Abstract: The present application relates to a composition and a use thereof. The present application may provide a composition that can be cured at room temperature in the case of curing and can form a heat-dissipation material exhibiting an appropriate level of hardness, low adhesive strength, and excellent thermal conductivity. In addition, it is possible in the present application to achieve the low adhesive strength and the like without using a plasticizer or the like or with a plasticizer used at a minimal ratio. The present application may provide a product including the composition or a cured product thereof.
| # | Name | Date |
|---|---|---|
| 1 | 202317071418-STATEMENT OF UNDERTAKING (FORM 3) [19-10-2023(online)].pdf | 2023-10-19 |
| 2 | 202317071418-PRIORITY DOCUMENTS [19-10-2023(online)].pdf | 2023-10-19 |
| 3 | 202317071418-POWER OF AUTHORITY [19-10-2023(online)].pdf | 2023-10-19 |
| 4 | 202317071418-NOTIFICATION OF INT. APPLN. NO. & FILING DATE (PCT-RO-105-PCT Pamphlet) [19-10-2023(online)].pdf | 2023-10-19 |
| 5 | 202317071418-FORM 1 [19-10-2023(online)].pdf | 2023-10-19 |
| 6 | 202317071418-DECLARATION OF INVENTORSHIP (FORM 5) [19-10-2023(online)].pdf | 2023-10-19 |
| 7 | 202317071418-COMPLETE SPECIFICATION [19-10-2023(online)].pdf | 2023-10-19 |
| 8 | 202317071418-Proof of Right [09-11-2023(online)].pdf | 2023-11-09 |
| 9 | 202317071418-FORM 3 [09-11-2023(online)].pdf | 2023-11-09 |
| 10 | 202317071418-MARKED COPIES OF AMENDEMENTS [28-11-2023(online)].pdf | 2023-11-28 |
| 11 | 202317071418-FORM 13 [28-11-2023(online)].pdf | 2023-11-28 |
| 12 | 202317071418-AMMENDED DOCUMENTS [28-11-2023(online)].pdf | 2023-11-28 |
| 13 | 202317071418-FORM 18 [26-05-2025(online)].pdf | 2025-05-26 |