Abstract: Provided is a cooling device that satisfies at least one of (1) and (2). (1) The cooling device comprises a casing which includes a metal part, a resin part that is connected to at least a portion of the metal part, and a flow channel which is disposed inside the casing. (2) The cooling device comprises a casing which comprises metal, a flow channel which is disposed inside the casing, and a component which comprises resin and is connected to a surface of the casing.
[0001]The present invention relates to a cooling device and a method
for manufacturing the cooling device .
Background technology
[0002]Various cooling devices using a liquid refrigerant such as water have been proposed as means for cooling an object (heating body) that generates heat during operation, such as a CPU mounted on a computer and a secondary battery mounted on an electric vehicle. .. For example, there is known a cooling device provided with a flow path for flowing a refrigerant inside a housing made of a material having excellent heat dissipation such as metal.
[0003]
In a cooling device having the above configuration, the metal members constituting the device are generally joined by brazing so as to withstand the internal pressure of the refrigerant flowing inside and prevent the refrigerant from leaking. .. Further, Patent Document 1 proposes a cooling device manufactured by properly using welding and spot welding for each part.
Prior art literature
Patent documents
[0004]
Patent Document 1: Japanese Patent Application Laid-Open No. 2015-210032
Outline of the invention
Problems to be solved by the invention
[0005]
In the conventional cooling device, a method is adopted in which the members constituting the housing are joined by brazing and then parts such as joints are joined to the housing by brazing. As described above, since the brazing is performed in two stages, there is a problem that the process is complicated and the strength of the metal housing is lowered due to the influence of heat received in the brazing process.
On the other hand, in response to the diversification of applications of cooling devices in recent years, it is desired to respond to the complicated shape, weight reduction and cost reduction of cooling devices, and there is a need for diversification in recent years only by brazing. I'm not satisfied.
In particular, in a cooling device using a liquid refrigerant, a technique for joining the housing by a method other than brazing is required while ensuring airtightness between the housing and the parts attached to the housing.
[0006]
In view of the above circumstances, it is an object of the present invention to provide a cooling device having a portion made of metal and a portion made of resin and having excellent airtightness, and a method for manufacturing the same.
Means to solve problems
[0007]
Means for solving the above problems include the following embodiments.
<1> A cooling device including a housing including a metal portion and a resin portion joined to at least a part of the metal portion, and a flow path arranged inside the housing.
<2> The cooling device according to <1>, wherein the surface of the metal portion joined to the resin portion is roughened.
<3> The cooling device according to <1> or <2>, wherein a plurality of the metal portions are present, and the resin portion is arranged between the plurality of metal portions.
<4> The cooling device according to any one of <1> to <3>, wherein the resin portion is arranged on a peripheral edge portion of the housing.
<5> The cooling device according to <4>, wherein the resin portion has a band shape along the peripheral edge portion of the housing, and at least one surface of the resin portion is not joined to the metal portion.
<6> The resin is provided with two metal portions corresponding to each of the main surfaces of the housing and having a flow path formed on one of them, and a resin portion interposed between the two metal portions. The cooling device according to any one of <1> to <3>, wherein the portion is joined to a metal portion in which the flow path is not formed and is arranged so as to face the flow path.
<7> The cooling device according to <6>, wherein another resin portion is arranged on the peripheral edge portion of the housing.
<8> The resin portion arranged on the peripheral edge portion of the housing has a band shape along the peripheral edge portion of the housing, and at least one surface of the resin portion is not joined to the metal portion, according to <7>. Cooling system.
<9> The cooling device according to any one of <6> to <8>, wherein the plurality of metal parts are made of metals different from each other.
<10> The cooling device according to any one of <1> to <9>, further comprising a component attached to the housing.
<11> The cooling device according to <10>, wherein the housings have main surfaces facing each other, and the parts are arranged on the main surfaces of the housing.
<12> The resin contained in the resin portion is a polyolefin resin, a polyvinyl chloride, a polyvinylidene chloride, a polystyrene resin, an AS resin, an ABS resin, a polyester resin, a poly (meth) acrylic resin, a polyvinyl alcohol, or a polycarbonate resin. Resin, polyamide resin, polyimide resin, polyether resin, polyacetal resin, fluorine resin, polysulfone resin, polyphenylene sulfide resin, polyketone resin, phenol resin, melamine resin, urea resin, polyurethane resin, epoxy resin The cooling device according to any one of <1> to <11>, which comprises at least one selected from the unsaturated polyester resin and the unsaturated polyester resin.
<13> The metal contained in the metal portion consists of a group consisting of iron, copper, nickel, gold, silver, platinum, cobalt, zinc, lead, tin, titanium, chromium, aluminum, magnesium, manganese and an alloy containing the metal. The cooling device according to any one of <1> to <12>, which comprises at least one selected.
<14> A cooling device including a housing containing metal, a flow path arranged inside the housing, and a component containing resin and joined to the surface of the housing.
<15> The cooling device according to <14>, wherein the surface to which the parts of the housing are joined is roughened.
<16> The cooling device according to <14> or <15>, wherein the housings have main surfaces facing each other, and the parts are arranged on the main surfaces of the housing.
<17> The cooling device according to <16>, wherein the component is arranged on one of the main surfaces of the housing.
<18> The cooling device according to <17>, wherein the component is arranged on a main surface opposite to the side facing the heating element.
<19> The cooling device according to any one of <14> to <18>, wherein the component is a joint portion connecting the flow path and a pipe for supplying a refrigerant to the flow path.
<20> The resin contained in the component is a polyolefin resin, polyvinyl chloride, polyvinylidene chloride, polystyrene resin, AS resin, ABS resin, polyester resin, poly (meth) acrylic resin, polyvinyl alcohol, polycarbonate resin. , Polyamide resin, Polyimide resin, Polyether resin, Polyacetal resin, Fluorine resin, Polysulfone resin, Polyphenylene sulfide resin, Polyketone resin, Phenolic resin, Melamine resin, Uria resin, Polyurethane resin, Epoxy resin and The cooling device according to any one of <14> to <19>, which comprises at least one selected from unsaturated polyester resins.
<21> The metal contained in the housing consists of a group consisting of iron, copper, nickel, gold, silver, platinum, cobalt, zinc, lead, tin, titanium, chromium, aluminum, magnesium, manganese and alloys containing the metal. The cooling device according to any one of <14> to <20>, which comprises at least one selected.
