FORM 2
The Patent Act 1970
(39 of 1970)
&
The Patent Rules, 2005

COMPLETE SPECIFICATION
(SEE SECTION 10 AND RULE 13)

TITLE OF THE INVENTION

“BRAZED GRINDING WHEEL DESIGN”

APPLICANTS:

Name Nationality Address
Wendt India Ltd Indian 69/70 Sipcot Hosur 635 126 Tamil Nadu India

The following specification particularly describes and ascertains the nature of this invention and the manner in which it is to be performed:-

FIELD OF INVENTION
[001] This invention relates to super abrasive discs, and more particularly but not exclusively to super abrasive discs that can be used for multiple applications.

BACKGROUND OF INVENTION
[002] Super abrasive discs can be used for grinding purposes, such as, grinding of concrete surfaces to remove bulges and undulations. Further, the super abrasive discs can be used for chamfering, forming of full and half radius in granite. Furthermore, super abrasive discs can be used for grinding, chamfering and finishing of marble edges while laying, among other applications. It can also be used for fettling, weld removal and to create decorative finishes on wood.
[003] Such super abrasive discs include a blank over which super abrasive particles, such as, diamond grains and CBN grains, are provided. One such super abrasive disc is illustrated in FIG. 1 in sectional view. The disc 100 defines a opening 104 at the center to enable loading of the disk to a means that is configured to rotate the disk, for example, the disc is loaded on to a handheld grinding tool that enables rotation of the disk, and thereby enabling grinding of the object with which grinding surface 102 of the disc 100 comes in contact. The grinding surface 102 of the disc 100 illustrated in FIG. 1 is a substantially flat surface over which super abrasive particles are superimposed. It has been observed that such discs can only be used for grinding operation.
[004] Such grinding discs are used for grinding of concrete surfaces to remove bulges and undulations, thereby reducing the time required for removal of bulges and undulations on concrete surfaces. However, it has been observed that an essential activity of hacking concrete surfaces is performed using chisel and it has been observed to be time consuming. Hacking is an operation of creating roughness on cast concrete surface, which is generally performed before plastering the cast concrete surface. The roughness created on the concrete surface ensures bonding of the plastering material and the concrete surface. Conventionally, hacking is performed using chisel. This methodology of hacking with the chisel has been found to be time consuming, laborious and results labor fatigue.
[005] In light of the foregoing discussion, there is a need for an super abrasive tool that can be used for multiple applications, reduces labor fatigue and reduces the time required for performing hacking operation.

STATEMENT OF INVENTION
[006] Accordingly the invention provides a grinding wheel configured for performing grinding and hacking is provided. The grinding wheel includes a blank defining a hole at a center thereof and a top surface. The top surface includes a grinding surface and a hacking surface. The grinding surface is adjacent to the hacking surface and the hacking surface extends towards a periphery of the blank. The hacking surface defines a curvature and each of said grinding surface and hacking surface is provided with super abrasive material.
[007] These and other aspects of the embodiments herein will be better appreciated and understood when considered in conjunction with the following description and the accompanying drawings. It should be understood, however, that the following descriptions, while indicating preferred embodiments and numerous specific details thereof, are given by way of illustration and not of limitation. Many changes and modifications may be made within the scope of the embodiments herein without departing from the spirit thereof, and the embodiments herein include all such modifications.

BRIEF DESCRIPTION OF FIGURES
[008] This invention is illustrated in the accompanying drawings, through out which like reference letters indicate corresponding parts in the various figures. The embodiments herein will be better understood from the following description with reference to the drawings, in which:
[009] FIG. 2 illustrates a top view of a grinding wheel 200, in accordance with an embodiment; and
[0010] FIG. 3 illustrates a sectional view of the grinding wheel 200 along the cutting plane X – X, in accordance with an embodiment.

