FORM 2
THE PATENTS ACT, 1970
(39 of 1970)
&
THE PATENTS RULES, 2003
COMPLETE SPECIFICATION
[See section 10, Rule 13]
ELECTRIC COMPONENT MODULE
MITSUBISHI ELECTRIC CORPORATION, A CORPORATION ORGANISED
AND EXISTING UNDER THE LAWS OF JAPAN, WHOSE ADDRESS IS 7-3,
MARUNOUCHI 2-CHOME, CHIYODA-KU, TOKYO 1008310, JAPAN
THE FOLLOWING SPECIFICATION PARTICULARLY DESCRIBES THE
INVENTION AND THE MANNER IN WHICH IT IS TO BE PERFORMED.
2
DESCRIPTION
Field
[0001] The present disclosure relates to an electric
component module including a heat generating component.5
Background
[0002] Typically, heat generating components that
generate heat such as a coil or a capacitor are installed on
an electric component module. Therefore, the electric10
component module needs means for dissipating the heat
generated from the heat generating component.
[0003] For example, Patent Literature 1 discloses an
electric component module in which an electric component is
disposed away from a substrate on one end of the substrate15
in a plate thickness direction, a metal member is disposed
away from the substrate on another end of the substrate in
the plate thickness direction, and in addition, a heat
dissipation member is disposed to be sandwiched between the
substrate and the metal member.20
[0004] The electric component disclosed in Patent
Literature 1 includes a coil that is a heat generating
component, a core portion that houses the coil, and a heat
transfer resin sandwiched between the core portion and the
substrate. According to the technique disclosed in Patent25
Literature 1, heat generated from the coil can be transferred
to the heat transfer resin, the substrate, the heat
dissipation member, and the metal member in this order and
can be dissipated from the metal member. As a result, the
coil can be cooled.30
Citation List
Patent Literature
3
[0005] Patent Literature 1: Japanese Patent Application
Laid-open No. 2020-088127
Summary of Invention
Problem to be solved by the Invention5
[0006] In order to promote cooling of the coil, higher
heat transfer efficiency from the coil to the metal member
is more desirable. According to the technique disclosed in
Patent Literature 1, the heat generated from the coil is
transferred to the substrate or the like only through the10
heat transfer resin. Therefore, a possibility remains that
it is possible to increase the heat transfer efficiency from
the coil to the metal member.
[0007] The present disclosure has been made in view of
the above, and an object of the present disclosure is to15
obtain an electric component module that can increase heat
transfer efficiency from a heat generating component to a
metal member than in the past.
Means to Solve the Problem20
[0008] In order to solve the above problems and to achieve
the object, an electric component module according to the
present disclosure includes a substrate that includes a first
surface, a second surface facing an opposite side of the
first surface, a first metal foil provided on the first25
surface, and a second metal foil provided on the second
surface, in which a via hole that penetrates from the first
surface to the second surface and electrically connects the
first metal foil and the second metal foil is provided.
Furthermore, the electric component module includes a heat30
generating component that is disposed away from the substrate
in a plate thickness direction of the substrate and a heat
transfer resin that is disposed between the substrate and
4
the heat generating component and has contact with the
substrate and the heat generating component. Furthermore,
the electric component module includes a metal member that
is disposed on an opposite side of the heat generating
component with the substrate therebetween and disposed away5
from the substrate in the plate thickness direction of the
substrate, a heat dissipation member that is disposed between
the substrate and the metal member and has contact with the
substrate and the metal member, and a metal heat transfer
pin to be inserted into the via hole. A part of the heat10
transfer pin has contact with the heat transfer resin.
Effects of the Invention
[0009] An electric component module according to the
present disclosure achieves an effect that it is possible to15
increase heat transfer efficiency from a heat generating
component to a metal member than in the past.
Brief Description of Drawings
[0010] FIG. 1 is a perspective view schematically20
illustrating an appearance of an air conditioning device
according to a first embodiment.
FIG. 2 is a perspective view schematically illustrating
an internal structure of the air conditioning device
according to the first embodiment.25
FIG. 3 is a cross-sectional view illustrating an
electric component module according to the first embodiment.
