Technical field
[0001]
The present invention relates to a cooling device and a structure.
Background technology
[0002]
In recent years, batteries have been attracting attention as a power source for electric vehicles and the like. It is known that a high-output and large-capacity battery generates a large amount of heat in the charge / discharge process, and this heat causes deterioration of the battery. Therefore, the battery requires a cooling system.
In addition, heat countermeasures have traditionally been regarded as important for electronic components equipped with semiconductor elements that are heat generating elements. In particular, with the recent trend toward miniaturization and high-density mounting of electronic components, or the speeding up of microprocessors, the power consumption per electronic component has increased significantly, and an efficient cooling system is important. It has become.
[0003]
In recent years, liquid-cooled cooling devices are being adopted as cooling systems for heating elements such as batteries and electronic components. A liquid-cooled cooling device is a device in which a metal plate with a built-in flow path for circulating refrigerant, a so-called cold plate, is brought into contact with a heating element, and heat generated from the heating element is generated by the refrigerant passing through the flow path. The heating element is cooled by transporting it to a heat sink on the heat dissipation side provided outside (see, for example, Patent Document 1).
Patent Document 1 describes a first plate having a mounting surface that is in thermal contact with the corresponding assembled battery, a second plate that is fixed to the surface opposite to the mounting surface described above, the first plate, and the first plate. A cooling mechanism including a cooling flow path formed between two plates and a seal portion arranged between the first plate and the second plate for sealing the cooling flow path is disclosed. There is.
Prior art literature
Patent documents
[0004]
Patent Document 1: International Publication No. 2017/002325
Outline of the invention
Problems to be solved by the invention
[0005]
However, the cooling mechanism disclosed in Patent Document 1 has a problem that the weight becomes large because both the first plate and the second plate are made of metal. Furthermore, when applied to cooling a large to heavy battery block, the seal between the metal plates is partially destroyed by impact or vibration, and if the cooling medium leaks and comes into contact with the assembled battery, the battery will be short-circuited. I was afraid.
[0006]
The present invention has been made in view of the above circumstances, and provides a cooling device and a structure that can reduce the risk of leakage of the cooling medium and are excellent in light weight.
Means to solve problems
[0007]
According to the present invention, the cooling device and the structure shown below are provided.
[0008]
[1]
A resin flow path provided with a space that serves as a flow path on at least one surface,
A metal cooling panel that covers the space and at least partly contacts the resin flow path and cools the heating element.
A resin joining member for joining the resin flow path and the metal cooling panel,
Equipped with
The metal cooling panel has a fine uneven structure at least on the surface of the joint with the resin joint member.
A cooling device in which the metal cooling panel and the resin joining member are joined by infiltrating a part of the resin joining member into the fine uneven structure.
[2]
In the cooling device described in [1] above,
At the joint between the resin flow path and the resin joining member, a cooling device in which the resin component constituting the resin flow path and the resin component constituting the resin joining member are integrated.
[3]
In the cooling device according to [1] or [2] above,
At the joint between the resin flow path and the resin joining member, a cooling device in which the resin component constituting the resin flow path and the resin component constituting the resin joining member are fused.
[4]
In the cooling device according to any one of the above [1] to [3],
A cooling device in which both the resin component constituting the resin flow path and the resin component constituting the resin joining member are thermoplastic resins, or both are thermosetting resins.
[5]
In the cooling device according to any one of the above [1] to [4],
The resin flow path and the metal cooling panel are in contact with each other on the outer periphery of the resin flow path.
[6]
In the cooling device described in [5] above,
The resin flow path and the metal cooling panel are cooling devices that are in contact with each other even inside the resin flow path.
[7]
In the cooling device according to any one of the above [1] to [6],
The resin flow path is a cooling device having a bottom portion, a side wall portion erected on the bottom portion, and a plurality of threshold-like barriers for forming a flow path of a cooling medium on the bottom portion.
[8]
In the cooling device according to any one of the above [1] to [7],
A cooling device in which the metal cooling panel and the resin flow path are joined by one or more means selected from an adhesive method, a heat welding method, and a mechanical fastening method.
[9]
In the cooling device according to any one of the above [1] to [8],
A cooling device in which the interval period of the fine uneven structure is in the range of 0.01 μm or more and 500 μm or less.
[10]
In the cooling device according to any one of the above [1] to [9],
A cooling device in which the metal cooling panel is composed of at least one member selected from the group consisting of an aluminum member, an aluminum alloy member, a copper member, and a copper alloy member.
