DESC:F O R M 2
THE PATENTS ACT, 1970
(39 of 1970)
The Patent Rule, 2003

COMPLETE SPECIFICATION
(See section 10 and rule 13)

CABINET FOR CONDUCTION COOLED ELECTRONICS MODULES

BHARAT ELECTRONICS LIMITED
WITH ADDRESS:
OUTER RING ROAD, NAGAVARA, BANGALORE 560045,
KARNATAKA, INDIA

THE FOLLOWING SPECIFICATION PARTICULARLY DESCRIBES THE INVENTION AND THE MANNER IN WHICH IT IS TO BE PERFORMED
TECHNICAL FIELD OF THE INVENTION:
[001] The present invention relates generally to a cabinet construction and more particularly to a cabinet having multiple chambers for conduction cooled electronics application modules.
BACKGROUND OF THE INVENTION:
[002] Systems have become extremely complicated in recent years. To achieve a single mission need, numerous distinct types of subsystems are required, each of which is highly diverse in terms of engineering and applications. As a result, these subsystems are often intended to be modular in order to allow for independent development cycles and maintenance tasks. Furthermore, these subsystems are typically conduction cooled. At the system level, there is a significant issue in extracting heat from these various sub-systems, as most of these sub-systems are accessible from one side.
[003] There are currently products on the market to suit this criterion. However, when the number of electronic application modules increases, all these products have a propensity to take on an imbalanced appearance - either very tall or very wide. This is due to the fact that these products use a single chamber technique in which heat from particular electronics application modules is directed to either the right-left or top-bottom sides of the system.
[004] US Patent document US9351424B2 discloses an apparatus for passively cooling electronics. The apparatus for passively cooling electronics includes at least one heat sink configured to be thermally coupled to at least one cabinet. When the at least one cabinet is thermally coupled to the at least one heat sink, the at least one heat sink draws heat from the at least one cabinet.
[005] Document US9538687B2 describes a high-density rack unit systems and methods for telecommunication and data communication systems that utilize airflow mechanisms thereby enabling modularity and high-density in small-form factor units. The system offers airflow mechanisms via right-angle backplane connectors to enable more airflow in a rack unit as well as field replaceable fans in these high-density rack units. Further, the system includes a baffle structure to keep power-supply-related airflow separate from the airflow over other components in the 1U or 2U rack unit.
[006] Document US9232678B2 discloses a modular, scalable and expandable (MSE) rack-based information handling system (RIHS) includes: a rack assembly having a frame that defines: a front bay chassis with height, depth and width dimensions that enable insertion of a plurality of different sizes of IT gear; and a rear bay that accommodates power and cooling components to Support operation of the different sizes of IT gear. The power and cooling for the IT gear are provided from the rear bay and are separate from and independent of the IT gear installed within the front bay chassis. The rack assembly further includes a power and management chassis in which is inserted a power and management module having power and management components located there onto provide rack-level power and management. A modular configuration of fan modules is inserted within fan receptacles within the rear bay to provide block level cooling of adjacent blocks of IT gear.
[007] All the above prior arts explain about various electronics system packaging methods with conduction cooling. However, none of the products provides balanced aspect ratio, effectively utilizing the available three-dimensional mounting space for the conduction cooled electronics application modules. Thus, the present invention focuses to address the above-mentioned drawbacks of the known chambers providing effective mounting and cooling configuration.
OBJECTIVES OF THE INVENTION:
[008] These objectives are provided to introduce a selection of concepts in a simplified form that are further described below in the detailed description. These objectives are not intended to identify key features or essential features of the claimed subject matter, nor it is intended to be used as an aid in determining the scope of the claimed subject matter.
[009] The primary objective of the present invention is to provide a construction of cabinet having multiple chambers to achieve balanced aspect ratio, and effectively utilizing the available three-dimensional mounting space.
[0010] Another objective of the present invention is to provide a method of electronics packaging for conduction cooled and sealed system by the unique construction of multiple chambers.
[0011] Yet another objective of the present invention is to provide a modular cabinet design, such that the chamber requires minimal repair time.
[0012] Still another objective of the present invention is to provide a cabinet having high vibration stability which can be mounted in various conditions: rack mount, table mount, wall mount and vehicle mount.
