Claims:WE CLAIM:

1. A Charging System (100), comprising:
at least one circuit board (200), comprising at least one electronic component;
at least one thermally conductive and electrically insulative material layer, herein a thermal pad, (700) suitably placed to contact an outer wall of at least electronic components and an outer wall of at least one heat sink (600), wherein the one or more thermal pads (700) absorb heat from the electronic components and discharge the heat to the heat sink (600), wherein the heat sink (600) is configured to discharge the heat to the environment or an external thermal management system;
wherein, the Charger system (100) comprises thermal pads (700) of suitable thicknesses chosen in accordance with respective operating temperatures of the attached electronic components such that the electronic components operate at peak efficiencies.

2. The Charger system (100) as claimed in claim 1, wherein the thermal pads (700) have dissimilar thermal conductivities suitably chosen in accordance with respective operating temperatures of attached electronic components such that the electronic components operate at peak efficiencies.

3. An electric vehicle system (80), comprising:
a chassis (90) configured to provide structure to the electric vehicle;
at least one controller (110) operatively coupled within the chassis (90), and configured to control a plurality of electronic components within the electric vehicle;
a charger system (100) placed within the chassis (90) and is operatively coupled to at least one controller (110), wherein the charger system (100) comprises at least one circuit board (200), comprising at least one electronic component;
at least one thermally conductive and electrically insulative material layer, herein a thermal pad, (700) suitably placed to contact an outer wall of at least electronic components and an outer wall of at least one heat sink (600), wherein the one or more thermal pads (700) absorb heat from the electronic components and discharge the heat to the heat sink (600), wherein the heat sink (600) is configured to discharge the heat to the environment or an external thermal management system;
wherein, the Charger system (100) comprises thermal pads (700) of suitable thicknesses chosen in accordance with respective operating temperatures of the attached electronic components such that the electronic components operate at peak efficiencies.

4. The electric vehicle system (80) as claimed in claim 3, wherein the thermal pads (700) have dissimilar thermal conductivities suitably chosen in accordance with respective operating temperatures of attached electronic components such that the electronic components operate at peak efficiencies.

5. The Charger system (100) as claimed in claim 1, wherein the circuit board comprises electronic component groups (210), (220), and (230);
wherein, the electronic component groups (210), (220), and (230) comprise power semiconductor devices without inbuilt diode, power semiconductor devices with inbuilt diode, and peripheral devices respectively;
wherein, separate thermal pads (701), (702), and (703) are suitably placed to contact the electronic component groups (210), (220), and (230) respectively;
wherein, the thermal pads (701), (702), and (703) have thicknesses in ascending order and suitably chosen in accordance with respective operating temperatures of the attached electronic components such that the electronic components operate at peak efficiencies.

6. The Charger system (100) as claimed in claim 1, wherein the circuit board comprises electronic component groups (210), (220), and (230);
wherein, the electronic component groups (210), (220), and (230) comprise power semiconductor devices without inbuilt diode, power semiconductor devices with inbuilt diode, and peripheral devices respectively;
wherein, separate thermal pads (701), (702), and (703) are suitably placed to contact the electronic component groups (210), (220), and (230) respectively;
wherein, the thermal pads (701), (702), and (703) have thermal conductivities in ascending order and suitably chosen in accordance with respective operating temperatures of the attached electronic components such that the electronic components operate at peak efficiencies.

7. The Charger system (100) as claimed in claim 1, wherein the circuit board comprises electronic component groups (210), (220), and (230);
wherein, the electronic component groups (210), (220), and (230) comprise power semiconductor devices without inbuilt diode, power semiconductor devices with inbuilt diode, and peripheral devices respectively;
wherein, a common thermal pad (700) is suitably placed to contact the electronic component groups (210), (220), and (230);
wherein, the heat sink (600) is an air cooled heat sink with fin geometry suitably structured such that fin height is suitably high close to the electronic component group (210), and suitably moderate close to the electronic component group (220), and suitably minimum close to the electronic component group (230), such that the electronic component groups (210), (220), and (230) are maintained at suitable operating temperatures and thus operating at peak efficiency.

8. The Charger system (100) as claimed in claim 1, wherein the circuit board comprises electronic component groups (210), (220), and (230);
wherein, the electronic component groups (210), (220), and (230) comprise power semiconductor devices without inbuilt diode, power semiconductor devices with inbuilt diode, and peripheral devices respectively;
wherein, a common thermal pad (700) is suitably placed to contact the electronic component groups (210), (220), and (230);
wherein, the heat sink (600) is an air cooled heat sink with fin geometry suitably structured such that fin thickness and fin spacing results suitably high heat transfer close to the electronic component group (210), and suitably moderate heat transfer close to the electronic component group (220), and suitably minimum heat transfer close to the electronic component group (230), such that the electronic component groups (210), (220), and (230) are maintained at suitable operating temperatures and thus operating at peak efficiency.

