Description:FIELD OF THE INVENTION

[0001] The present invention relates to a computer cabinet cooling device that autonomously adjust its cooling mechanisms based on temperature variations within different regions of the computer cabinet by continuously monitoring and responding to localized thermal conditions, thus ensuring targeted and efficient heat removal for preventing overheating and maintaining optimal performance.

BACKGROUND OF THE INVENTION

[0002] Computer cabinet cooling is essential to maintain optimal performance and prevent damage to critical components such as the CPU, GPU, and power supply. When these components work at high loads, they generate significant amounts of heat. If the heat is not effectively dissipated, this lead to thermal throttling, where the system automatically reduces its performance to avoid overheating, or, worse, permanent hardware damage. Proper cooling helps ensure that the internal temperature of the cabinet remains within safe limits, thereby improving system reliability, longevity, and efficiency. The cooling process typically involves the use of fans, heat sinks, and sometimes liquid cooling systems to direct airflow and reduce heat buildup. A well-ventilated computer cabinet also minimizes the risk of dust accumulation, which further obstruct airflow and degrade cooling performance. Additionally, efficient cooling enhances the overall user experience by keeping the system quiet and stable. As modern computing demands increase, especially with gaming, video editing, or high-performance computing tasks, the need for effective computer cabinet cooling becomes even more critical. With proper cooling, a system performs at its peak without the risk of overheating, making it an indispensable component in any high-performance computer build.

[0003] The traditional method of cooling a computer cabinet primarily relies on air cooling, which involves the use of fans and passive heat sinks to dissipate heat from critical components like the CPU, GPU, and power supply. Fans are installed in strategic locations within the cabinet to promote airflow, drawing cool air in and expelling hot air out. Heat sinks, typically made of metal, are attached to heat-generating components to increase surface area for better heat dissipation. While this method is cost-effective and relatively simple, it has several drawbacks. First, air cooling is inefficient for high-performance systems, as it struggles to manage the heat produced by modern, high-powered components like gaming GPUs or overclocked CPUs. Moreover, fans are noisy, especially when running at high speeds, detracting from the user experience. Dust accumulation is another issue, as dust particles clog filters and obstruct airflow, reducing cooling efficiency and potentially damaging components. Additionally, air cooling is limited by the ambient temperature of the environment, making it less effective in hot conditions. As computing power continues to increase, the traditional air-cooling methods often fall short, leading to the development of more solutions like liquid cooling for more effective heat management.

[0004] WO2001015507A1 discloses about an invention that has output of known cooling equipment cabinets fitted with air-to-air heat exchangers is not sufficient for hot climates. The proposed cooling system is bipartite, comprising a first set of cooling equipment that provides for closed cooling air circulation inside the cabinet, and a second set of cooling equipment that provides for open cooling air circulation inside the cabinet. For most of the year, cooling of the cabinet can be handled with the first set of cooling equipment, which consists of an air-to-air heat exchanger (100). For the short period of time that the heat exchanger alone cannot ensure sufficient cooling of the air inside the cabinet, the second set of cooling equipment will be employed to provide through-flow air circulation. This is achieved by drawing air into the cabinet through a filter (104) and blowing warmed-up air out. Because the period of time when the through-flow equipment needs to be used is short, it is not necessary to encase the equipment and the risk of the filters getting clogged is low, meaning that they need to be replaced less frequently.

[0005] US8245764B2 discloses about an invention that relates to a cooling system for a computer system, said computer system comprising at least one unit such as a central processing unit (CPU) generating thermal energy and said cooling system intended for cooling the at least one processing unit and comprising a reservoir having an amount of cooling liquid, said cooling liquid intended for accumulating and transferring of thermal energy dissipated from the processing unit to the cooling liquid. The cooling system has a heat exchanging interface for providing thermal contact between the processing unit and the cooling liquid for dissipating heat from the processing unit to the cooling liquid, Different embodiments of the heat exchanging system as well as means for establishing and controlling a flow of cooling liquid and a cooling strategy constitutes the invention of the cooling system.

[0006] Conventionally, many methods are available for cooling the computer cabinet. However, the cited inventions rely on either air-to-air heat exchangers or cooling liquid circulation to manage heat dissipation. However, they fail to address dynamic and adaptive nature of heat generation in modern computer systems. The mentioned invention is limited by the reliance on a fixed cooling strategy that is not responsive to fluctuating heat levels, especially during peak heat periods.