[0013] Further objective of the present invention is to provide a cabinet with flexible chambers which can be modified based on available mounting space, number of chambers, height of each chamber, number of slots in each chamber.
[0014] These objects of the present invention are not limited to the above-mentioned problem. Other technical problems that are not mentioned will become apparent to those skilled in the art from the following description.
SUMMARY OF THE INVENTION:
[0015] In one aspect of the present invention, a cabinet for conduction cooled electronics modules is provided.
[0016] The cabinet includes a chassis with a plurality of chambers. Each chamber is adapted to receive at least one conduction cooled electronics module.
[0017] The cabinet further includes a base plate that is firmly secured to the chassis, ensuring stability and structural integrity.
[0018] The cabinet further includes a top cover that is securely attached to the chassis.
[0019] The cabinet further includes at least one extreme wall on the right and left sides, forming opposing ends of the chassis, wherein each extreme wall is connected to the other using one or more connecting flats.
[0020] The cabinet further includes at least one extreme heat sink wall having one or more slots on one side and a plurality of heat fins on other side. The extreme heat sink wall is connected to the base plate and coupled to each right and left side extreme walls.
[0021] In some aspects of the present invention, the plurality of heat fins is arranged on an external surface of the extreme heat sink wall facing the right and left side extreme walls.
[0022] The cabinet further includes one or more intermediate heat sink walls having one or more slots on one side and a plurality of heat fins on other side. The intermediate heat sink walls are connected to the base plate in such a way that each adjacent intermediate heat sink wall is connected to the other by a connecting plate.
[0023] In some aspects of the present invention, one or more slots of the extreme and intermediate heat sink walls are adapted to receive at least one conduction cooled electronics module.
[0024] The cabinet further includes a door that is mounted on the front side of the chassis and configured to close one or more openings of the plurality of chambers.
[0025] In some aspects of the present invention, the door is equipped with a panel for continuously indicating health status of one or more conduction cooled electronics modules.
[0026] The cabinet further includes a rear assembly that is attached to the rear side of the chassis.
[0027] The cabinet further includes a fan tray assembly that is attached to the rear assembly of the chassis.
[0028] In accordance with an embodiment of the present invention, the rear assembly includes a backplane PCB assembly having one or more internal interface connectors that are strategically positioned to mate with corresponding conduction cooled electronics modules to facilitate transmission of electrical signals; an external interface PCB assembly having one or more external interface connectors and a bridge connector for communication with the backplane PCB assembly; one or more spacers that are configured to space apart the external interface PCB assembly from backplane PCB assembly; and a rear plate having at least one of a switch, fuse, and panel-mount connectors, configured to secure at least one of the external interface PCB assembly and backplane PCB assembly with the chassis through one or more connection holes and connectors.
[0029] In accordance with an embodiment of the present invention, the fan tray assembly includes one or more fans for extracting heat from the plurality of chambers; a fan plate that is configured to hold one or more fans at strategic locations corresponding to the heat fins; and a wiring harness, routing one or more fan wires to a single connector for facilitating the connection with the rear assembly to enable at least one of a power supply, health monitoring, and speed control.
[0030] In accordance with an embodiment of the present invention, the cabinet further comprises at least one gasket that is configured to provide a sealant connection against ingress of water into the cabinet.
[0031] In accordance with an embodiment of the present invention, the connecting flats include a plurality of grooves and holes at its top, front, and rear faces, establishing a secured connection with the top cover, door and rear assembly.
[0032] In accordance with an embodiment of the present invention, the plurality of chambers further includes one or more heat pipes or vapor chambers for optimized heat distribution.
[0033] In accordance with an embodiment of the present invention, the fan tray assembly is detached when the heat loads from the electronics modules and ambient conditions permit cooling by natural convection.
[0034] In accordance with an embodiment of the present invention, the cabinet further comprises one or more brackets and handles that are secured to the chassis structure for ease of transport and mounting.
[0035] In another aspect of the present invention, a method for packaging a cabinet for conduction cooled electronics modules is provided.
