Abstract: The present application may provide a resin composition or a cured product thereof that exhibits low adhesive strength to a predetermined adherend while exhibiting high thermal conductivity. In addition, in the present application, the low adhesive strength may be achieved without using an adhesive strength-adjusting component such as a plasticizer or by minimizing the use ratio thereof.
| # | Name | Date |
|---|---|---|
| 1 | 202417005093-STATEMENT OF UNDERTAKING (FORM 3) [25-01-2024(online)].pdf | 2024-01-25 |
| 2 | 202417005093-PROOF OF RIGHT [25-01-2024(online)].pdf | 2024-01-25 |
| 3 | 202417005093-POWER OF AUTHORITY [25-01-2024(online)].pdf | 2024-01-25 |
| 4 | 202417005093-NOTIFICATION OF INT. APPLN. NO. & FILING DATE (PCT-RO-105-PCT Pamphlet) [25-01-2024(online)].pdf | 2024-01-25 |
| 5 | 202417005093-FORM 1 [25-01-2024(online)].pdf | 2024-01-25 |
| 6 | 202417005093-DRAWINGS [25-01-2024(online)].pdf | 2024-01-25 |
| 7 | 202417005093-DECLARATION OF INVENTORSHIP (FORM 5) [25-01-2024(online)].pdf | 2024-01-25 |
| 8 | 202417005093-COMPLETE SPECIFICATION [25-01-2024(online)].pdf | 2024-01-25 |
| 9 | 202417005093-FORM 3 [05-02-2024(online)].pdf | 2024-02-05 |
| 10 | 202417005093-MARKED COPIES OF AMENDEMENTS [12-02-2024(online)].pdf | 2024-02-12 |
| 11 | 202417005093-FORM 13 [12-02-2024(online)].pdf | 2024-02-12 |
| 12 | 202417005093-AMMENDED DOCUMENTS [12-02-2024(online)].pdf | 2024-02-12 |
| 13 | 202417005093-Verified English translation [27-02-2024(online)].pdf | 2024-02-27 |
| 14 | 202417005093-FORM 18 [07-05-2025(online)].pdf | 2025-05-07 |