9. The Charger system (100) as claimed in claim 1, wherein the circuit board comprises electronic component groups (210), (220), and (230);
wherein, the electronic component groups (210), (220), and (230) comprise power semiconductor devices without inbuilt diode, power semiconductor devices with inbuilt diode, and peripheral devices respectively;
wherein, a common thermal pad (700) is suitably placed to contact the electronic component groups (210), (220), and (230);
wherein, the heat sink (600) is a liquid cooled heat sink with an coolant inlet (601) and an coolant outlet (602) suitably placed such that cold coolant flows close to the electronic component group (210), and hot coolant flows close to the electronic component group (220), and the coolant does not flow close to the electronic component group (230), such that the electronic component groups (210), (220), and (230) are maintained at suitable operating temperatures and thus operating at peak efficiency.
, Description:FORM 2
THE PATENTS ACT, 1970
(39 of 1970)
&
THE PATENTS RULES, 2003
COMPLETE SPECIFICATION
(See section 10, rule 13)

“ELECTRIC VEHICLE CHARGER COOLING SYSTEM”
By
Emflux Motors Pvt. Ltd.
An Indian Company
No. 16, Bhuvanappa Layout, Tavarekere Main Road, Kaveri Layout, Suddagunte Palya, Bengaluru, Karnataka 560029

The following specification particularly describes the invention and the manner in which it is to be performed.
FIELD OF INVENTION

[001] The present invention generally relates to a field of electronic circuit components, such as integrated circuit chips (IC) or semiconductor elements, mounted on a printed circuit board. More specifically, the present invention relates to a electric vehicle charging device comprising a temperature regulation system.

BACKGROUND

[002] The vehicles using electric power for all or a portion of their motive power (e.g., Battery electric vehicles (BEVs), hybrid electric vehicles (HEVs), plug-in hybrid electric vehicles (PHEVs), and the like, collectively referred to as “electric vehicles”), may provide a number of advantages as compared to more traditional gas-powered vehicles using internal combustion engines. Over the rising concerns of oil costs, climate change and energy security, efforts to promote energy efficient electric vehicles have grown. Energy efficient electric vehicles provide overall reduced air emissions compared to conventional combustion vehicles.

[003] Electric vehicles comprise an energy storage device (e.g., Battery Pack). The battery pack system needs to be charged at high rates, which produces large amount of heat in the Charging Devices. These Charging Devices may be on-board (inside the vehicle) or off-board (outside the vehicle). The performance of Charging Devices depend on the operating temperatures. Thus, maintaining a suitable operating temperature becomes necessary to maximise the efficiency and reduce power losses.

[004] Further, a Charging Device comprise multiple electronic components, e.g., MOSFETs, Diodes, Inductors, Capacitors, etc. These electronic components have respective operating temperature. Thus, maintaining different operating temperatures for different components is required.

[005] In existing Charging Devices, a common heat sink is used, wherein the heat sink maintains approximately equal temperatures of different electronics components. Thus, the system becomes less efficient.

[006] Therefore, there is a need in the art to provide a cooling system for a Charging Device for maintaining respective operating temperatures of different electronic components.

SUMMARY

[007] This summary is provided to introduce a selection of concepts in a simple manner that is further described in the detailed description of the disclosure. This summary is not intended to identify key or essential inventive concepts of the subject matter nor is it intended for determining the scope of the disclosure.

[008] In order to overcome the problems discussed in the prior art, the present invention provides a Charger system comprising thermal pad and heat sink arranged in a manner that ensures proper operating temperature of different electronic components.