[11]
With a heating element
The cooling device according to any one of the above [1] to [10] and
Equipped with
A structure in which the heating element is arranged on the surface of the metal cooling panel in the cooling device.
The invention's effect
[0009]
According to the present invention, it is possible to provide a cooling device and a structure which can reduce the risk of leakage of the cooling medium and are excellent in light weight.
A brief description of the drawing
[0010]
FIG. 1 is a plan view schematically showing an example of the structure of the cooling device according to the present embodiment.
2A and 2B are a cross-sectional view taken along the line AA', a side view and a cross-sectional view taken along the line CC'of the cooling device shown in FIG.
3 is a horizontal cross-sectional view taken along the line BB'of the cooling device shown in FIG. 2 (b).
FIG. 4 is a cross-sectional view showing an example of the positional relationship between the resin flow path, the metal cooling panel, and the resin joining member according to the present embodiment.
FIG. 5 is a cross-sectional view showing an example of the positional relationship between the resin flow path, the metal cooling panel, and the resin joining member according to the present embodiment.
Embodiment for carrying out the invention
[0011]
Hereinafter, embodiments of the present invention will be described with reference to the drawings. In all the drawings, similar components are designated by a common reference numeral, and the description thereof will be omitted as appropriate. Further, the figure is a schematic view and does not match the actual dimensional ratio. Unless otherwise specified, the "~" between the numbers in the text indicates the following from the above.
[0012]
FIG. 1 is a plan view schematically showing an example of the structure of the cooling device according to the present embodiment. 2A and 2B are a cross-sectional view of (a) AA', a side view of (b) and a cross-sectional view of (c) CC'of the cooling device shown in FIG. FIG. 3 is a horizontal sectional view taken along the line BB'of the cooling device shown in FIG. 2 (b).
The cooling device according to the present embodiment covers the resin flow path 10 provided with the space portion 10A serving as a flow path on at least one surface, and covers the space portion 10A and at least a part of the cooling device is in contact with the resin flow path 10. Further, the metal cooling panel 20 is provided with a metal cooling panel 20 for cooling the heating element and a resin joining member 30 for joining the resin flow path 10 and the metal cooling panel 20. At least the surface of the joint portion with the resin joint member 30 has a fine concavo-convex structure, and the metal cooling panel 20 and the resin joint member 30 are formed by infiltrating a part of the resin joint member 30 into the fine concavo-convex structure. Is joined.
[0013]
Since the metal cooling panel 20 is entirely cooled by a cooling medium (hereinafter, also referred to as a refrigerant) conductive to the space 10A which is a flow path formed in the resin flow path 10, the metal cooling panel 20 is a metal cooling panel. It is possible to increase the cooling efficiency of a heating element such as a battery cell or an electronic component in contact with 20. Further, since the resin flow path 10 is integrally formed of a lightweight resin material, the weight of the entire cooling device can be reduced.
Further, the bondability between the metal cooling panel 20 and the resin joining member 30 can be improved by infiltrating a part of the resin joining member 30 into the fine uneven structure of the metal cooling panel 20. As a result, the resin flow path 10 and the metal cooling panel 20 can be firmly joined by using the resin joining member 30, so that the airtightness between the resin flow path 10 and the metal cooling panel 20 can be improved. can. As a result, the risk of refrigerant leakage from the cooling device can be suppressed.
From the above, according to the present embodiment, it is possible to provide a cooling device that can reduce the risk of leakage of the cooling medium and is excellent in light weight.
[0014]
Here, from the viewpoint of further reducing the risk of the refrigerant leaking from the cooling device, at least at the joint portion between the resin flow path 10 and the resin joining member 30, the resin component constituting the resin flow path 10 and the resin are made. It is preferable that the resin component constituting the joining member 30 is integrated, and at least at the joint portion between the resin flow path 10 and the resin joining member 30, the resin component constituting the resin flow path 10 and the resin joining are made. It is more preferable that the resin component constituting the member 30 is fused. As a result, the bondability between the resin flow path 10 and the resin joining member 30 is improved, and the leakage of the refrigerant from the joint portion between the resin flow path 10 and the resin joining member 30 can be further suppressed. can. When the appearances of the resin flow path 10 and the resin joining member 30 are similar in color, it may be difficult to determine that they are integrated with the naked eye, but it is observed that the resin components are integrated with each other. As a method, for example, by cutting out a cross section of an integrated portion and observing the cross section with an optical microscope or a polarizing microscope, a boundary where the orientation state of the resin crystal alignment layer and the reinforced filler alignment layer at the time of resin molding is changed. It can be determined that the part is an integrated part.