[0007] In order to overcome the aforementioned drawbacks, there exists a need in the art to develop a device that not only provides a highly efficient method of heat dissipation, but also adapts dynamically to the varying thermal conditions of the computer cabinet. The developed invention also needs to offer solution that continuously monitors and adjusts the cooling process based on real-time thermal data.

OBJECTS OF THE INVENTION

[0008] The principal object of the present invention is to overcome the disadvantages of the prior art.

[0009] An object of the present invention is to develop a device that is capable of providing an effective solution for dissipating heat from a computer cabinet to prevent overheating and ensures optimal performance of electronic components inside the cabinet.

[0010] Another object of the present invention is to develop a device that automatically adjusts its cooling mechanisms based on temperature variations within different regions of the computer cabinet, ensuring targeted heat removal where it is most needed.

[0011] Another object of the present invention is to develop a device that minimizes energy consumption while maximizing the cooling performance, including the ability to adapt cooling efforts based on real-time thermal data.

[0012] Another object of the present invention is to develop a device that is capable of incorporating real-time monitoring and adjustment of the heat dissipation methods based on temperature feedback, thus improving the longevity and stability of the electronic components in the cabinet.

[0013] Yet another object of the present invention is to develop a device that is capable of detecting dust accumulation and automatically clearing it from the cabinet, thereby reducing the likelihood of dust-related issues such as reduced cooling efficiency or hardware malfunction.

[0014] The foregoing and other objects, features, and advantages of the present invention will become readily apparent upon further review of the following detailed description of the preferred embodiment as illustrated in the accompanying drawings.

SUMMARY OF THE INVENTION

[0015] The present invention relates to a computer cabinet cooling device to minimize energy consumption while maximizing cooling effectiveness based on real-time thermal data, ensuring that cooling resources are used efficiently and only, when necessary, thus reducing wasteful energy consumption without compromising on performance.

[0016] According to an embodiment of the present invention, a computer cabinet cooling device, comprises of a hollow cuboidal frame adapted to be installed over a computer cabinet, a conduit connected with a chamber continuously embedded along inner surfaces of the frame for circulating coolant from the chamber into the conduit and back to the chamber to absorb heat emanating from the cabinet, a Peltier unit embedded with the chamber to cool down a returned coolant carrying heat absorbed from the cabinet for recirculation, a temperature sensor incorporated in the chamber detects temperature of the coolant, a plurality of rectangular plates having fins disposed on surfaces of the plates, attached by means of hinges on primary sliding units installed along horizontal edges of the frame, to be positioned over heated portions of the cabinet for heat dissipation, an artificial intelligence-based thermal imaging unit configured on the frame to determine heated portions of the cabinet, a thermal anemometer installed on the plates to detect amount of heat removed, a dust sensor disposed on with the frame detects dust falling on the cabinet, plurality of air blowers incorporated on secondary sliding units provided along inner surfaces of the frame to blow the dust, a pair of motorized rollers installed along upper edges of the frame, the rollers containing spools of a mesh fabric for covering of the cabinet from sides and a pair of telescopic grippers positioned on the frame by means of ball and socket joints, for gripping the fabric and pulling across the cabinet.

[0017] While the invention has been described and shown with particular reference to the preferred embodiment, it will be apparent that variations might be possible that would fall within the scope of the present invention.

BRIEF DESCRIPTION OF THE DRAWINGS

[0018] These and other features, aspects, and advantages of the present invention will become better understood with regard to the following description, appended claims, and accompanying drawings where:
Figure 1 illustrates an isometric view of a computer cabinet cooling device.

DETAILED DESCRIPTION OF THE INVENTION

[0019] The following description includes the preferred best mode of one embodiment of the present invention. It will be clear from this description of the invention that the invention is not limited to these illustrated embodiments but that the invention also includes a variety of modifications and embodiments thereto. Therefore, the present description should be seen as illustrative and not limiting. While the invention is susceptible to various modifications and alternative constructions, it should be understood, that there is no intention to limit the invention to the specific form disclosed, but, on the contrary, the invention is to cover all modifications, alternative constructions, and equivalents falling within the spirit and scope of the invention as defined in the claims.

[0020] In any embodiment described herein, the open-ended terms "comprising," "comprises,” and the like (which are synonymous with "including," "having” and "characterized by") may be replaced by the respective partially closed phrases "consisting essentially of," consists essentially of," and the like or the respective closed phrases "consisting of," "consists of, the like.

[0021] As used herein, the singular forms “a,” “an,” and “the” designate both the singular and the plural, unless expressly stated to designate the singular only.

