Abstract: An electrical edge connector (12) for BIPV solar module laminates having edge (11), comprising pin type connectors (13) and bypass diode (15) positioned in a cavity of said connector, a plurality of electrical connecting strips (14) which are brought out from between the glass shuts of the said laminates and joined to leads of pin type connectors (13) and bypass diode(15),the side of edge connector (12) having pin connector (13) and bypass diode (15) being filled and sealed with epoxy resin characterized in that the edge connector (12) is either press-fitted or glued to the edge of laminate (11) to facilitate connection of electrical wires or cables without drilling any hole on the back glass of laminate (11).
FIELD OF THE INVENTION;
The invention relates to Building Integrated Photovoltaics (BIPV) in general and to
connection facility of cable to BIPV modules in particular.
BACKGROUND AND PRIOR ART:
The solar module laminates for incorporation in Building Integrated Photovoltaics (BIPV)
are presently provided with a terminal box at its back. To fix the terminal box at the rear
side, a hole is required to be drilled in the back glass to bring out the copper strips of
the end electrical connections of the solar modules. Although this structure is quite safe
for the copper strips, it is not suitable for BIPV modules as the terminal box at the rear
of the module blocks some light. Also drilling of hole in the back glass weakens the
module which becomes prone to damages with time. The other alternative has been to
bring out the copper strips to the side and solder /crimp wires of the system to the
copper strips. In this type of arrangement, the copper strips may get damaged due to
mechanical pull or get corroded due to moisture. Therefore, an edge connector is
required which does not interfere with the fixing arrangement and protects the copper
strips from damage and corrosion. US Patent application No. 2006/0225780 describes
the integration of BIPV tiles with interlocking arrangement on a sloping roof. The
method of electrical termination is not described. The contacts are prone to corrosion if
they are not embedded in leak proof environment. If the strips are protruding outside
and connected to wires, they are prone to breakage or corrosion as the moisture may
travel along the strip inside module.
The following patent publications are incorporated by way of reference in this
specification:
US PATENTS:
1. 20060225780 Oct 2006 A 1 Johnson et al
2. 20060243318 Nov 2006 A 1 Reldmeier et al
The present invention seeks to overcome the above drawbacks of the prior art.
DESCRIPTION OF THE INVENTION:
A solar module is fabricated by interconnecting solar cells to provide required voltage
and current to power an application such as light or fan. In normal applications, the
modules are mounted on the ground or roof in usually inclined position so that it sees
maximum sunlight during the day. In an attempt to make it more economic, the
modules are integrated in the building, where they become a part of the building as
well as generate power by converting sunrays into electricity. This is known as Building
Integrated Photovoltaics (BIPV). Various types of solar laminates based on glass-to-glass
or glass to polymer sheet have been developed to provide strength and allow sunlight in
the building reducing lighting load.
However, incorporation of modules in the building brings in various issues related to the
building requirements. The arrangement should aesthetically fit in the building envelop
without water seepage problems. The module is sealed at the edges by using pressure
plates and sealing gaskets or sealing epoxies.
The electrical terminals of the solar modules are quite prone for moisture penetration
and corrosion. The flexible metal strips (usually tin coated copper strips) coming out
between the glass sheets are very fragile and prone for
corrosion. The strips have to be hermetically sealed in a terminal housing so that
moisture does not come in their contact.
In the present invention, a design of an H type electrical edge connector is disclosed.
The edge connector grips the module from the edge by the two walls of one side of the
H of the connector either by press fitting or gluing with an adhesive. Two copper
connectors facing opposite to each other and a bypass diode are fixed in the other side
of the H of the edge connecter. The connecting module strips for positive and negative
terminals are brought through the holes in the center strip of the H-type connector and
are soldered/ crimped to the connectors and the bypass diode. The housing for
connecters, soldered strips and bypass diode leads are sealed using a moisture
protecting epoxy.