[0015]
In the cooling device according to the present embodiment, the resin component constituting the resin flow path 10 and the resin component constituting the resin joining member 30 are both thermoplastic resins or both are thermocurable resins. It is more preferable that the resin component constituting the resin flow path 10 and the resin component constituting the resin joining member 30 contain the same series of resins. As a result, the compatibility between the resin component constituting the resin flow path 10 and the resin component constituting the resin joining member 30 can be improved, and as a result, the resin flow path 10 and the resin joining member 30 It is possible to improve the bondability of the resin.
Further, even in the case of a series of resins having different resin components constituting the resin flow path 10 and the resin bonding member 30, by selecting different resins having strong chemical interaction, high compatibility is achieved. It is also possible to obtain.
[0016]
As shown in FIGS. 1 and 2, in the cooling device according to the present embodiment, the resin flow path 10 and the metal cooling panel 20 are usually in contact with each other on the outer periphery of the resin flow path 10, but the resin flow path is formed. From the viewpoint of further firmly joining the path 10 and the metal cooling panel 20 and further improving the airtightness between the resin flow path 10 and the metal cooling panel 20, the resin flow path 10 and the metal cooling panel 20 are further strengthened. It is preferable to provide one or more close parts even inside the resin flow path 10 (a portion other than the outer periphery, for example, a central portion).
[0017]
Further, in the cooling device according to the present embodiment, normally, the resin flow path 10 and the metal cooling panel 20 are not directly joined, and the resin joining member 30 is the resin flow path 10 and the metal cooling panel. By joining each of the 20s, the resin flow path 10 and the metal cooling panel 20 are indirectly joined, that is, they are in close contact with each other so as to maintain airtightness so that the refrigerant does not leak. Since the metal cooling panel 20 is laminated after molding the resin flow path 10 having the space portion 10A, the resin flow path 10 and the metal cooling panel 20 are not normally directly joined. Here, in the present embodiment, the state in which the resin flow path 10 and the metal cooling panel 20 are directly joined means that a part of the resin flow path 10 penetrates into the fine uneven structure on the surface of the metal cooling panel 20. This means that the metal cooling panel 20 and the resin flow path 10 are joined to each other, and the resin flow path 10 and the metal flow path 10 are cooled by a joining method selected from an adhesive method, a heat welding method, and a mechanical fastening method.The state of being joined to the reject panel 20 is excluded.
[0018]
In the cooling device according to the present embodiment, the resin flow path 10 may include a plurality of flow path units. As a result, the flow of the refrigerant can be controlled in a more complicated manner, and for example, a plurality of heating elements can be liquid-cooled at the same time.
Here, the plurality of flow path units may have an integrated configuration or a divided configuration. When a plurality of flow path units are divided, the flow path units can be connected to each other by using, for example, a refrigerant pipe through which a refrigerant flows.
The number of flow path units constituting the resin flow path 10 is not particularly limited, and can be arbitrarily set depending on the size and number of heating elements to be cooled.
[0019]
4 and 5 are cross-sectional views showing an example of the positional relationship between the resin flow path 10, the metal cooling panel 20, and the resin joining member 30 according to the present embodiment.
Further, as an example of the positional relationship between the resin flow path 10, the metal cooling panel 20, and the resin joining member 30 according to the present embodiment, for example, the structures (a) to (d) shown in FIG. 4 can be mentioned. ..
Further, as an example of the positional relationship between the resin flow path 10, the metal cooling panel 20, and the resin joining member 30 according to the present embodiment, for example, the structures (a) to (c) shown in FIG. 5 can be mentioned. ..
FIG. 5A shows a configuration in which a recess is provided in the metal cooling panel 20 and a part of the resin flow path 10 is inserted into the recess. Further, FIGS. 5 (b) and 5 (c) have a configuration in which a wall of a convex portion is provided on the metal cooling panel 20, and a part of the resin flow path 10 engages with the step of the convex portion. By adopting the structures (a) to (c) shown in FIG. 5, the side wall portion of the resin flow path 10 and the plurality of threshold-like barriers collapse due to the flow pressure of the resin when forming the resin joining member 30. Therefore, it is possible to prevent the resin from leaking into the flow path.
