2012-(25-10-2012)CLAIMS.pdf | 2012-10-25 |
| 13 | 3243-KOLNP-2012-(15-11-2012)-FORM-1.pdf | 2012-11-15 |
| 13 | 3243-Kolnp-2012-(25-10-2012)CORRESPONDENCE.pdf | 2012-10-25 |
| 14 | 3243-KOLNP-2012-(15-11-2012)-CORRESPONDENCE.pdf | 2012-11-15 |
| 14 | 3243-Kolnp-2012-(25-10-2012)DESCRIPTION (COMPLETE).pdf | 2012-10-25 |
| 15 | 3243-Kolnp-2012-(25-10-2012)DRAWINGS.pdf | 2012-10-25 |
| 15 | 3243-KOLNP-2012-FORM18.pdf | 2013-03-29 |
| 16 | 3243-Kolnp-2012-(25-10-2012)FORM-1.pdf | 2012-10-25 |
| 16 | 3243-KOLNP-2012-(26-04-2013)-FORM 3.pdf | 2013-04-26 |
| 17 | 3243-Kolnp-2012-(25-10-2012)FORM-2.pdf | 2012-10-25 |
| 17 | 3243-KOLNP-2012-(26-04-2013)-ENGLISH TRANSLATION.pdf | 2013-04-26 |
| 18 | 3243-KOLNP-2012-(26-04-2013)-CORRESPONDENCE.pdf | 2013-04-26 |
| 18 | 3243-Kolnp-2012-(25-10-2012)FORM-3.pdf | 2012-10-25 |
| 19 | 3243-KOLNP-2012-FER.pdf | 2018-09-18 |
| 19 | 3243-Kolnp-2012-(25-10-2012)FORM-5.pdf | 2012-10-25 |
| 20 | 3243-KOLNP-2012-AbandonedLetter.pdf | 2019-04-01 |
| 20 | 3243-Kolnp-2012-(25-10-2012)SPECIFICATION.pdf | 2012-10-25 |
| 1 | SEARCHSTRATEGY_06-10-2017.pdf |