[0022] The present invention relates to a computer cabinet cooling device, seeks to enhance the reliability and longevity of computer by incorporating real-time monitoring, temperature feedback alongside detecting and clearing dust accumulation automatically, thus ensuring continued efficient operation and reducing risk of dust-related issues, such as decreased cooling efficiency or hardware malfunctions.

[0023] Referring to Figure 1, an isometric view of a computer cabinet cooling device is illustrated, comprising a hollow cuboidal frame 101, a conduit 102 continuously embedded along inner surfaces of the frame 101 and connected with a chamber 103 attached with the frame, a plurality of rectangular plates 104 having fins 113 disposed on surfaces of the plates 104, attached by means of hinges 105, on primary sliding unit 106 installed along horizontal edges of the frame, an artificial intelligence-based thermal imaging unit 107 installed on the frame, a thermal anemometer 108 installed on the plates 104, a plurality of air blowers 109 incorporated on secondary sliding units 110 provided along inner surfaces of the frame, a pair of motorized rollers 111 installed along upper edges of the frame, and a pair of telescopic grippers 112 positioned on the frame 101by means of ball and socket joints.

[0024] The proposed device comprises of a hollow cuboidal frame 101 that is developed to be positioned over a computer cabinet. The frame 101 is developed with a protective exterior of the device and the components associated with the device are mounted in and over the body. The body is cuboidal in shape and made up of material that offers a corrosion resistant, strength and durability to the device and is easy to maintain. Inner side of the frame 101 is embedded with a conduit 102, continuously and connected to a chamber 103 storing coolant, attached with the frame 101. On actuation an inbuilt microcontroller actuates a pump housed in the chamber 103 for delivering coolant in the conduit 102 such that the coolant gets circulated into the conduit 102.

[0025] The coolant solution absorbs heat through the process of thermal conduction when circulated through the conduit 102. As the coolant flows in the conduit 102 over cabinet, this absorbs the excess heat of the cabinet, causing its temperature to rise. The coolant, typically a mixture of water and antifreeze, has high thermal conductivity, allowing the coolant to efficiently transfer heat from the cabinet to the coolant fluid.

[0026] The pump used herein is of centrifugal type and comprises of an inlet duct, impeller vane, outlet duct and all these components are assembled in an involute casing. The impeller vane is directly coupled with the shaft of a DC motor associated with the pump which enables the rotation of the vane. The impeller vane is designed in such a way that on rotation generates the negative pressure within the involute casing and as a result the water is sucked within the casing continuously through the inlet duct and transferred outside through the outlet duct with pressure and then in conduit 102s for absorption of heat from the computer cabinet and then sent back chamber 103.

[0027] In the chamber 103, a Peltier unit is installed with the chamber 103, that is dedicated towards cooling down of the coolant returned back into the chamber 103 for making the coolant available for recirculation. The Peltier unit employed herein is based on the Peltier effect that stated that the cooling of one junction and the heating of the other when electric current is maintained in a circuit of material consisting of two dissimilar conductors. The Peltier effect related to production or absorption of heat at the junction of two metals on the passage of a current. Based on the user-specified temperature, the Peltier unit herein generates the cooling effect in order cool down the coolant

[0028] The chamber 103 features a temperature sensor for detecting temperature of the coolant. The temperature sensor consists a conductive sensing element. On varying the temperature, the resistance of conductive element deviates which results in fluctuation in voltage flow across the sensing element. The voltage fluctuation causes the current to flow across the sensing element is detected by the microcontroller in form of electric pulse. Further the microcontroller evaluates the amplitude of the electric pulse to determine the temperature coolant and based on which the microcontroller regulates functionality of the Peltier unit for cooling the coolant rapidly.

[0029] Plurality of rectangular plates 104 are attached to the frame 101 by means of hinges 105, that are actuated by the microcontroller for adjusting orientation of the plates 104 to ensure the proper contact of plates 104 on the computer cabinet. The hinges 105 are a piece of metal that interconnects the plates 104 with frame 101 and allows them to be oriented by revolving along the longitudinal axis whose operation is governed by a bi-directional direct current motor that is linked with the microcontroller. The bi-directional direct current motor is capable of converting direct current into mechanical work by following the principle of Lorentz Law which states that, the current carrying conduction when placed in magnetic or electrical field experiences a force known as Lorentz force. Such that the motor converts the electrical current derived from an external source into a mechanical torque for providing the required power to the hinges 105 to orient the plates 104 to ensure the proper contact of plates 104 on the computer cabinet.