[0020]
The structure according to the present embodiment includes a heating element, a cooling device according to the present embodiment, and a case for accommodating the heating element as needed, and the heating element is provided on the surface of the metal cooling panel 20 in the cooling device. Is placed. The heating element is, for example, a battery or an electronic component. The metal cooling panel 20 and the heating element may be brought into direct contact with each other, but preferably, a heat conductive sheet is interposed in the contact portion. Instead of the heat conductive sheet, a substance called a so-called thermal interface material (TIM) may be used, specifically, thermal grease, phase change material (PCM), gel, high heat conductive adhesive, thermal tape, etc. Can be exemplified.
A heating element such as a battery or an electronic component is mounted on the surface of the metal cooling panel 20 opposite to the refrigerant flow surface, and the heating element is housed in a case as needed. A refrigerant injection port 10B and a refrigerant recovery port 10C, which are liquid passage ports for inflow and outflow of the refrigerant, are provided on the side wall portion of the resin flow path 10.
[0021]
Since the entire metal cooling panel 20 is cooled by the refrigerant flowing through the flow path formed inside the resin flow path 10, what is the contact surface of the metal cooling panel 20 with the resin flow path 10? The cooling efficiency of the heating element in contact with the opposite surface can be increased. Further, since the resin flow path 10 in which the flow path of the refrigerant is formed is formed of a lightweight material having excellent heat insulating properties, for example, it can contribute to weight reduction of the entire structure and improve cooling efficiency. ..
[0022]
In the cooling device according to the present embodiment, the resin flow path 10 and the metal cooling panel 20 are tightly packed in order to ensure strict watertightness so that the refrigerant does not leak even when used in a harsh environment. It is preferable that they are firmly joined. Therefore, the resin joining member 30 and another joining means may be combined. Preferred joining means other than the resin joining member 30 include one or more selected from an adhesive method, a heat welding method and a mechanical fastening method.
For example, the method of joining the resin flow path 10 and the metal cooling panel 20 via an adhesive is a joining using an adhesive method. A method of forming a resin bank portion on the surface of the metal cooling panel 20 by means such as insert molding and then joining a resin flow path onto the resin bank portion by welding means is a resin-metal heat. It is a method that uses a combination of the welding method and the resin-resin heat welding method. A method of joining the resin flow path 10 and the metal cooling panel 20 via an adhesive and then mechanically fastening them is a joining means that combines a heat welding method and a mechanical fastening method.
As the adhesive used in the above joining means, known natural adhesives and synthetic adhesives can be used without limitation, but synthetic adhesives are preferable from the viewpoint of sustainability of adhesive strength.
Synthetic adhesives can be classified into thermoplastic adhesives, thermosetting adhesives, and elastomers, but thermosetting adhesives are preferable from the viewpoint of adhesive strength. The thermosetting adhesive may be a room temperature reaction type adhesive (one-component type), a heat-curable adhesive (two-component type), or a photocurable adhesive.
What kind of adhesive is used is a matter to be arbitrarily determined by those skilled in the art depending on the circumstances such as what kind of characteristic the cooling device is formed from and what kind of material.
[0023]
In the cooling device according to the present embodiment, as the mechanical fastening between the resin flow path 10 and the metal cooling panel 20, for example, mechanical fastening by rivets, screwing, or the like can be mentioned. In this case, it is preferable that at least the outer peripheral end of the metal cooling panel 20 and the resin flow path 10 are riveted or screwed. It is possible to rivet or screw not only the outer peripheral edge of the metal cooling panel 20 but also the periphery of the central portion of the metal cooling panel 20 to the extent that the flow of the flow path is not obstructed. When the outer peripheral ends of the metal cooling panel 20 are mechanically joined, for example, when the metal cooling panel 20 has a rectangular shape in a plan view, it is preferable that at least the four corners of the outer peripheral portion are mechanically joined. After forming a resin base for mechanical joining not only at the outer peripheral edge of the metal cooling panel 20 but also near the center of the metal cooling panel 20, the machine of the metal cooling panel 20 and the resin flow path 10 It may be joined to the target. In this case, by devising and installing the position of the resin base in the flow path so that the flow path causes turbulence, it is possible to contribute to the uniform temperature of the refrigerant passing through the flow path. In some cases.