[009] The present invention discloses a Charger system comprising at least one circuit board and cooling structure to maintain respective operating temperatures of various electronic components on the circuit board to maximise the efficiency of charging. The circuit board comprises at least one micro-controller, which monitors and controls other components on the board. Further, the circuit board comprises at least one power semiconductor device (e.g. Field Effect Transistor, Insulated Gate Bipolar Junction Transistor, etc.) for switching the supply input current and at least one amplifier device (e.g. Gate Driver IC, etc.) for operating the power semiconductor device. Further, the circuit board comprises peripheral devices such as resistors and diodes for the operation of said amplifier devices. Further, the said power semiconductor devices may have an internal diode (e.g. Field Effect Transistor with inbuilt diode, Insulated Gate Bipolar Junction Transistor with inbuilt diode, etc.). At least one type or quantity of thermal pad is operatively coupled to said electronic components on the circuit board. Herein, a thermal pad is a layer of thermally conducting and electrically insulating material. The material of a thermal pad may be rubber, plastic, epoxy, or other material known in the art used for thermal conduction and electrical insulation. A heat sink is operatively coupled to the said at least one thermal pad. Herein, a heat sink is a structure used for heat dissipation and cooling. The said heat sink may be an air cooled heat sink or a liquid heat sink. The said at least one thermal pad absorbs heat from the respective electronic components and dumps the heat to the heat sink. The heat sink, in turn, dissipates the heat to the environment in case of an air cooled heat sink. In case of a liquid heat sink, a liquid coolant is circulated through the heat sink which absorbs the heat and discharges the heat to an external thermal management system. The said coolant may be circulated by a pump.

[0010] Another embodiment of the present invention discloses an Electric vehicle. The electric vehicle system includes a chassis. The chassis is configured to provide a structure to the electric vehicle. The electric vehicle system also includes at least one controller operatively coupled within the chassis. The at least one controller is configured to control a plurality of electronic components within the electric vehicle. The electric vehicle system also includes a Charger system placed within the chassis and is operatively coupled to the at least one controller. The charger system comprises at least one circuit board and cooling structure to maintain respective operating temperatures of various electronic components on the circuit board to maximise the efficiency of charging. The circuit board comprises at least one micro-controller, which monitors and controls other components on the board. Further, the circuit board comprises at least one power semiconductor device (e.g. Field Effect Transistor, Insulated Gate Bipolar Junction Transistor, etc.) for switching the supply input current and at least one amplifier device (e.g. Gate Driver IC, etc.) for operating the power semiconductor device. Further, the circuit board comprises peripheral devices such as resistors and diodes for the operation of said amplifier devices. Further, the said power semiconductor devices may have an internal diode (e.g. Field Effect Transistor with inbuilt diode, Insulated Gate Bipolar Junction Transistor with inbuilt diode, etc.). At least one type or quantity of thermal pad is operatively coupled to said electronic components on the circuit board. Herein, a thermal pad is a layer of thermally conducting and electrically insulating material. The material of a thermal pad may be rubber, plastic, epoxy, or other material known in the art used for thermal conduction and electrical insulation. A heat sink is operatively coupled to the said at least one thermal pad. Herein, a heat sink is a structure used for heat dissipation and cooling. The said heat sink may be an air cooled heat sink or a liquid heat sink. The said at least one thermal pad absorbs heat from the respective electronic components and dumps the heat to the heat sink. The heat sink, in turn, dissipates the heat to the environment in case of an air cooled heat sink. In case of a liquid heat sink, a liquid coolant is circulated through the heat sink which absorbs the heat and discharges the heat to an external thermal management system. The said coolant may be circulated by a pump.

[0011] Furthermore, different embodiments of the present invention describe the use of combination of above stated structures and devices for maintaining respective operating temperatures of the electronic components on the circuit board of the Charger system.

[0012] The summary above is illustrative only and is not intended to be in any way limiting. Further aspects, exemplary embodiments, and features will become apparent by reference to the drawings and the following detailed description.

BRIEF DESCRIPTION OF DRAWINGS
[0013] Embodiments of the disclosure will now be described, by way of example, with reference to the accompanying drawings, in which:

[0014] FIG. 1 is a schematic representation of the circuit board of the Charger system, in accordance with a first embodiment of the present invention.

[0015] FIG. 2 is a Front view of the Charger system with circuit board shown in FIG. 1, emphasizing thermal pads of same material properties but different thickness, and with air cooled heat sink in accordance with a second embodiment of the present invention.

[0016] FIG. 3 is a Top view of the Charger system shown in FIG. 2 in accordance with the second embodiment of the present invention.

[0017] FIG. 4 is a Front view of the Charger system with circuit board shown in FIG. 1, emphasizing thermal pads of same material properties but different thickness, and with liquid cooled heat sink in accordance a third embodiment of the present invention.

[0018] FIG. 5 is a Top view of the Charger system shown in FIG. 4 in accordance with the third embodiment of the present invention.

[0019] FIG. 6 is a Front view of the Charger system with circuit board shown in FIG. 1, emphasizing thermal pads of same thickness but different material properties, and with air cooled heat sink in accordance with a fourth embodiment of the present invention.

[0020] FIG. 7 is a Top view of the Charger system shown in FIG. 6 in accordance with the fourth embodiment of the present invention.

