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Curable Composition
Abstract: The present application relates to a resin composition and uses thereof. The present application may provide a resin composition that exhibits low adhesive strength to a predetermined adherend even while exhibiting high thermal conductivity, or a cured product thereof. In addition, in the present application, the low adhesive strength may be achieved without using a component for adjusting adhesive strength such as a plasticizing agent, or in a state in which a use ratio thereof is minimized. The present application may also provide uses of the resin composition or the cured product thereof.
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Notices, Deadlines & Correspondence
Notices, Deadlines & Correspondence
Patent Information
Application #
Filing Date
24 January 2024
Publication Number
41/2024
Publication Type
INA
Invention Field
POLYMER TECHNOLOGY
Status
Email
Parent Application
Applicants
LG CHEM, LTD.
128, Yeoui-daero
Yeongdeungpo-gu
Seoul 07336
Inventors
1. LEE, Jeong Hyun
LG Chem Research Park, 188, Munji-ro
Yuseong-gu
Daejeon 34122
2. KANG, Yang Gu
LG Chem Research Park, 188, Munji-ro
Yuseong-gu
Daejeon 34122
3. KIM, Do Yeon
LG Chem Research Park, 188, Munji-ro
Yuseong-gu
Daejeon 34122
Specification
Documents
Application Documents
| # | Name | Date |
|---|---|---|
| 1 | 202417004864-STATEMENT OF UNDERTAKING (FORM 3) [24-01-2024(online)].pdf | 2024-01-24 |
| 2 | 202417004864-PROOF OF RIGHT [24-01-2024(online)].pdf | 2024-01-24 |
| 3 | 202417004864-POWER OF AUTHORITY [24-01-2024(online)].pdf | 2024-01-24 |
| 4 | 202417004864-FORM 1 [24-01-2024(online)].pdf | 2024-01-24 |
| 5 | 202417004864-DRAWINGS [24-01-2024(online)].pdf | 2024-01-24 |
| 6 | 202417004864-DECLARATION OF INVENTORSHIP (FORM 5) [24-01-2024(online)].pdf | 2024-01-24 |
| 7 | 202417004864-COMPLETE SPECIFICATION [24-01-2024(online)].pdf | 2024-01-24 |
| 8 | 202417004864-FORM 3 [05-02-2024(online)].pdf | 2024-02-05 |
| 9 | 202417004864-MARKED COPIES OF AMENDEMENTS [12-02-2024(online)].pdf | 2024-02-12 |
| 10 | 202417004864-FORM 13 [12-02-2024(online)].pdf | 2024-02-12 |
| 11 | 202417004864-AMMENDED DOCUMENTS [12-02-2024(online)].pdf | 2024-02-12 |
| 12 | 202417004864-Verified English translation [27-02-2024(online)].pdf | 2024-02-27 |
| 13 | 202417004864-FORM 18 [07-05-2025(online)].pdf | 2025-05-07 |