<22> A housing including a first metal member and a second metal member, a flow path arranged inside the housing, and a component containing resin and joined to the surface of the first metal member. A method of manufacturing a cooling device including the
above , wherein the parts are joined to a first metal member.
A method for manufacturing a cooling device, comprising a step of joining a first metal member to which the parts are joined and a second metal member in this order.
<23> The method for manufacturing a cooling device according to <22>, wherein the flow path is integrally formed with a second metal member.
<24> The method for manufacturing a cooling device according to <22> or <23>, wherein the surface of the first metal member joined to the component is roughened.
<25> The method for manufacturing a cooling device according to any one of <22> to <24>, wherein the component includes a joint portion.
The invention's effect
[0008]
According to the present invention, there is provided a cooling device having a portion made of metal and a portion made of resin and having excellent airtightness, and a method for manufacturing the same.
A brief description of the drawing
[0009]
FIG. 1 is an external view schematically showing an example of a configuration of a cooling device according to an embodiment of the present invention.
FIG. 2 is a cross-sectional view schematically showing a modified example of a component of the cooling device shown in FIG.
FIG. 3 is a cross-sectional view schematically showing a modified example of a component of the cooling device shown in FIG.
FIG. 4 is a cross-sectional view schematically showing a modified example of a component of the cooling device shown in FIG.
5 is a cross-sectional view schematically showing a modified example of the parts of the cooling device shown in FIG. 1. FIG.
[Fig. 6] Fig. 6 is an external view schematically showing an example of a configuration of a housing of a cooling device.
FIG. 7 is an external view schematically showing an example of the form of a resin portion arranged on a peripheral edge of a housing.
FIG. 8 is an external view schematically showing an example of a configuration of a housing of a cooling device.
[Fig. 9] Fig. 9 is an external view schematically showing an example of a configuration of a housing of a cooling device.
Mode for carrying out the invention
[0010]
In the present disclosure, the numerical range indicated by using "-" indicates a range including the numerical values before and after "-" as the minimum value and the maximum value, respectively.
In the numerical range described stepwise in the present disclosure, the upper or lower limit value described in one numerical range may be replaced with the upper limit value or lower limit value of another numerical range described stepwise. , May be replaced with the values shown in the examples.
In the present disclosure, the amount of each component in a material means the total amount of a plurality of substances present in the material, unless otherwise specified, when a plurality of substances corresponding to each component in the material are present.
[0011]
The cooling device of the first embodiment is joined to a housing containing metal, a flow path arranged inside the housing, and a surface of the housing containing resin. It is a cooling device including the parts that are used.
[0012]
In the cooling device, the parts bonded to the surface of the housing contain resin. Therefore, as compared with the case where the component is made of metal, it is possible to cope with the complicated shape, the weight reduction of the device, the cost reduction, and the like.
[0013]
In the cooling device, parts containing resin are joined to the surface of the housing. In the present disclosure, "joining" means a state in which parts are attached by being joined and integrated with the surface of a housing without using an adhesive, screws, or the like. As a result, for example, as compared with the case where the parts manufactured in another process are attached to the surface of the housing using an adhesive, screws, etc., the parts are firmly joined to any part of the housing, and excellent airtightness is achieved. Will be done.
[0014]
Further, in the cooling device, when the component includes a portion made of a material other than resin and a portion made of resin, the portion made of resin can also be used as a means for binding the component to the housing. This makes it possible, for example, to manufacture a cooling device in which two or more kinds of metals, which are difficult to join by brazing or welding, are used for the housing and the parts, respectively.
[0015]
If necessary, the cooling device may include parts that are attached to the housing by means other than joining such as brazing, welding, bonding with an adhesive, and screwing. The parts in this case are not limited to those containing resin, and may be entirely made of a material other than resin.
[0016]
Hereinafter, the cooling device of the first embodiment will be described in detail. However, the present invention is not limited to this embodiment.
[0017]
The
housing is not particularly limited as long as it contains metal and a flow path can be arranged inside. From the viewpoint of the cooling performance of the cooling device, it is preferable that the housing has a shape in which a sufficient area of a portion in contact with the heating element is secured. For example, it may have a shape having two main surfaces facing each other and a side surface having a thickness capable of arranging a flow path. The shape of the main surface (the surface having the largest area) of the housing is not particularly limited, and may be a quadrangle, a circle, or any other shape. The main surface of the housing may be flat or curved.
[0018]
The metal contained in the housing is not particularly limited and can be selected according to the application of the cooling device and the like. For example, from the group consisting of iron, copper, nickel, gold, silver, platinum, cobalt, zinc, lead, tin, titanium, chromium, aluminum, magnesium, manganese and alloys containing the metals (stainless steel, brass, phosphor bronze, etc.) It may be at least one selected.
From the viewpoint of thermal conductivity, the metal is preferably aluminum, an aluminum alloy, copper, or a copper alloy, and more preferably copper or a copper alloy.
From the viewpoint of weight reduction and ensuring strength, aluminum and aluminum alloy are more preferable as the metal.
[0019]
The dimensions of the housing are not particularly limited and can be selected according to the application of the cooling device and the like. For example, the area of the main surface of the housing 50 cm 2 ~ 5,000 cm 2 may be in the range of. Further, the thickness of the housing may be in the range of 1 mm to 50 mm.
[0020]
From the viewpoint of the joint strength with the parts arranged on the surface of the housing, it is preferable that the surface of the housing is roughened. When the surface of the housing is roughened, the texture of the surface of the component penetrates into the uneven structure formed on the surface, so that the anchor effect is exhibited and a strong bond can be obtained.
[0021]
The state of the uneven structure formed on the surface of the housing by the roughening treatment is not particularly limited as long as the joint strength with the parts can be sufficiently obtained.
The average pore diameter of the recesses in the concave-convex structure may be, for example, 5 nm to 250 μm, preferably 10 nm to 150 μm, and more preferably 15 nm to 100 μm.
The average hole depth of the recesses in the concave-convex structure may be, for example, 5 nm to 250 μm, preferably 10 nm to 150 μm, and more preferably 15 nm to 100 μm.
When either or both of the average hole diameter and the average hole depth of the recesses in the uneven structure is within the above numerical range, a stronger joint tends to be obtained.