[0036] In accordance with an embodiment of the present invention, the method may include the steps of: assembling a base plate with at least one of extreme heat sink walls and intermediate heat sink walls along with a connecting plate; attaching front and rear connecting flats to the assembled base plate; securing at least one extreme wall on right and left side along with a top cover to the assembled chassis; placing a gasket at the front and rear side of the assembled chassis; mounting a door on the front side of the chassis; connecting a rear assembly comprising a backplane PCB assembly and an external interface PCB assembly into the chassis from the rear side; assembling a fan tray assembly comprising one or more fans and a fan plate into the chassis; and inserting plurality of conduction cooled electronics modules into one or more slots of the heat sink walls from the front side.
BRIEF DESCRIPTION OF ACCOMPANYING DRAWINGS:
[0037] The detailed description is described with reference to the accompanying figures.
Figure 1 depicts a cabinet for conduction cooled electronics application modules, in accordance with an aspect of the present disclosure;
Figure 2 depicts an exploded view of the cabinet, in accordance with an aspect of the present disclosure;
Figure 3 depicts a chassis of the cabinet, in accordance with an aspect of the present disclosure;
Figure 4 depicts an exploded view of chassis of the cabinet, in accordance with an aspect of the present disclosure;
Figure 5 depicts an extreme heat sink wall in the chamber, in accordance with an aspect of the present disclosure;
Figure 6 depicts an intermediate heat sink wall in the chamber, in accordance with an aspect of the present disclosure;
Figure 7 depicts a modular rear assembly of the cabinet, in accordance with an aspect of the present disclosure;
Figure 8 depicts a modular fan tray assembly of the cabinet, in accordance with an aspect of the present disclosure; and
Figure 9 depicts a method for packaging a cabinet for conduction cooled electronics modules, in accordance with an aspect of the present disclosure.
[0038] Persons skilled in the art will appreciate that elements in the figures are illustrated for simplicity and clarity and may have not been drawn to scale. For example, the dimensions of some of the elements in the figure may be exaggerated relative to other elements to help to improve understanding of various exemplary embodiments of the present disclosure.
DETAILED DESCRIPTION OF THE INVENTION:
[0039] The following description with reference to the accompanying drawings is provided to assist in a comprehensive understanding of the invention as defined by the description. It includes various specific details to assist in the understanding, but these are to be regarded as merely exemplary. In addition, descriptions of well-known functions and constructions are omitted for clarity and conciseness.
[0040] The terms and words used in the following description are not limited to the bibliographical meanings but are merely used by the inventor to enable a clear and consistent understanding of the invention. Accordingly, it should be apparent to those skilled in the art that the following description of the present invention is provided for illustration purposes only.
[0041] It is to be understood that the singular forms "a", "an" and "the" include plural referents unless the context clearly dictates otherwise.
[0042] The present invention discloses a cabinet for conduction cooled electronics modules.
[0043] Referring to Figures 1 to 8, according to an aspect, the present invention discloses a cabinet (100) for conduction cooled electronics modules. The cabinet (100) includes a chassis (102), a base plate (108), a top cover (110), at least one extreme wall (112), at least one extreme heat sink wall (116), one or more intermediate heat sink walls (122), a door (130), a rear assembly (134), and a fan tray assembly (136).
[0044] In accordance with an embodiment of the present invention, the chassis (102) is designed to include a plurality of chambers (104). Each of these chambers (104) is configured to serve as a dedicated space for accommodating at least one conduction cooled electronics module (106), allowing for the efficient and organized arrangement of electronics module (106) within the chassis (102). By compartmentalizing the interior space of the cabinet (102) into plurality of chambers (104), the present invention optimizes the operation and maintenance of conduction cooled electronics modules (106), minimizing the risk of overheating and ensuring the reliable performance of electronics modules (106) under varying operational conditions.
[0045] Further, the cabinet (100) allows for the customization and adaptation of the chassis (102) to accommodate varying requirements and specifications of electronics modules (106). Whether it involves expanding the capacity to accommodate additional modules or reconfiguring the layout to optimize performance, the modular design facilitates seamless adaptability and upgradability of the overall system architecture. As a result, users can tailor the configuration of the chassis (102) to meet specific operational needs and future scalability requirements, enhancing the versatility and longevity of the cabinet (100).
[0046] Additionally, the modular layout simplifies maintenance and repair tasks by allowing for independent access and replacement of individual modules (106) within the chassis (102). This not only reduces downtime and operational disruptions, but also enhances the overall serviceability and longevity of the cabinet (100).