BRIEF DESCRIPTION OF THE ACCOMPANYING DRAWINGS:
Fir: 1 shows the schematic representation of edge connector according to the invention.
Fir: 2 shows photographic representation of the edge connector.
The invention will now be described in detail with help of an exemplary embodiment as
depicted in the accompanying drawings. However, there can be many other
embodiments, all of which are deemed covered by this specification.
In Fig. 1, an H type connector is described. The edge connector 12 is made of nylon,
polypropylene or Teflon and is machined or molded to exact dimensions so that it is
gripped in the two strips of one side of H on the edge of the module laminate 11. The
cavity of the other side of H connector is made suitable to house the pin type connectors
13 and bypass diode 15. The electrical connecting strips 14, which are brought out from
between the glass sheets of the laminate and through the holes of the middle strip of
the H connector, are
soldered or crimped to the leads of pin connectors 13 and the bypass diode 15. The
electrical edge connector 12 is either press-fitted or glued to the edge of the laminate
11. The side of the edge connector (12) having pin connector (13) and bypass diode
(15) is filled and sealed with epoxy resin such that the soldered connecting strips 14 and
the metallic leads of the bypass diode are covered with the sealant resin and the side
holes 16 of the pin type connectors remain free to accept the compatible
connector of the wires or cable for connection to the solar system. The
thickness of the sides of the H connector are kept between 1 to 2 mm so that
they remain thinner than the gasket of the pressure plate used for mounting of
these laminates. The solar laminate fixed with H connector is shown in Fig.2.
WE CLAIM:
1. An electrical edge connector (12) for BIPV solar module laminates having edge
(11), comprising
pin type connectors (13) and bypass diode (15) positioned in a cavity of
said connector,
a plurality of electrical connecting strips (14) which are brought out from
between the glass sheets of the said laminates and joined to leads of pin
type connectors (13) and bypass diode(15),
the side of edge connector (12) having pin connector (13) and bypass
diode (15) being filled and sealed with epoxy resin,
characterized in that the edge connector (12) is either press-fitted or glued to the
edge of laminate (11) to facilitate connection of electrical wires or cables without
drilling any hole on the back glass of laminate (11).
2. The edge connector as claimed in claim 1, wherein the shape of the connector is
in form of alphabet "H".
3. The edge connector as claimed in claim 1, wherein the electrical connecting
strips (14) are either soldered or crimped to the leads of pin connectors (13)
and bypass diode (15).
4. The edge connector as claimed in clam 1, wherein the soldered connecting
strips (14) and the metallic leads of bypass diode (15) are covered with sealant
epoxy resin, but side holes (16) of the pin type connectors (13) are left free.
5. The edge connector as claimed in claim 2, wherein the thickness of the sides of
the H-shaped edge connector is between 1 and 2 mm.
ABSTRACT
TITLE: ELECTRICAL EDGE CONNECTOR FOR BIPV SOLAR MODULE LAMINATES
An electrical edge connector (12) for BIPV solar module laminates having
edge (11), comprising pin type connectors (13) and bypass diode (15) positioned in a
cavity of said connector, a plurality of electrical connecting strips (14) which are
brought out from between the glass shuts of the said laminates and joined to leads of
pin type connectors (13) and bypass diode(15),the side of edge connector (12) having
pin connector (13) and bypass diode (15) being filled and sealed with epoxy resin
characterized in that the edge connector (12) is either press-fitted or glued to the
edge of laminate (11) to facilitate connection of electrical wires or cables without
drilling any hole on the back glass of laminate (11).
