Curable Composition

Abstract: Disclosed herein are a resin composition and a use thereof. The present application may provide a resin composition or a cured product thereof that exhibits low adhesive strength to a predetermined adherend while exhibiting high thermal conductivity. In addition, in the present application, the low adhesive strength may be achieved without using an adhesive strength-adjusting component such as a plasticizer or by minimizing the use ratio thereof. The present application may provide a product including the curable composition or a cured product thereof.

Patent Information

Application #

Filing Date

30 March 2024

Publication Number

45/2024

Publication Type

INA

Invention Field

POLYMER TECHNOLOGY

Status

Email

Parent Application

Applicants

LG CHEM, LTD.

128, Yeoui-daero Yeongdeungpo-gu Seoul 07336

Inventors

1. LEE, Jeong Hyun

LG Chem Research Park, 188, Munji-ro Yuseong-gu Daejeon 34122

2. KANG, Yang Gu

LG Chem Research Park, 188, Munji-ro Yuseong-gu Daejeon 34122

Specification

Documents

Application Documents

#	Name	Date
1	202417026706-STATEMENT OF UNDERTAKING (FORM 3) [30-03-2024(online)].pdf	2024-03-30
2	202417026706-FORM 1 [30-03-2024(online)].pdf	2024-03-30
3	202417026706-DRAWINGS [30-03-2024(online)].pdf	2024-03-30
4	202417026706-DECLARATION OF INVENTORSHIP (FORM 5) [30-03-2024(online)].pdf	2024-03-30
5	202417026706-COMPLETE SPECIFICATION [30-03-2024(online)].pdf	2024-03-30
6	202417026706-MARKED COPIES OF AMENDEMENTS [31-03-2024(online)].pdf	2024-03-31
7	202417026706-FORM 13 [31-03-2024(online)].pdf	2024-03-31
8	202417026706-AMMENDED DOCUMENTS [31-03-2024(online)].pdf	2024-03-31
9	202417026706-FORM-26 [01-04-2024(online)].pdf	2024-04-01
10	202417026706-Proof of Right [03-04-2024(online)].pdf	2024-04-03
11	202417026706-FORM 3 [03-04-2024(online)].pdf	2024-04-03
12	202417026706-FORM 18 [03-04-2024(online)].pdf	2024-04-03