1. A diamine compound represented by the general formula (1):
t
[Chem. 1]

wherein each R1 represents an alkyl group having 1 to 5 carbon atoms; each p represents an integer of 0 to 2; q represents an integer of 0 to 100; each R2 represents any case of a bivalent aliphatic group, alicyclic group or aromatic group, any case of a bivalent organic group in which plural aromatic group's are bonded to each other through a single bond, or any case of a bivalent organic group in which plural aromatic groups are bonded to each other through-0-, -CO-, -S02-, -C-H2-, -C(CH3)2-, or -C(CF3)2 wherein each F is each fluorine; X represents -0-, _s_, _co-, -S02-, -CH2-, -C(CH3)2-, -C(CH3) (C2H5)-,or -C(CF3)2-wherein each F is fluorine.
2 . A heat-resistant resin or heat-resistant resin precursor, having a structure originating'from the diamine compound recited in claim 1.

3. The heat-resistant resin or heat-resistant resin precursor according to claim 2, including at least one selected from polyimides, polybenzoxazoles, polybenzoimidazoles, and polybenzothiazoles; and respective precursors of these polymers, and copolymers of these polymers.
4. The heat-resistant resin or heat-resistant resin precursor according to claim 2 or 3, having at least one selected from respective structures represented by the general formulae (2), (3), and (5).:
[Chem. 2]

wherein R3 represents a bivalent to hexavalent organic group having 2 to 30 carbon atoms; E represents any one of OR4, S03R4, CONR4R5, COOR4, and S02NR4R5 wherein R4 and R5 each independently ' represent a hydrogen atom or a monovalent hydrocarbon group having 1 to 20 carbon atoms; i represents an integer of 0 to 4 ; and A represents a structure represented by. a general formula
(4); [Chem. 3]
V


wherein R6 represents a tetravalent to octavalent organic group
7 7
having 2 to 30 carbon atoms; F represents any one of OR , S03R , CONR7R8, COOR7, and S02NR7R8 wherein R7 and R8 each independently represent a hydrogen atom or a monovalent hydrocarbon group having 1 to 10 carbon atoms; j represents an-integer of 0 to 4; and A represents a structure represented by the general formula (4) : [Chem. 4] ■

wherein each R1 represents an alkyl group having 1 to 5 carbon atoms; each p is an integer of 0 to 2; q represents an integer of 0 to 100; each R2 represents any case of a bivalent aliphatic group, alicyclic group, or aromatic group, any case of a bivalent organic group in which plural aromatic group are bonded to each other through a single bond, or any case of a bivalent organic group in which plural aromatic groups are bonded to each other through -0-, -CO-, -S02-, -CH2-, -C(CH3)2-, or -C(CF3)2 . -.

wherein each F is fluorine; and X represents -0-, -S-, CO , -SO2-, -CH2-, -C(CH3)2-, -C(CH3) (C2H5)-, or -C (CF3) 2 wherein each F is fluorine; and [Chem. 5]
■
i
wherein R9 represents a bivalent to hexavalent organic group having 2 to 3,0 carbon atoms; G represents any one of OR10, SO3R , CONR10RU, COOR10, and SO2NR10R11 wherein R10 and R11 each represent a hydrogen atom or'a monovalent hydrocarbon group having 1 to 10 carbon atoms; k represent an integer of 0 to 4; B represents a structure represented by a general formula (6), and each Y represents NH, 0 or S; [Chem. 6]

wherein each R1 represents an alkyl group having 1 to 5 carboy atoms; each p represents an integer of 0 to 2; q represents an integer of 0 to 100; each R12 represents any case of a trivalent aliphatic group, alicyclic group, or aromatic group, any case of a trivalent organic group in which plural aromatic groups

are bonded to each other through a single bond, or any case of a trivalent organic group in which plural aromatic groups are bonded to each other through -0-, -CO-, -S02-, -CH2-, -CCCH3)2-, or -C(CF3)2 wherein each F is fluorine; and X represents -0-, _s_, _C0-, -S02-, -CH2-, -C(CH3)2-> -C(CH3) (C2H5)-, or-C(CF3)2.
5. A photosensitive resin composition, comprising the
heat-resistant resin or heat-resistant resin precursor (a)
recited in any one of claims 2 to 4, and further comprising a
photosensitive compound (b) and a solvent (c).
)
6. The photosensitive resin composition according to claim 5, wherein the photosensitive compound (b) is a guinonediazide compound (bl).
7. The photosensitive resin composition according to claim 5, wherein the photosensitive compound (b) is a photopolymerization - initiator (b.2) .
8. The photosensitive resin composition according to claim
7, further comprising a radical polymerizable compound (d).
9 . The photosensitive resin composition according to any one ■' of claims 5 to 8, further comprising an
alkoxymethyl-group-containing compound, and/or a

cyclic-polyether-structure-having compound (e).
10. A cured film, wherein the photosensitive resin-
composition recited in any one of claims 5 to 9 is cured.
i
11. An element, comprising the cured film recited in claim 10.
12. An organic EL display device, wherein the cured film recited in claim 10 is located over at least one of a planarizing layer over a driving circuit, and an insulation layer over a * first electrode.
13 . A method for producing an organic EL display device, using the photosensitive resin composition recited in any one of claims 5 to 9, comprising:
the step of applying the photosensitive resin composition onto a substrate to form a photosensitive resin film; and
the step of subjecting the photosensitive resin film to drying, exposure to light, development, and heating treatment.