| # | Name | Date |
|---|---|---|
| 1 | 868-KOL-2008-27-01-2023-LETTER OF PATENT.pdf | 2023-01-27 |
| 1 | abstract-00868-kol-2008.jpg | 2011-10-07 |
| 2 | 00868-kol-2008-gpa.pdf | 2011-10-07 |
| 2 | 868-KOL-2008-RELEVANT DOCUMENTS [20-03-2018(online)].pdf | 2018-03-20 |
| 3 | Form 27 [31-03-2017(online)].pdf | 2017-03-31 |
| 3 | 00868-kol-2008-form 3.pdf | 2011-10-07 |
| 4 | Other Patent Document [25-03-2017(online)].pdf | 2017-03-25 |
| 4 | 00868-kol-2008-form 2.pdf | 2011-10-07 |
| 5 | 868-KOL-2008_EXAMREPORT.pdf | 2016-06-30 |
| 5 | 00868-kol-2008-form 1.pdf | 2011-10-07 |
| 6 | 261828-(28-03-2016)-FORM-27.pdf | 2016-03-28 |
| 6 | 00868-kol-2008-drawings.pdf | 2011-10-07 |
| 7 | 868-KOL-2008-(01-04-2015)-FORM-27.pdf | 2015-04-01 |
| 7 | 00868-kol-2008-description complete.pdf | 2011-10-07 |
| 8 | 868-KOL-2008-(16-07-2014)-LETTER OF PATENT.pdf | 2014-07-16 |
| 8 | 00868-kol-2008-correspondence others.pdf | 2011-10-07 |
| 9 | 00868-kol-2008-claims.pdf | 2011-10-07 |
| 9 | 868-KOL-2008-CANCELLED PAGES.pdf | 2014-06-28 |
| 10 | 00868-kol-2008-abstract.pdf | 2011-10-07 |
| 10 | 868-KOL-2008-CORRESPONDENCE.pdf | 2014-06-28 |
| 11 | 868-KOL-2008-(17-02-2014)-PA.pdf | 2014-02-17 |
| 11 | 868-KOL-2008-EXAMINATION REPORT.pdf | 2014-06-28 |
| 12 | 868-KOL-2008-(17-02-2014)-OTHERS.pdf | 2014-02-17 |
| 12 | 868-kol-2008-form 18.pdf | 2014-06-28 |
| 13 | 868-KOL-2008-(17-02-2014)-FORM-2.pdf | 2014-02-17 |
| 13 | 868-KOL-2008-GPA.pdf | 2014-06-28 |
| 14 | 868-KOL-2008-(17-02-2014)-FORM-1.pdf | 2014-02-17 |
| 14 | 868-KOL-2008-GRANTED-ABSTRACT.pdf | 2014-06-28 |
| 15 | 868-KOL-2008-(17-02-2014)-DRAWINGS.pdf | 2014-02-17 |
| 15 | 868-KOL-2008-GRANTED-CLAIMS.pdf | 2014-06-28 |
| 16 | 868-KOL-2008-(17-02-2014)-DESCRIPTION (COMPLETE).pdf | 2014-02-17 |
| 16 | 868-KOL-2008-GRANTED-DESCRIPTION (COMPLETE).pdf | 2014-06-28 |
| 17 | 868-KOL-2008-GRANTED-DRAWINGS.pdf | 2014-06-28 |
| 17 | 868-KOL-2008-(17-02-2014)-CORRESPONDENCE.pdf | 2014-02-17 |
| 18 | 868-KOL-2008-(17-02-2014)-CLAIMS.pdf | 2014-02-17 |
| 18 | 868-KOL-2008-GRANTED-FORM 1.pdf | 2014-06-28 |
| 19 | 868-KOL-2008-(17-02-2014)-ABSTRACT.pdf | 2014-02-17 |
| 19 | 868-KOL-2008-GRANTED-FORM 2.pdf | 2014-06-28 |
| 20 | 868-KOL-2008-GRANTED-FORM 3.pdf | 2014-06-28 |
| 20 | 868-KOL-2008-REPLY TO EXAMINATION REPORT.pdf | 2014-06-28 |