FIG. 4 is a cross-sectional view illustrating details
of the electric component module according to the first
embodiment.30
FIG. 5 is a cross-sectional view illustrating details
of an electric component module according to a second
embodiment.
5
Description of Embodiments
[0011] Hereinafter, an electric component module
according to embodiments will be described in detail with
reference to the drawings.5
[0012] First Embodiment.
FIG. 1 is a perspective view schematically illustrating
an appearance of an air conditioning device 10 according to
a first embodiment. FIG. 2 is a perspective view
schematically illustrating an internal structure of the air10
conditioning device 10 according to the first embodiment.
As illustrated in FIG. 1, the air conditioning device 10
includes an indoor unit 11 installed indoors and an outdoor
unit 12 installed outdoors. The indoor unit 11 blows
conditioned air into a room. The indoor unit 11 and the15
outdoor unit 12 are connected via a refrigerant pipe 13 that
circulates a refrigerant. Although not specifically
illustrated, the refrigerant pipe 13 is connected to a valve
device such as a four-way valve that switches a refrigerant
flow direction or an expansion valve that expands the20
refrigerant to a predetermined pressure.
[0013] As illustrated in FIG. 2, the outdoor unit 12
includes a sheet-metal housing 12a, an outdoor fan 12b, an
outdoor heat exchanger 12c, a compressor 12d, and a driving
device 12e. An arrow Y illustrated in FIGs. 1 and 2 indicates25
a blowing direction of an air flow generated by the outdoor
fan 12b. In the present embodiment, a side of the outdoor
unit 12 where the air flow generated by the outdoor fan 12b
is discharged to the outside is set as a front side, and an
opposite side of the front side is set as a back side.30
[0014] The sheet-metal housing 12a is a box-like member
serving as an outline of the outdoor unit 12. A material of
the sheet-metal housing 12a is metal. The sheet-metal
6
housing 12a includes a separator 12f. The separator 12f
divides an inside of the sheet-metal housing 12a into a fan
chamber 12g and a machine chamber 12h. The fan chamber 12g
and the machine chamber 12h are formed side by side in a
width direction of the outdoor unit 12.5
[0015] In the fan chamber 12g, the outdoor fan 12b and
the outdoor heat exchanger 12c are disposed. The outdoor
fan 12b is a device that generates an air flow. The outdoor
heat exchanger 12c is a member for exchanging heat between
the refrigerant and outdoor air. Outdoor air to be taken10
into the outdoor fan 12b passes through the outdoor heat
exchanger 12c. As illustrated in FIG. 1, in a portion,
facing the fan chamber 12g, in a front side wall of the
sheet-metal housing 12a, a wire grille 12i is provided. In
a portion, facing the fan chamber 12g, in a back side wall15
of the sheet-metal housing 12a, an air supply port (not
illustrated) is provided. When the outdoor fan 12b
illustrated in FIGs. 1 and 2 is driven, outside air of the
outdoor unit 12 flows from the air supply port into the fan
chamber 12g, and passes through the outdoor heat exchanger20
12c, and then, is discharged to the outside of the fan
chamber 12g from the wire grille 12i.
[0016] As illustrated in FIG. 2, in the machine chamber
12h, the compressor 12d and the driving device 12e are
disposed. The compressor 12d is a device that compresses25
the refrigerant using a motor (not illustrated) as a driving
source. The driving device 12e is a device that receives
power from an external power supply (not illustrated) and
outputs power to the motor. The driving device 12e is
provided on a surface, facing the machine chamber 12h, of30
the separator 12f.
[0017] FIG. 3 is a cross-sectional view illustrating an
electric component module 1 according to the first embodiment.
7
In the driving device 12e, the electric component module 1
illustrated in FIG. 3 is installed. The electric component
module 1 includes a substrate 2, a coil 3, a heat transfer
resin 4, a metal member 5, a heat dissipation member 6, and
a plurality of heat transfer pins 7. Hereinafter, when a5
direction of each component of the electric component module
1 is described, a plate thickness direction of the substrate
2 is set as a first direction, and a direction intersecting
with the first direction is set as a second direction.