[0047] In accordance with an embodiment of the present invention, the base plate (108) is firmly secured to the chassis (102) to ensure stability and structural integrity of the cabinet (100), ensuring that the entire assembly remains robust and rigid, even under challenging operational conditions. By firmly anchoring the base plate (108) to the chassis (100), potential issues such as vibration-induced wear or structural instability are mitigated, thus enhancing the overall durability and reliability of the cabinet (100). This secure attachment also provides a solid foundation that facilitates a seamless integration of other components into the cabinet (100) structure.
[0048] In accordance with an embodiment of the present invention, the top cover (110) is securely attached to the chassis (102). The top cover (110) adds to the structural integrity of the cabinet (102), further bolstering its ability to withstand environmental stresses and mechanical shocks.
[0049] In accordance with an embodiment of the present invention, at least one extreme wall (112) positioned on the right and left sides of the chassis (102), serving as opposing ends of the cabinet (100) structure. These extreme walls (112) are intricately connected to each other using one or more connecting flats (114), ensuring a seamless and robust enclosure for the electronics modules (106) housed within the cabinet (100). By securely connecting the extreme walls (112) with the connecting flats (114), any potential weak points or vulnerabilities in the cabinet (100) structure are minimized, enhancing its overall durability and longevity. Additionally, this design configuration allows for easy assembly and disassembly of the cabinet (100) components, facilitating maintenance and servicing operations as needed.
[0050] In some aspects of the present invention, one connecting flat (114) may be used at the front side of the chassis (102) and another connecting flat (114) may be used at the rear side of the chassis (102). Each connecting flats (114) may include a plurality of grooves (166) and holes (168) at its top, front, and rear faces, establishing a secured connection and proper alignment with at least one of a top cover (110), door (130) and rear assembly (134) during assembly.
[0051] In some aspects of the present invention, the grooves (166) and holes (168) on the connecting flats (114) enable efficient fastening mechanisms (not shown) to be employed, including, but not limited to screws and bolts. This allows for a strong and reliable attachment between the connecting flats (114) and the top cover (110), door (130) and rear assembly (134), further enhancing the structural stability of the cabinet (100). Additionally, the use of standardized fastening methods simplifies the assembly process and facilitates easy maintenance and repair tasks if necessary.
[0052] In accordance with an embodiment of the present invention, at least one extreme heat sink wall (116) is connected to the base plate (108) and coupled to both the right and left side extreme walls (112) of the chassis. The extreme heat sink wall (116) includes one or more slots (118) on one side and a plurality of heat fins (120) on the other side, with the arrangement of these heat fins (120) on the external surface facing the extreme wall (112). This configuration is pivotal in facilitating efficient heat dissipation from the electronics modules (106).
[0053] In accordance with an embodiment of the present invention, one or more intermediate heat sink walls (122) are connected to the base plate (108). Similar to the extreme heat sink walls (116), the intermediate heat sink walls (122) include one or more slots (124) on one side and a plurality of heat fins (126) on the other side. The arrangement of the heat fins (126) on the external surface facing the extreme wall (112), ensures efficient heat dissipation, thereby maintaining optimal operating conditions for the electronics modules (106) housed within the chassis (102).
[0054] In some aspects of the present invention, each adjacent intermediate heat sink wall (122) is interconnected by a connecting plate (128), enhancing the structural integrity of the overall design.
[0055] In some aspects of the present invention, the slots (118, 124) present on both extreme and intermediate heat sink walls (116, 122) are tailored to accommodate conduction cooled electronics modules (106). This feature allows for seamless integration of these modules (106) into the chassis (102), ensuring effective thermal management. By providing slots (118, 124) on the heat sink walls (116, 122), the design enables straightforward installation and replacement of electronics modules (106), enhancing the modularity and versatility of the system. This adaptable configuration caters to diverse application requirements, offering flexibility and ease of maintenance in conduction cooled electronics modules (106) packaging.
[0056] In accordance with an embodiment of the present invention, the door (130) is mounted on the front side of the chassis (102) to access/ close one or more openings of the plurality of chambers (104), ensuring the encapsulation and protection of the conduction cooled electronics modules (106) housed within.
