View All Documents & Correspondence
Container For Electronic Component(s) And Associated Electronic Assembly Of Parts
Abstract: ABSTRACT The case for packaging electronic component(s), forming a housing intended to receive at least one electronic component (4), including a first support wall (8) including an inner face (14) suitable for receiving the electronic component(s) (4), and an outer face, further comprises a microfluidic cooling device (20) made of a second material and inserted into said first support wall (8), the microfluidic cooling device (20) including at least one channel (22) for the circulation of a heat-transfer fluid connected to a first inlet port (24) for the heat-transfer fluid and to a second outlet port (26) for the heat-transfer fluid, the cooling device (20) including at least one platform (28) for receiving the electronic component(s) (4) in contact with said at least one channel (22) for the circulation of a heat-transfer fluid.
Notices, Deadlines & Correspondence
Patent Information
Applicants
THALES
Inventors
1. KERTESZ, Philippe
2. RODRIGUES, Pedro
3. VOUZELAUD, Franck
Specification
Description:AS ATTACHED , Claims:AS ATTACHED
Documents
Application Documents
| # | Name | Date |
|---|---|---|
| 1 | 202314017082-STATEMENT OF UNDERTAKING (FORM 3) [14-03-2023(online)].pdf | 2023-03-14 |
| 2 | 202314017082-POWER OF AUTHORITY [14-03-2023(online)].pdf | 2023-03-14 |
| 3 | 202314017082-FORM 1 [14-03-2023(online)].pdf | 2023-03-14 |
| 4 | 202314017082-DRAWINGS [14-03-2023(online)].pdf | 2023-03-14 |
| 5 | 202314017082-DECLARATION OF INVENTORSHIP (FORM 5) [14-03-2023(online)].pdf | 2023-03-14 |
| 6 | 202314017082-COMPLETE SPECIFICATION [14-03-2023(online)].pdf | 2023-03-14 |
| 7 | 202314017082-Proof of Right [04-04-2023(online)].pdf | 2023-04-04 |
| 8 | 202314017082-Correspondence-Letter [13-04-2023(online)].pdf | 2023-04-13 |
| 9 | 202314017082-FORM 3 [25-07-2023(online)].pdf | 2023-07-25 |