[0030] The surface of plates 104 is configured with multiple fins 113 that also positioned in contact with heated computer cabinet. As the computer cabinet generates heat, the fins 113 facilitate efficient thermal transfer by absorbing the heat from the cabinet's surface. The fins 113 provide large surface area for heat dissipation and as larger surface area provided by the fins 113 allows for greater heat exchange between the heated surface of cabinet and the surrounding air. This improves the efficiency of heat absorption and promotes faster cooling. The air surrounding the fins 113 absorbs the heat and carries it away, helping in maintaining the temperature of the computer cabinet within safe operating limits.

[0031] The frame 101 is provided with primary sliding units 106 and pin joint, installed along horizontal edges of the frame 101, that is actuated for adjusting location of the plates 104 for efficient heat dissipation. The primary sliding unit 106 is a unit used for precise linear positioning of the plates 104. The primary sliding unit 106 combines the functionalities of a linear actuator and a sliding mechanism. The primary sliding unit 106 consists of a rail arrangement that provides a guided path for linear movement. The rail arrangement usually includes a pair of parallel rails or tracks, along which the primary sliding unit 106 moves. The slider carriage, also called a stage or platform, is the moving component of the primary sliding unit 106. primary sliding unit 106 is attached to the rail mechanism and slides along the rails. The carriage is equipped with a mechanism to minimize friction and ensure smooth motion. This involves the use of ball bearings. The primary sliding unit 106 incorporates a motor and a drive mechanism to generate linear motion for providing movement to the plates 104 to adjust plates 104 for efficient heat dissipation by means of both conduction and convection.

[0032] The frame 101 features an artificial intelligence-based thermal imaging unit 107, installed on the frame 101 and integrated with a processor for recording and processing thermal images in a vicinity of the housing. The artificial intelligence-based thermal imaging unit 107 captures and analyses thermal images of the surrounding environment using infrared sensors. The artificial intelligence-based thermal imaging unit 107 records temperature data across the surface and nearby areas, detecting heat patterns and anomalies. The processor processes these thermal images in real-time, utilizing AI protocols encrypted in processer, to identify potential overheating areas on the cabinet to trigger the microcontroller to actuates the primary sliding units 106 to translate and position the plates 104 adjacent to the heated portions of the cabinet for enhanced heat dissipation

[0033] Over the plates 104, a thermal anemometer 108 is installed to detect amount of heat removed. The thermal anemometer 108 measures the rate of heat removal from the computer cabinet by detecting the flow of air and its temperature variation. thermal anemometer 108 consists of a heated sensor, often a thin wire or film, that is exposed to the airflow. When air passes over the sensor, it cools the wire, causing its resistance to change. The anemometer 108 measures this change in resistance, which is directly proportional to the airflow rate and the amount of heat being removed. The faster the airflow, the greater the heat dissipation, leading to a higher cooling effect. The thermal anemometer 108 provides real-time data on airflow velocity and thermal energy to microcontroller that actuates the pin joints to change angle of the fins 113 to optimise heat dissipation.

[0034] Over the inner side of frame 101, a dust sensor is integrated to sense falling of dust over cabinet. The dust sensor used herein is based on an optical sensing method to detect dust. The dust sensor consists of a photo sensor and an infrared light-emitting diode (IR LED). The IR- LED emits the IR rays on the cabinet surface and the photo-sensor receive the reflected IR LED rays from the surface. The reflected rays are processed by the microcontroller to detect the presence of the dust over the cabinet. Based on the detected dust, the microcontroller actuates plurality of air blowers 109 incorporated in inner side of the frame 101, responsible for blowing air on cabinet for detaching the dust from the cabinet surface to prevent overheating, reduces wear on components, minimize the risk of electrical short circuits, and extends the lifespan of internal hardware by avoiding dust buildup. secondary sliding units 110 are provided along inner surfaces of the frame 101, to translate the blowers 109 and the blowers 109 to blow the dust away, properly.

[0035] A pair of telescopic grippers 112 are positioned on the frame 101 using ball and socket joints that serve to handle the mesh fabric which is developed to cover the computer cabinet. These grippers 112 are mounted in such a way that their position and orientation are adjusted with great flexibility due to the ball-and-socket joint design. This allows the grippers 112 to extend and retract and also rotate or pivot as needed to effectively grip and manipulate the fabric. When deployed, the grippers 112 grasp the fabric at specific points, pulling the fabric across the sides of the cabinet.