DETAILED DESCRIPTION OF INVENTION
[0011] The embodiments herein and the various features and advantageous details thereof are explained more fully with reference to the non-limiting embodiments that are illustrated in the accompanying drawings and detailed in the following description. Descriptions of well-known components and processing techniques are omitted so as to not unnecessarily obscure the embodiments herein. The examples used herein are intended merely to facilitate an understanding of ways in which the embodiments herein may be practiced and to further enable those of skill in the art to practice the embodiments herein. Accordingly, the examples should not be construed as limiting the scope of the embodiments herein.
[0012] The embodiments herein disclose a grinding wheel that can be used for, both, grinding and hacking. Referring now to the drawings, and more particularly to FIGS. 2 and 3, where similar reference characters denote corresponding features consistently throughout the figures, there are shown embodiments.
[0013] FIG. 2 illustrates a top view of the grinding wheel 200 and FIG. 3 illustrates a sectional view of the grinding wheel 200 along the cutting plane X – X, in accordance with an embodiment. The grinding wheel 200 includes a blank 212. The blank 212 defines a hole 202 at a central axis. The grinding wheel 200 further defines a top surface 214. The top surface 214 defines at least a grinding surface 208 and a hacking surface 210. The grinding surface 208 is defined on the top surface 214 and is concentric with the hole 202. The hacking surface 210 surrounds the grinding surface 208 towards the periphery of the blank 212. Further, in accordance with an embodiment, the bank 212 includes a first portion 204 and a second portion 206. The hole 202, the first portion 204 and the second portion 206 may enable mounting of the grinding wheel 200 onto a device, for example, a handheld grinding machine, which is configured to rotate the grinding wheel 200. It may be noted that the configuration of the hole 202, the first portion 204 and the second portion 206 may be accordingly modified by a person with ordinary skill in the art to enable effective mounting of the grinding wheel 200 onto a corresponding element of the grinding machine (not shown) without deterring the intended function of the grinding wheel 200.
[0014] The top surface 214, especially at the grinding surface 208 and the hacking surface 210 of the grinding wheel 200, is provided with super abrasive material A. For example the grinding surface 208 and the hacking surface 210 may be provided with diamond grains and/or CBN grains. Alternatively, the grinding surface 208 may be provided with a first type of super abrasive material while the hacking surface 210 may be provided with a second type, different from the first type, of super abrasive material. Further, the super abrasive material may be arranged to follow a predetermined pattern on the top surface 214 of the blank 212. The super abrasive material may also be disposed in a random configuration on the any or both of the grinding surface 208 and the hacking surface 210 of the top surface 214. Alternatively, the pattern in which the super abrasive material is provided on the grinding surface 208 may be different from the pattern provided on the hacking surface 210 of the top surface 214. The super abrasive material A which is provided on the grinding surface 208 and the hacking surface 210 may be chosen based on the type of the surface to ground or hacked.
[0015] The hacking surface 210 defines a curvature extending towards the periphery of the grinding wheel 200. The curvature defined by the hacking surface 210 enables hacking operation using the grinding wheel 200. Providing a curvature in the hacking surface 210 enables the hacking portion 210 to withstand the forces generated while at least a part of the hacking surface 210 comes in contact with the surface being hacked and hence the present shape and structure of the hacking portion 210 is advantageous over the prior art. In accordance with an embodiment, a plane of the grinding surface 208 is substantially parallel to a plane of the hole 202. Further, the grinding surface 208 of the grinding wheel 200 is vertically spaced away from the hole 202 thereby defining a depression in the grinding wheel 200.
[0016] Further, the first portion 204 of the blank 212 is provided between the grinding surface 208 and the hole 202, and the first portion is in proximity to the hole 202. A plane of the first portion 204 is substantially parallel to the plane of the hole 202. Further, the second portion 206 is provided between the grinding surface 208 and the first portion 204 and connects the grinding surface 208 and the first portion 204.
[0017] Further, the second portion 206 is angled with respect to the grinding surface 208. The second portion 206 is angled to ensure that the grinding surface 208 is projected with respect to the plane of the hole 202 such that while performing grinding or hacking the respective grinding surface 208 and the hacking surface 210 comes in contact with the surface being ground or hacked. The angle provided in the second portion 206 of the blank 212 precludes the element of the grinding machine, which engages the grinding wheel 200, from coming in contact with the surface to be ground or hacked. In light of the afore mentioned description, a person having ordinary skill in the art may modify the portion of the blank 212 between the grinding surface 208 and center of the hole 202 to achieve the intended functions. In operation, grinding may be performed by bringing at least a part of the grinding surface 208 in contact with the surface that has to be ground, while the grinding wheel 200 is rotating. Further, when hacking has to be performed, at least a part of the hacking surface 210 is brought in contact with the surface that has to be hacked, while the grinding wheel 200 is rotating. Hence, the grinding wheel 200 can be used for both, grinding and hacking operation.