Further, in the cooling device according to the present embodiment, in addition to being joined (adhesive method) via an adhesive layer as described above, the resin flow path 10 and the metal cooling panel 20 are rivets or screws. It is preferable that they are mechanically joined by a stopper or the like. By firmly joining the resin flow path 10 and the metal cooling panel 20 in two stages in this way, it is possible to more effectively suppress the leakage of the refrigerant flowing in the resin flow path 10.
[0024]
In the present embodiment, the average thickness of the adhesive layer when bonded using the adhesive method is, for example, 0.5 to 5000 μm, preferably 1.0 to 2000 μm, and more preferably 10 to 1000 μm. When the average thickness is at least the above lower limit value, the adhesive strength between the resin flow path 10 and the metal cooling panel 20 can be improved, and when it is at least the above upper limit value, during the curing reaction. The amount of residual strain generated can be suppressed.
[0025]
In the cooling device according to the present embodiment, a primer layer may be provided between the resin flow path 10 and the adhesive layer, and between the adhesive layer and the metal cooling panel 20. The primer layer is not particularly limited, but is usually made of a resin material containing a resin component constituting the resin layer. The resin material for the primer layer is not particularly limited, and known materials can be used. Specifically, polyolefin-based primers, epoxy-based primers, urethane-based primers and the like can be exemplified. Two or more kinds of these primers may be combined including the multilayer mode and the like.
[0026]
The cooling device according to the present embodiment is manufactured, for example, by superimposing the flow path forming surface of the resin flow path 10 and the peripheral edge portion of the metal cooling panel 20 and then injection molding the resin joining member 30. can do. Further, the cooling device according to the present embodiment can also be molded by, for example, die slide injection molding, two-color molding, or the like. In this case, by using a die slide injection molding die, a two-color molding die, or the like, the present implementation is performed without taking out components such as the resin flow path 10 and the metal cooling panel 20 from the molding die. The cooling device according to the form can be manufactured.
[0027]
The resin flow path 10 and the resin joining member 30 according to the present embodiment are preferably molded bodies of a thermoplastic resin composition. The thermoplastic resin composition contains a thermoplastic resin as a resin component, and may further contain a filler if necessary.
The thermoplastic resin is not particularly limited, and for example, a polyolefin resin, a polar group-containing polyolefin resin, a polymethacrylic resin such as polymethylmethacrylate resin, a polyacrylic resin such as methylpolyacrylate resin, and a polystyrene resin. Polyvinyl alcohol-polyvinyl chloride copolymer resin, polyvinyl acetal resin, polyvinyl butyral resin, polyvinyl formal resin, polymethylpentene resin, maleic anhydride-styrene copolymer resin, polycarbonate resin, polyphenylene ether resin, polyether ether ketone resin , Aromatic polyether ketone such as polyether ketone resin, polyester resin, polyamide resin, polyamide imide resin, polyimide resin, polyetherimide resin, styrene elastomer, polyolefin elastomer, polyurethane elastomer, polyester elastomer, polyamide System elastomer, ionomer, aminopolyacrylamide resin, isobutylene anhydride copolymer, ABS, ACS, AES, AS, ASA, MBS, ethylene-vinyl chloride copolymer, ethylene-vinyl acetate copolymer, ethylene-vinyl acetate-vinyl chloride graft polymer, Ethylene-vinyl alcohol copolymer, chlorinated polyvinyl chloride resin, chlorinated polyethylene resin, chlorinated polypropylene resin, carboxyvinyl polymer, ketone resin, amorphous copolyester resin, norbornen resin, fluoroplastic, polytetrafluoroethylene resin, fluorine Ethylene polypropylene resin, PFA, polychlorofluoroethylene resin, ethylene tetrafluoroethylene copolymer, polyvinylidene fluoride resin, vinyl fluoride resin, polyallylate resin, thermoplastic polyimide resin, vinylidene chloride resin, polyvinyl chloride resin, polyacetic acid Vinyl resin, polysulfone resin, polyparamethylstyrene resin, polyallylamine resin, polyvinyl ether resin, polyphenylene oxide resin, polyphenylene sulfide (PPS) resin, polymethylpentene resin, oligoester acrylate, xylene resin, maleic acid resin, polyhydroxybuty Examples thereof include rate resin, polysulfone resin, polylactic acid resin, polyglutamic acid resin, polycaprolactone resin, polyethersulfone resin, polyacrylonitrile resin, styrene-acrylonitrile copolymer resin and the like. .. These thermoplastic resins may be used alone or in combination of two or more.