[0021] FIG. 8 is a Front view of the Charger system with circuit board shown in FIG. 1, emphasizing thermal pads of same thickness but different material properties, and with liquid cooled heat sink in accordance with a fifth embodiment of the present invention.

[0022] FIG. 9 is a Top view of the Charger system shown in FIG. 8 in accordance with the fifth embodiment of the present invention.

[0023] FIG. 10 is a Front view of the Charger system with circuit board shown in FIG. 1, emphasizing common thermal pad for all electronic components, and with air cooled heat sink of non-uniform fin height in accordance with a sixth embodiment of the present invention.

[0024] FIG. 11 is a Top view of the Charger system shown in FIG. 10 in accordance with the sixth embodiment of the present invention.

[0025] FIG. 12 is a Front view of the Charger system with circuit board shown in FIG. 1, emphasizing common thermal pad for all electronic components, and with air cooled heat sink of non-uniform fin thickness in accordance with a seventh embodiment of the present invention.

[0026] FIG. 13 is a Top view of the Charger system shown in FIG. 12 in accordance with the seventh embodiment of the present invention.

[0027] FIG. 14 is a Front view of the Charger system with circuit board shown in FIG. 1, emphasizing common thermal pad for all electronic components, and with liquid cooled heat sink with specific flow pattern in accordance with an eighth embodiment of the present invention.

[0028] FIG. 15 is a Top view of the Charger system shown in FIG. 14 in accordance with the eighth embodiment of the present invention.

[0029] FIG. 16 is a Block Diagram of the Charge system enclosed in an Electric vehicle system in accordance with a ninth embodiment of the present invention.

[0030] Further, persons skilled in the art to which this disclosure belongs will appreciate that elements in the figures are illustrated for simplicity and may not have necessarily been drawn to scale. Furthermore, in terms of the construction of the device, one or more components of the device may have been represented in the figures by conventional symbols, and the figures may show only those specific details that are pertinent to understanding the embodiments of the present disclosure so as not to obscure the figures with details that will be readily apparent to those of ordinary skill in the art having benefit of the description herein.

DETAILED DESCRIPTION
[0031] For the purpose of promoting an understanding of the principles of the disclosure, reference will now be made to the embodiment illustrated in the figures and specific language will be used to describe them. It will nevertheless be understood that no limitation of the scope of the disclosure is thereby intended. Such alterations and further modifications to the disclosure, and such further applications of the principles of the disclosure as described herein being contemplated as would normally occur to one skilled in the art to which the disclosure relates are deemed to be a part of this disclosure.

[0032] It will be understood by those skilled in the art that the foregoing general description and the following detailed description are exemplary and explanatory of the disclosure and are not intended to be restrictive thereof.

[0033] The terms "comprises", "comprising", or any other variations thereof, are intended to cover a non-exclusive inclusion, such that a process or method that comprises a list of steps does not include only those steps but may include other steps not expressly listed or inherent to such a process or a method. Similarly, one or more devices or sub-systems or elements or structures or components preceded by "comprises... a" does not, without more constraints, preclude the existence of other devices, other subsystems, other elements, other structures, other components, additional devices, additional sub-systems, additional elements, additional structures, or additional components. Appearances of the phrase “in an embodiment”, “in another embodiment” and similar language throughout this specification may, but do not necessarily, all refer to the same embodiment.

[0034] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure belongs. The system, methods, and examples provided herein are illustrative only and not intended to be limiting.

[0035] Embodiments of the present disclosure will be described below in detail with reference to the accompanying figures.

[0036] Various embodiments of the Charger system 100 are explained using FIGS 1-15.

[0037] In accordance to the first embodiment of the present invention, a circuit board 200 of the Charger system 100 is provided as illustrated in FIG. 1. The circuit board 200 comprises three types of electronic components grouped as 210, 220, and 230. The group of power semiconductor devices without inbuilt diode (211 to 219) is numbered 210. The group of power semiconductor devices with inbuilt diode (221 to 229) is numbered 220, while the group of peripheral devices (231 to 239) is numbered 230.

[0038] It is to be noted that the circuit board 200 may comprise several other electronic components such as micro-controllers, amplifier devices, voltage converters, inductors, capacitors etc. and that the arrangement of the components may not be as represented in FIG. 1. The components shown in FIG. 1 are heat producing components and are represented for exemplary purpose. Any other components which produce considerable heat lie within the scope of the present invention.

[0039] The present invention does not intend to limit the quantity of the electronic components in the Charger system 100. Moreover, the arrangement of the electronic components may be on the top or bottom of the circuit board 200.