[0057] In some aspects of the present invention, the door (130) is equipped with a panel (132) for continuously monitoring the health status of one or more conduction cooled electronics modules (106), providing real-time feedback on the operational status and health conditions of the conduction cooled electronics modules (106) contained within the chambers (104). This continuous monitoring capability offers invaluable insights into the performance and well-being of the electronics modules (106), allowing for prompt detection of any anomalies or malfunctions. Such proactive monitoring not only ensures the integrity and reliability of the system, but also facilitates timely maintenance and troubleshooting procedures, thereby minimizing downtime and enhancing overall operational efficiency.
[0058] In some aspects of the present invention, the panel (132) may offer a user-friendly accessibility and visibility, allowing operators or maintenance personnel to ascertain the health status of the electronics modules (106) quickly and easily without the need for extensive disassembly or inspection. Through intuitive visual cues or indicators displayed on the panel (132), pertinent information including, but not limited to temperature, voltage, operational status, and other critical parameters, can be efficiently conveyed, enabling swift and informed decision-making.
[0059] In accordance with an embodiment of the present invention, the rear assembly (134) facilitates the interface and communication between one or more components within the cabinet (100) for conduction cooled electronics modules (106).
[0060] In some aspects of the present disclosure, the rear assembly (134) includes a backplane PCB assembly (138) that serves as the backbone for electrical connectivity within the system. The backplane PCB assembly (138) incorporates one or more internal interface connectors (140), strategically positioned to mate with corresponding conduction cooled electronics modules (106) to facilitate transmission of electrical signals across the system, enabling seamless operation of the cabinet (100).
[0061] In some aspects of the present invention, the backplane PCB assembly (138) and the external interface PCB assembly (142) may be a U-shaped backplane PCB assembly and a U-shaped external interface PCB assembly, facilitating electrical interface with one or more electronics application modules (106) in the plurality of chambers (104).
[0062] In some aspects of the present disclosure, the rear assembly (134) further includes an external interface PCB assembly (142) that serves as a key element for interfacing with external devices and systems. The external interface PCB assembly (142) is equipped with one or more external interface connectors (144), to facilitate communication with external peripherals, data transfer, and control functions. Further, the external interface PCB assembly (142) also includes a bridge connector (146), enabling communication with the backplane PCB assembly (138). This bridge connector (146) may establish a vital link between the internal and external interfaces, ensuring comprehensive connectivity and functionality of the electronics system.
[0063] In some aspects of the present disclosure, the rear assembly (134) further includes one or more spacers (148) to maintain optimal positioning and alignment of the internal and external interface PCB assemblies (138, 142). These spacers (148) are configured to space apart the external interface PCB assembly (142) from the backplane PCB assembly (138), ensuring adequate clearance and preventing interference between components. By maintaining precise alignment, the spacers (148) contribute to the overall structural integrity and performance of the rear assembly (134), enhancing the reliability and functionality of the electronics cabinet (100).
[0064] In some aspects of the present disclosure, the rear assembly (134) further includes a rear plate (150) that serves as a mounting platform and interface for one or more auxiliary components including, but not limited to switches, fuses, and panel-mount connectors, facilitating convenient access and integration of essential control and monitoring elements within the cabinet (100).
[0065] In some aspects of the present invention, the rear plate (150) may be designed to secure the external interface PCB assembly (142) and backplane PCB assembly (138) with the chassis (106) through one or more connection holes (152) and connectors (154). This secure attachment may ensure stability and robustness of the rear assembly (134) within the cabinet (100), safeguarding against mechanical stress and environmental factors.
[0066] In accordance with an embodiment of the present invention, the fan tray assembly (136) is configured to efficiently manage heat extraction from the plurality of chambers (104) within the cabinet (100) for conduction cooled electronics modules (106).
[0067] In some aspects of the present invention, the fan tray assembly (136) includes one or more fans (156) to dissipate the heat generated by the one or more electronic components within each chamber (104). These fans (156) are strategically positioned to ensure optimal airflow and effective heat dissipation, thereby maintaining the temperature within the cabinet (100) at desirable levels to safeguard the integrity and performance of the electronics modules (106).