Furthermore, in the following description, a direction from10
an end portion of the substrate 2 in the second direction
toward a center of the substrate 2 in the second direction
is set as an inner side, and an opposite side of the inner
side is set as an outer side.
[0018] FIG. 4 is a cross-sectional view illustrating15
details of the electric component module 1 according to the
first embodiment. The substrate 2 is a flat-plate-like
member including a conductor portion. The substrate 2
includes a base material 2a, a first metal foil 2d, and a
second metal foil 2e. Furthermore, a via hole 2f is provided20
in the substrate 2.
[0019] A cross-sectional shape of the base material 2a is
a rectangle that is longer in the second direction than the
first direction. As a material of the base material 2a, an
insulating resin is used. The base material 2a includes a25
first surface 2b and a second surface 2c facing an opposite
side of the first surface 2b.
[0020] The first metal foil 2d is provided on the first
surface 2b of the base material 2a. The first metal foil 2d
is partially bonded to the first surface 2b of the base30
material 2a. The second metal foil 2e is provided on the
second surface 2c of the base material 2a. The second metal
foil 2e is partially bonded to the second surface 2c of the
8
base material 2a. In the present embodiment, copper is used
as materials of the first metal foil 2d and the second metal
foil 2e. However, for example, copper alloys, aluminum,
aluminum alloys, nickel, and nickel alloys may be used.
[0021] The via hole 2f penetrates from the first surface5
2b to the second surface 2c and electrically connects the
first metal foil 2d and the second metal foil 2e. The via
hole 2f includes a hole 2g that penetrates from the first
surface 2b of the base material 2a to the second surface 2c
in the first direction and a conductor layer 2h that covers10
an inner wall of the hole 2g. The conductor layer 2h is
formed in a tubular shape. The conductor layer 2h is formed
by plating. The conductor layer 2h electrically connects
the first metal foil 2d and the second metal foil 2e. The
conductor portion of the substrate 2 is the first metal foil15
2d, the second metal foil 2e, and the conductor layer 2h of
the via hole 2f.
[0022] Electronic components (not illustrated) are
mounted on the substrate 2. The electronic components
include, for example, a noise filter, a smoothing capacitor,20
sensors that detect a current and a voltage, a microcomputer,
and a peripheral circuit of the microcomputer. The
electronic component is bonded to the first metal foil 2d,
the second metal foil 2e, or the via hole 2f by soldering.
[0023] The coil 3 is a heat generating component disposed25
away from the substrate 2 in the first direction. When the
driving device 12e is driven, heat is generated from the
coil 3. The coil 3 includes two lead wires 3a extending
toward the substrate 2. The two lead wires 3a are separated
from each other in the second direction.30
[0024] The heat transfer resin 4 is a member that is
disposed between the substrate 2 and the coil 3 and has
contact with the substrate 2 and the coil 3. The heat
9
transfer resin 4 plays a role for transferring the heat
generated from the coil 3 to the heat transfer pin 7 and the
substrate 2. It is preferable that a resin with a high heat
conductivity be used as the heat transfer resin 4. The heat
transfer resin 4 is sandwiched between the substrate 2 and5
the coil 3. The heat transfer resin 4 is thermally coupled
to the first metal foil 2d and the coil 3. A part of the
heat transfer resin 4 passes through the first metal foil 2d
in the first direction and has contact with the first surface
2b.10
[0025] The metal member 5 is a member that is disposed on
an opposite side of the coil 3 with the base material 2a
therebetween and is disposed away from the substrate 2 in
the first direction. The metal member 5 has a conductivity
and heat dissipation. The metal member 5 plays a role for15
dissipating the heat generated from the coil 3 to outside of
the driving device 12e. In the present embodiment, the metal
member 5 is a sheet metal. However, the metal member 5 may
be a heat sink, a housing configuring an outline of a device
on which the driving device 12e is installed, or the like.20
In a case where the driving device 12e is installed on the
air conditioning device 10, the metal member 5 may be the
sheet-metal housing 12a of the outdoor unit 12.