[0022]
The average pore diameter and average pore depth of the recesses in the concave-convex structure can be determined by using an electron microscope or a laser microscope. Specifically, the surface of the housing and the cross section of the surface are photographed. From the obtained photographs, 50 arbitrary recesses can be selected, and the average hole diameter and average hole depth of the recesses can be calculated as arithmetic mean values from the hole diameters and hole depths of those recesses, respectively.
[0023]
The method of roughening the surface of the housing is not particularly limited, and various known methods can be used. For example, a method using a laser as disclosed in Patent No. 4020957; a method of immersing the surface of the housing in an aqueous solution of an inorganic base such as NaOH or an inorganic acid such as HCl or HNO 3 ; Methods of treating the surface of the housing by anodic oxidation, as disclosed; acid-based etchants (preferably inorganic acids, ferric ions or) as disclosed in WO 2015-8847. Substituent crystallization method in which an aqueous acid-based etching agent containing manganese ion, aluminum chloride hexahydrate, sodium chloride, etc., if necessary, is used for cupric ion); International Publication No. 2009/31632. A method of immersing the surface of the housing in one or more aqueous solutions selected from such hydrated hydrazine, ammonia, and water-soluble amine compounds (hereinafter, may be referred to as NMT method); Hot water treatment method as disclosed in; blast treatment and the like can be mentioned. The roughening treatment method can be used properly according to the material of the surface of the housing, the state of the desired uneven structure, and the like.
[0024]
The surface of the housing may be subjected to a treatment for adding a functional group in addition to the roughening treatment. By imparting a functional group to the surface of the housing, the chemical bond between the surface of the housing and the surface of the member increases, and the bonding strength tends to be further improved.
[0025]
The treatment for adding the functional group to the surface of the housing is preferably performed at the same time as the roughening treatment or after the roughening treatment.
The method of adding the functional group to the surface of the housing is not particularly limited, and various known methods can be used. For example, a chemical substance having a functional group is encapsulated in water or a solution prepared by dissolving a chemical substance in an organic solvent such as methyl alcohol, isopropyl alcohol, ethyl alcohol, acetone, toluene, ethyl cell solve, dimethyl formaldehyde, tetrahydrofuran, methyl ethyl ketone, benzene, or ethyl ether acetate. A method of immersing the surface of the body; a method of coating or spraying a chemical substance having a functional group or a solution containing the same on the surface of the housing; a method of attaching a film containing a chemical substance having a functional group to the surface of the housing, etc. Can be mentioned.
Examples of the method of performing the treatment for adding a functional group at the same time as the roughening treatment include a method of performing a wet etching treatment, a chemical conversion treatment, an anodic oxidation treatment and the like using a liquid containing a chemical substance having a functional group.
[0026]
The housing may include a metal portion and a resin portion bonded to at least a part of the metal portion. When a part of the housing is made of a resin portion, it is possible to cope with the complicated shape, the weight reduction of the device, the cost reduction, etc., as compared with the case where the entire housing is made of metal.
The details and preferred embodiments of the housing including the metal portion and the resin portion are the same as the details and preferred embodiments of the housing provided in the cooling device of the second embodiment described later.
[0027]
The resin contained in the resin portion of the housing is not particularly limited and can be selected according to the application of the cooling device and the like. For example, polyolefin resin, polyvinyl chloride, polyvinylidene chloride, polystyrene resin, AS resin, ABS resin, polyester resin, poly (meth) acrylic resin, polyvinyl alcohol, polycarbonate resin, polyamide resin, polyimide resin. , Polyether resin, Polyacetal resin, Fluorine resin, Polysulfone resin, Polyphenylene sulfide resin, Polyketone resin and other thermoplastic resins (including elastomer), and phenol resin, melamine resin, urea resin, polyurethane resin, Examples thereof include thermosetting resins such as epoxy resins and unsaturated polyester resins. These resins may be used alone or in combination of two or more.
From the viewpoint of moldability, a thermoplastic resin is preferable as the resin contained in the part.
[0028]
The resin contained in the component may contain various compounding agents. Examples of the compounding agent include fillers, heat stabilizers, antioxidants, pigments, weathering agents, flame retardants, plasticizers, dispersants, lubricants, mold release agents, antistatic agents and the like.
[0029]
The
parts are not particularly limited as long as they contain a resin and can be bonded to the surface of the housing. Specific examples of the component include a joint portion that connects a flow path arranged inside the housing and an external pipe, a reinforcing rib provided outside the housing, and the like.
[0030]
The state in which the parts are joined to the surface of the housing can be formed, for example, by applying a molten resin to the surface of the housing. When the resin applied to the surface of the housing is in a molten state, the degree of adhesion to the surface of the housing is improved (for example, the resin enters the uneven structure of the surface of the housing to exhibit the anchor effect). , The parts can be firmly bonded to the surface of the housing.
[0031]
The molten resin may be formed into a desired shape using a mold or the like. The molding method is not particularly limited, and can be carried out by a known method such as injection molding.
[0032]
The position of the parts in the cooling device, the number of parts, and the like are not particularly limited, and can be selected according to the shape of the cooling device, the method of use, and the like. In certain embodiments, the components may be placed on either side of the main surface of the housing. For example, when the cooling device is used with one of the main surfaces of the housing facing the heating element, the components may be arranged on the main surface opposite to the side facing the heating element.
[0033]
The resin contained in the parts is not particularly limited and can be selected according to the application of the cooling device and the like. For example, it may be selected from the resins that may be contained in the resin portion of the housing described above.
From the viewpoint of moldability, a thermoplastic resin is preferable as the resin contained in the part.
[0034]
In the present disclosure, "parts containing resin" includes cases where the whole is made of resin (and a compounding agent contained as necessary), and cases where a part of the parts is made of a material other than resin (metal, ceramics, carbon, glass, etc.). ) Consists of. When a part of the part is made of metal, the metal may be selected from the metals contained in the parts described later.
When a part of the part is made of a material other than resin, it is preferable that the part of the part to be joined to the surface of the housing is made of resin from the viewpoint of the bonding strength with the surface of the housing.
