Curable Composition

Abstract: Disclosed in the present specification are a resin composition and use thereof. The present application can provide a resin composition or cured body thereof which exhibits low adhesion to a predetermined adherend body, while exhibiting high thermal conductivity. In addition, in the present application, the low adhesion can be achieved without using an adhesion-adjusting component such as a plasticizer or by minimizing the proportion thereof used. The present application can also provide a product comprising the resin composition or cured body thereof.

Patent Information

Application #

Filing Date

24 January 2024

Publication Number

41/2024

Publication Type

INA

Invention Field

POLYMER TECHNOLOGY

Status

Email

Parent Application

Applicants

LG CHEM, LTD.

128, Yeoui-daero Yeongdeungpo-gu Seoul 07336

Inventors

1. LEE, Jeong Hyun

LG Chem Research Park, 188, Munji-ro Yuseong-gu Daejeon 34122

2. KANG, Yang Gu

LG Chem Research Park, 188, Munji-ro Yuseong-gu Daejeon 34122

Specification

Documents

Application Documents

#	Name	Date
1	202417004913-STATEMENT OF UNDERTAKING (FORM 3) [24-01-2024(online)].pdf	2024-01-24
2	202417004913-PROOF OF RIGHT [24-01-2024(online)].pdf	2024-01-24
3	202417004913-POWER OF AUTHORITY [24-01-2024(online)].pdf	2024-01-24
4	202417004913-FORM 1 [24-01-2024(online)].pdf	2024-01-24
5	202417004913-DRAWINGS [24-01-2024(online)].pdf	2024-01-24
6	202417004913-DECLARATION OF INVENTORSHIP (FORM 5) [24-01-2024(online)].pdf	2024-01-24
7	202417004913-COMPLETE SPECIFICATION [24-01-2024(online)].pdf	2024-01-24
8	202417004913-FORM 3 [05-02-2024(online)].pdf	2024-02-05
9	202417004913-MARKED COPIES OF AMENDEMENTS [12-02-2024(online)].pdf	2024-02-12
10	202417004913-FORM 13 [12-02-2024(online)].pdf	2024-02-12
11	202417004913-AMMENDED DOCUMENTS [12-02-2024(online)].pdf	2024-02-12
12	202417004913-Verified English translation [27-02-2024(online)].pdf	2024-02-27
13	202417004913-FORM 18 [07-05-2025(online)].pdf	2025-05-07