[0026] The heat dissipation member 6 is a member that is
disposed between the substrate 2 and the metal member 5 and25
has contact with the substrate 2 and the metal member 5.
The heat dissipation member 6 plays a role for dissipating
the heat generated from the coil 3. As the heat dissipation
member 6, a heat dissipation sheet, gel, or gel having heat
dissipation is used. The heat dissipation member 6 is30
sandwiched between the substrate 2 and the metal member 5.
The heat dissipation member 6 is thermally coupled to the
second metal foil 2e and the metal member 5. A part of the
10
heat dissipation member 6 passes through the second metal
foil 2e in the first direction and has contact with the
second surface 2c.
[0027] The heat transfer pin 7 is a metal member inserted
into the via hole 2f. It is preferable that metal with a5
high heat conductivity be used as the heat transfer pin 7.
The heat transfer pin 7 protrudes toward the heat transfer
resin 4 than the first surface 2b of the substrate 2 and the
first metal foil 2d. A part of the heat transfer pin 7 has
contact with the heat transfer resin 4. A part of the heat10
transfer pin 7 enters the heat transfer resin 4. The heat
transfer pin 7 protrudes toward the heat dissipation member
6 than the second surface 2c of the substrate 2 and the
second metal foil 2e. A part of the heat transfer pin 7 has
contact with the heat dissipation member 6. A part of the15
heat transfer pin 7 enters the heat dissipation member 6.
The heat transfer pin 7 passes through the via hole 2f from
the heat transfer resin 4 and reaches the heat dissipation
member 6.
[0028] Although the number of heat transfer pins 7 is not20
particularly limited, the number is four in the present
embodiment. The four heat transfer pins 7 are arranged at
intervals in the second direction. The single heat transfer
pin 7 is inserted into the single via hole 2f. The heat
transfer pin 7 is disposed at a position overlapping the25
coil 3 in the first direction. The heat transfer pin 7 is
disposed at a position closer to the center of the coil 3 in
the second direction. The heat transfer pin 7 is disposed
between the two lead wires 3a in the second direction. The
heat transfer pin 7 is disposed on an inner side of each30
lead wire 3a.
[0029] Hereinafter, effects of the electric component
module 1 according to the first embodiment will be described.
11
[0030] In the present embodiment, as illustrated in FIG.
4, the electric component module 1 includes the coil 3
disposed away from the substrate 2 in the plate thickness
direction of the substrate 2 and the heat transfer resin 4
that is disposed between the substrate 2 and the coil 3 and5
has contact with the substrate 2 and the coil 3. Furthermore,
the electric component module 1 includes the metal member 5
that is disposed on the opposite side of the coil 3 with the
substrate 2 therebetween and is disposed away from the
substrate 2 in the plate thickness direction of the substrate10
2 and the heat dissipation member 6 that is disposed between
the substrate 2 and the metal member 5 and has contact with
the substrate 2 and the metal member 5. Furthermore, the
electric component module 1 includes the metal heat transfer
pin 7 inserted into the via hole 2f, and a part of the heat15
transfer pin 7 has contact with the heat transfer resin 4.
Furthermore, a part of the heat transfer pin 7 has contact
with the heat dissipation member 6. With these
configurations, in the present embodiment, a route is mainly
divided into a route in which the heat generated from the20
coil 3 is transferred to the heat transfer resin 4, the heat
transfer pin 7, the heat dissipation member 6, and the metal
member 5 in this order and a route in which the heat generated
from the coil 3 is transferred to the heat transfer resin 4,
the substrate 2, the heat dissipation member 6, and the metal25
member 5 in order. Then, the heat transferred from each
route to the metal member 5 can be dissipated from the metal
member 5 to the outside of the driving device 12e. Note
that the heat transferred from the heat transfer resin 4 to
the substrate 2 is transferred to the first metal foil 2d,30
the via hole 2f, and the second metal foil 2e in this order.