[0035]
As an example of the case where a part of the part is made of a material other than resin, for example, it is a tubular part such as a joint part, the inner circumference (or outer circumference) is made of resin, and the outer circumference (or inner circumference) is resin. Examples thereof include those made of a material other than the above, those in which the portion (base) in contact with the surface of the housing is made of resin, and the portion above the base is made of a material other than resin.
[0036]
The
flow path is not particularly limited as long as it is arranged inside the housing and allows the refrigerant to flow. For example, it may be formed integrally with a member constituting the housing by press molding or the like, or may be formed by arranging separately manufactured members inside the housing. Alternatively, the flow path containing the resin may be arranged in a state of being joined to the roughened surface inside the housing, if necessary.
[0037]
The material of the flow path is not particularly limited, and can be selected according to the material of the housing and parts, the type of refrigerant, and the like. When the flow path is made of metal, examples of the metal include metals that may be contained in the housing described above. When the flow path is made of resin, examples of the resin include resins that may be contained in the housing described above. The flow path may consist of two or more different materials (eg, resin and metal).
[0038]
Hereinafter, an example of the configuration of the cooling device will be described with reference to the drawings. In all the drawings, the same components are designated by a common reference numeral, and the description thereof will be omitted as appropriate.
[0039]
FIG. 1 is an overview view schematically showing an example of the configuration of a cooling device. The cooling device 10 shown in FIG. 1 includes a housing 12 and a component 14 attached to the surface of the housing 12. Inside the housing 12, a flow path (not shown) for circulating the refrigerant is arranged.
[0040]
In the cooling device 10 shown in FIG. 1, the housing 12 has a flat rectangular parallelepiped shape. As a result, a sufficient area where the main surface comes into contact with the heating element can be secured, and a sufficient cooling effect can be obtained.
[0041]
In the cooling device 10 shown in FIG. 1, the main surface of the housing 12 is composed of a metal portion a and a metal portion b, and the side surface is composed of a resin portion c. Further, the resin portion c is joined to the surfaces of the metal portion a and the metal portion b, respectively. That is, the resin portion c forms the side surface (peripheral portion) of the housing 12, and also plays a role of indirectly connecting the metal portion a and the metal portion b.
[0042]
In the cooling device 10 shown in FIG. 1, the component 14 is arranged only on the surface of the metal portion a. By arranging in this way, when the metal portion b is used facing the heating element, a sufficient area where the housing 12 and the heating element are in contact with each other can be secured. Further, since the component 14 is located on the upper surface instead of the side surface, it is advantageous in terms of maintainability of the cooling device 10.
For example, when the component 14 is provided on a surface other than the main surface of the housing, if there is an abnormality in the cooling unit composed of a plurality of cooling devices, it is necessary to remove the entire cooling unit. By arranging the 14 on the main surface, only the cooling device having an abnormality can be removed, so that maintenance is easy.
[0043]
In the cooling device 10 shown in FIG. 1, the component 14 has the shape of a joint portion that connects the flow path and the outside. In the configuration shown in FIG. 1, a joint portion for supplying the refrigerant from the outside to the flow path and a joint portion for discharging the refrigerant from the flow path to the outside are arranged adjacent to each other, but this is limited. However, it can be changed according to the shape of the flow path.
[0044]
The component 14 in the cooling device 10 shown in FIG. 1 may be entirely made of resin or partly made of a material other than resin. FIGS. 2 to 5 show modified examples of the component 14.
FIG. 2 is a cross-sectional view showing a configuration in which the entire component 14 is made of resin.
FIG. 3 is a cross-sectional view showing a configuration in which the inner side d of the cylindrical portion of the component 14 is made of resin and the outer side e is made of a material other than resin (for example, metal).
FIG. 4 is a cross-sectional view showing a configuration in which a portion (base portion f) of the component 14 close to the housing 12 is made of resin, and a portion (upper portion g) above the base portion f is made of a material other than resin (for example, metal). be.
In FIG. 5, the inner d of the cylindrical portion of the component 14 is made of resin, the outer e is made of a material other than resin (for example, metal), the base f is made of resin, and the upper portion g is made of a material other than resin (for example). , Metal) is a cross-sectional view showing a configuration.
[0045]
The cooling device of the second embodiment includes a housing including a metal portion, a resin portion bonded to at least a part of the metal portion, and an inside of the housing. It is a cooling device including a flow path arranged in.
[0046]
A part of the housing of the cooling device is made of a resin part. Therefore, as compared with the case where the entire housing is made of metal, it is possible to cope with the complicated shape, the weight reduction of the device, the cost reduction, and the like.
[0047]
In the cooling device, at least a part of the metal portion constituting the housing and the resin portion are joined. As a result, for example, as compared with the case where the resin portion produced in another process is attached to the surface of the metal portion using an adhesive, a screw, or the like, the resin portion is firmly bonded to the metal portion, and excellent airtightness is achieved. ..
[0048]
Further, in the cooling device, the resin portion can be used as a means for joining the metal portion by arranging the resin portion between the plurality of metal portions and joining the resin portion with the surface of each metal member. This makes it possible to manufacture a cooling device that combines two or more kinds of metals that cannot be bonded by brazing or welding, for example.
[0049]
Hereinafter, the cooling device of the second embodiment will be described in detail. However, the present invention is not limited to this embodiment.
[0050]
The
housing is not particularly limited as long as it includes a metal portion and a resin portion bonded to at least a part of the metal portion and a flow path can be arranged inside. From the viewpoint of the cooling performance of the cooling device, it is preferable that the housing has a shape in which a sufficient area of a portion in contact with the heating element is secured. For example, it may have a shape having two main surfaces facing each other and a side surface having a thickness capable of arranging a flow path. The shape of the main surface (the surface having the largest area) of the housing is not particularly limited, and may be a quadrangle, a circle, or any other shape. The main surface of the housing may be flat or curved.
[0051]
From the viewpoint of cooling performance, it is preferable that at least the portion of the housing in contact with the heating element is made of metal.
[0052]
The number of metal parts and resin parts constituting the housing is not particularly limited, and may be one or two or more, respectively.
When two or more metal parts are present, the resin part may be arranged between the two or more metal parts. In this case, all of the metal portion may be bonded to the resin portion, or only a part of the metal portion may be bonded to the resin portion.
[0053]
The metal and resin contained in the metal portion are not particularly limited and can be selected according to the application of the cooling device and the like. For example, it may be selected from the metals and resins contained in the housing of the cooling device of the first embodiment.