[0040] In accordance to the second embodiment of the present invention, a Charger system 100 is provided as illustrated in FIG. 2 and FIG. 3. Thermal pads 701, 702, and 703 of same material are provided in the Charger system 100. Herein, a thermal pad is a thermally conductive and electrically insulative material layer used for thermal conduction and electrical insulation. In an example embodiment, the thermal pad may be or may include a rubber, plastic, epoxy or any other material.

[0041] The thermal pads 701, 702, and 703 are suitably placed to contact the electronic component groups 210, 220, and 230 respectively. The term “suitably placed” herein means that the thermal pads 701, 702, and 703 are positioned to cover complete exposed surface area for heat transfer. As illustrated in the FIG. 2, the thermal pad 701 has lower thickness than 702 and 703, the thermal pad 702 has more thickness than thermal pad 701 but lower thickness than 703, and the thermal pad 703 has the highest thickness among all.

[0042] The electronic component group 210, herein as example - power semiconductor devices without inbuilt diode, is required to be maintained at low operating temperature. Further, the electronic component group 220, herein as example - power semiconductor devices with inbuilt diode, is required to be maintained at moderate operating temperature. Further, the electronic component group 230, herein as example - peripheral devices, is required to be maintained at high operating temperature.

[0043] Further, referring to FIG. 2 and FIG. 3, a heat sink 600 is provided in the Charger system 100. Herein, a heat sink is a structure used for heat dissipation and thus for cooling. In accordance to the second embodiment of the present invention, the said heat sink 600 is an air cooled heat sink. As used herein, an air cooled heat sink dissipates the heat absorbed by it to the environment by virtue of convection. The heat sink 600 is attached to the thermal pads 701, 702, and 703. Herein, the thermal pads 701, 702, and 703 transfer the heat produced by electronic component group 210, 220, and 230 respectively to the heat sink 600.

[0044] As can be evaluated from basic conduction heat transfer equations known in the art, the temperature difference between the electronic component group 210 and the heat sink 600 is lowest, since the thickness of thermal pad 701 is lowest. Thus the operating temperature of electronic component group 210 is maintained lowest. Similarly, the temperature difference between the electronic component group 220 and the heat sink 600 is moderate, since the thickness of thermal pad 702 is moderate. Thus the operating temperature of electronic component group 220 is maintained moderate. Similarly, the temperature difference between the electronic component group 230 and the heat sink 600 is highest, since the thickness of thermal pad 703 is highest. Thus the operating temperature of electronic component group 230 is maintained high. The thermal pad thicknesses may be accurately determined to obtain particular operating temperatures from the heat transfer equations known in the art.

[0045] In accordance to the third embodiment of the present invention, a Charger system 100 is provided as illustrated in FIG. 4 and FIG. 5. Thermal pads 701, 702, and 703 of same material are provided in the Charger system 100.

[0046] The thermal pads 701, 702, and 703 are suitably placed to contact the electronic component groups 210, 220, and 230 respectively. The term “suitably placed” herein means that the thermal pads 701, 702, and 703 are positioned to cover complete exposed surface area for heat transfer. As illustrated in the FIG. 4, the thermal pad 701 has lower thickness than 702 and 703, the thermal pad 702 has more thickness than thermal pad 701 but lower thickness than 703, and the thermal pad 703 has the highest thickness among all.

[0047] The electronic component group 210, herein as example - power semiconductor devices without inbuilt diode, is required to be maintained at low operating temperature. Further, the electronic component group 220, herein as example - power semiconductor devices with inbuilt diode, is required to be maintained at moderate operating temperature. Further, the electronic component group 230, herein as example - peripheral devices, is required to be maintained at high operating temperature.

[0048] Further, referring to FIG. 4 and FIG. 5, a heat sink 600 is provided in the Charger system 100. Herein, a heat sink is a structure used for heat dissipation and thus for cooling. In accordance to the third embodiment of the present invention, the said heat sink 600 is a liquid cooled heat sink. As used herein, a liquid cooled heat sink dissipates the heat absorbed by it to an external thermal management system. A liquid coolant is circulated in the liquid cooled heat sink, the coolant may be circulated by an external pump. The heat sink 600 has an inlet 601 for the coolant to flow in the heat sink and an outlet 602 for the coolant to flow out of the heat sink. The heat sink 600 is attached to the thermal pads 701, 702, and 703. Herein, the thermal pads 701, 702, and 703 transfer the heat produced by electronic component group 210, 220, and 230 respectively to the heat sink 600.