[0028]
Among these, as the thermoplastic resin, the viewpoint that the bonding strength between the resin flow path 10 and the resin joining member 30 and the bonding strength between the metal cooling panel 20 and the resin joining member 30 can be obtained more effectively. Or, from the viewpoint of effectively developing resistance to the chemicals contained in the refrigerant, select from polyolefin-based resins, polyester-based resins, polyamide-based resins, fluororesins, polyarylene ether-based resins, and polyarylene sulfide-based resins. One or more thermoplastic resins to be used are preferably used.
Here, as described above, it is more preferable that the resin component constituting the resin flow path 10 and the resin component constituting the resin joining member 30 contain the same series of resins. In the present embodiment, the resin of the same series means a resin which may have a difference in molecular weight or monomer component in the same classification. For example, the resins included in the classification of polyolefin resins are all in the same series even if there are differences in molecular weight and monomer components.
[0029]
Book In the thermoplastic resin composition according to the embodiment, an arbitrary component and a filler can be used in combination from the viewpoint of improving the mechanical properties of the resin flow path 10 and the resin joining member 30 and adjusting the difference in linear expansion coefficient. .. As the filler, for example, one or more kinds can be selected from the group consisting of glass fiber, carbon fiber, carbon particles, clay, talc, silica, mineral and cellulose fiber. Of these, one or more selected from glass fiber, carbon fiber, talc, and minerals are preferable. Further, a heat-dissipating filler typified by alumina, forsterite, mica, alumina nitride, boron nitride, zinc oxide, magnesium oxide and the like can also be used. The shape of these fillers is not particularly limited and may be any shape such as fibrous, particulate, plate-like, etc., but as will be described later, a fine concavo-convex structure is formed on the surface of the metal cooling panel 20. If so, it is preferable to use a filler having a size sufficient to penetrate the recess.
When the thermoplastic resin composition contains a filler, the content thereof is preferably 1 part by mass or more and 100 parts by mass or less, and more preferably 5 parts by mass or more and 90 parts by mass with respect to 100 parts by mass of the thermoplastic resin. It is not more than 10 parts by mass, and particularly preferably 10 parts by mass or more and 80 parts by mass or less.
[0030]
It is also possible to use a thermosetting resin composition as the resin flow path 10 according to the present embodiment. The thermosetting resin composition is a resin composition containing a thermosetting resin. Examples of the thermosetting resin include phenol resin, epoxy resin, unsaturated polyester resin, diallyl phthalate resin, melamine resin, oxetane resin, maleimide resin, urea resin, polyurethane resin, silicone resin, and benzoxazine ring. Resins, cyanate ester resins and the like are used. These may be used alone or in combination of two or more.
Among these, a thermosetting resin containing one or more selected from the group consisting of phenol resin, epoxy resin and unsaturated polyester resin from the viewpoint of heat resistance, processability, mechanical properties, adhesiveness, rust resistance and the like. The composition is preferably used. The content of the thermosetting resin in the thermosetting resin composition is preferably 15 parts by mass or more and 60 parts by mass or less, and more preferably 25 parts by mass or more and 50 parts by mass, when the entire resin composition is 100 parts by mass. It is less than the mass part. The residual component is, for example, a filler, and as the filler, for example, the above-mentioned filler can be used.
[0031]
As a molding method for the resin flow path 10, known methods can be used without limitation, for example, injection molding, extrusion molding, heat press molding, compression molding, transfer molding, casting molding, laser welding molding, reaction injection molding (RIM). Molding), rim molding (LIM molding), spray molding and the like can be exemplified. Among these, the injection molding method is preferable as the molding method for the resin flow path 10 from the viewpoint of productivity and quality stability.
[0032]
The resin flow path 10 according to the present embodiment has, for example, a bottom portion and a side wall portion erected on the bottom portion. The shape of the resin flow path 10 is preferably composed of a bottom portion of a rectangular view in a plan view and four side wall portions having a rectangular frame shape in a plan view standing upright at the bottom portion, and a plurality of portions for forming a flow path of the refrigerant on the bottom portion. The threshold-like barrier 10D is formed. The top surface of the barrier 10D is preferably in contact with the surface of the metal cooling panel 20 opposite to the surface on which the heating element is mounted. Then, the top surface and the metal cooling panel 20 may be joined by an adhesive.