[0054]
The dimensions of the housing are not particularly limited and can be selected according to the application of the cooling device and the like. For example, the area of the main surface of the housing 50 cm 2 ~ 5,000 cm 2 may be in the range of. Further, the thickness of the housing may be in the range of 1 mm to 50 mm.
[0055]
From the viewpoint of the bonding strength between the resin portion and the metal portion, it is preferable that the surface of the metal portion is roughened. When the surface of the metal portion is roughened, the texture of the surface of the resin portion penetrates into the uneven structure formed on the surface, so that the anchor effect is exhibited and a firmly bonded state can be obtained.
The details and preferred embodiments of the roughening treatment are the same as the details and preferred embodiments of the roughening treatment applied to the surface of the housing of the cooling device of the first embodiment.
[0056]
The
cooling device may further include parts to be attached to the housing.
The type of parts that can be attached to the housing is not particularly limited. Specific examples thereof include a joint portion that connects a flow path arranged inside the housing and an external pipe, a reinforcing rib provided outside or inside the housing, and the like.
The material of the parts is not particularly limited, and may be a resin, a material other than the resin, or a combination thereof.
[0057]
The method of attaching the component to the housing is not particularly limited. For example, it may be bonded to the surface of the housing in the same manner as the resin portion described above, or may be attached by brazing, welding, adhesion using an adhesive, screwing, or the like.
[0058]
In some embodiments, the component may contain resin and be bonded to the surface of the housing.
The details and preferred embodiments of the parts containing the resin are the same as the details and preferred embodiments of the parts in the cooling device of the first embodiment.
[0059]
The
flow path is not particularly limited as long as it is arranged inside the housing and allows the refrigerant to flow. The details and preferred embodiments of the flow path are the same as the details and preferred embodiments of the flow path included in the cooling device of the first embodiment.
[0060]
Hereinafter, as a configuration example of the cooling device of the second embodiment, a configuration example of the housing will be described with reference to the drawings. For the parts other than the housing, the above-described configuration example of the cooling device can be referred to.
[0061]
In the
housing configuration example 1, two metal portions are joined by a resin portion arranged on the peripheral edge of the housing. More specifically, it includes two metal portions corresponding to each of the main surfaces of the housing and a resin portion corresponding to the peripheral edge portion of the housing (for example, the side surface of the housing), and the two metal portions are resin portions. It is a state indirectly connected by.
[0062]
FIG. 6 schematically shows an example of a cross section of the housing having the above configuration. The housing 12 shown in FIG. 6 includes a metal portion a and a metal portion b corresponding to each of the main surfaces, and a resin portion c arranged between the metal portion a and the metal portion b. The metal portion b is formed with irregularities in the shape of a flow path.
The resin portion c is joined to each of the metal portion a and the metal portion b to indirectly bond the metal portion a and the metal portion b and to form a peripheral edge portion of the housing 12. Further, in FIG. 6, in order to reinforce the housing 12, a resin portion c'is also arranged inside the housing 12 between the metal portion a and the metal portion b.
[0063]
The resin portion arranged on the peripheral edge of the housing may be strip-shaped along the peripheral edge of the housing, or at least one surface thereof may not be joined to the metal portion.
FIG. 7 schematically shows an example of the form of the resin portion bonded to the resin portion. Specifically, in FIG. 7A, a band-shaped resin portion c is arranged between the metal portion a and the metal portion b, and the resin portion c is joined to the side surfaces of the metal portion a and the metal portion b. Indicates no state. Further, in FIG. 7B, a band-shaped resin portion c is arranged between the metal portion a and the metal portion b, which are the two main surfaces of the housing, and also on the side surfaces of the metal portion a and the metal portion b. Indicates a state in which the resin parts are joined. Among these, the form (B) is preferable from the viewpoint of long leak path size (overlapping width of resin that can be sealed) and easy molding process.
[0064]
When the housing having the above structure is formed by injection molding of resin, the metal portion may be deformed by the pressure of the resin or the resin may leak into the flow path. Therefore, the thickness of the portion of the convex portion formed on the metal portion b that is joined to the resin portion c (the portion indicated by the reference numeral t in FIG. 7) is such that the resin portion can withstand the pressure during injection molding. It is preferable that the thickness is such that the strength can be secured. Specifically, it is preferably 1 mm or more, more preferably 1 mm to 10 mm, and even more preferably 1 mm to 5 mm.
[0065]
In order to further increase the strength of the metal portion b, as shown in FIG. 7C, the metal portion b may be fitted in the recess provided in the metal portion a. Alternatively, as shown in FIGS. 7D and 7A, the metal portion b may abut against the step or convex portion provided on the metal portion a. With such a configuration, it is possible to prevent the metal portion b from falling toward the flow path side due to the pressure of the resin.
[0066]
The housing having the above configuration has a resin portion on the side surface, and the resin portion plays a role of connecting the metal portion as the main surface, so that unlike the case of brazing, the strength of the metal portion is not affected and the airtightness is not affected. The sex can be secured.
Further, from the viewpoint of ensuring the strength of the cooling device, a joint portion between one or more metal portions and a resin portion is further provided in a place other than the peripheral portion of the housing (for example, inside the housing) as necessary. May be good.
For example, especially when the area of the main surface is large, there is a problem that the housing of the cooling device swells due to the pressure when the refrigerant flows. By providing the housing, the strength of the housing can be increased, and the problem of swelling of the housing can be solved. The joining means of the binding site provided inside the housing is not particularly limited, but from the viewpoint of simplifying the process, joining with a resin portion is preferable as in the peripheral portion of the housing.
[0067]
The housing having the above configuration is, for example, arranged in a mold so that two metal plates serving as main surfaces face each other, and resin is filled between the metal plates by injection molding or the like to fill the peripheral portion of the housing. And, if necessary, it can be produced by forming a resin portion at a bonding site other than the side surface to be formed. According to this method, the housing can be manufactured without bending the metal plate, brazing the metal plate, or the like.
[0068]
In the
housing configuration example 2, the two metal portions corresponding to each of the main surfaces of the housing and having a flow path formed on one of them and the two metal portions are interposed. The resin portion is joined to a metal portion in which the flow path is not formed, and is arranged so as to face the flow path.