[0031] In the present embodiment, the heat generated from
the coil 3 is transferred to the substrate 2 through the
12
heat transfer resin 4, and in addition, the heat generated
from the coil 3 is transferred to the heat dissipation member
6 through the heat transfer pin 7. Therefore, as compared
with a case where the heat generated from the coil 3 is
transferred to the substrate 2 only through the heat transfer5
resin 4, heat transfer efficiency from the coil 3 to the
metal member 5 can be increased, and cooling of the coil 3
can be promoted. In particular, in the present embodiment,
by connecting the heat transfer resin 4 and the heat
dissipation member 6 with the metal heat transfer pin 7, the10
heat transfer efficiency from the heat transfer resin 4 to
the heat dissipation member 6 can be increased.
[0032] Furthermore, by increasing the heat transfer
efficiency from the coil 3 to the metal member 5, it is
possible to reduce a size of the coil 3, and it is possible15
to reduce an effect of the heat of the coil 3 on peripheral
components and reduce an area of the substrate 2.
[0033] In the present embodiment, as illustrated in FIG.
4, the heat transfer pin 7 protrudes toward the heat transfer
resin 4 than the first surface 2b of the substrate 2 and the20
first metal foil 2d so that a surface area of the heat
transfer pin 7 that receives heat from the heat transfer
resin 4 increases. Therefore, it is possible to efficiently
transfer the heat from the heat transfer resin 4 to the heat
transfer pin 7, and it is possible to further increase the25
heat transfer efficiency from the coil 3 to the metal member
5.
[0034] In the present embodiment, as illustrated in FIG.
4, the heat transfer pin 7 protrudes toward the heat
dissipation member 6 from the second surface 2c of the30
substrate 2 and the second metal foil 2e so that the surface
area of the heat transfer pin 7 that transfers heat to the
heat dissipation member 6 increases. Therefore, it is
13
possible to efficiently transfer the heat from the heat
transfer pin 7 to the heat dissipation member 6, and it is
possible to further increase the heat transfer efficiency
from the coil 3 to the metal member 5.
[0035] In the present embodiment, since the heat transfer5
resin 4 illustrated in FIG. 4 is a resin, the heat transfer
resin 4 can be easily deformed. Therefore, the coil 3 having
irregularities can be brought into close contact with the
heat transfer resin 4, it is possible to efficiently transfer
the heat from the coil 3 to the heat transfer resin 4, and10
it is possible to further increase the heat transfer
efficiency from the coil 3 to the metal member 5.
[0036] Note that, in the present embodiment, the heat
transfer pin 7 is inserted into the via hole 2f and is fixed
to the heat transfer resin 4 and the heat dissipation member15
6. However, the heat transfer pin 7 may be bonded to the
substrate 2 by soldering. Since a volume of a metal portion
of the heat transfer pin 7 can be increased in this way, it
is possible to further increase the heat transfer efficiency
from the coil 3 to the metal member 5.20
[0037] Second Embodiment.
Next, an electric component module 1A according to a
second embodiment will be described with reference to FIG.
5. FIG. 5 is a cross-sectional view illustrating details of
the electric component module 1A according to the second25
embodiment. The present embodiment is different from the
first embodiment in that a liquid metal 6a is used as the
heat dissipation member 6 and a housing portion 5a that
houses the liquid metal 6a is provided in the metal member
5. Note that, in the second embodiment, portions overlapping30
the first embodiment are denoted with the same reference
numerals, and description thereof is omitted.
[0038] The annular housing portion 5a that protrudes
14
toward the substrate 2 is formed in a portion of the metal
member 5 facing the substrate 2. A front end of a wall of
the housing portion 5a has contact with the second metal
foil 2e of the substrate 2. A recess 5b that opens toward
the substrate 2 is formed in the housing portion 5a. The5
liquid metal 6a is housed in the recess 5b. The liquid metal
6a has contact with the second metal foil 2e, the heat
transfer pin 7, and the lead wire 3a of the coil 3. A part
of the heat transfer pin 7 and a part of the lead wire 3a
enter the liquid metal 6a.10
[0039] In the present embodiment, the heat dissipation
member 6 is the liquid metal and the metal member 5 includes
the housing portion 5a that houses the liquid metal 6a so
that heat transferred from the heat transfer pin 7 to the
liquid metal 6a causes a convection phenomenon in the liquid15
metal 6a. That is, the heated liquid metal 6a transfers the
heat to the metal member 5 while causing the convection
phenomenon. Therefore, by utilizing characteristics of the
liquid metal 6a that causes the convection phenomenon as
liquid and characteristics of the liquid metal 6a having a20
high heat conductivity as metal, it is possible to
efficiently transfer the heat from the heat dissipation
member 6 to the metal member 5, and it is possible to further
increase the heat transfer efficiency from the coil 3 to the
metal member 5.25
[0040] In the present embodiment, a configuration in
which the housing portion 5a is formed by protruding a part
of the portion of the metal member 5 facing the substrate 2
toward the substrate 2 has been described. However, the
present embodiment is not limited to this configuration. For30
example, the housing portion 5a may be formed by recessing
a part of the portion of the metal member 5 facing the
substrate 2 so as to be away from the substrate 2 in the
15
first direction.