[0049] As can be evaluated from basic conduction heat transfer equations known in the art, the temperature difference between the electronic component group 210 and the heat sink 600 is lowest, since the thickness of thermal pad 701 is lower than 702 and 703. Thus the operating temperature of electronic component group 210 is lowest. Similarly, the temperature difference between the electronic component group 220 and the heat sink 600 is moderate, since the thickness of thermal pad 702 is moderate. Thus the operating temperature of electronic component group 220 is moderate. Similarly, the temperature difference between the electronic component group 230 and the heat sink 600 is highest, since the thickness of thermal pad 703 is higher than 701 and 702. Thus the operating temperature of electronic component group 230 is highest. The thermal pad thicknesses may be accurately determined to obtain particular operating temperatures from the heat transfer equations known in the art.

[0050] In accordance to the fourth embodiment of the present invention, a Charger system 100 is provided as illustrated in FIG. 6 and FIG. 7. Thermal pads 701, 702, and 703 of different material properties are provided in the Charger system 100.

[0051] The thermal pads 701, 702, and 703 are suitably placed to contact the electronic component groups 210, 220, and 230 respectively. The term “suitably placed” herein means that the thermal pads 701, 702, and 703 are positioned to cover complete exposed surface area for heat transfer. The thermal pad 701 is made up of material having highest thermal conductivity, the thermal pad 702 is made up of material having moderate thermal conductivity, and the thermal pad 703 is made up of material having least thermal conductivity.

[0052] The electronic component group 210, herein as example - power semiconductor devices without inbuilt diode, is required to be maintained at low operating temperature. Further, the electronic component group 220, herein as example - power semiconductor devices with inbuilt diode, is required to be maintained at moderate operating temperature. Further, the electronic component group 230, herein as example - peripheral devices, is required to be maintained at high operating temperature.

[0053] Further, referring to FIG. 6 and FIG. 7, a heat sink 600 is provided in the Charger system 100. Herein, a heat sink is a structure used for heat dissipation and thus for cooling. In accordance to the fourth embodiment of the present invention, the said heat sink 600 is an air cooled heat sink. As used herein, an air cooled heat sink dissipates the heat absorbed by it to the environment by virtue of convection. The heat sink 600 is attached to the thermal pads 701, 702, and 703. Herein, the thermal pads 701, 702, and 703 transfer the heat produced by electronic component group 210, 220, and 230 respectively to the heat sink 600.

[0054] As can be evaluated from basic conduction heat transfer equations known in the art, the temperature difference between the electronic component group 210 and the heat sink 600 is lowest, since the thermal conductivity of the thermal pad 701 is higher than 702 and 703. Thus the operating temperature of electronic component group 210 is maintained lowest. Similarly, the temperature difference between the electronic component group 220 and the heat sink 600 is moderate, since the thermal conductivity of the thermal pad 702 is moderate. Thus the operating temperature of electronic component group 220 is maintained moderate. Similarly, the temperature difference between the electronic component group 230 and the heat sink 600 is highest, since the thermal conductivity of the thermal pad 703 is lower than 701 and 702. Thus the operating temperature of electronic component group 230 is maintained highest. The thermal pad thermal conductivities may be accurately determined to obtain particular operating temperatures from the heat transfer equations known in the art.

[0055] In accordance to the fifth embodiment of the present invention, a Charger system 100 is provided as illustrated in FIG. 8 and FIG. 9. Thermal pads 701, 702, and 703 of different material properties are provided in the Charger system 100.

[0056] The thermal pads 701, 702, and 703 are suitably placed to contact the electronic component groups 210, 220, and 230 respectively. The term “suitably placed” herein means that the thermal pads 701, 702, and 703 are positioned to cover complete exposed surface area for heat transfer. The thermal pad 701 is made up of material having highest thermal conductivity, the thermal pad 702 is made up of material having moderate thermal conductivity, and the thermal pad 703 is made up of material having least thermal conductivity.

[0057] The electronic component group 210, herein as example - power semiconductor devices without inbuilt diode, is required to be maintained at low operating temperature. Further, the electronic component group 220, herein as example - power semiconductor devices with inbuilt diode, is required to be maintained at moderate operating temperature. Further, the electronic component group 230, herein as example - peripheral devices, is required to be maintained at high operating temperature.

[0058] Further, referring to FIG. 8 and FIG. 9, a heat sink 600 is provided in the Charger system 100. Herein, a heat sink is a structure used for heat dissipation and thus for cooling. In accordance to the fifth embodiment of the present invention, the said heat sink 600 is a liquid cooled heat sink. As used herein, a liquid cooled heat sink dissipates the heat absorbed by it to an external thermal management system. A liquid coolant is circulated in the liquid cooled heat sink, the coolant may be circulated by an external pump. The heat sink 600 has an inlet 601 for the coolant to flow in the heat sink and an outlet 602 for the coolant to flow out of the heat sink. The heat sink 600 is attached to the thermal pads 701, 702, and 703. Herein, the thermal pads 701, 702, and 703 transfer the heat produced by electronic component group 210, 220, and 230 respectively to the heat sink 600.