[0069]
A housing having such a configuration is particularly effective in the case of a combination of dissimilar metals because the metal portions are isolated from each other with the resin portion interposed between the metal portions. For example, in a mode in which copper having excellent thermal conductivity is used for the main surface on the side in contact with the heating element of the housing and lightweight aluminum is used for the main surface on the opposite side, a resin portion is provided between the metal portions. Therefore, the problem of galvanic corrosion due to contact between dissimilar metals can be avoided. In addition, the weight can be reduced as compared with a cooling device made entirely of copper.
[0070]
In a housing having the above configuration, for example, a resin portion is formed in advance by injecting resin onto one metal plate so as to be joined to the metal plate, and the formed resin portion and the other metal plate are formed. After abutting, it can be produced by joining the peripheral edges of the two main surfaces by the following joining means. The joining means of the peripheral portions of the two main surfaces may be any means for ensuring airtightness, and the joining means by joining is preferable from the viewpoint of further improving the airtightness. Here, as a joining method, the two main surfaces are joined by arranging the resin on the side surface of the housing as in the configuration example 1, but the details are the same as in the configuration example 1.
[0071]
As described in Configuration Example 1, from the viewpoint of ensuring the strength of the housing, one or more binding sites can be provided not only on the side surface but also on the main surface as needed. Since the joining means is the same as that of the first configuration example, the description thereof will be omitted here.
[0072]
In the present disclosure, "bonding" is a broader concept than joining. For example, a state in which the resin part and the metal part are joined, a state in which the resin part is fixed to the metal part by using a fastening means such as an adhesive, a screw, or a resin part, a combination of these joining means, and the like can be mentioned. , Not limited to these.
In the present disclosure, the "contact" means a state in which the resin portion is in contact with the surface of the metal portion without being fixed.
[0073]
The resin portion interposed between the metal portions may be joined to the entire surface of the metal portion in which the flow path is not formed, and among the surfaces of the metal portion in which the flow path is not formed, the unevenness of the flow path shape is convex. It may be joined only to the portion corresponding to the portion.
[0074]
FIG. 8 schematically shows an example of a cross section of the housing having the above configuration. In the housing 12 shown in FIG. 8, unlike FIG. 8, the metal portion a and the metal portion b are separated by the resin portion c located at the convex portion of the flow path formed in the metal portion b. Therefore, even if the metal portion a and the metal portion b are made of dissimilar metals, galvanic corrosion does not occur due to contact between the two. For example, the resin portion c may be joined to the metal portion a in which the flow path is not formed, and may be bonded or abutted with the metal portion b in which the flow path is formed by a method other than joining.
[0075]
In
the configuration example 3 of the housing, the resin portion includes two metal parts corresponding to each of the main surfaces of the housing and a resin part arranged between the two metal parts. It is in a state of forming a flow path.
[0076]
FIG. 9 schematically shows another example of the cross section of the housing having the above configuration. In the housing 12 shown in FIG. 9, unlike FIG. 8, the resin portion c arranged between the metal portion a and the metal portion b corresponding to the main surface separates the metal portion a and the metal portion b and flows. Forming a road. For example, the resin portion c may be joined to the metal portion a and may be bonded or abutted with the metal portion b by a method other than joining.
[0077]
The application of the cooling device of the present disclosure is not particularly limited. For example, it is suitably used for cooling a heating element such as a CPU mounted on a computer and a secondary battery mounted on an electric vehicle. In addition, it is suitably used for all applications requiring temperature control, such as air conditioning equipment, hot water supply equipment, and power generation equipment.
[0078]
The manufacturing method of the cooling device of the present disclosure includes a housing including a first metal member and a second metal member, a flow path arranged inside the housing, and a resin. A method of manufacturing a cooling device including a component bonded to the surface of a
first metal member,
wherein the component is bonded to the first metal member and a first metal to which the component is bonded. This is a method for manufacturing a cooling device, which comprises a step of joining a member and a second metal member in this order.
[0079]
According to the above method, a cooling device having excellent airtightness can be manufactured.
That is, since the step of joining the parts to the first metal member is performed by injection molding of the molten resin or the like, a large pressure is applied to the first metal member. On the other hand, since the housing of the cooling device has a space for accommodating the flow path inside, it is easily affected by an external force. Therefore, if a component is joined to the first metal member in a state where the first metal member and the second metal member are joined, the housing may be compressed at the time of joining, resulting in deformation, breakage, or the like.
In the above method, since the first metal member and the second metal member are joined after the parts are joined to the first member, deformation, breakage, etc. of the housing are effectively suppressed. As a result, a cooling device having excellent airtightness can be manufactured.
[0080]
From the viewpoint of the joint strength between the component and the first metal member, it is preferable that the surface of the first metal member is roughened. The details and preferred embodiments of the roughening treatment are the same as the details and preferred embodiments of the roughening treatment applied to the surface of the housing of the cooling device described above.
[0081]
The type of parts is not particularly limited. In one embodiment, the component is a joint that connects a flow path arranged inside the housing to an external pipe.
[0082]
The mode in which the first metal member and the second metal member included in the housing are bonded is not particularly limited. For example, the metal members may be joined to each other by welding or the like, or may be joined via another member such as a resin. Further, the flow path included in the cooling device may be integrally formed with the first metal member or the second metal member, or may be formed from another member such as resin.
In some embodiments, the housings may have main surfaces facing each other, each of which may consist of a first metal member and a second metal member.
[0083]
Details and preferred embodiments of the cooling device manufactured by the above method and the metal members, parts and flow paths used in the method are the details and preferred embodiments of the above-mentioned cooling device and the metal members, parts and flow paths included in the cooling device. It is the same as the aspect. That is, the above method may be for manufacturing the above-mentioned cooling device.
Example
[0084]
Hereinafter, embodiments according to the present invention will be described in detail with reference to examples. The present invention is not limited to these descriptions.
[0085]
Two aluminum plates of 150 mm × 80 mm × 2 mm were prepared as the main surface material of the cooling device. On one aluminum plate, a flow path (height 2 mm) is formed by press molding. The other aluminum plate is formed with through holes having a diameter of 10 mm at positions corresponding to the supply port and the discharge port of the refrigerant.