[0068] In some aspects of the present invention, the fan tray assembly (136) further includes a fan plate (158) to facilitate the proper placement and operation of the fans (156). This fan plate (158) is configured to securely hold one or more fans (156) at strategic locations within the cabinet (100), aligning them with the heat fins (120, 126) present on the extreme and intermediate heat sink walls (116, 122). By aligning the fans (156) with these heat fins (120, 126), the fan plate (136) ensures that heat is efficiently drawn away from the electronic components (106) and dissipated into the surrounding environment, thereby preventing overheating and potential damage to the cabinet (100) structure.
[0069] In some aspects of the present invention, the fan plate (158) may be a W-shaped fan-plate.
[0070] In some aspects of the present invention, the fan tray assembly (136) further includes a wiring harness (160) that is designed to streamline the connectivity and operation of one or more fans (156). This wiring harness (160) may serve the essential function of routing one or more fan wires to a single connector (162), simplifying the process of connecting the fans (156) to the rear assembly (134) of the cabinet (100). By consolidating the fan wires into a single connector (162), the wiring harness (160) minimizes clutter and simplifies maintenance tasks, enhancing the overall reliability and ease of operation of the cooling system.
[0071] In some aspects of the present invention, when the heat loads from the electronics modules (106) are relatively low and the surrounding environment facilitates efficient dissipation of heat, the fan tray assembly (136) can be detached from the chassis (102). This detachment of the fan tray assembly (136) allows for the optimization of energy usage and reduces the overall power consumption of the system. By relying on natural convection for cooling under these conditions, the need for active fan-based cooling mechanisms is minimized, leading to energy savings and potentially extending the lifespan of the cooling components. Further, detaching the fan tray assembly (136) when natural convection suffices for cooling may also contribute to a quieter operating environment. Without the noise generated by the operation of fans, the overall acoustic profile of the system is reduced, making it more suitable for noise-sensitive environments or applications where minimal disturbance is desired.
[0072] In accordance with an embodiment of the present invention, the cabinet (100) further includes at least one gasket (164) to maintain the integrity of the enclosure against the ingress of water, dust, moisture, or other contaminants into the interior of the cabinet (100) is effectively prevented, safeguarding the sensitive electronics modules (106) housed within. The gasket (164), meticulously designed and strategically placed within the cabinet's (100) structure, acts as a secure seal and barrier to prevent water infiltration, thereby safeguarding the sensitive electronic components housed within. This gasket (164) is particularly vital in environments where exposure to moisture or humidity is a concern, such as outdoor installations or industrial settings where the cabinet (100) may be subjected to adverse weather conditions or potential liquid spills.
[0073] In accordance with an embodiment of the present invention, the plurality of chambers (104) includes one or more heat pipes or vapor chambers for optimized heat distribution within the cabinet (100) for conduction cooled electronics modules (106). It is known that heat pipes and vapor chambers are advanced thermal management technologies renowned for their efficiency in dissipating heat away from electronic components. These electronic components, particularly within densely packed modules, generate significant amounts of heat during operation, necessitating effective heat dissipation mechanisms to maintain optimal operating temperatures and prevent thermal damage.
[0074] By integrating heat pipes or vapor chambers within the chambers (104) of the cabinet (100), heat generated by the electronics modules (106) can be efficiently transferred and dissipated throughout the system. Heat pipes utilize the principle of phase change to transfer heat, typically involving the evaporation of a working fluid at the heat source, transportation of the vapor to a cooler area, condensation back into liquid form, and return of the liquid to the heat source through capillary action or gravity. This cyclic process effectively removes heat from hot spots and distributes it across a larger surface area, facilitating more uniform temperature distribution within the cabinet (100).
[0075] Similarly, vapor chambers operate on the principle of vaporization and condensation but on a larger scale. A vapor chamber consists of a flat, sealed container filled with a small amount of working fluid. When heat is applied to the vapor chamber, the fluid vaporizes and spreads out to areas of lower temperature, carrying heat away from the heat source. As the vapor reaches cooler regions, it condenses back into liquid form, releasing the absorbed heat and allowing the cycle to continue.
[0076] The inclusion of heat pipes or vapor chambers within the plurality of chambers (104) enhances the overall thermal management capabilities of the cabinet (100). By effectively distributing heat generated by the electronics modules (106), these thermal management components help maintain optimal operating conditions, mitigate the risk of thermal throttling or component failure, and extend the lifespan of critical electronic modules (106).