[0041] The configurations illustrated in the above
embodiments indicate examples and can be combined with other
known techniques. Furthermore, the embodiments can be
combined with each other, and some configurations can be5
partially omitted or changed without departing from the scope
of the present invention.
[0042] In each embodiment described above, a case where
the number of heat transfer pins 7 is four is described.
However, the number of heat transfer pins 7 may be10
appropriately increased or decreased. Furthermore, although
the heat transfer pins 7 illustrated in FIGs. 3 to 5 are
arranged in a horizontal direction of the paper, the heat
transfer pins 7 may be arranged in a depth direction of the
paper or may be arranged in both of the horizontal direction15
of the paper and the depth direction of the paper.
Furthermore, although the heat transfer pin 7 illustrated in
FIGs. 3 to 5 is disposed on the inner side of the lead wire
3a, the heat transfer pin 7 may be disposed on the outer
side of the lead wire 3a. In a case of such a configuration,20
it is sufficient that the via hole 2f be provided in a
portion of the substrate 2 positioned on the outer side of
the lead wire 3a and the heat transfer pin 7 be inserted
into the via hole 2f.
[0043] In each embodiment described above, the heat25
transfer pin 7 protrudes toward the heat transfer resin 4
than the first metal foil 2d. However, the heat transfer
pin 7 may have contact with the heat transfer resin 4 without
protruding the heat transfer pin 7 toward the heat transfer
resin 4 than the first metal foil 2d. That is, an end30
surface of the heat transfer pin 7 facing the heat transfer
resin 4 and an end surface of the first metal foil 2d facing
the heat transfer resin 4 may form the same surface.
16
[0044] Furthermore, in each embodiment described above,
the heat transfer pin 7 protrudes toward the heat dissipation
member 6 than the second metal foil 2e. However, the heat
transfer pin 7 may have contact with the heat dissipation
member 6 without protruding the heat transfer pin 7 toward5
the heat dissipation member 6 than the second metal foil 2e.
That is, an end surface of the heat transfer pin 7 facing
the heat dissipation member 6 and an end surface of the
second metal foil 2e facing the heat transfer resin 4 may
form the same surface.10
[0045] Furthermore, in each embodiment described above,
a part of the heat transfer pin 7 has contact with the heat
dissipation member 6. However, a part of the heat transfer
pin 7 may be separated from the heat dissipation member 6
without making the heat transfer pin 7 have contact with the15
heat dissipation member 6. In this way, the route is divided
into the route in which the heat generated from the coil 3
is transferred to the heat transfer resin 4, the heat
transfer pin 7, the substrate 2, the heat dissipation member
6, and the metal member 5 in this order and the route in20
which the heat generated from the coil 3 is transferred to
the heat transfer resin 4, the substrate 2, the heat
dissipation member 6, and the metal member 5 in this order.
That is, the heat generated from the coil 3 is transferred
to the substrate 2 through the heat transfer resin 4, and in25
addition, the heat generated from the coil 3 is transferred
to the substrate 2 through the heat transfer pin 7.
Therefore, it is possible to increase the heat transfer
efficiency from the coil 3 to the metal member 5 than in the
past, and it is possible to promote cooling of the coil 3.30
[0046] The heat generating component to be cooled is not
limited to the coil 3, as long as the heat generating
component is an electronic device that generates heat. The
17
heat generating component may be, for example, a capacitor.