[0086]
The surface of the aluminum plate was etched by immersing it in a chemical solution (product name: Amalfa A-10201 manufactured by MEC) for 5 minutes. Next, the surface of the etched aluminum plate was washed with water, alkaline (immersed in a 5% NaOH aqueous solution for 20 seconds), washed with water, and neutralized (immersed in a 5% H 2 SO 4 aqueous solution for 20 seconds). , And washing with water was carried out continuously to roughen the surface.
When the surface of the roughened aluminum plate was observed with an electron microscope, an uneven structure was formed in which the average pore diameter and the average pore depth were each in the range of 5 nm or more and 250 μm or less.
[0087]
An aluminum plate having a through hole was placed in a mold for injection molding. Next, a molten resin (polyphenylene sulfide (PPS), manufactured by Tosoh Corporation, Sustil (registered trademark) SGX-120) is injected into the mold, and the through hole is made of resin around the through hole and the through hole of the aluminum plate. A joint portion was formed that was joined to the nearby surface.
[0088]
The aluminum plate on which the joint portion was formed and the aluminum plate on which the flow path was formed were arranged in a mold for injection molding so as to face each other with the flow path inside. Next, a molten resin (polyphenylene sulfide (PPS), manufactured by Tosoh Corporation, Sustil (registered trademark) SGX-120) is injected into the mold, and the side surface made of resin and bonded to the surface of the aluminum plate is formed. It was formed to produce a cooling device having a configuration as shown in FIG.
[0089]
When the refrigerant (water) was injected into the produced cooling device and the inside of the cooling device was allowed to flow at a high pressure, the joint portion from the aluminum plate was not peeled off, the refrigerant leaked, and the housing was not deformed. Therefore, it was found that the cooling device has sufficient airtightness.
[0090]
The disclosures of Japanese Patent Applications No. 2019-099573 and No. 2019-105544 are incorporated herein by reference in their entirety. All documents, patent applications, and technical standards described herein are to the same extent as if the individual documents, patent applications, and technical standards were specifically and individually stated to be incorporated by reference. Incorporated herein by reference.
WE CLAIMS
A cooling device including a housing including a metal portion and a resin portion joined to at least a part of the metal portion, and a flow path arranged inside the housing.
[Claim 2]
The cooling device according to claim 1, wherein the surface of the metal portion joined to the resin portion is roughened.
[Claim 3]
The cooling device according to claim 1 or 2, wherein a plurality of the metal portions are present, and the resin portion is arranged between the plurality of metal portions.
[Claim 4]
The cooling device according to any one of claims 1 to 3, wherein the resin portion is arranged on a peripheral edge portion of the housing.
[Claim 5]
The cooling device according to claim 4, wherein the resin portion has a band shape along a peripheral edge portion of the housing, and at least one surface of the resin portion is not joined to a metal portion.
[Claim 6]
The resin portion comprises two metal portions corresponding to each of the main surfaces of the housing and having a flow path formed on one of them, and a resin portion interposed between the two metal portions. The cooling device according to any one of claims 1 to 3, wherein the cooling device is joined to a metal portion in which the flow path is not formed and is arranged so as to face the flow path.
[Claim 7]
The cooling device according to claim 6, wherein another resin portion is arranged on the peripheral edge portion of the housing.
[Claim 8]
The cooling device according to claim 7, wherein the resin portion arranged on the peripheral edge portion of the housing has a band shape along the peripheral edge portion of the housing, and at least one surface of the resin portion is not joined to the metal portion.
[Claim 9]
The cooling device according to any one of claims 6 to 8, wherein the plurality of metal parts are made of metals different from each other.
[Claim 10]
The cooling device according to any one of claims 1 to 9, further comprising a component attached to the housing.
[Claim 11]
The cooling device according to claim 10, wherein the housing has main surfaces facing each other, and the parts are arranged on the main surface of the housing.
[Claim 12]
The resin contained in the resin portion is a polyolefin resin, polyvinyl chloride, polyvinylidene chloride, polystyrene resin, AS resin, ABS resin, polyester resin, poly (meth) acrylic resin, polyvinyl alcohol, polycarbonate resin, polyamide. Based resin, polyimide resin, polyether resin, polyacetal resin, fluorine resin, polysulfone resin, polyphenylene sulfide resin, polyketone resin, phenol resin, melamine resin, urea resin, polyurethane resin, epoxy resin and unsaturated The cooling device according to any one of claims 1 to 11, which comprises at least one selected from polyester resins.
[Claim 13]
The metal contained in the metal portion is selected from the group consisting of iron, copper, nickel, gold, silver, platinum, cobalt, zinc, lead, tin, titanium, chromium, aluminum, magnesium, manganese and alloys containing the metal. The cooling device according to any one of claims 1 to 12, which comprises at least one type.
[Claim 14]
A cooling device including a housing containing metal, a flow path arranged inside the housing, and a component containing resin and joined to the surface of the housing.
[Claim 15]
The cooling device according to claim 14, wherein the surface to which the parts of the housing are joined is roughened.
[Claim 16]
The cooling device according to claim 14 or 15, wherein the housing has main surfaces facing each other, and the parts are arranged on the main surface of the housing.
[Claim 17]
The cooling device according to claim 16, wherein the component is arranged on any one of the main surfaces of the housing.
[Claim 18]
The cooling device according to claim 17, wherein the parts are arranged on a main surface opposite to the side facing the heating element.
[Claim 19]
The cooling device according to any one of claims 14 to 18, wherein the component is a joint portion that connects the flow path and a pipe that supplies a refrigerant to the flow path.
[Claim 20]
The resins contained in the parts are polyolefin resin, polyvinyl chloride, polyvinylidene chloride, polystyrene resin, AS resin, ABS resin, polyester resin, poly (meth) acrylic resin, polyvinyl alcohol, polycarbonate resin, polyamide resin. Resin, polyimide resin, polyether resin, polyacetal resin, fluorine resin, polysulfone resin, polyphenylene sulfide resin, polyketone resin, phenol resin, melamine resin, urea resin, polyurethane resin, epoxy resin and unsaturated polyester The cooling device according to any one of claims 14 to 19, which comprises at least one selected from resins.
[Claim 21]
The metal contained in the housing is selected from the group consisting of iron, copper, nickel, gold, silver, platinum, cobalt, zinc, lead, tin, titanium, chromium, aluminum, magnesium, manganese and alloys containing the metal. The cooling device according to any one of claims 14 to 20, which comprises at least one kind.