| 21 | 868-KOL-2008-GRANTED-SPECIFICATION-COMPLETE.pdf | 2014-06-28 |
| 22 | 868-KOL-2008-GRANTED-FORM 3.pdf | 2014-06-28 |
| 22 | 868-KOL-2008-REPLY TO EXAMINATION REPORT.pdf | 2014-06-28 |
| 23 | 868-KOL-2008-(17-02-2014)-ABSTRACT.pdf | 2014-02-17 |
| 23 | 868-KOL-2008-GRANTED-FORM 2.pdf | 2014-06-28 |
| 24 | 868-KOL-2008-GRANTED-FORM 1.pdf | 2014-06-28 |
| 24 | 868-KOL-2008-(17-02-2014)-CLAIMS.pdf | 2014-02-17 |
| 25 | 868-KOL-2008-GRANTED-DRAWINGS.pdf | 2014-06-28 |
| 25 | 868-KOL-2008-(17-02-2014)-CORRESPONDENCE.pdf | 2014-02-17 |
| 26 | 868-KOL-2008-(17-02-2014)-DESCRIPTION (COMPLETE).pdf | 2014-02-17 |
| 26 | 868-KOL-2008-GRANTED-DESCRIPTION (COMPLETE).pdf | 2014-06-28 |
| 27 | 868-KOL-2008-(17-02-2014)-DRAWINGS.pdf | 2014-02-17 |
| 27 | 868-KOL-2008-GRANTED-CLAIMS.pdf | 2014-06-28 |
| 28 | 868-KOL-2008-(17-02-2014)-FORM-1.pdf | 2014-02-17 |
| 28 | 868-KOL-2008-GRANTED-ABSTRACT.pdf | 2014-06-28 |
| 29 | 868-KOL-2008-(17-02-2014)-FORM-2.pdf | 2014-02-17 |
| 29 | 868-KOL-2008-GPA.pdf | 2014-06-28 |
| 30 | 868-KOL-2008-(17-02-2014)-OTHERS.pdf | 2014-02-17 |
| 30 | 868-kol-2008-form 18.pdf | 2014-06-28 |
| 31 | 868-KOL-2008-(17-02-2014)-PA.pdf | 2014-02-17 |
| 31 | 868-KOL-2008-EXAMINATION REPORT.pdf | 2014-06-28 |
| 32 | 00868-kol-2008-abstract.pdf | 2011-10-07 |
| 32 | 868-KOL-2008-CORRESPONDENCE.pdf | 2014-06-28 |
| 33 | 00868-kol-2008-claims.pdf | 2011-10-07 |
| 33 | 868-KOL-2008-CANCELLED PAGES.pdf | 2014-06-28 |
| 34 | 00868-kol-2008-correspondence others.pdf | 2011-10-07 |
| 34 | 868-KOL-2008-(16-07-2014)-LETTER OF PATENT.pdf | 2014-07-16 |
| 35 | 00868-kol-2008-description complete.pdf | 2011-10-07 |
| 35 | 868-KOL-2008-(01-04-2015)-FORM-27.pdf | 2015-04-01 |
| 36 | 261828-(28-03-2016)-FORM-27.pdf | 2016-03-28 |
| 36 | 00868-kol-2008-drawings.pdf | 2011-10-07 |
| 37 | 868-KOL-2008_EXAMREPORT.pdf | 2016-06-30 |
| 37 | 00868-kol-2008-form 1.pdf | 2011-10-07 |
| 38 | Other Patent Document [25-03-2017(online)].pdf | 2017-03-25 |
| 38 | 00868-kol-2008-form 2.pdf | 2011-10-07 |
| 39 | Form 27 [31-03-2017(online)].pdf | 2017-03-31 |
| 39 | 00868-kol-2008-form 3.pdf | 2011-10-07 |
| 40 | 868-KOL-2008-RELEVANT DOCUMENTS [20-03-2018(online)].pdf | 2018-03-20 |
| 40 | 00868-kol-2008-gpa.pdf | 2011-10-07 |
| 41 | abstract-00868-kol-2008.jpg | 2011-10-07 |
| 41 | 868-KOL-2008-27-01-2023-LETTER OF PATENT.pdf | 2023-01-27 |