Reference Signs List
[0047] 1, 1A electric component module; 2 substrate; 2a
base material; 2b first surface; 2c second surface; 2d5
first metal foil; 2e second metal foil; 2f via hole; 2g
hole; 2h conductor layer; 3 coil; 3a lead wire; 4 heat
transfer resin; 5 metal member; 5a housing portion; 5b
recess; 6 heat dissipation member; 6a liquid metal; 7 heat
transfer pin; 10 air conditioning device; 11 indoor unit;10
12 outdoor unit; 12a sheet-metal housing; 12b outdoor
fan; 12c outdoor heat exchanger; 12d compressor; 12e
driving device; 12f separator; 12g fan chamber; 12h
machine chamber; 12i wire grille; 13 refrigerant pipe.
15
18
WE CLAIM:
[Claim 1] An electric component module (1, 1A) comprising:
a substrate (2) to include a first surface (2b), a
second surface (2c) facing an opposite side of the first
surface (2b), a first metal foil (2d) provided on the first5
surface (2b), and a second metal foil (2e) provided on the
second surface (2c), in which a via hole (2f) that penetrates
from the first surface (2b) to the second surface (2c) and
electrically connects the first metal foil (2d) and the
second metal foil (2e) is provided;10
a heat generating component disposed away from the
substrate (2) in a plate thickness direction of the substrate
(2);
a heat transfer resin (4) to be disposed between the
substrate (2) and the heat generating component and have15
contact with the substrate (2) and the heat generating
component;
a metal member (5) disposed on an opposite side of the
heat generating component with the substrate (2)
therebetween and disposed away from the substrate (2) in the20
plate thickness direction of the substrate (2);
a heat dissipation member (6) to be disposed between
the substrate (2) and the metal member (5) and have contact
with the substrate (2) and the metal member (5); and
a metal heat transfer pin (7) to be inserted into the25
via hole (2f), wherein
the first metal foil (2d) and the via hole (2f) are
formed at positions overlapping at least the heat generating
component as viewed along the plate thickness direction of
the substrate (2), and30
a part of the heat transfer pin (7) inserted into the
via hole (2f) has contact with the heat transfer resin (4).
19
[Claim 2] An electric component module (1, 1A) comprising:
a substrate (2) to include a first surface (2b), a
second surface (2c) facing an opposite side of the first
surface (2b), a first metal foil (2d) provided on the first
surface (2b), and a second metal foil (2e) provided on the5
second surface (2c), in which a via hole (2f) that penetrates
from the first surface (2b) to the second surface (2c) and
electrically connects the first metal foil (2d) and the
second metal foil (2e) is provided;
a heat generating component disposed away from the10
substrate (2) in a plate thickness direction of the substrate
(2);
a heat transfer resin (4) to be disposed between the
substrate (2) and the heat generating component and have
contact with the substrate (2) and the heat generating15
component;
a metal member (5) disposed on an opposite side of the
heat generating component with the substrate (2)
therebetween and disposed away from the substrate (2b)in the
plate thickness direction of the substrate (2);20
a heat dissipation member (6) to be disposed between
the substrate (2) and the metal member (5) and have contact
with the substrate (2) and the metal member (5); and
a metal heat transfer pin to be inserted into the via
hole, wherein25
a part of the heat transfer pin (7) protrudes toward
the heat transfer resin (4) than the first surface (2b) of
the substrate (2) and the first metal foil (2d) and has
contact with the heat transfer resin (4).
30
[Claim 3] The electric component module (1, 1A) according to
claim 1 or 2, wherein
the heat dissipation member (6) is a liquid metal, and
20
the metal member (5) includes a housing portion (5a)
that houses the liquid metal.
[Claim 4] The electric component module (1, 1A) according to
any one of claims 1 to 3, wherein a part of the heat transfer5
pin (7) has contact with the heat dissipation member.
[Claim 5] The electric component module (1, 1A) according to
any one of claims 1 to 4, wherein the heat transfer pin (7)
is soldered to the substrate.10