[0077] In accordance with an embodiment of the present invention, the cabinet (100) further comprises one or more brackets (170) and handles (172) that are secured to the chassis (102) structure for ease of transport and mounting.
[0078] The brackets (170) are strategically positioned within the chassis (102) to provide sturdy attachment points, ensuring stability during transport and handling. These brackets (170) may be typically made from durable materials such as metal alloys to withstand the rigors of transportation and mounting activities. By securely fastening the brackets (170) to the chassis (102) structure, the cabinet (100) gains increased structural integrity, minimizing the risk of damage or deformation during handling.
[0079] Further, the handles (172) are configured to offer a comfortable grip for users during lifting and maneuvering operations. These handles (172) are strategically positioned on the exterior of the cabinet (100), allowing for easy accessibility and manipulation. Whether it's for relocation within a facility or installation in a specific location, the handles (172) provide a convenient means of handling the cabinet (100) with minimal effort.
[0080] In some aspects of the present invention, the cabinet (100) may include one or more undercut surfaces (174) whose purpose is to mate with profile of module ejectors (not shown). The ejectors may provide enough force to module's (106) connector to mate or disengage with the backplane's connector (140) while moving the lever in or out. Using ejectors may help users to have mechanical advantage while mating or disengaging high retention force connector pairs. It also prevents damage to electrical connector due to excessive applied force while mating or disengaging. This may help prevent movement or displacement of the modules (106) during operation, reducing the risk of damage to sensitive components and ensuring the long-term reliability of the electronic system.
[0081] Referring to Figure 9, according to an aspect, the present invention discloses a method (200) for packaging a cabinet (100) for conduction cooled electronics modules (106). The method (200) includes: an initial step (202), in which a base plate (108) is assembled with at least one of extreme heat sink walls (116) and intermediate heat sink walls (122) along with a connecting plate (128). In a next step (204), front and rear connecting flats (114) are attached to the assembled base plate (108). In a further step (206), at least one extreme wall (112) is secured on right and left side along with a top cover (110) to the assembled chassis (102). In a further step (208), one or more brackets (170) and handles (172) are secured to the chassis (102) for ease of transport and mounting. In a further step (210), a gasket (164) is placed at the front and rear side of the assembled chassis (102). In a further step (212), a rear assembly (134) comprising a backplane PCB assembly (138), an external interface PCB assembly (142), and a rear plate (150), is connected to the chassis (102) from the rear side. In a further step (214), a fan tray assembly (136) comprising one or more fans (156) and a fan plate (158) is assembled into the chassis (102). In a final step (216), a plurality of conduction cooled electronics modules (106) are inserted into one or more slots (118, 124) of the heat sink walls (116, 122) from the front side.
[0082] The above mentioned process nowhere limits the invention and is provided for understanding of the invention.
[0083] Although there has been shown and described the preferred embodiment of the present invention, it will be readily apparent to those skilled in the art that modifications may be made thereto which do not exceed the scope of the appended claims. Therefore, the scope of the invention is only to be limited by the following claims.
,CLAIMS:We Claim:
1. A cabinet (100) for conduction cooled electronics modules, comprising:
a chassis (102) having a plurality of chambers (104), each chamber (104) is adapted to receive at least one conduction cooled electronics module (106);
a base plate (108) that is firmly secured to the chassis (102), ensuring stability and structural integrity;
a top cover (110) that is securely attached to the chassis (102);
at least one extreme wall (112) on the right and left side, forming opposing ends of the chassis (102), wherein each extreme wall (112) is connected to the other by a one or more connecting flats (114);
at least one extreme heat sink wall (116) connected to the base plate (108) and coupled to each right and left side extreme walls (112), having one or more slots (118) on one side and a plurality of heat fins (120) on the other side, wherein the plurality of heat fins (120) is arranged on its external surface facing the extreme wall (112);
one or more intermediate heat sink walls (122) connected to the base plate (108), having one or more slots (124) on one side and a plurality of heat fins (126) on the other side, wherein each adjacent intermediate heat sink wall (122) is connected to the other by a connecting plate (128);
wherein the plurality of heat fins (120, 126) are arranged on an external surface of the heat sink walls (116, 122),
wherein one or more slots (118, 124) of the extreme and intermediate heat sink walls (116, 122) are adapted to receive at least one conduction cooled electronics module (106),
a door (130) mounted on the front side of the chassis (102), configured to close one or more openings of the plurality of chambers (104) and equipped with a panel (132) for continuously indicating health status of one or more conduction cooled electronics modules (106);
a rear assembly (134) that is attached to the rear side of the chassis (106); and
a fan tray assembly (136) that is attached to the rear assembly (134) of the chassis (106).