A plurality of space portions 10A are formed on the entire bottom surface of the resin flow path 10 according to the present embodiment on the metal cooling panel 20 side, and the space portion 10A has the resin flow path 10 as the metal cooling panel 20 surface. The close contact creates a function as a flow path for the refrigerant.
Further, the overall shape of the resin flow path 10 according to the present embodiment increases the contact area between the refrigerant and the metal cooling panel, and is efficient even for a large heating element while minimizing the pressure loss of the fluid. Moreover, the panel shape is preferable from the viewpoint that it is easy to form a flow path shape that can be cooled uniformly.
[0033]
It is preferable that a blind or reinforcing rib is formed on the surface of the resin flow path 10 according to the present embodiment, which is opposite to the surface on the metal cooling panel 20 side. It is preferable that such a reinforcing rib is made of the same material as the resin flow path 10. By providing the reinforcing ribs, the structure of the resin flow path 10 can be protected from external stress. Further, by setting the rib height of the reinforcing ribs high, a sufficient space can be created between the reinforcing ribs and the ground surface of the resin flow path 10, and as a result, the heat insulating effect of the resin flow path 10 can be further improved. , It may be possible to extend the duration of the cooling function. Alternatively, by narrowing the distance between the ribs of the reinforcing ribs, the heat insulating effect of the resin flow path 10 can be further improved, and as a result, the duration of the cooling function may be extended.
[0034]
The flow path forming surface side of the resin flow path 10 according to the present embodiment is covered with a metal cooling panel 20. When the resin flow path 10 includes a plurality of flow path units, each flow path unit may be covered with one metal cooling panel 20 for each flow path unit, or may have a plurality of large areas. The entire flow path unit of the above may be covered with one metal cooling panel 20.
[0035]
The metal cooling panel 20 according to the present embodiment is, for example, rectangular in a plan view. The metal cooling panel 20 has two roles of diffusing the heat from the heating element and efficiently transferring the heat to the refrigerant flowing in the resin flow path 10. Therefore, it is preferable that the material of the metal cooling panel 20 has excellent heat transfer properties. From this point of view, an aluminum-based metal or a copper-based metal is used as the metal type constituting the metal cooling panel 20, and specifically, the metal cooling panel 20 is made of an aluminum member, an aluminum alloy member, or copper. It is preferably composed of at least one member selected from the group consisting of members and members made of copper alloy. The average thickness of the metal cooling panel 20 is, for example, 0.5 mm to 30 mm, preferably 0.5 mm to 20 mm, in consideration of heat transferability, strength, and lightness.
[0036]
The fine concavo-convex structure on the metal cooling panel 20 preferably has an interval period of 0.01 μm or more and 500 μm or less from the viewpoint of more firmly joining the metal cooling panel 20 and the resin joining member 30.
The interval period of the fine uneven structure is an average value of the distances from the convex portion to the adjacent convex portion, and can be obtained from a photograph taken with an electron microscope or a laser microscope.
Specifically, the surface of the metal cooling panel 20 on which the fine concavo-convex structure is formed is photographed with an electron microscope or a laser microscope. From the photograph, 50 arbitrary convex portions are selected, and the distances from the convex portions to the adjacent convex portions are measured respectively. The interval period is defined as the sum of all the distances from the convex portion to the adjacent convex portion and divided by 50.
[0037]
The interval period of the fine concavo-convex structure is preferably 0.02 μm or more and 100 μm or less, more preferably 0.05 μm or more and 50 μm or less, still more preferably 0.05 μm or more and 20 μm or less, and particularly preferably 0.10 μm or more and 10 μm or less.
When the interval period of the fine concavo-convex structure is equal to or greater than the lower limit, more resin joining members 30 can enter the recesses of the fine concavo-convex structure, and the metal cooling panel 20 and the resin joining member 30 can be combined with each other. The bonding strength can be further improved. Further, when the interval period of the fine concavo-convex structure is not more than the upper limit value, it is possible to further suppress the formation of a gap in the joint portion between the metal cooling panel 20 and the resin joint member 30. As a result, it is possible to prevent the refrigerant from leaking from the joint portion between the metal cooling panel 20 and the resin joint member 30.
[0038]
In the present embodiment, the size (depth, pore diameter, distance between pore diameters, etc.) of the fine concavo-convex structure formed on the surface of the metal cooling panel 20 is not particularly limited, but is measured according to JIS B 0601. The ten-point average roughness Rzjis is, for example, 1 μm or more, preferably 1 μm or more and 1 mm or less, and more preferably 3 μm or more and 100 μm or less.