[Claim 22]
A housing including a first metal member and a second metal member, a flow path arranged inside the housing, and a component containing resin and joined to the surface of the first metal member. A method of manufacturing a cooling device, in which
a step of joining the parts to a first metal member and a step of joining the first metal member to which the
parts are joined and a second metal member are performed in this order. A method for manufacturing a cooling device.
[Claim 23]
The method for manufacturing a cooling device according to claim 22, wherein the flow path is integrally formed with a second metal member.
[Claim 24]
The method for manufacturing a cooling device according to claim 22 or 23, wherein the surface of the first metal member joined to the component is roughened.
[Claim 25]
The method for manufacturing a cooling device according to any one of claims 22 to 24, wherein the part includes a joint portion.
| # | Name | Date |
|---|---|---|
| 1 | 202117032949-IntimationOfGrant30-08-2023.pdf | 2023-08-30 |
| 1 | 202117032949-TRANSLATIOIN OF PRIOIRTY DOCUMENTS ETC. [22-07-2021(online)].pdf | 2021-07-22 |
| 2 | 202117032949-PatentCertificate30-08-2023.pdf | 2023-08-30 |
| 2 | 202117032949-STATEMENT OF UNDERTAKING (FORM 3) [22-07-2021(online)].pdf | 2021-07-22 |
| 3 | 202117032949-REQUEST FOR EXAMINATION (FORM-18) [22-07-2021(online)].pdf | 2021-07-22 |
| 3 | 202117032949-FORM 3 [12-06-2023(online)].pdf | 2023-06-12 |
| 4 | 202117032949-PROOF OF RIGHT [22-07-2021(online)].pdf | 2021-07-22 |
| 4 | 202117032949-FORM 3 [13-01-2023(online)].pdf | 2023-01-13 |
| 5 | 202117032949-PRIORITY DOCUMENTS [22-07-2021(online)].pdf | 2021-07-22 |
| 5 | 202117032949-FORM 3 [29-09-2022(online)].pdf | 2022-09-29 |
| 6 | 202117032949-POWER OF AUTHORITY [22-07-2021(online)].pdf | 2021-07-22 |
| 6 | 202117032949-FORM 3 [17-08-2022(online)].pdf | 2022-08-17 |
| 7 | 202117032949-FORM 18 [22-07-2021(online)].pdf | 2021-07-22 |
| 7 | 202117032949-CLAIMS [08-06-2022(online)].pdf | 2022-06-08 |
| 8 | 202117032949-FORM 1 [22-07-2021(online)].pdf | 2021-07-22 |
| 8 | 202117032949-DRAWING [08-06-2022(online)].pdf | 2022-06-08 |
| 9 | 202117032949-DRAWINGS [22-07-2021(online)].pdf | 2021-07-22 |
| 9 | 202117032949-FER_SER_REPLY [08-06-2022(online)].pdf | 2022-06-08 |
| 10 | 202117032949-DECLARATION OF INVENTORSHIP (FORM 5) [22-07-2021(online)].pdf | 2021-07-22 |
| 10 | 202117032949-OTHERS [08-06-2022(online)].pdf | 2022-06-08 |
| 11 | 202117032949-COMPLETE SPECIFICATION [22-07-2021(online)].pdf | 2021-07-22 |
| 11 | 202117032949-FER.pdf | 2022-02-24 |
| 12 | 202117032949-FORM 3 [01-11-2021(online)].pdf | 2021-11-01 |
| 12 | 202117032949.pdf | 2021-10-19 |
| 13 | 202117032949-FORM 3 [01-11-2021(online)].pdf | 2021-11-01 |
| 13 | 202117032949.pdf | 2021-10-19 |
| 14 | 202117032949-COMPLETE SPECIFICATION [22-07-2021(online)].pdf | 2021-07-22 |
| 14 | 202117032949-FER.pdf | 2022-02-24 |
| 15 | 202117032949-DECLARATION OF INVENTORSHIP (FORM 5) [22-07-2021(online)].pdf | 2021-07-22 |
| 15 | 202117032949-OTHERS [08-06-2022(online)].pdf | 2022-06-08 |
| 16 | 202117032949-DRAWINGS [22-07-2021(online)].pdf | 2021-07-22 |
| 16 | 202117032949-FER_SER_REPLY [08-06-2022(online)].pdf | 2022-06-08 |
| 17 | 202117032949-FORM 1 [22-07-2021(online)].pdf | 2021-07-22 |
| 17 | 202117032949-DRAWING [08-06-2022(online)].pdf | 2022-06-08 |
| 18 | 202117032949-FORM 18 [22-07-2021(online)].pdf | 2021-07-22 |
| 18 | 202117032949-CLAIMS [08-06-2022(online)].pdf | 2022-06-08 |
| 19 | 202117032949-POWER OF AUTHORITY [22-07-2021(online)].pdf | 2021-07-22 |
| 19 | 202117032949-FORM 3 [17-08-2022(online)].pdf | 2022-08-17 |
| 20 | 202117032949-PRIORITY DOCUMENTS [22-07-2021(online)].pdf | 2021-07-22 |
| 20 | 202117032949-FORM 3 [29-09-2022(online)].pdf | 2022-09-29 |
| 21 | 202117032949-PROOF OF RIGHT [22-07-2021(online)].pdf | 2021-07-22 |
| 21 | 202117032949-FORM 3 [13-01-2023(online)].pdf | 2023-01-13 |
| 22 | 202117032949-REQUEST FOR EXAMINATION (FORM-18) [22-07-2021(online)].pdf | 2021-07-22 |
| 22 | 202117032949-FORM 3 [12-06-2023(online)].pdf | 2023-06-12 |
| 23 | 202117032949-STATEMENT OF UNDERTAKING (FORM 3) [22-07-2021(online)].pdf | 2021-07-22 |
| 23 | 202117032949-PatentCertificate30-08-2023.pdf | 2023-08-30 |
| 24 | 202117032949-TRANSLATIOIN OF PRIOIRTY DOCUMENTS ETC. [22-07-2021(online)].pdf | 2021-07-22 |
| 24 | 202117032949-IntimationOfGrant30-08-2023.pdf | 2023-08-30 |
| 1 | search730E_23-02-2022.pdf |