2. The cabinet (100) for conduction cooled electronics modules as claimed in claim 1, wherein the rear assembly (134) comprising:
a backplane PCB assembly (138) having one or more internal interface connectors (140) that are strategically positioned to mate with corresponding conduction cooled electronics modules (106) to facilitate transmission of electrical signals;
an external interface PCB assembly (142) having one or more external interface connectors (144) and a bridge connector (146) for communication with the backplane PCB assembly (138);
one or more spacers (148) that are configured to space apart the external interface PCB assembly (142) from backplane PCB assembly (138); and
a rear plate (150) having at least one of a switch, fuse, and panel-mount connectors, configured to secure at least one of the external interface PCB assembly (142) and backplane PCB assembly (138) with the chassis (106) through one or more connection holes (152) and connectors (154).
3. The cabinet (100) for conduction cooled electronics modules as claimed in claim 1, wherein the fan tray assembly (136) comprising:
one or more fans (156) for extracting heat from the plurality of chambers (104);
a fan plate (158) configured to hold one or more fans (156) at strategic locations corresponding to the heat fins (120, 126); and
a wiring harness (160), routing one or more fan wires to a single connector (162) for facilitating the connection with the rear assembly (134) to enable at least one of a power supply, health monitoring, and speed control.
4. The cabinet (100) for conduction cooled electronics modules as claimed in claim 1, wherein the cabinet (100) further comprises at least one gasket (164) that is configured to provide a sealant connection against ingress of water into the cabinet (100).
5. The cabinet (100) for conduction cooled electronics modules as claimed in claim 1, wherein the connecting flats (114) comprises a plurality of grooves (166) and holes (168) at its top, front, and rear faces, establishing a secured connection with the top cover (110), door (130) and rear assembly (134).
6. The cabinet (100) for conduction cooled electronics modules as claimed in claim 1, wherein the plurality of chambers (104) further comprises one or more heat pipes or vapor chambers for optimized heat distribution.
7. The cabinet (100) for conduction cooled electronics modules as claimed in claims 1 and 3, wherein the fan tray assembly (136) is detached when the heat loads from the electronics modules (106) and ambient conditions permit cooling by natural convection.
8. The cabinet (100) for conduction cooled electronics modules as claimed in claim 1, wherein the cabinet (100) further comprises one or more brackets (170) and handles (172) that are secured to the chassis (102) structure for ease of transport and mounting.
9. A method for packaging a cabinet (100) for conduction cooled electronics modules, the method comprising the steps of:
assembling a base plate (108) with at least one of extreme heat sink walls (116) and intermediate heat sink walls (122) along with a connecting plate (128);
attaching front and rear connecting flats (114) to the assembled base plate (108);
securing at least one extreme wall (112) on right and left side along with a top cover (110) to the assembled chassis (102);
securing one or more brackets (170) and handles (172) to the chassis (102) for ease of transport and mounting;
placing a gasket (164) at the front and rear side of the assembled chassis (102);
mounting a door (130) on the front side of the chassis (102);
connecting a rear assembly (134) comprising a backplane PCB assembly (138), an external interface PCB assembly (142), and a rear plate (150) into the chassis (102) from the rear side;
assembling a fan tray assembly (136) comprising one or more fans (156) and a fan plate (158) into the chassis (102); and
inserting plurality of conduction cooled electronics modules (106) into one or more slots (118, 124) of the heat sink walls (116, 122) from the front side.

Dated this 30th day of March, 2023

For BHARAT ELECTRONICS LIMITED
(By their Agent)

D. MANOJ KUMAR (IN/PA-2110)
KRISHNA & SAURASTRI ASSOCIATES LLP