[0039]
The method for forming the fine concavo-convex structure on the surface of the metal cooling panel 20 is not particularly limited, but for example, metal cooling is performed on an inorganic base aqueous solution such as sodium hydroxide and / or an inorganic acid aqueous solution such as hydrochloric acid or nitric acid. A method of immersing the panel 20; a method of treating the metal cooling panel 20 by an anodic oxidation method; a metal cooling panel for a mold punch having a fine uneven structure produced by mechanical cutting such as diamond abrasive grain grinding or blasting. A method of forming a fine concavo-convex structure on the surface of a metal cooling panel 20 by pressing on the surface of 20; a method of forming a fine concavo-convex structure on the surface of a metal cooling panel 20 by sandblasting, lorlet processing, or laser processing; Examples thereof include a method of immersing the metal cooling panel 20 in one or more aqueous solutions selected from hydrated hydrazine, ammonia, and a water-soluble amine compound, as disclosed in Pamphlet No. 2009/31632.
[0040]
In addition, among the above-mentioned methods, particularly when the dipping method is adopted, the fine concavo-convex structure is not only the joint surface of the metal cooling panel 20 with the resin joining member 30, but also the entire surface of the metal cooling panel 20. However, such an embodiment does not impair the effect of the present invention at all, but rather increases the heat exchange area with the refrigerant and realizes better cooling efficiency. There is also.
[0041]
This application claims priority on the basis of Japanese Application Japanese Patent Application No. 2019-115281 filed on June 21, 2019, and incorporates all of its disclosures herein.
Code description
[0042]
10 Resin flow path
10A Space section
10B Refrigerant inlet
10C Refrigerant recovery port
10D barrier
20 Metal cooling panel
30 Resin joining member
The scope of the claims
[Claim 1]
A resin flow path provided with a space that serves as a flow path on at least one surface,
A metal cooling panel that covers the space and at least partly contacts the resin flow path and cools the heating element.
A resin joining member for joining the resin flow path and the metal cooling panel,
Equipped with
The metal cooling panel has a fine uneven structure at least on the surface of the joint with the resin joint member.
A cooling device in which the metal cooling panel and the resin joining member are joined by infiltrating a part of the resin joining member into the fine concavo-convex structure.
[Claim 2]
In the cooling device according to claim 1,
At the joint portion between the resin flow path and the resin joining member, a cooling device in which the resin component constituting the resin flow path and the resin component constituting the resin joining member are integrated.
[Claim 3]
In the cooling device according to claim 1 or 2.
At the joint portion between the resin flow path and the resin joining member, a cooling device in which the resin component constituting the resin flow path and the resin component constituting the resin joining member are fused.
[Claim 4]
In the cooling device according to any one of claims 1 to 3,
A cooling device in which both the resin component constituting the resin flow path and the resin component constituting the resin joining member are thermoplastic resins, or both are thermosetting resins.
[Claim 5]
In the cooling device according to any one of claims 1 to 4,
The resin flow path and the metal cooling panel are in contact with each other on the outer periphery of the resin flow path.
[Claim 6]
In the cooling device according to claim 5,
The resin flow path and the metal cooling panel are cooling devices that are in contact with each other even inside the resin flow path.
[Claim 7]
In the cooling device according to any one of claims 1 to 6.
The resin flow path is a cooling device having a bottom portion, a side wall portion erected on the bottom portion, and a plurality of threshold-like barriers for forming a flow path of a cooling medium on the bottom portion.
[Claim 8]
In the cooling device according to any one of claims 1 to 7.
The metal A cooling device in which a cooling panel made of resin and the resin flow path are joined by one or more means selected from an adhesive method, a heat welding method, and a mechanical fastening method.
[Claim 9]
In the cooling device according to any one of claims 1 to 8.
A cooling device in which the interval period of the fine uneven structure is in the range of 0.01 μm or more and 500 μm or less.
[Claim 10]
In the cooling device according to any one of claims 1 to 9.
A cooling device in which the metal cooling panel is composed of at least one member selected from the group consisting of an aluminum member, an aluminum alloy member, a copper member, and a copper alloy member.
[Claim 11]
With a heating element
The cooling device according to any one of claims 1 to 10 and
Equipped with
A structure in which the heating element is arranged on the surface of the metal cooling panel in the cooling device.