[0059] As can be evaluated from basic conduction heat transfer equations known in the art, the temperature difference between the electronic component group 210 and the heat sink 600 is lowest, since the thermal conductivity of the thermal pad 701 is higher than 702 and 703. Thus the operating temperature of electronic component group 210 is maintained lowest. Similarly, the temperature difference between the electronic component group 220 and the heat sink 600 is moderate, since the thermal conductivity of the thermal pad 702 is moderate. Thus the operating temperature of electronic component group 220 is maintained moderate. Similarly, the temperature difference between the electronic component group 230 and the heat sink 600 is highest, since the thermal conductivity of the thermal pad 703 is lower than 701 and 702. Thus the operating temperature of electronic component group 230 is maintained highest. The thermal pad thermal conductivities may be accurately determined to obtain particular operating temperatures from the heat transfer equations known in the art.

[0060] In accordance to the sixth embodiment of the present invention, a Charger system 100 is provided as illustrated in FIG. 10 and FIG. 11. A circuit board 200 and a thermal pad 700 are provided in the Charger system 100.

[0061] The thermal pad 700 is suitably placed to contact the electronic component groups 210, 220, and 230. The term “suitably placed” herein means that the thermal pad 700 is positioned to cover complete exposed surface area for heat transfer. The electronic component group 210, herein as example - power semiconductor devices without inbuilt diode, is required to be maintained at low operating temperature. Further, the electronic component group 220, herein as example - power semiconductor devices with inbuilt diode, is required to be maintained at moderate operating temperature. Further, the electronic component group 230, herein as example - peripheral devices, is required to be maintained at high operating temperature.

[0062] Further, referring to FIG. 10 and FIG. 11, a heat sink 600 is provided in the Charger system 100. Herein, a heat sink is a structure used for heat dissipation and thus for cooling. In accordance to the sixth embodiment of the present invention, the said heat sink 600 is an air cooled heat sink having dissimilar fin height. As used herein, an air cooled heat sink dissipates the heat absorbed by it to the environment by virtue of convection. Herein, a fin is referred to a member attached to the base of heat sink which helps to spread the heat over a large area and increases heat transfer. The heat sink 600 is attached to the thermal pad 700. Herein, the thermal pad 700 transfer the heat produced by electronic component group 210, 220, and 230 to the heat sink 600.

[0063] The heat sink 600 has fins of dissimilar heights. The fin height is highest where the component group 210 is attached, thus highest heat transfer occurs and the component group 210 is maintained at low operating temperature. Similarly, the fin height is moderate where the component group 220 is attached, thus moderate heat transfer occurs and the component group 220 is maintained at moderate operating temperature. Similarly, the fin height is lowest where the component group 230 is attached, thus lowest heat transfer occurs and the component group 230 is maintained at high operating temperature. The fin height may be accurately determined from heat transfer equations known in the art.

[0064] In accordance to the seventh embodiment of the present invention, a Charger system 100 is provided as illustrated in FIG. 12 and FIG. 13. A circuit board 200 and a thermal pad 700 are provided in the Charger system 100.

[0065] The thermal pad 700 is suitably placed to contact the electronic component groups 210, 220, and 230. The term “suitably placed” herein means that the thermal pad 700 is positioned to cover complete exposed surface area for heat transfer. The electronic component group 210, herein as example - power semiconductor devices without inbuilt diode, is required to be maintained at low operating temperature. Further, the electronic component group 220, herein as example - power semiconductor devices with inbuilt diode, is required to be maintained at moderate operating temperature. Further, the electronic component group 230, herein as example - peripheral devices, is required to be maintained at high operating temperature.

[0066] Further, referring to FIG. 12 and FIG. 13, a heat sink 600 is provided in the Charger system 100. Herein, a heat sink is a structure used for heat dissipation and thus for cooling. In accordance to the seventh embodiment of the present invention, the said heat sink 600 is an air cooled heat sink having dissimilar fin thickness and fin spacing. Herein, a fin is referred to a member attached to the base of heat sink which helps to spread the heat over a large area and increases heat transfer. As used herein, an air cooled heat sink dissipates the heat absorbed by it to the environment by virtue of convection. The heat sink 600 is attached to the thermal pad 700. Herein, the thermal pad 700 transfer the heat produced by electronic component group 210, 220, and 230 to the heat sink 600.