[0036] The ability to adjust their position ensures that the fabric is precisely positioned over the cabinet's surface for providing a protective cover. The ball and socket joints give the grippers 112 the range of motion necessary to handle fabric placement, even on irregularly shaped cabinets in view of ensuring full coverage from side to side. Once the fabric is in place, the grippers 112 release them and retract back to their initial position, ready to be used again. This contributes to both the physical protection of the cabinet and the maintenance of a clean, dust-free environment for enhancing the overall functionality of the cooling arrangement.

[0037] The present invention works best in the following manner, where the hollow cuboidal frame 101 as disclosed in the invention is developed to be placed over the computer cabinet. The frame 101 houses the conduit 102 embedded along its inner surfaces, which circulates coolant between the connected chamber 103 and the conduit 102. As heat emanates from the cabinet, the coolant absorbs this heat and returns to the chamber 103, where the Peltier unit cools it down. The temperature sensor within the chamber 103 detects the coolant’s temperature and activates the Peltier unit to maintain optimal coolant temperature for effective heat transfer. Simultaneously, the set of rectangular plates 104 with fins 113, mounted on primary sliding units 106, are positioned over the heated areas of the cabinet. The plate’s fins 113, attached via pin joints, adjust their angles to optimize heat dissipation. The AI-based thermal imaging unit 107 scans the vicinity of the cabinet for identifying heated regions and directing the microcontroller to move the sliding units in view of positioning the plates 104 where cooling is most needed. The thermal anemometer 108 on the plates 104 detects the amount of heat removed and signals the microcontroller to further adjust the angle of the fins 113 to maximize heat dissipation efficiency. The dust sensor monitors dust accumulation on the cabinet in view of triggering air blowers 109 on secondary sliding units 110 to blow away any dust and maintain airflow. Herein, if required, motorized rollers 111 deploy the mesh fabric to cover the cabinet by means of the grippers 112 for providing protection from environmental factors.

[0038] Although the field of the invention has been described herein with limited reference to specific embodiments, this description is not meant to be construed in a limiting sense. Various modifications of the disclosed embodiments, as well as alternate embodiments of the invention, will become apparent to persons skilled in the art upon reference to the description of the invention. , C , Claims:1) A computer cabinet cooling device, comprising:

i) a hollow cuboidal frame 101 adapted to be positioned over a computer cabinet;
ii) a conduit 102 continuously embedded along inner surfaces of said frame 101, wherein said conduit 102 is connected with a chamber 103 attached with said frame 101 for circulating coolant from said chamber 103 into said conduit 102 and back to said chamber 103 to absorb heat emanating from said cabinet;
iii) a Peltier unit installed with said chamber 103 to cool down a returned coolant carrying heat absorbed from said cabinet for recirculation, wherein a temperature sensor embedded in said chamber 103 detects temperature of said coolant to accordingly actuate said Peltier unit for cooling said coolant;
iv) a plurality of rectangular plates 104 having fins 113 disposed on surfaces of said plates 104, attached by means of hinges 105 on primary sliding units 106 installed along horizontal edges of said frame 101, to be positioned over heated portions of said cabinet for heat dissipation, wherein said fins 113 are attached with said plate by means of pin joints;
v) an artificial intelligence-based thermal imaging unit 107, installed on said frame 101 and integrated with a processor for recording and processing images in a vicinity of said housing, to determine heated portions of said cabinet to trigger a microcontroller to accordingly actuate said primary sliding units 106 to translate and position said plates 104 adjacent to said heated portions of said cabinet for enhanced heat dissipation; and
vi) a thermal anemometer 108 installed on said plates 104 to detect amount of heat removed to trigger said microcontroller to actuate said pin joints to change angle of said fins 113 to optimise heat dissipation.

2) The device as claimed in claim 1, wherein a plurality of air blowers 109 incorporated on secondary sliding units 110 provided along inner surfaces of said frame 101, wherein a dust sensor disposed on with said frame 101 detects dust falling on said cabinet to trigger said microcontroller to actuate said secondary sliding units 110 to translate said blowers 109 and said blowers 109 to blow said dust.

3) The device as claimed in claim 1, wherein a pair of motorized rollers 111 installed along upper edges of said frame 101, said rollers 111 containing spools of a mesh fabric for covering of said cabinet from sides.

4) The device as claimed in claim 3, wherein a pair of telescopic grippers 112 positioned on said frame 101 by means of ball and socket joints, for gripping said fabric and pulling across said cabinet.