EXAMPLE OF GRINDING WHEEL 200
[0018] This example provides dimensions of elements of the grinding wheel 200. The grinding wheel 200 includes a blank 212. The blank 212 has a thickness of about 2.2mm to 2.5 mm. The blank 212 defines a hole 202 at a central axis. The hole 202 has a diameter of about 20mm to 22.23 mm. The grinding wheel 200 further defines a top surface 214. The top surface 214 defines at least a grinding surface 208 and a hacking surface 210. The grinding surface 208 has a radial width of 15.12 mm and the hacking surface has a radial width of 7.23 mm. Further, the bank 212 includes a first portion 204 and a second portion 206. The first portion has a radial width of 8.5 mm and the second portion 206 has a radial width of 9.65mm. Further, the second portion is angled at 500 with respect to the plane of the hole 202. The plane of the hole is spaced at 14mm from the plane of the grinding surface 208, and the plane of the hole is spaced at 8.2 mm from a plane substantially defining the end of the hacking surface 210. Further, the hacking surface 210 has a radius of curvature of 8mm.
[0019] The foregoing description of the specific embodiments will so fully reveal the general nature of the embodiments herein that others can, by applying current knowledge, readily modify and/or adapt for various applications such specific embodiments without departing from the generic concept, and, therefore, such adaptations and modifications should and are intended to be comprehended within the meaning and range of equivalents of the disclosed embodiments. It is to be understood that the phraseology or terminology employed herein is for the purpose of description and not of limitation. Therefore, while the embodiments herein have been described in terms of preferred embodiments, those skilled in the art will recognize that the embodiments herein can be practiced with modification within the spirit and scope of the embodiments as described herein.

We claim:

1. A grinding wheel configured for performing grinding and hacking, the grinding wheel comprising:
a blank defining a hole at a center thereof; and
a top surface comprising a grinding surface and a hacking surface, said grinding surface is adjacent to the hacking surface and said hacking surface extends towards a periphery of the blank, wherein
said hacking surface defines a curvature; and
each of said grinding surface and hacking surface is provided with super abrasive material.
2. The grinding wheel according to claim 1, wherein the grinding surface is vertically spaced away from a plane of the hole.
3. The grinding wheel according to claim 1, wherein the hacking surface has a radius of curvature of around 8mm.
4. The grinding wheel according to claim 1, wherein the super abrasive material is provided to follow a predetermined pattern.
5. The grinding wheel according to claim 4, wherein a first type of super abrasive material is provided on the hacking surface and a second type, different from the first type, of super abrasive material is provided on the grinding surface.
6. The grinding wheel according to claim 4, wherein the pattern in which the super abrasive material is provided on the grinding surface is different from the pattern of the super abrasive material provided on the hacking surface.
7. The grinding wheel according to claim 1, wherein the super abrasive material is provided in a random configuration.
8. The grinding wheel according to claim 7, wherein a first type of super abrasive material is provided on the hacking surface and a second type, different from the first type, of super abrasive material is provided on the grinding surface.
9. The grinding wheel according to claim 1, further comprising a first portion and a second portion defined between the hole and the grinding surface, wherein the second portion is adjacent to the grinding surface.
10. A grinding wheel as herein above described in the specification with reference FIG. 2 and FIG. 3.

Dated June 17, 2010

Nishant Kewalramani
Patent Agent