[0067] The heat sink 600 has fins of dissimilar thickness and spacing. The fin thickness and spacing above the component group 210 is such that maximum surface area obtained, thus highest heat transfer occurs and the component group 210 is maintained at low operating temperature. Similarly, the fin thickness and spacing above the component group 220 is such that moderate surface area obtained, thus moderate heat transfer occurs and the component group 220 is maintained at moderate operating temperature. Similarly, the fin thickness and spacing above the component group 230 is such that minimum required surface area is obtained, thus low heat transfer occurs and the component group 210 is maintained at high operating temperature. The fin thickness and spacing may be accurately determined from heat transfer equations known in the art.

[0068] In accordance to the eighth embodiment of the present invention, a Charger system 100 is provided as illustrated in FIG. 14 and FIG. 15. A circuit board 200 and a thermal pad 700 are provided in the Charger system 100.

[0069] The thermal pad 700 is suitably placed to contact the electronic component groups 210, 220, and 230. The term “suitably placed” herein means that the thermal pad 700 is positioned to cover complete exposed surface area for heat transfer. The electronic component group 210, herein as example - power semiconductor devices without inbuilt diode, is required to be maintained at low operating temperature. Further, the electronic component group 220, herein as example - power semiconductor devices with inbuilt diode, is required to be maintained at moderate operating temperature. Further, the electronic component group 230, herein as example - peripheral devices, is required to be maintained at high operating temperature.

[0070] Further, referring to FIG. 14 and FIG. 15, a heat sink 600 is provided in the Charger system 100. In accordance to the eighth embodiment of the present invention, the said heat sink 600 is a liquid cooled heat sink. As used herein, a liquid cooled heat sink dissipates the heat absorbed by it to an external thermal management system. A liquid coolant is circulated in the liquid cooled heat sink, the coolant may be circulated by an external pump. The heat sink 600 has an inlet 601 for the coolant to flow in the heat sink and an outlet 602 for the coolant to flow out of the heat sink. The heat sink 600 is attached to the thermal pads 701, 702, and 703. Herein, the thermal pads 701, 702, and 703 transfer the heat produced by electronic component group 210, 220, and 230 respectively to the heat sink 600.

[0071] The heat sink 600 has its inlet 601 and outlet 602 positioned such that the inlet 601 is above the electronic component group 210 and the outlet 602 is above the electronic component group 220. Cold coolant enters through the inlet 601, thus electronic component group 210 is maintained at low operating temperature. As the coolant takes away the heat from electronic component group 210, the temperature of the coolant rises. Thus, as hot coolant passes over the electronic component group 220, a relatively higher operating temperature is maintained. As there is no path for coolant to flow above the electronic component group 230, the heat transfer path to the coolant is longer. Thus, a higher temperature difference is created between the coolant and the electronic component group 230. Thus, the electronic component group 230 is maintained at highest temperature. The flow rate of coolant and position of inlet and outlet may be accurately determined from heat transfer equations or computer aided simulations known in the art.
[0072] Referring to FIG. 16, an electric vehicle system is represented. As used herein, an electric vehicle is defined as a vehicle which uses one or more electric motors for propulsion instead of conventional internal combustion engines. FIG. 16 is a block diagram representation of a Charger system enclosed in an electric vehicle in accordance with the ninth embodiment of the present disclosure. The electric vehicle system (80) includes a chassis (90). As used herein, the chassis (90) is defined as a base frame of a wheeled vehicle. The chassis (90) is configured to provide a structure to the electric vehicle. The electric vehicle system (80) also includes at least one controller (110) operatively coupled within the chassis (90). The at least one controller (110) is configured to control a plurality of electronic components within the electric vehicle.
[0073] Furthermore, the electric vehicle system (80) also includes an Charger system (100), as mentioned in various previous embodiments, placed within the chassis (90) and is operatively coupled to the at least one controller (110).
[0074] While specific language has been used to describe the disclosure, any limitations arising on account of the same are not intended. As would be apparent to a person skilled in the art, various working modifications may be made to the method in order to implement the inventive concept as taught herein.

[0075] The figures and the foregoing description give examples of embodiments. Those skilled in the art will appreciate that one or more of the described elements may well be combined into a single functional element. Alternatively, certain elements may be split into multiple functional elements. Elements from one embodiment may be added to another embodiment. For example, orders of processes described herein may be changed and are not limited to the manner described herein. The scope of embodiments is by no means limited by these specific examples. Numerous variations, whether explicitly given in the specification or not, such as differences in structure, dimension, and use of material, are possible. The scope of embodiments is at least as broad as given by the following claims.